CN114273743A - Method for welding to-be-welded part through side wall solder hanging structure - Google Patents
Method for welding to-be-welded part through side wall solder hanging structure Download PDFInfo
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- CN114273743A CN114273743A CN202111622149.XA CN202111622149A CN114273743A CN 114273743 A CN114273743 A CN 114273743A CN 202111622149 A CN202111622149 A CN 202111622149A CN 114273743 A CN114273743 A CN 114273743A
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- 238000003466 welding Methods 0.000 title claims abstract description 141
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 94
- 238000000034 method Methods 0.000 title claims abstract description 49
- 230000004907 flux Effects 0.000 claims abstract description 18
- 239000007788 liquid Substances 0.000 claims abstract description 13
- 230000009471 action Effects 0.000 claims abstract description 10
- 238000001816 cooling Methods 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 26
- 238000004140 cleaning Methods 0.000 claims description 21
- 230000000630 rising effect Effects 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 18
- 230000007547 defect Effects 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 description 16
- 239000003344 environmental pollutant Substances 0.000 description 9
- 231100000719 pollutant Toxicity 0.000 description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 8
- 230000009194 climbing Effects 0.000 description 7
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000003064 anti-oxidating effect Effects 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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Abstract
A method for welding a to-be-welded part through a side wall solder hanging structure is preferably a process method for solving the weld defect in vacuum welding through the side wall solder hanging structure, wherein the to-be-welded part at least comprises a first to-be-welded part and a second to-be-welded part, the contact surface of the first to-be-welded part and the second to-be-welded part is provided with a solder hole, the solder hole is provided with an opening facing the second to-be-welded part, and solder is placed in the solder hole; raising the temperature to reach the welding temperature, and enabling the molten solder to flow into a welding area between two adjacent pieces to be welded under the capillary action; keeping the molten state of the solder, and vacuumizing to overflow bubbles wrapped in the liquid solder; cooling, lowering the temperature of the welding part and solidifying the welding flux. In the application, the solder is melted and filled into the gap between the first welding part and the second welding part together with the bubbles; in the subsequent vacuum bubble removal process, bubbles can be discharged from the solder holes, and the disturbance of the bubbles to the whole liquid solder is reduced, so that the welding quality is improved.
Description
Technical Field
The invention relates to the technical field of vacuum welding processes, in particular to a process method for solving welding seam defects in vacuum welding through a side wall hanging solder structure.
Background
In the multi-component welding process, in order to improve the welding efficiency, a plurality of components need to be assembled at one time and are welded simultaneously; this presents a problem of voids created by soldering, particularly large area solder soldering, typically tab soldering.
In order to solve the problem, the ideal welding method is vacuum welding: sucking vacuum in a state that the solder is molten, and sucking out bubbles in the solder; vacuum soldering may negatively affect additional components, particularly small areas of solder. For example, the solder is usually a welding wire or a welding ring, and during the vacuum suction process of vacuum welding, the solder is easily sucked out of the original welding seam area, so that welding defects are generated. In order to solve the problems, a two-stage welding method can be generally adopted, namely, high-melting-point solder is selected firstly to complete the welding of a group of elements; then, low-melting-point solder is selected to match with vacuum to complete the welding of another group of components.
In small area soldering, it is common for the solder to be placed either internally or in a top-opening solder placement.
Solder or a welding ring is placed in the welding piece, the solder or the welding ring needs to be placed in the middle of the welding piece in advance, the liquid solder molten at high temperature in welding extends in a climbing mode along two directions of the axis of the welding piece, the climbing distance is far larger than the thickness of the solder, the welding time is long, the climbing distances of different positions are different, the situation that the solder in part of the welding area climbs beyond the welding area is easily caused, the solder in the other part of the welding area does not climb to the position, and the welding quality is affected; this phenomenon is particularly evident after increasing the vacuum. In addition, after the solder placed inside is moved, the original position can form a cavity due to the fact that the material is spread thin, and the reliability of the product can be reduced due to the influence of high and low temperature and the like in the using process of the product.
The top opening placing method is another common welding method: the solder is arranged on the top of the glass bead, the liquid solder climbs towards the bottom of the weldment only along the axial direction of the weldment during welding, at the moment, the air in the welding area is completely wrapped, and after the vacuum is increased, the liquid solder is separated from the welding area to generate welding beading.
Disclosure of Invention
The invention aims to provide a process method for solving the weld defects in vacuum welding through a side wall tin-hanging structure, which can reduce the movement of liquid solder of a welding element with a small area to the maximum extent in the simultaneous welding of multiple components and avoid the negative influence of vacuum on the welding; thereby improving the welding quality on the whole; the welding time is saved.
In order to achieve the purpose, the invention is realized by the following technical scheme: a method for welding a to-be-welded part through a side wall solder hanging structure, preferably a process method for solving welding seam defects in vacuum welding through the side wall solder hanging structure, comprises the following steps:
(1) cleaning a to-be-welded part before welding; drying;
(2) assembling a welding part: the parts to be welded in the step (1) at least comprise a first part to be welded and a second part to be welded, wherein on the contact surface of the first part to be welded and the second part to be welded, a welding flux hole is formed in the surface of the first part to be welded, an opening facing the second part to be welded is formed in the welding flux hole, and welding fluxes are placed in the welding flux hole;
(3) preheating and welding: raising the temperature to reach the welding temperature, and enabling the molten solder to flow into a welding area between two adjacent pieces to be welded under the capillary action;
(4) keeping the molten state of the solder, and vacuumizing to overflow bubbles wrapped in the liquid solder;
(5) cooling, lowering the temperature of the welding part and solidifying the welding flux.
Further, the workpiece to be welded is cleaned to be qualified, and the qualified condition is that: and (3) placing pure water drops on the surface of the to-be-welded part, and verifying whether the pure water drops meet a preset range or not by measuring an included angle between the water drops and the to-be-welded part.
Further, the included angle meeting the preset range is at least 37 degrees.
Further, the step of cleaning the to-be-welded part further comprises cleaning verification: and (3) placing pure water drops on the surface of the to-be-welded part, verifying whether the pure water drops are qualified or not by measuring an included angle between the water drops and the to-be-welded part, and if the pure water drops are not qualified, continuing to clean until the pure water drops are qualified.
Further, the method for welding the to-be-welded part through the side wall hanging solder structure comprises the following steps:
(1) cleaning before welding: cleaning the long molecular chain on the surface of the workpiece to be welded to remove pollutants;
(2) cleaning and verifying: pure water is dripped on the surface of a to-be-welded part, whether the pure water is qualified or not is verified by measuring an included angle between the pure water and the to-be-welded part, unqualified pure water is continuously cleaned until the pure water is qualified, and the qualified angle is 37 degrees;
(3) assembling a welding part: the parts to be welded in the step (2) are specifically the assembly of a first part to be welded and a second part to be welded, a solder hole is formed in the inner surface of the first part to be welded, solder is placed in the solder hole, after the parts to be welded are cleaned to be qualified, the first part to be welded and the second part to be welded are assembled, the solder hole is communicated with a welding area between the first part to be welded and the second part to be welded, and the solder is ensured to flow into the welding area through the solder hole under the capillary action in the process of melting:
(4) preheating and welding: the temperature rises, welding is carried out after the welding temperature is reached, the welding process comprises vacuum pumping treatment, so that bubbles wrapped in liquid soldering tin overflow on the surface of the soldering tin, and the hole rate in the soldering tin is controlled within 5%;
(5) and (3) cooling: the temperature is reduced and the solder solidifies.
Further, the cleaning before welding in the step (1) adopts physical plasma cleaning: breaking and stripping pollutants of the long molecular chain on the surface of the workpiece to be welded by bombardment of high-quality and high-speed charged particles; or
Cleaning by adopting a chemical method: reacting with the pollutants with long molecular chains to generate water-soluble compounds or directly generate volatile gas to remove the pollutants.
The long molecular chain means that the number of atoms (preferably carbon atoms) constituting the main chain of the molecular chain is at least 15.
Furthermore, the soldering flux is arranged in the soldering flux.
Furthermore, the assembly of the welding part also comprises a fixing device, wherein the fixing device is used for fixing the first part to be welded and the second part to be welded and fixing the positions of the parts to be welded in the welding process.
Further, the temperature during preheating and welding is increased in a curve.
In a preferred embodiment, the curve is ascending, which means that the ascending speed of the first stage is smaller than that of the second stage. For example, the temperature increase rate before the inflection point of the temperature increase curve is smaller than the temperature increase rate after the inflection point of the temperature increase curve.
Further, the temperature during cooling is a curve drop.
In a preferred embodiment, the curve is descending, which means that the descending speed of the first stage is lower than that of the second stage. For example, the temperature drop rate before the inflection point of the temperature drop curve is smaller than the temperature drop rate after the inflection point of the temperature drop curve.
In a preferred embodiment, the side walls of the solder hole are provided with through holes leading to the soldering area where the solder hole is not in contact. In a more preferred embodiment, the through-hole extending direction does not coincide with the solder hole extending direction.
In a preferred embodiment, the first part to be welded is annular and surrounds the second part to be welded.
In a preferred embodiment, the first part to be welded is higher than the second part to be welded.
In a preferred embodiment, the solder holes are distributed symmetrically or asymmetrically on the surface of the piece to be soldered.
In a preferred embodiment, the solder hole is a slot with a notch facing the adjacent piece to be soldered.
In a preferred embodiment, the solder is tin.
In a preferred embodiment, the welding is performed in a closed box.
By the scheme, the invention at least has the following advantages:
1. after the solder is melted, the solder and the bubbles are filled in the gap between the first welding part and the second welding part; in the subsequent vacuum bubble removing process, bubbles can overflow from the upper end face of the welding part and can be discharged from the welding flux hole, and the disturbance of the bubbles to the whole liquid welding flux is reduced, so that the welding quality is improved;
2. the multi-component assembly with different welding areas can finish welding by using the same temperature curve, and the welding efficiency is improved on the premise of the same welding quality.
Drawings
FIG. 1 is a schematic view of an assembly structure of a first part to be welded and a second part to be welded;
FIG. 2 is a schematic top view of an assembly of a first part to be welded and a second part to be welded;
FIG. 3 is a schematic sectional view of an assembly of a first part to be welded and a second part to be welded;
FIG. 4 is a schematic view of a welding structure of a first to-be-welded member and a second to-be-welded member of embodiment 2;
fig. 5, 6 and 7 are graphs of welding effects of the application and the prior art.
Detailed Description
The invention is further described below with reference to the accompanying drawings:
the invention relates to a process method for solving the weld defects in vacuum welding through a side wall tin hanging structure, which comprises the following implementation steps of:
(1) cleaning before welding: cleaning the long molecular chain on the surface of the workpiece to be welded to remove pollutants;
(2) cleaning and verifying: pure water is dripped on the surface of a to-be-welded part, whether the pure water is qualified or not is verified by measuring an included angle between the pure water and the to-be-welded part, unqualified pure water is continuously cleaned until the pure water is qualified, and the qualified angle is 37 degrees;
(3) assembling a welding part: the parts to be welded in step (2) are specifically the first parts to be welded and the second parts to be welded, the inner surface of the first parts to be welded is provided with a solder hole, solder is placed in the solder hole, the side wall of the solder hole is provided with a through hole, and after the parts to be welded and the second parts to be welded are cleaned to be qualified, the first parts to be welded and the second parts to be welded are assembled:
(4) preheating and welding: controlling the temperature to slowly rise, welding after reaching the welding temperature, wherein the welding process comprises vacuum pumping treatment;
(5) and (3) cooling: and controlling the temperature to slowly reduce the temperature of the welding parts to normal temperature.
Example 1
Carry out physical plasma cleaning with first weldment 1 and the second weldment 2 of waiting before the welding, assemble the weldment after the washing is verified qualified: fig. 1-3 show an assembly embodiment of a set of parts to be welded, wherein the first part to be welded 1 is ring-shaped, the second part to be welded 2 is cylindrical, and the second part to be welded 2 is enclosed in the ring of the first part to be welded 1.
Cleaning before welding: and cleaning to remove the pollutants of the long molecular chain on the surface of the workpiece to be welded. Can be as follows: 1) cleaning by adopting physical plasma: breaking and stripping pollutants of the long molecular chain on the surface of the workpiece to be welded by bombardment of high-quality and high-speed charged particles; or) cleaning by adopting a chemical method: reacting with the pollutants with long molecular chains to generate water-soluble compounds or directly generate volatile gas to remove the pollutants.
Cleaning and verifying: and (3) placing pure water drops on the surface of the to-be-welded part, verifying whether the pure water drops are qualified or not by measuring an included angle between the water drops and the to-be-welded part, and cleaning the pure water drops which are unqualified until the pure water drops are qualified, wherein the qualified angle is 37 degrees.
The inner surface of the first part to be welded 1 is provided with four solder holes 3, solder 4 can be placed in the solder holes 3, and the side walls of the solder holes 3 are provided with transverse through holes to lead to other welding areas between the two parts to be welded so as to ensure that the solder can flow into the welding areas through the through holes under the capillary action during melting. After the welding device is cleaned to be qualified, the first part to be welded 1 and the second part to be welded 2 are assembled according to the mode of a figure 1, the assembled welding parts are fixed through a fixing device, and the material selection and the structural design of the specific heat capacity of the fixing device do not influence the direct effect of the temperature control of the welding device on welding.
The prepared solder wire 4 (such as soldering tin) is placed in the solder hole 3, the soldering flux is placed in the solder wire 4, and the soldering flux can generate anti-oxidation gas in the preheating process, so that air in the welding area is discharged out of the welding area, and the welding quality is improved.
The control temperature is enabled to slowly rise in a curve shape (the temperature rising speed is gradually increased), the anti-oxidation gas can be generated in the preheating process, air in the welding area is discharged out of the welding area, the welding quality is guaranteed, welding is carried out, vacuumizing is carried out in the welding process, bubbles wrapped in liquid soldering tin overflow on the surface of the soldering tin, and after welding is completed, the control temperature is controlled to slowly fall in a curve shape (the temperature falling speed is gradually increased) until the temperature reaches the room temperature, and a welding part is obtained.
The temperature during preheating and welding rises slowly for the curve, guarantees that welding piece and passive components and parts outside the welding piece avoid the thermal shock and cause the damage, and likewise, the temperature during cooling descends slowly for the curve, guarantees that welding piece and passive components and parts outside the welding piece avoid the cold shock and cause the damage.
Example 2
On the basis of the embodiment 1, referring to fig. 4, a first part to be welded 1 is higher than a second part to be welded 2, a containing cavity is formed in a ring of the first part to be welded 1, a solder 4 can be placed in a solder hole 3 during welding, a through hole is formed in the side wall of the solder hole 3, the solder can flow into a welding area through the through hole under the capillary action during melting, after the welding area is cleaned to be qualified, the first part to be welded 1 and the second part to be welded 2 are assembled, and the assembled welding part is fixed through a fixing device; while the solder 5 of the solder ring is placed on top of the second part to be soldered 2 so that the solder completely covers the solder hole 3.
Referring to fig. 5, it is obvious from an electron microscope photograph that, by adopting the method, the solder can be spread and distributed very uniformly under the capillary action, no obvious holes exist, and the hole rate can be controlled below 5%.
Referring to fig. 6, using the prior art internal placement method, it can be seen that the solder spread in the solder area is significantly asymmetric and non-uniform. By adopting the method, the local excessive climbing and the insufficient climbing of the symmetrical surface form a welding seam gap; after the solder migrates under the action of capillary action, voids can form in the original positions.
Fig. 7 is a top placement method in the prior art, and it can be seen that the climbing height of the left solder fillet is obviously higher than that of the right solder fillet, and the climbing heights are not consistent because the liquid solder climbs to the bottom of the weldment only along the axial direction of the weldment under the action of capillary force during welding, and at the moment, the air inside the welding area is completely wrapped, the capillary force is weakened, and the liquid solder breaks away from the welding area after vacuum is increased. Flash is produced.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and any embodiments implemented by the claims covered by the present application, or any other embodiments that can be made by the method disclosed by the above claims and the modifications thereof by those skilled in the art are also within the scope of the present invention.
Claims (10)
1. A method for welding a to-be-welded part through a side wall solder hanging structure is characterized by comprising the following steps of:
(1) cleaning a to-be-welded part before welding; drying;
(2) assembling a welding part: the parts to be welded in the step (1) at least comprise a first part to be welded and a second part to be welded, wherein on the contact surface of the first part to be welded and the second part to be welded, a welding flux hole is formed in the surface of the first part to be welded, an opening facing the second part to be welded is formed in the welding flux hole, and welding fluxes are placed in the welding flux hole;
(3) preheating and welding: raising the temperature to reach the welding temperature, and enabling the molten solder to flow into a welding area between two adjacent pieces to be welded under the capillary action;
(4) keeping the molten state of the solder, and vacuumizing to overflow bubbles wrapped in the liquid solder;
(5) cooling, lowering the temperature of the welding part and solidifying the welding flux.
2. The method of claim 1, wherein the cleaning of the weldment to be welded is qualified by: and (3) placing pure water drops on the surface of the to-be-welded part, and verifying whether the pure water drops meet a preset range or not by measuring an included angle between the water drops and the to-be-welded part.
3. The method of claim 2, wherein the predetermined range of included angles is at least 37 degrees.
4. The method of claim 1 wherein the temperature during preheating and welding is a ramp; the curve rising means that the rising speed of the first stage is smaller than that of the second stage.
5. The method of claim 1, wherein the temperature during cooling is a decrease in the curve; the curve descending means that the descending speed of the first stage is lower than that of the second stage.
6. The method of claim 1, wherein the solder via sidewalls are provided with through holes leading to solder areas not contacted by the solder via.
7. The method of claim 6, wherein the via hole extension direction is not coincident with the solder hole extension direction.
8. The method according to claim 1, characterized in that the first part to be welded is annular, surrounding the second part to be welded; the first part to be welded is higher than the second part to be welded.
9. The method of claim 1, wherein the solder has flux built in.
10. The method as in claim 1, wherein the weldment assembly further comprises a fixture that secures the first and second members to be welded in place during welding.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111622149.XA CN114273743B (en) | 2021-12-28 | 2021-12-28 | Method for welding to-be-welded piece through side wall solder hanging structure |
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| CN202111622149.XA CN114273743B (en) | 2021-12-28 | 2021-12-28 | Method for welding to-be-welded piece through side wall solder hanging structure |
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| CN114273743A true CN114273743A (en) | 2022-04-05 |
| CN114273743B CN114273743B (en) | 2023-07-25 |
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| CN113689990A (en) * | 2021-08-27 | 2021-11-23 | 深圳供电局有限公司 | High-temperature superconducting strip connection annular electrode device |
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2021
- 2021-12-28 CN CN202111622149.XA patent/CN114273743B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05318098A (en) * | 1992-05-22 | 1993-12-03 | Showa Alum Corp | Heat exchanger |
| JP2006258919A (en) * | 2005-03-15 | 2006-09-28 | Olympus Medical Systems Corp | Optical unit and its manufacturing method |
| CN103187543A (en) * | 2011-12-27 | 2013-07-03 | 比亚迪股份有限公司 | Sealing assembly for battery, manufacturing method of sealing assembly for battery and lithium ion battery |
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