CN113600953B - Vacuum vapor phase welding method - Google Patents
Vacuum vapor phase welding method Download PDFInfo
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- CN113600953B CN113600953B CN202110997765.7A CN202110997765A CN113600953B CN 113600953 B CN113600953 B CN 113600953B CN 202110997765 A CN202110997765 A CN 202110997765A CN 113600953 B CN113600953 B CN 113600953B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Engineering & Computer Science (AREA)
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a vacuum vapor phase welding method, which comprises the following steps: s1, coating soldering paste on the to-be-welded part, placing the to-be-welded part in a welding cavity of a welding furnace, heating to raise the temperature of the soldering paste to the melting point temperature of the solder, stopping heating, and vacuumizing the welding cavity to exhaust gas in the soldering paste; s2, adjusting the air pressure in the welding cavity to atmospheric pressure, heating the part to be welded, and keeping the temperature at the peak temperature for 50-70S after the temperature rises to the peak temperature; and S3, stopping heating, cooling until the soldering paste is solidified, and completing soldering. According to the vacuum vapor phase welding method, when the temperature of the soldering paste is raised to the soldering flux activation temperature and the temperature of the soldering paste is raised to the melting point temperature of the soldering flux, the soldering flux is respectively vacuumized, bubbles in a welding point of a to-be-welded part are effectively separated, internal gaps of a welding material are reduced, the voidage of the welding point of the to-be-welded part is effectively reduced, and the service life and the reliability of a product obtained after welding are improved.
Description
Technical Field
The invention relates to the technical field of vacuum vapor phase welding, in particular to a vacuum vapor phase welding method.
Background
The welding of the printed circuit board assembly is a key technology for realizing the electrical interconnection between the lead of the component and the printed circuit board, and the welding quality directly influences the quality and reliability of the product. The existing welding method of the assembly of the printed circuit board mainly comprises reflow soldering, vapor phase welding, laser welding, manual welding and the like. The vapor phase welding technology utilizes the latent heat of vaporization released when saturated vapor is cooled and converted into liquid to heat, so as to quickly raise the temperature of an assembly part and finish the welding process.
The vacuum vapor phase welding method is characterized in that vacuum is formed in a welding cavity, and bubbles in welding points are pumped out, so that internal gaps of welding materials are reduced, and the voidage of BGA devices and large-area grounding devices is effectively reduced. At present, the vacuum vapor phase welding method commonly used at home and abroad applies low vacuum degree at the highest temperature stage of a welding curve to extract redundant gas in a welding spot, but the welding flux is in a completely molten liquid state at the highest temperature stage, when the vacuum degree is too low, adjacent welding spots break through the surface tension of the liquid to be fused together to form the condition of bridging short circuit, and once the bridging welding spot appears on a printed board assembly, the welding defect product is obtained. In order to avoid bridging welding spots, the air pressure in the welding process needs to be controlled, so that the voidage of the welding spots of the welded product can be controlled to be not more than 15%. However, for products with high reliability and long service life, a new vacuum vapor phase welding method needs to be developed to further reduce the void ratio in the welding spot and improve the service life and reliability of the products.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a vacuum vapor phase welding method, which effectively separates bubbles in welding spots of a to-be-welded part and reduces internal gaps of welding materials by respectively vacuumizing when the temperature of a welding paste is raised to a soldering flux activation temperature and the temperature of the welding paste is raised to a welding flux melting point temperature, thereby effectively reducing the voidage of the welding spots of the to-be-welded part, solving the problem that liquid welding spot bridging can be generated between adjacent welding spots in the prior art, and improving the service life and reliability of a product obtained after welding.
The invention provides a vacuum vapor phase welding method, which comprises the following steps:
s1, coating soldering paste on a to-be-welded part, wherein the soldering paste comprises solder and soldering flux, the to-be-welded part is placed in a welding cavity of a welding furnace, heating is stopped after the temperature of the soldering paste rises to the melting point temperature of the solder, and then the welding cavity is vacuumized to discharge gas in the soldering paste;
s2, adjusting the air pressure in the welding cavity to atmospheric pressure, heating the part to be welded, and keeping the temperature at the peak temperature for 50-70S after the temperature is increased to the peak temperature;
and S3, stopping heating, cooling until the soldering paste is solidified, and completing soldering.
According to the vacuum vapor phase welding method, when the solder in the soldering paste is at the melting point temperature, the solder is in a solid-liquid coexisting state, and the inside of the welding cavity is vacuumized, so that gas in the soldering paste can be extracted and separated from the soldering paste by breaking through the surface tension of the solder liquid along with the vacuumizing process, and the problem of liquid welding point bridging between adjacent welding points can be avoided.
In an embodiment of the present invention, the step S1 specifically includes the following steps:
s11, coating soldering paste on the to-be-welded piece, wherein the soldering paste comprises soldering flux and soldering flux, and the to-be-welded piece is placed in a welding cavity of a welding furnace;
s12, vacuumizing the welding cavity, injecting vapor-phase liquid into the welding cavity, exchanging heat between the to-be-welded part and the vaporized vapor-phase liquid, recovering the vapor-phase liquid in the welding cavity after the temperature of the soldering paste rises to the activation temperature of the soldering flux, and stopping heating;
s13, vacuumizing the welding cavity to discharge the partially vaporized soldering flux in the soldering paste;
s14, adjusting the air pressure in the welding cavity to atmospheric pressure, injecting vapor-phase liquid into the welding cavity, performing heat exchange between the to-be-welded part and the vapor-phase liquid, and slowly heating the temperature of the soldering paste to the melting point temperature of the solder;
and S15, vacuumizing the welding cavity to exhaust the gas in the welding paste.
According to the vacuum vapor phase welding method, when the temperature of the soldering paste is raised to the soldering flux activation temperature and the temperature of the soldering paste is raised to the melting point temperature of the soldering flux, vacuum pumping is respectively carried out, and air bubbles in welding points of components are pumped out, so that internal gaps of welding materials are reduced, the voidage of the welding points of the components is effectively reduced, and the service life and the reliability of products obtained after welding are improved. In step S12, the soldering chamber is pre-evacuated to reduce the air concentration in the soldering chamber and improve the oxidation reaction and the wettability of the solder during the soldering process; in step S12, after the vapor phase liquid in the welding chamber is recovered, the heat transfer medium in the welding chamber is lost, and the heating process is stopped; in step S13, the partially vaporized flux is extracted from the solder paste during the vacuum process.
In one embodiment of the present invention, the gas obtained after all of the vapor phase liquid injected in step S12 is vaporized can cover the workpiece to be welded and transfer heat by contact with the workpiece to be welded. In step S12, the injection amount of the vapor phase liquid is controlled such that the gas generated by vaporization of the injected vapor phase liquid can only cover the surface of the to-be-welded part, and the vaporized vapor phase liquid and the to-be-welded part in the welding cavity are contacted to transfer heat so that the temperature of the to-be-welded part gradually reaches the activation temperature of the flux.
In one embodiment of the present invention, the vapor phase liquid injected in step S14 is completely vaporized and does not contact the workpiece to be welded, and radiative heat transfer is performed between the workpiece to be welded and the furnace wall of the welding furnace. In step S14, the air pressure in the welding chamber is adjusted to atmospheric pressure, so that the vapor phase liquid volatilizes to the boiling point at normal pressure, a small amount of vapor phase liquid is injected, the vapor phase liquid is heated to the boiling point by the radiant heat of the welding furnace wall and then vaporized, the injection amount of the vapor phase liquid is controlled such that the gas generated by the vaporization of the injected vapor phase liquid cannot release the parts to be welded, and the parts to be welded are slowly heated to the melting point of the solder by the vaporized gas of the small amount of vapor phase liquid and the radiant heat of the welding furnace wall.
In one embodiment of the invention, a vacuum is applied to 500mbar in step S12.
In one embodiment of the present invention, the vacuum is pumped to 100mbar to 200mbar in step S13.
In one embodiment of the present invention, the vacuum is pumped to 100mbar to 200mbar in step S15.
In an embodiment of the present invention, step S2 specifically includes the following steps: adjusting the air pressure in the welding cavity to atmospheric pressure, injecting vapor-phase liquid into the welding cavity, quickly reducing the air pressure in the welding cavity, reducing the boiling point of the vapor-phase liquid, vaporizing the vapor-phase liquid after the boiling point is reduced, carrying out heat exchange with a part to be welded, and keeping the vapor-phase liquid at the peak temperature for 50-70 s after the temperature is increased to the peak temperature.
In step S2, after the air pressure in the welding furnace is adjusted to the normal pressure, the air pressure is quickly reduced to reduce the boiling point of the vapor phase liquid, the vapor phase liquid with the reduced boiling point can be quickly vaporized, and the temperature of the part to be welded is quickly raised to the peak temperature through contact heat transfer between a large amount of vapor phase liquid or the parts to be welded in the welding cavity and is continuously maintained for 50-70 seconds, so that the solder paste is fully melted to the molten state.
In one embodiment of the present invention, in step S2, the pressure within the weld is rapidly reduced to 600mbar within 3-5S.
In an embodiment of the present invention, the step S3 specifically includes the following steps: and (4) recovering the vapor-phase liquid in the welding cavity, losing the heat-conducting medium in the welding cavity, stopping heating, cooling until the soldering paste is solidified, and completing welding.
Compared with the prior art, the embodiment of the invention has the following beneficial effects:
1. according to the vacuum vapor phase welding method provided by the embodiment of the invention, the bubbles in the welding spots of the to-be-welded parts are effectively separated by respectively vacuumizing when the temperature of the soldering paste is raised to the soldering flux activation temperature and the temperature of the soldering paste is raised to the melting point temperature of the soldering flux, so that the internal gaps of the welding materials are reduced, the voidage of the welding spots of the to-be-welded parts is further effectively reduced, the problem that liquid welding spots are bridged between adjacent welding spots in the prior art is solved, and the service life and the reliability of products obtained after welding are improved.
2. The vacuum vapor phase welding method provided by the embodiment of the invention has the advantages of simple and safe process and wide application prospect.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a process flow diagram of a vacuum vapor phase welding method provided by an embodiment of the present invention;
FIG. 2 is a temperature/pressure-time curve of soldering using perfluoropolyether as vapor-liquid and Sn63Pb37 as solder paste in accordance with an embodiment of the present invention;
FIG. 3 is an X-ray inspection diagram of a solder joint obtained after the vacuum vapor phase soldering process provided by the embodiment of the present invention is completed in a test example;
FIG. 4 is an X-ray inspection chart of a solder joint obtained after completion of soldering by a vacuum vapor phase soldering method in the prior art in a test example.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that it would be obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit of the invention. All falling within the scope of the present invention.
Examples
This embodiment provides a vacuum vapor phase soldering method, in which the part to be soldered in this embodiment is a printed circuit board, the vapor phase liquid used in this embodiment is a perfluoropolyether vapor phase liquid having a boiling point of 240 ℃, and the solder paste in this embodiment is Sn63Pb37 having a melting point of 183 ℃.
The vacuum vapor phase welding method in the embodiment specifically comprises the following steps:
s1, coating soldering paste on the to-be-welded part, wherein the soldering paste comprises solder and soldering flux, the to-be-welded part is placed in a welding cavity of a welding furnace, heating is carried out to raise the temperature of the soldering paste to the melting point temperature of the solder, then, the heating is stopped, and then, the welding cavity is vacuumized to discharge gas in the soldering paste;
s2, adjusting the air pressure in the welding cavity to atmospheric pressure, injecting vapor-phase liquid into the welding cavity, rapidly reducing the air pressure in the welding cavity to 600mbar, reducing the boiling point of the vapor-phase liquid, vaporizing the vapor-phase liquid after the boiling point is reduced, performing heat exchange with the part to be welded, and keeping 50-70S after the temperature reaches the peak temperature on the reflow soldering temperature curve, so that the solder is fully melted to a molten state; wherein, the vapor phase liquid with reduced boiling point can be quickly vaporized;
and S3, recovering the vapor-phase liquid in the welding cavity, stopping heating when the heat conduction medium is lost in the welding cavity, cooling until the soldering paste is solidified, and recovering the temperature of the to-be-welded part to the room temperature to finish welding.
Specifically, step S1 in this embodiment specifically includes the following steps:
s11, coating soldering paste on the to-be-welded part, wherein the soldering paste comprises solder and soldering flux, and the to-be-welded part is placed in a welding cavity of a welding furnace;
s12, vacuumizing the welding cavity to 500mbar, reducing the air concentration in the welding cavity, improving the oxidation process and the wetting capacity of soldering paste in the welding process, then injecting vapor-phase liquid into the welding cavity, conducting heat between the part to be welded and the vaporized vapor-phase liquid, recovering the vapor-phase liquid in the welding cavity after the temperature of the soldering paste rises to the activation temperature of the soldering flux, losing a heat conduction medium in the welding cavity, and stopping heating; in step S12, the injection amount of the vapor phase liquid is controlled such that the gas after vaporization of the injected vapor phase liquid can only cover the surface of the to-be-welded part, so that the vaporized vapor phase liquid and the to-be-welded part in the welding cavity are contacted to transfer heat, and the temperature of the to-be-welded part gradually reaches the activation temperature of the soldering flux; wherein, part of the soldering flux is vaporized in the process of raising the temperature of the to-be-welded piece to the activation temperature of the soldering flux;
s13, vacuumizing the welding cavity to 100-200 mbar, so that the partially vaporized soldering flux is extracted and separated from the soldering paste along with the vacuumizing process;
s14, adjusting the air pressure in the welding cavity to atmospheric pressure, enabling vapor phase liquid to recover the boiling point of the normal pressure state, slowing down the heating and vaporization process of the vapor phase liquid, injecting the vapor phase liquid into the welding cavity, and slowly heating the to-be-welded part to the melting point temperature of the solder by means of the vaporized gas of a small amount of the vapor phase liquid and the radiant heat of the furnace wall of the welding furnace; in step S14, the amount of vapor-phase liquid injected is controlled such that the gas in which the injected vapor-phase liquid is completely vaporized cannot release the parts to be welded, so that the parts to be welded are slowly heated to the melting point of the solder for about 180 seconds by means of the gas in which a small amount of vapor-phase liquid is vaporized and the radiant heat of the furnace wall of the welding furnace.
S15, vacuumizing the welding cavity to 100-200 mbar to exhaust gas in the soldering paste; the temperature of the soldering paste is at the melting point temperature of the solder, the state of the solder is in a solid-liquid coexisting state, the problem of bridging of liquid solder joints is avoided, and redundant gas in the solder is extracted and separated from the solder by breaking through the surface tension of the solder liquid along with the vacuumizing process.
Further, in step S14 in the embodiment, the temperature of the to-be-welded piece is raised to 140-170 ℃ within 60-120S.
Further, in step S14 of the present embodiment, the adjustment of the air pressure in the welding chamber to the atmospheric pressure in step S2 is performed by injecting air or nitrogen gas into the welding chamber.
Furthermore, a valve is arranged on the welding furnace, and the gas-phase and liquid-phase vapor phase liquid can be extracted and recovered. In the present embodiment, the structure of the furnace wall of the welding furnace is not limited to the above selection, and those skilled in the art can reasonably set the heating module according to the prior art and common knowledge in the field.
The whole process of the vacuum vapor phase welding method in the embodiment is divided into the following stages according to the welding temperature curve: a preheating zone, a first vacuumizing bubble separation zone, a heat preservation zone, a second vacuumizing bubble separation zone, a welding zone and a cooling zone.
Wherein, step S11, S12, S13 are in the preheating zone, and the welding chamber of welding stove is seal structure, wait that the weldment sends into the welding chamber through transport mechanism after, the air in the welding chamber can take place oxidation reaction with the soldering paste in the welding process to reduce the wet ability of soldering paste, the main effect in preheating zone is: the air concentration in the soldering cavity is reduced, and meanwhile, the temperature of the soldering paste is raised to the activation temperature of the soldering flux, namely about 130 ℃.
And step S13, the first vacuum-pumping bubble separation area is located, a part of the flux is vaporized during the heating and temperature-raising process in the preheating area, and the vaporized flux is extracted and separated from the solder paste in the first vacuum-pumping bubble separation area along with the vacuum-pumping process.
Wherein, step S14 is in heat preservation district, and the main effect in heat preservation district lies in: the soldering flux is fully activated, the deoxidation effect is exerted, meanwhile, the overall heat balance of the to-be-welded part is achieved, and the overall temperature of the to-be-welded part is slowly raised; in addition, the heat conduction efficiency is higher after the vapor phase liquid is vaporized, and the temperature rising slope of a welding temperature curve is continuously improved, so the injection amount of the vapor phase liquid in the heat preservation area is strictly controlled.
The step S15 is in the second vacuum-pumping bubble separation zone, at this time, the temperature of the solder paste is at the melting point temperature of the solder, the solder state is a solid-liquid coexisting state, and the problem of liquid solder joint bridging is not generated, so that the excessive gas in the solder is extracted and separated from the solder by breaking the surface tension of the solder liquid along with the vacuum-pumping process.
Wherein, the step S2 is located in a welding area, and the main function of the welding area is to make the solder melt rapidly and diffuse with the parent metal of the piece to be welded to form an intermetallic compound (IMC). Research finds that the IMC thickness of a welding point of an electronic product is related to the integral of temperature above the melting point of a welding curve welding flux to time, and thicker IMC is more likely to generate brittleness of the welding point, so that the heating rate of a to-be-welded part is accelerated in the welding area, the welding time is shortened, but the vapor phase liquid is in a normal-temperature liquid state when being injected, and a large amount of time is needed from the normal-temperature vapor phase liquid state to the boiling point, so that the welding time process of the to-be-welded part is caused.
In step S2, the gas pressure in the welding chamber is reduced to 600mbar within 3-5S. The step S3 is in a cooling area, and the cooling area is mainly used to reduce the temperature of the to-be-welded part to room temperature, so as to avoid the unbalance of the overall temperature of the to-be-welded part and the too fast temperature reduction rate.
Test examples
The vacuum vapor phase welding method in the invention and the vacuum vapor phase welding method in the prior art are respectively adopted to weld the BGA device on the circuit board, and the X-ray is adopted to detect the welding point after the welding is finished, the result is shown in figures 3 and 4, the black point in the figures is the welding point, the welding point after the welding is finished by adopting the vacuum vapor phase welding method in the invention is basically free of bubbles as shown in figure 3, and the maximum void ratio can reach 30% as shown in figure 4.
Among them, the vacuum vapor phase welding method in the prior art includes the following steps:
coating soldering paste on a to-be-welded part, placing the to-be-welded part in a welding cavity of a welding furnace, vacuumizing the welding cavity, injecting vapor-liquid, directly heating to the peak temperature on a reflow soldering temperature curve, and vacuumizing the welding cavity to discharge gas in the soldering paste.
In summary, in the vacuum vapor phase soldering method of the present invention, by respectively vacuumizing when the temperature of the solder paste is raised to the flux activation temperature and the temperature of the solder paste is raised to the melting point temperature of the solder, bubbles in the solder joints of the to-be-soldered parts are effectively separated, the internal voids of the soldering material are reduced, the void ratio of the solder joints of the to-be-soldered parts is effectively reduced, and in addition, the problem that liquid solder joints are bridged between adjacent solder joints in the prior art is also solved, so that the service life and the reliability of the product obtained after the soldering are improved.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.
Claims (9)
1. A vacuum vapor phase welding method, comprising the steps of:
s1, coating soldering paste on a to-be-welded part, wherein the soldering paste comprises solder and soldering flux, the to-be-welded part is placed in a welding cavity of a welding furnace, heating is stopped after the temperature of the soldering paste rises to the melting point temperature of the solder, and then the welding cavity is vacuumized to discharge gas in the soldering paste;
s2, adjusting the air pressure in the welding cavity to atmospheric pressure, heating the part to be welded, and keeping the temperature at the peak temperature for 50-70S after the temperature is increased to the peak temperature;
s3, stopping heating, cooling until the soldering paste is solidified, and completing soldering;
wherein, the step S1 specifically includes the following steps:
s11, coating soldering paste on the to-be-welded part, wherein the soldering paste comprises solder and soldering flux, and the to-be-welded part is placed in a welding cavity of a welding furnace;
s12, vacuumizing the welding cavity, injecting vapor-phase liquid into the welding cavity, exchanging heat between the to-be-welded part and the vaporized vapor-phase liquid, recovering the vapor-phase liquid in the welding cavity after the temperature of the soldering paste rises to the activation temperature of the soldering flux, and stopping heating;
s13, vacuumizing the welding cavity to discharge the partially vaporized soldering flux in the soldering paste;
s14, adjusting the air pressure in the welding cavity to atmospheric pressure, injecting vapor-phase liquid into the welding cavity, performing heat exchange between the to-be-welded part and the vapor-phase liquid, and slowly heating the temperature of the soldering paste to the melting point temperature of the solder;
and S15, vacuumizing the welding cavity to exhaust the gas in the welding paste.
2. The vacuum vapor phase welding method as claimed in claim 1, wherein the vapor phase liquid injected in step S12 is vaporized completely to cover the member to be welded and to transfer heat by contact with the member to be welded.
3. The vacuum vapor-phase welding method according to claim 1, wherein all of the vapor phase liquid injected in step S14 is vaporized and does not contact with the member to be welded, and radiant heat transfer is performed between the member to be welded and the wall of the welding furnace.
4. The vacuum vapor welding process of claim 1 wherein the vacuum applied in step S12 is pulled to 500 mbar.
5. The vacuum vapor welding method as set forth in claim 1, wherein the vacuum is drawn to 100mbar to 200mbar in step S13.
6. The vacuum vapor welding method as set forth in claim 1, wherein the vacuum is drawn to 100mbar to 200mbar in step S15.
7. The vacuum vapor phase welding method as set forth in claim 1, wherein the step S2 specifically includes the steps of: adjusting the air pressure in the welding cavity to atmospheric pressure, injecting vapor-phase liquid into the welding cavity, quickly reducing the air pressure in the welding cavity, reducing the boiling point of the vapor-phase liquid, vaporizing the vapor-phase liquid after the boiling point is reduced, carrying out heat exchange with a part to be welded, and keeping the vapor-phase liquid at the peak temperature for 50-70 s after the temperature is increased to the peak temperature.
8. A vacuum vapour phase welding process according to claim 7 wherein in step S2 the gas pressure within the weld is reduced to 600mbar within 3 to 5 seconds.
9. The vacuum vapor phase welding method as recited in claim 1, wherein the step S3 specifically includes the steps of: and (4) recovering the vapor-phase liquid in the welding cavity, losing the heat-conducting medium in the welding cavity, stopping heating, cooling until the soldering paste is solidified, and completing welding.
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| CN114147313A (en) * | 2021-11-24 | 2022-03-08 | 合肥恒力装备有限公司 | Device for realizing high temperature uniformity of vacuum reflow soldering and processing method thereof |
| CN114273743B (en) * | 2021-12-28 | 2023-07-25 | 上海轩田工业设备有限公司 | Method for welding to-be-welded piece through side wall solder hanging structure |
| CN117583684A (en) * | 2024-01-16 | 2024-02-23 | 无锡市古德电子有限公司 | SMT welding method |
| CN118081014A (en) * | 2024-04-22 | 2024-05-28 | 南京屹立芯创半导体科技有限公司 | Welding method by adjusting temperature and gas molecular number in cavity |
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| CN106825825A (en) * | 2017-03-26 | 2017-06-13 | 中国电子科技集团公司第十六研究所 | A kind of penetration rate welding method high for the assembling of microwave and millimeter wave device |
| CN111655416A (en) * | 2018-02-02 | 2020-09-11 | 浜名湖电装株式会社 | Electric component manufacturing apparatus and method of manufacturing electric component |
| CN212599534U (en) * | 2020-07-28 | 2021-02-26 | 康耐威(苏州)半导体科技有限公司 | Soldering device with low bubble generation rate for semiconductor package |
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