CN114273743B - Method for welding to-be-welded piece through side wall solder hanging structure - Google Patents

Method for welding to-be-welded piece through side wall solder hanging structure Download PDF

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CN114273743B
CN114273743B CN202111622149.XA CN202111622149A CN114273743B CN 114273743 B CN114273743 B CN 114273743B CN 202111622149 A CN202111622149 A CN 202111622149A CN 114273743 B CN114273743 B CN 114273743B
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welding
welded
solder
piece
temperature
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CN114273743A (en
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陈远明
薛建光
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Shanghai Xuantian Intelligent Technology Co ltd
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Shanghai Sharetek Technology Co Ltd
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Abstract

The method for welding the to-be-welded parts through the side wall hanging welding flux structure is characterized in that the to-be-welded parts at least comprise a first to-be-welded part and a second to-be-welded part, a welding flux hole is formed in the surface of the first to-be-welded part, an opening facing the second to-be-welded part is formed in the welding flux hole, and welding flux is placed in the welding flux hole; raising the temperature to reach the welding temperature, and allowing the molten solder to flow into a welding area between two adjacent parts to be welded under the capillary action; maintaining the molten state of the solder, and vacuumizing to overflow bubbles wrapped in the liquid solder; and cooling, reducing the temperature of the welding piece, and solidifying the welding flux. In the application, after the solder is melted, the solder is filled with bubbles together with gaps between the first welding piece and the second welding piece; in the subsequent vacuum bubble removal process, bubbles can be discharged from the solder holes, and the disturbance of the bubbles on the whole liquid solder is reduced, so that the welding quality is improved.

Description

Method for welding to-be-welded piece through side wall solder hanging structure
Technical Field
The invention relates to the technical field of vacuum welding processes, in particular to a process method for solving weld defects in vacuum welding through a side wall hanging solder structure.
Background
In the welding process of the multiple components, in order to improve the welding efficiency, the multiple components are required to be assembled at one time and welded at the same time; this presents a problem in that the problem of holes is created by soldering, particularly large area solder soldering, typically soldering lug soldering.
In order to solve this problem, a preferred welding method is vacuum welding: sucking vacuum in the molten solder state to suck out bubbles in the solder; vacuum bonding may negatively impact additional components, particularly small area solders. For example, in general, the solder is a welding wire or a welding ring, and during the vacuum suction process of the vacuum welding, the solder is easily sucked out of the original welding seam area, so that welding defects are generated. To solve the above problems, a two-stage soldering method is generally adopted, i.e. a high-melting-point solder is selected first to finish a group of element soldering; and then selecting low-melting-point solder, and matching with vacuum to finish the welding of another group of elements.
In the case of small area soldering, it is common for the solder to be placed internally or in top-port solder.
The welding flux or the welding ring is placed in the middle of the welding part in advance, the liquid welding flux melted at high temperature in welding is climbed and extended along two directions of the axis of the welding part, the climbing distance is far longer than the thickness of the welding flux, the welding time is long, the climbing distances of different positions are different, the welding flux of part of the area is easy to climb beyond the welding area, and the other part of the area climbs to the position short of the position, so that the welding quality is influenced; this is particularly true after increasing the vacuum. In addition, after the solder in the inner part is migrated, the original position forms a cavity because of the thinning of the material, and the product is influenced by high and low temperature and the like in the use process, so that the reliability of the product is reduced.
The top placement method is another common welding method: the solder is arranged at the top of the glass bead, the liquid solder climbs to the bottom of the weldment only along the axial direction of the weldment during welding, at the moment, the air in the welding area is completely wrapped, and after the vacuum is increased, the liquid solder is separated from the welding area, so that weld flash is generated.
Disclosure of Invention
The invention aims to provide a process method for solving the weld defect in vacuum welding through a side wall tin-plating structure, which reduces the movement of the liquid solder of a small-area welding original piece to the maximum extent in the simultaneous welding of multiple components and avoids the negative influence of vacuum on the welding; thereby improving the welding quality as a whole; the welding time is saved.
In order to achieve the above purpose, the present invention is realized by the following technical scheme: a method for welding a part to be welded through a side wall hanging solder structure, preferably a process method for solving a weld defect in vacuum welding through a side wall hanging solder structure, comprises the following steps:
(1) Cleaning a piece to be welded before welding; drying;
(2) And (3) assembling a welding part: the to-be-welded piece in the step (1) at least comprises a first to-be-welded piece and a second to-be-welded piece, wherein a solder hole is formed in the surface of the first to-be-welded piece and on the contact surface of the first to-be-welded piece and the second to-be-welded piece, an opening facing the second to-be-welded piece is formed in the solder hole, and solder is placed in the solder hole;
(3) Preheating and welding: raising the temperature to reach the welding temperature, and allowing the molten solder to flow into a welding area between two adjacent parts to be welded under the capillary action;
(4) Maintaining the molten state of the solder, and vacuumizing to overflow bubbles wrapped in the liquid solder;
(5) And cooling, reducing the temperature of the welding piece, and solidifying the welding flux.
Further, the cleaning of the parts to be welded is carried out until the parts are qualified, wherein the qualification refers to: and (3) the pure water drops are arranged on the surface of the to-be-welded piece, and whether the water drops accord with a preset range or not is verified by measuring the included angle between the water drops and the to-be-welded piece.
Further, the included angle meeting the preset range is at least 37 degrees.
Further, the step of cleaning the weldment to be welded further comprises cleaning verification: and (3) the pure water drops are arranged on the surface of the to-be-welded piece, whether the to-be-welded piece is qualified or not is verified by measuring the included angle between the water drops and the to-be-welded piece, and cleaning is continued until the to-be-welded piece is qualified if the to-be-welded piece is not qualified.
Further, the method for welding the to-be-welded piece through the side wall-mounted solder structure comprises the following steps:
(1) Cleaning before welding: cleaning pollutants of long molecular chains on the surface of a part to be welded;
(2) Cleaning and verifying: the method comprises the steps that pure water drops are arranged on the surface of a piece to be welded, whether the water drops are qualified or not is verified by measuring the included angle between the water drops and the piece to be welded, cleaning is continued until the water drops are qualified, and the qualified angle is 37 degrees;
(3) And (3) assembling a welding part: the to-be-welded piece in the step (2) is specifically the assembly of a first to-be-welded piece and a second to-be-welded piece, a solder hole is formed in the inner surface of the first to-be-welded piece, solder is placed in the solder hole, after the to-be-welded piece is cleaned to be qualified, the first to-be-welded piece and the second to-be-welded piece are assembled, and the solder hole is communicated with a welding area between the first to-be-welded piece and the second to-be-welded piece, so that the solder can flow into the welding area through the solder hole under capillary action in melting:
(4) Preheating and welding: the temperature is increased, welding is carried out after the welding temperature is reached, the welding process comprises vacuumizing treatment, so that bubbles wrapped in liquid soldering tin overflow on the surface of the soldering tin, and the hole rate in the soldering tin is controlled within 5%;
(5) And (3) cooling: the temperature is lowered and the solder solidifies.
Further, the pre-welding cleaning in the step (1) adopts physical plasma cleaning: breaking and stripping pollutants of long molecular chains on the surface of a piece to be welded through bombardment of high-quality high-speed charged particles; or (b)
Cleaning by adopting a chemical method: react with the long molecular chain pollutant to produce water soluble compound or produce volatile gas directly to eliminate pollutant.
Wherein the long molecular chain means that the number of atoms (preferably carbon atoms) constituting the main chain of the molecular chain is at least 15.
Further, the solder is internally provided with a soldering flux.
Further, the welding part assembly further comprises a fixing device, wherein the fixing device is used for fixing the first part to be welded and the second part to be welded, and the fixing device is used for fixing the position of the part to be welded in the welding process.
Further, the temperature at the time of preheating and welding is a curve rise.
In a preferred embodiment, the curve rises, meaning that the first stage rise rate is less than the second stage rise rate. For example, the temperature rising speed before the temperature rising curve point is smaller than the temperature rising speed after the temperature rising curve point.
Further, the temperature at the time of cooling is a curve drop.
In a preferred embodiment, the curve decreases, meaning that the first stage decreases at a rate less than the second stage. For example, the temperature decrease rate before the temperature decrease curve point is smaller than the temperature decrease rate after the temperature decrease curve point.
In a preferred embodiment, the solder aperture side walls are provided with through holes leading to soldering areas where the solder apertures are not in contact. In a more preferred embodiment, the through hole extending direction is not coincident with the solder hole extending direction.
In a preferred embodiment, the first part to be welded is annular and the second part to be welded is surrounded.
In a preferred embodiment, the first part to be welded is higher than the second part to be welded.
In a preferred embodiment, the solder apertures are symmetrically or asymmetrically distributed on the surface of the part to be soldered.
In a preferred embodiment, the solder apertures are slots, with the slots facing the adjacent workpieces to be soldered.
In a preferred embodiment, the solder is tin.
In a preferred embodiment, the welding is performed in a closed box.
By means of the scheme, the invention has at least the following advantages:
1. after the solder is melted, the solder and bubbles are filled in the gap between the first welding piece and the second welding piece; in the subsequent vacuum bubble removing process, bubbles can be discharged from the solder holes except for overflowing from the upper end face of the welding piece, and the disturbance of the bubbles on the whole liquid solder is reduced, so that the welding quality is improved;
2. the multi-component assemblies with different welding areas can be welded by using the same temperature curve, and the welding efficiency is improved on the premise of the same welding quality.
Drawings
FIG. 1 is a schematic diagram of an assembled structure of a first part to be welded and a second part to be welded;
FIG. 2 is a schematic diagram of an assembled top view of a first part to be welded and a second part to be welded;
FIG. 3 is a schematic diagram of an assembled cross-sectional structure of a first part to be welded and a second part to be welded;
fig. 4 is a schematic diagram of welding structures of a first part to be welded and a second part to be welded according to embodiment 2;
fig. 5, 6 and 7 are diagrams of welding effect of the present application and the prior art.
Detailed Description
The invention is further described below with reference to the accompanying drawings:
the invention discloses a process method for solving the weld defect in vacuum welding through a side wall tin coating structure, which comprises the following implementation steps:
(1) Cleaning before welding: cleaning pollutants of long molecular chains on the surface of a part to be welded;
(2) Cleaning and verifying: the method comprises the steps that pure water drops are arranged on the surface of a piece to be welded, whether the water drops are qualified or not is verified by measuring the included angle between the water drops and the piece to be welded, cleaning is continued until the water drops are qualified, and the qualified angle is 37 degrees;
(3) And (3) assembling a welding part: the to-be-welded parts in the step (2) are specifically the first to-be-welded parts and the second to-be-welded parts, the inner surface of the first to-be-welded parts is provided with a solder hole, the solder is placed in the solder hole, the side wall of the solder hole is provided with a through hole, and after the to-be-welded parts are cleaned to be qualified, the first to-be-welded parts and the second to-be-welded parts are assembled:
(4) Preheating and welding: controlling the temperature to slowly rise, and welding after the temperature reaches the welding temperature, wherein the welding process comprises vacuumizing treatment;
(5) And (3) cooling: and slowly reducing the temperature to the temperature of the welding part to reach the normal temperature.
Example 1
Before welding, carrying out physical plasma cleaning on the first to-be-welded piece 1 and the second to-be-welded piece 2, and assembling the welding pieces after cleaning and verifying to be qualified: fig. 1-3 show an assembly embodiment of a set of parts to be welded, wherein a first part to be welded 1 is annular, a second part to be welded 2 is cylindrical, and the second part to be welded 2 is wrapped in a ring of the first part to be welded 1.
Cleaning before welding: and cleaning the pollutants of the long molecular chains on the surface of the to-be-welded piece. The method can be as follows: 1) Physical plasma cleaning is adopted: breaking and stripping pollutants of long molecular chains on the surface of a piece to be welded through bombardment of high-quality high-speed charged particles; or) cleaning by adopting a chemical method: react with the long molecular chain pollutant to produce water soluble compound or produce volatile gas directly to eliminate pollutant.
Cleaning and verifying: and (3) verifying whether the pure water drops are qualified or not by measuring the included angle between the water drops and the to-be-welded piece on the surface of the to-be-welded piece, and continuing cleaning the to-be-welded piece until the to-be-welded piece is qualified, wherein the qualified angle is 37 degrees.
The inner surface of the first part to be welded 1 is provided with four solder holes 3, solder 4 can be placed in the solder holes 3, and transverse through holes are arranged on the side walls of the solder holes 3 so as to lead to other welding areas between the two parts to be welded, so that the solder can flow into the welding areas under capillary action through the through holes in melting. After the welding equipment is qualified in cleaning, the first part to be welded 1 and the second part to be welded 2 are assembled according to the mode shown in fig. 1, the assembled welding parts are fixed through the fixing device, and the material selection and the structural design of the specific heat capacity of the fixing device do not influence the direct effect of the temperature control of the welding equipment on welding.
And the prepared solder wire solder 4 (such as soldering tin) is placed in the solder hole 3, the soldering flux is arranged in the solder wire solder 4, and in the preheating process, the soldering flux can generate oxidation-resistant gas, so that air in a welding area is discharged out of the welding area, and the welding quality is improved.
The control temperature is enabled to rise slowly in a curve (the temperature rising speed is gradually increased), oxidation-resistant gas can be generated in the preheating process, air in the welding area is discharged out of the welding area, welding quality is guaranteed, welding is carried out, vacuumizing is carried out in the welding process, bubbles wrapped in liquid soldering tin overflow on the surface of the soldering tin, and after the welding is finished, the control temperature is enabled to fall slowly in a curve (the temperature reducing speed is gradually increased) until the room temperature, so that a welding piece is obtained.
The temperature during preheating and welding is the curve slowly rises, guarantees that the welding piece and the passive components except the welding piece are prevented from being damaged by thermal shock, and likewise, the temperature during cooling is the curve slowly drops, and guarantees that the welding piece and the passive components except the welding piece are prevented from being damaged by cold impact.
Example 2
On the basis of embodiment 1, referring to fig. 4, a first part to be welded 1 is higher than a second part to be welded 2, a cavity is formed in a ring of the first part to be welded 1, during welding, solder 4 can be placed in a solder hole 3, a through hole is formed in the side wall of the solder hole 3, so that the solder can flow into a welding area under capillary action through the through hole in melting, after being cleaned to be qualified, the first part to be welded 1 and the second part to be welded 2 are assembled, and the assembled part to be welded is fixed through a fixing device; while the bead solder 5 is placed on top of the second part to be soldered 2 so that the solder completely covers the solder apertures 3.
Referring to fig. 5, it is apparent from an electron microscope photograph that by adopting the method of the present application, the solder can be very uniformly spread and distributed under the capillary action, and no obvious holes are formed, and the hole rate can be controlled below 5%.
Referring to fig. 6, using the prior art internal placement method, it can be seen that the solder spread in the solder area is significantly asymmetric and non-uniform. By adopting the method, the welding seam gap is formed by local excessive climbing and insufficient climbing of the symmetrical surface; after the solder migrates under capillary action, voids are formed in the original locations.
Fig. 7 shows that the climbing height of the welding flesh on the left side is obviously higher than that on the right side by the top placement method in the prior art, and the climbing heights are inconsistent, because the liquid solder in welding climbs to the bottom of the welding part only along the axial direction of the welding part under the capillary action, at this time, the air in the welding area is completely wrapped, the capillary action is weakened, and after the vacuum is increased, the liquid solder is separated from the welding area. Flash is generated.
The foregoing description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the claims, any technical solution implemented in the scope of the claims covered by the claims, or any person skilled in the art may make many possible variations and modifications by using the disclosed method.

Claims (7)

1. A method for welding a part to be welded by a side wall solder hanging structure, comprising the steps of:
(1) Cleaning a piece to be welded before welding; drying;
(2) And (3) assembling a welding part: the to-be-welded piece in the step (1) at least comprises a first to-be-welded piece and a second to-be-welded piece, wherein the first to-be-welded piece is annular, the second to-be-welded piece is surrounded, and the first to-be-welded piece is higher than the second to-be-welded piece; the welding device comprises a first part to be welded and a second part to be welded, wherein at least two welding flux holes are formed in the surface of the first part to be welded, the welding flux holes are groove bodies which extend along the axial direction of the first part to be welded, the groove openings face the second part to be welded, a plurality of welding flux holes are symmetrically or asymmetrically distributed on the inner wall of the first part to be welded, and welding flux is placed in the welding flux holes;
(3) Preheating and welding: raising the temperature to reach the welding temperature, and allowing the molten solder to flow into a welding area between two adjacent parts to be welded under the capillary action; wherein the temperature during preheating and welding is curve rising; the curve rising is that the rising speed of the first stage is smaller than that of the second stage;
(4) Maintaining the molten state of the solder, vacuumizing to ensure that bubbles wrapped in the liquid solder overflow on the upper end surface of the piece to be soldered and are discharged from the solder holes;
(5) Cooling, reducing the temperature of the welding piece, and solidifying the welding flux; wherein the temperature at the time of cooling is a curve drop; the curve falling means that the falling speed of the first stage is smaller than that of the second stage.
2. The method of claim 1, wherein the cleaning the weldment to be welded is performed until the weldment is qualified, wherein the qualification is: and (3) the pure water drops are arranged on the surface of the to-be-welded piece, and whether the water drops accord with a preset range or not is verified by measuring the included angle between the water drops and the to-be-welded piece.
3. The method of claim 2, wherein the included angle that meets the predetermined range is at least 37 degrees.
4. The method of claim 1, wherein the solder aperture sidewall is provided with a through hole leading to a solder area where the solder aperture is not in contact.
5. The method of claim 4, wherein the direction of extension of the through hole is not coincident with the direction of extension of the solder hole.
6. The method of claim 1, wherein the solder embeds a flux.
7. The method of claim 1, wherein the weld assembly further comprises a securing device that secures the first and second workpieces to be welded in position during welding.
CN202111622149.XA 2021-12-28 2021-12-28 Method for welding to-be-welded piece through side wall solder hanging structure Active CN114273743B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006258919A (en) * 2005-03-15 2006-09-28 Olympus Medical Systems Corp Optical unit and its manufacturing method
CN103187543A (en) * 2011-12-27 2013-07-03 比亚迪股份有限公司 Sealing assembly for battery, manufacturing method of sealing assembly for battery and lithium ion battery
CN113689990A (en) * 2021-08-27 2021-11-23 深圳供电局有限公司 High-temperature superconducting strip connection annular electrode device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0818124B2 (en) * 1992-05-22 1996-02-28 昭和アルミニウム株式会社 Heat exchanger
CN109226921B (en) * 2018-11-19 2020-12-22 广西天正钢结构有限公司 Corrosion-resistant welding steel structure beneficial to solder circulation and manufacturing method thereof
CN112212086A (en) * 2020-10-12 2021-01-12 佛山市顺德区捷永电器实业有限公司 Copper-iron combined seamless air suction pipe
CN215145452U (en) * 2020-12-07 2021-12-14 苏州豪尔尼克机电有限公司 Self-positioning vacuum brazing connection structure for pipe shell-shaped product
CN113600953B (en) * 2021-08-27 2022-08-02 上海航天电子通讯设备研究所 Vacuum vapor phase welding method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006258919A (en) * 2005-03-15 2006-09-28 Olympus Medical Systems Corp Optical unit and its manufacturing method
CN103187543A (en) * 2011-12-27 2013-07-03 比亚迪股份有限公司 Sealing assembly for battery, manufacturing method of sealing assembly for battery and lithium ion battery
CN113689990A (en) * 2021-08-27 2021-11-23 深圳供电局有限公司 High-temperature superconducting strip connection annular electrode device

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