CN106825825A - A kind of penetration rate welding method high for the assembling of microwave and millimeter wave device - Google Patents
A kind of penetration rate welding method high for the assembling of microwave and millimeter wave device Download PDFInfo
- Publication number
- CN106825825A CN106825825A CN201710185698.2A CN201710185698A CN106825825A CN 106825825 A CN106825825 A CN 106825825A CN 201710185698 A CN201710185698 A CN 201710185698A CN 106825825 A CN106825825 A CN 106825825A
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- Prior art keywords
- vacuum welding
- vacuum
- welding equipment
- solder
- weldment
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
Abstract
The present invention relates to a kind of penetration rate welding method high for the assembling of microwave and millimeter wave device, the method is comprised the following steps：Vacuum welding equipment is vacuumized, to being filled with protective gas in equipment；Heating weldment and solder.After to-be-welded pieces temperature is increased in certain temperature range, stop heating, vacuum welding equipment is vacuumized, maintain vacuum state T1 seconds；To being filled with protective gas in vacuum welding equipment；Weldment and solder in vacuum welding equipment is heated.To-be-welded pieces temperature is risen to when on solder melt point, stops heating, and vacuum welding equipment is vacuumized, and maintains vacuum state T2 seconds；To being filled with protective gas in vacuum welding equipment；When weldment temperature is down to below solder melt point, stop to vacuum welding equipment insufflation gas, allow weldment natural cooling.The present invention can solve the problem that and rise the slow problem of gentle rate of temperature fall in the prior art, and it is welded together with penetration rate higher weldment can be passed through into solder.
Description
Technical field
The present invention relates to welding technology field, and in particular to a kind of penetration rate high weldering for the assembling of microwave and millimeter wave device
Connect method.
Background technology
In microwave and millimeter wave device packaging technology, typically require that printed board and the ground connection welding of chip have relatively higher
Penetration rate, to realize preferable device performance, such as relatively low device noise temperature, without self-excitation phenomena etc..In order to realize printed board
There is penetration rate relatively higher with the welding that is grounded of chip, general use is welded under vacuum conditions（Call vacuum welding in the following text
Connect）.During using vacuum welding, because the carrier of oxygen that can be reacted with solder and weldment is few, weldment surface wettability is good, and
And the gas in welding region can be discharged in time so that bubble is less, penetration rate higher is so capable of achieving.
But need to be carried out under the hot environment higher than solder melt point during vacuum welding, be so accomplished by solder and welding
Part is heated so that temperature is higher than solder melt point.Vacuum welding is typically carried out in vacuum drying oven, and heating means are generally by fluorescent tube
To graphite heat conduction plate, the weldment being placed on thereon is then transferred heat to using graphite heat conduction plate.Due under vacuum conditions
Air pressure is very low, and gas density is smaller, and generally between weldment and heat-conducting plate not perfect face contacts, cause heat transfer
It is relatively slow, so as to cause the gentle rate of temperature fall of the liter of weldment slower.When the gentle rate of temperature fall of liter is slower, will cause and rise gentle cooling
Overlong time, intermetallic compound grain at excessive, weld interface is thick, weldment coating excessive dissolution to cause scaling powder to volatilize
Etc. phenomenon, welding quality is influenceed.According to controlled atmosphere welding, i.e., enter nitrogen or other protectiveness in vacuum stove evacuation backlash
Gas, reducibility gas, although the gentle rate of temperature fall of liter when can improve welding process；But do not weld under vacuum conditions,
Gas in welding region is difficult discharge, easily forms cavity, causes the presence of certain cavity in welding region.
The content of the invention
It is an object of the invention to provide a kind of penetration rate welding method high for the assembling of microwave and millimeter wave device, the party
Method is applied in microwave and millimeter wave device packaging technology, for printing plate earthing welding and chip welding, can be led to weldment
Cross solder welded together with penetration rate higher.
To achieve the above object, present invention employs following technical scheme：
A kind of penetration rate welding method high for the assembling of microwave and millimeter wave device, the method is comprised the following steps：
（1）One takes out one fills：After weldment and solder are put into vacuum welding equipment and carry out technological preparation, by vacuum welding equipment
Vacuumize, the air for making vacuum welding set inside is discharged；Then to protective gas is filled with vacuum welding equipment, make vacuum welding
Air pressure reaches more than 50000Pa in equipment；Then the weldment and solder in vacuum welding equipment are heated again；
（2）Two take out two fills：After to-be-welded pieces temperature is increased in certain temperature range, stop heating, vacuum welding equipment is entered
Row is vacuumized for the second time, discharges the gas of vacuum welding device interior, and maintain vacuum state T1 seconds；Then to vacuum welding
Protective gas is filled with equipment again, air pressure in vacuum welding equipment is reached more than 50000Pa；Then vacuum welding is set again
Weldment and solder in standby are heated；
（3）Three take out three fills：To-be-welded pieces temperature is risen to when on solder melt point, stops heating, and the is carried out to vacuum welding equipment
Three vacuumize processs, and maintain vacuum state T2 seconds；Then to being filled with protective gas for the third time in vacuum welding equipment；Work as weldering
Fitting temperature is down to when below solder melt point, is stopped to vacuum welding equipment insufflation gas, allows weldment natural cooling, completes weldering
Termination process.
Further, step（2）The span of middle T1 is 20 ~ 60.
Further, step（3）The span of middle T2 is 3 ~ 180.By time T1 and T2 to maintaining vacuum state
Span be configured, be in order to preferably discharge the gas in vacuum chamber or in solder because only air pressure reduction
First half term shorter time in, it is impossible to discharge the gas in vacuum chamber or in solder well, have more residual gas
Body.
From above technical scheme, the present invention can not only solve to rise gentle rate of temperature fall in existing vacuum welding technology
Slow problem, effectively shortens weld interval, realizes the welding quality higher than vacuum welding, additionally it is possible to by weldment by solder with
Penetration rate higher is welded together, realizes welding penetration rate high than controlled atmosphere.
Brief description of the drawings
Fig. 1 is the process chart of welding method of the present invention.
Specific embodiment
The present invention will be further described below in conjunction with the accompanying drawings：
A kind of penetration rate welding method high for the assembling of microwave and millimeter wave device as shown in Figure 1, the method includes following step
Suddenly：
（1）One takes out one fills：After weldment and solder are put into vacuum welding equipment and carry out technological preparation, by vacuum welding equipment
Vacuumize（Vacuum of the present invention refers to that air pressure is less than 1000Pa）, vacuum welding is set into inner air discharge；Then to
Nitrogen or other protective gas, reducibility gas are filled with vacuum welding equipment, air pressure in vacuum welding equipment is reached
More than 50000Pa, then begins to heating.The step can discharge oxygen in vacuum welding equipment, the nitrogen being filled with or other guarantor
Shield property gas, reducibility gas can provide anti-oxidation effect or reduction solder surface oxide layer, enhancing wetting in welding process
Ability.In addition, relative vacuum welding procedure, rises gentle to being filled with vacuum welding equipment during protective gas can improve welding process
Rate of temperature fall, in step（2）And step（3）In to be filled with protective gas be also same effect.
（2）Two take out two fills：After to-be-welded pieces temperature is risen in certain temperature range（It is typically maintained in scaling powder or soldering paste
In the range of preheating temperature.Different scaling powders or soldering paste preheating temperature are different, it is necessary to corresponding according to scaling powder used or soldering paste selection
Temperature range）；Then vacuum welding equipment is vacuumized, discharges the gas of vacuum welding device interior, and maintain vacuum
State 20~60 seconds.Backward vacuum welding equipment in be filled with nitrogen or other protective gas, reducibility gas, make vacuum welding
Connect air pressure in equipment and reach more than 50000Pa.Two purposes taken out are the gas that scaling powder or soldering paste are volatilized in warm
State material discharges welding equipment；Two purposes filled fill identical with one.Two take out two fill during, continuous heating makes to-be-welded pieces
Temperature is maintained in the range of the preheating temperature of scaling powder used or soldering paste or more.Two take out two fills after the completion of process, continues to heat
So that temperature continues to raise.
（3）Three take out three fills：To-be-welded pieces temperature is risen to when on solder melt point, typically higher than solder melt point 20 DEG C~60 DEG C
（It is higher than solder melt point 20 DEG C~60 DEG C, it is to leave temperature margin）, start that vacuum welding equipment is carried out to take out true for the third time
Vacancy is managed, and maintains vacuum state 3 seconds~180 seconds.This is vacuumized can improve through welding by the gas discharge in fusion welding
Rate.Then to nitrogen or other protective gas are filled with vacuum welding equipment, to realize to weldment fast cooling.When temperature drop
When below to solder melt point, insufflation gas can be stopped, allowing weldment natural cooling, complete welding process.After solder dissolves,
By solder connection, until solder solidification, whole welding process is completed weldment.
Embodiment described above is only that the preferred embodiment of the present invention is described, not to model of the invention
Enclose and be defined, on the premise of design spirit of the present invention is not departed from, those of ordinary skill in the art are to technical side of the invention
Various modifications and improvement that case is made, all should fall into the protection domain of claims of the present invention determination.
Claims (3)
1. it is a kind of for microwave and millimeter wave device assembling penetration rate welding method high, it is characterised in that：The method includes following
Step：
（1）One takes out one fills：After weldment and solder are put into vacuum welding equipment and carry out technological preparation, by vacuum welding equipment
Vacuumize, the air for making vacuum welding set inside is discharged；Then to protective gas is filled with vacuum welding equipment, make vacuum welding
Air pressure reaches more than 50000Pa in equipment；Then the weldment and solder in vacuum welding equipment are heated again；
（2）Two take out two fills：After to-be-welded pieces temperature is increased in certain temperature range, stop heating, vacuum welding equipment is entered
Row is vacuumized for the second time, discharges the gas of vacuum welding device interior, and maintain vacuum state T1 seconds；Then to vacuum welding
Protective gas is filled with equipment again, air pressure in vacuum welding equipment is reached more than 50000Pa；Then vacuum welding is set again
Weldment and solder in standby are heated；
（3）Three take out three fills：To-be-welded pieces temperature is risen to when on solder melt point, stops heating, and the is carried out to vacuum welding equipment
Three vacuumize processs, and maintain vacuum state T2 seconds；Then to being filled with protective gas for the third time in vacuum welding equipment；Work as weldering
Fitting temperature is down to when below solder melt point, is stopped to vacuum welding equipment insufflation gas, allows weldment natural cooling, completes weldering
Termination process.
2. it is according to claim 1 it is a kind of for microwave and millimeter wave device assembling penetration rate welding method high, its feature
It is：Step（2）The span of middle T1 is 20 ~ 60.
3. it is according to claim 1 it is a kind of for microwave and millimeter wave device assembling penetration rate welding method high, its feature
It is：Step（3）The span of middle T2 is 3 ~ 180.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710185698.2A CN106825825B (en) | 2017-03-26 | 2017-03-26 | A kind of high penetration rate welding method for the assembling of microwave and millimeter wave device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710185698.2A CN106825825B (en) | 2017-03-26 | 2017-03-26 | A kind of high penetration rate welding method for the assembling of microwave and millimeter wave device |
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| CN106825825A true CN106825825A (en) | 2017-06-13 |
| CN106825825B CN106825825B (en) | 2018-11-13 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107378166A (en) * | 2017-07-28 | 2017-11-24 | 中国振华集团永光电子有限公司（国营第八七三厂） | A kind of sealing technique for reducing electronic component cover plate sealing cavity |
| CN113385763A (en) * | 2021-07-14 | 2021-09-14 | 成都共益缘真空设备有限公司 | Vacuum reflow soldering positive and negative pressure combined soldering process |
| CN113600953A (en) * | 2021-08-27 | 2021-11-05 | 上海航天电子通讯设备研究所 | Vacuum vapor phase welding method |
| CN114309854A (en) * | 2021-12-28 | 2022-04-12 | 中国科学院空天信息创新研究院 | Method and tool suitable for integrated brazing of multiple substrates of box body with two-sided open cavity |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1321409A (en) * | 1998-10-02 | 2001-11-07 | 艾利森电话股份有限公司 | Soldering of semiconductor chip to substrate |
| CN102371410A (en) * | 2011-09-07 | 2012-03-14 | 中国航天科技集团公司第九研究院第七七一研究所 | Process for making non-void high-reliability convex points in wafer by vacuum brazing |
| CN102497730A (en) * | 2011-12-08 | 2012-06-13 | 无锡华测电子系统有限公司 | Ceramic substrate assembly and grounding welding method thereof |
| JP2016203228A (en) * | 2015-04-27 | 2016-12-08 | 株式会社ケーヒン | Manufacturing method of power converter |
-
2017
- 2017-03-26 CN CN201710185698.2A patent/CN106825825B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1321409A (en) * | 1998-10-02 | 2001-11-07 | 艾利森电话股份有限公司 | Soldering of semiconductor chip to substrate |
| CN102371410A (en) * | 2011-09-07 | 2012-03-14 | 中国航天科技集团公司第九研究院第七七一研究所 | Process for making non-void high-reliability convex points in wafer by vacuum brazing |
| CN102497730A (en) * | 2011-12-08 | 2012-06-13 | 无锡华测电子系统有限公司 | Ceramic substrate assembly and grounding welding method thereof |
| JP2016203228A (en) * | 2015-04-27 | 2016-12-08 | 株式会社ケーヒン | Manufacturing method of power converter |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107378166A (en) * | 2017-07-28 | 2017-11-24 | 中国振华集团永光电子有限公司（国营第八七三厂） | A kind of sealing technique for reducing electronic component cover plate sealing cavity |
| CN107378166B (en) * | 2017-07-28 | 2019-12-10 | 中国振华集团永光电子有限公司（国营第八七三厂） | Fusion sealing process for reducing fusion sealing holes of electronic element cover plate |
| CN113385763A (en) * | 2021-07-14 | 2021-09-14 | 成都共益缘真空设备有限公司 | Vacuum reflow soldering positive and negative pressure combined soldering process |
| CN113600953A (en) * | 2021-08-27 | 2021-11-05 | 上海航天电子通讯设备研究所 | Vacuum vapor phase welding method |
| CN113600953B (en) * | 2021-08-27 | 2022-08-02 | 上海航天电子通讯设备研究所 | Vacuum vapor phase welding method |
| CN114309854A (en) * | 2021-12-28 | 2022-04-12 | 中国科学院空天信息创新研究院 | Method and tool suitable for integrated brazing of multiple substrates of box body with two-sided open cavity |
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| Publication number | Publication date |
|---|---|
| CN106825825B (en) | 2018-11-13 |
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Address after: 230088 658 Wangjiang West Road, Hefei high tech Zone, Anhui Patentee after: CHINA ELECTRONICS TECHNOLOGY Group CORPORATION NO 16 INSTITUTE Address before: No. 439, Suixi Road, Luyang District, Hefei City, Anhui Province, 230043 Patentee before: CHINA ELECTRONICS TECHNOLOGY Group CORPORATION NO 16 INSTITUTE |