CN107378166B - Fusion sealing process for reducing fusion sealing holes of electronic element cover plate - Google Patents
Fusion sealing process for reducing fusion sealing holes of electronic element cover plate Download PDFInfo
- Publication number
- CN107378166B CN107378166B CN201710633679.1A CN201710633679A CN107378166B CN 107378166 B CN107378166 B CN 107378166B CN 201710633679 A CN201710633679 A CN 201710633679A CN 107378166 B CN107378166 B CN 107378166B
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- cover plate
- solder
- sealing
- sintering
- vacuumizing
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
Abstract
A fusion sealing process for decreasing the fusion sealing holes on the cover plate of electronic element is composed of preparing solder pieces, fixing them, sintering for fusion sealing, cooling, putting them between the cover plate and base, and fusing the solder in sintering furnace.
Description
Technical Field
The invention relates to a melt sealing process for reducing melt sealing cavities of an electronic element cover plate.
Background
With the development and the update of various electronic equipment systems in China, the performance, the reliability and the volume and the weight of an electronic control system also have important influence on the performance and the reliability of a weapon system. Therefore, electronic control systems also put increasing demands on miniaturization and high reliability of electronic components, and metal-packaged electronic components cannot meet the development and demand of electronic control systems due to large size and weight, and the size and weight of electronic components are gradually reduced.
Since the chip must be isolated from the outside to prevent the chip circuit from being corroded by impurities in the air and the electrical performance of the chip circuit is reduced, the package must have good sealing performance, and the performance of the chip and the design and manufacture of the PCB connected with the chip are directly affected by the quality of the packaging technology, so that the packaging technology is very important. However, since the miniaturized electronic component has a very small outer dimension, it is impossible to hermetically seal the electronic component by the parallel seam welding method which is generally used at present.
The existing packaging method is to add solder between a cover plate and a base and then put the cover plate and the base into a high-temperature sintering furnace for sealing, for example, a welding method of electronic component sealing packaging with publication number CN102528199A, which comprises the steps of preparing solder sheets according to the shape of the contact part of the cover plate and the base, fixing the cover plate, the solder sheets and the base together, putting the cover plate, the solder sheets and the base into the sintering furnace, heating until the solder is molten, and cooling after the solder is sufficiently molten; and fixing the solder sheet between the packaging cover plate and the base, placing the solder sheet in a sintering furnace, heating to 340-360 ℃, keeping the temperature for 3-5 min, vacuumizing the sintering furnace and filling protective gas during the heating, continuously heating to the melting temperature of the solder, fully melting the solder at the temperature, and cooling. Harmful gases such as water vapor, oxygen and the like in a sintering furnace are removed and the moisture on the surface of a product is removed in a preheating stage by vacuumizing and filling nitrogen, but a certain amount of gas is inevitably contained in the solder in the manufacturing process, and the gas in the solder is diffused when the solder is melted at high temperature in the sintering furnace, so that a large-area cavity is formed between a sealing back cover plate and a welding ring, the welding quality is reduced, and the reliability is reduced.
Disclosure of Invention
In order to solve the technical problems, the invention provides a melt sealing process for reducing the melt sealing cavities of the electronic element cover plate.
The invention is realized by the following technical scheme.
The invention provides a fusion sealing process for reducing fusion sealing cavities of an electronic element cover plate, which comprises the steps of manufacturing solder sheets, fixing the solder sheets, sintering, fusing and sealing and cooling, and comprises the following steps:
Manufacturing a solder sheet, wherein the solder sheet is manufactured according to the shape of the contact part of the packaging cover plate and the base;
Fixing the solder sheet, namely fixing the solder sheet on the packaging cover plate in a spot welding mode, and then fixing the packaging cover plate and the base by a clamp after overlapping;
sintering and melt-sealing, namely fixing the solder with the cover plate and the base, then placing the fixed solder into a sintering furnace, exhausting at the temperature of 100-160 ℃, then heating and preheating at the constant temperature of 200-270 ℃, finally sintering and melt-sealing at the temperature of 340-380 ℃, and performing the cycle operation of vacuumizing and filling protective gas in the sintering furnace all the time in the preheating, sintering and melt-sealing processes;
Cooling, namely pre-cooling for 40-70 seconds at the temperature of 100-160 ℃ under the condition of continuously filling protective gas after vacuumizing for 60-80 s, then closing the sintering furnace for natural cooling
the exhaust time is 60-120 s.
And vacuumizing the sintering furnace in the exhaust process.
And in the preheating process, the sintering furnace is subjected to circulation operation of filling protective gas and then vacuumizing, wherein the circulation time is 4-8 times, the single time of filling the protective gas is 40-70 s, and the single time of vacuumizing is 60-120 s.
and in the sintering and sealing process, firstly filling protective gas for 30-50 s, then vacuumizing for 30-50 s, and finally filling the protective gas for 30-50 s.
The protective gas is nitrogen.
The invention has the beneficial effects that: the welding flux sheet is arranged between the packaging cover plate and the base, then the welding flux is melted by adopting a sintering furnace, the sealing packaging of the small-sized component can be well realized, and the invention has the remarkable characteristics of high temperature control precision, controllable welding flux melting degree, programmable temperature curve setting, no damage to the self shape of the component, good sealing performance and the like due to the adoption of the sintering furnace, is particularly suitable for the sealing welding of the metal or ceramic packaging component with small overall dimension and higher quality level, and solves the problem of the cover plate sealing cavity of the product.
Detailed Description
the technical solution of the present invention is further described below, but the scope of the claimed invention is not limited to the described.
A melting sealing process for reducing melting sealing cavities of an electronic element cover plate comprises the steps of manufacturing solder sheets, fixing the solder sheets, sintering, melting sealing and cooling, and comprises the following steps:
Manufacturing a solder sheet, wherein the solder sheet is manufactured according to the shape of the contact part of the packaging cover plate and the base; the shape of the soldering lug is the same as that of the contact part of the encapsulation cover plate and the base.
Fixing the solder sheet, namely fixing the solder sheet on the packaging cover plate in a spot welding mode, and then fixing the packaging cover plate and the base by a clamp after overlapping; the clamp selects a molybdenum clamp to clamp and fix the whole product.
Sintering and sealing, namely fixing the solder with the cover plate and the base and then placing the solder into a sintering furnace, extracting air and moisture in the sintering furnace at the temperature of 100-160 ℃, then heating and keeping the temperature constant at 200-270 ℃ for preheating, fully extracting the moisture attached to the surfaces of the sintering furnace, the cover plate and the base in the preheating stage, finally performing sintering and sealing at the temperature of 340-380 ℃, and performing the cycle operation of vacuumizing and filling protective gas in the sintering furnace all the time in the processes of preheating, exhausting and sintering and sealing; the solder is melted at high temperature and then is vacuumized, so that moisture and air generated by melting the solder are completely extracted, and then the melted solder is cooled to reduce the generation of bubbles on the sealing surface.
and cooling, namely pre-cooling for 40-70 seconds at the temperature of 100-160 ℃ under the condition of continuously filling protective gas after vacuumizing for 60-80 s, then closing the sintering furnace for natural cooling, and cooling under the condition of keeping filling gas, so that air or moisture can be prevented from entering the sealing surface in the cooling process.
The exhaust time is 60-120 s.
And vacuumizing the sintering furnace in the exhaust process.
And in the preheating process, the sintering furnace is subjected to circulation operation of filling protective gas and then vacuumizing, wherein the circulation time is 4-8 times, the single time of filling the protective gas is 40-70 s, and the single time of vacuumizing is 60-120 s.
and in the sintering and sealing process, firstly filling protective gas for 30-50 s, then vacuumizing for 30-50 s, and finally filling the protective gas for 30-50 s.
The protective gas is nitrogen.
Example 1, taking the sealing process of SOT series ceramic patches as an example,
Manufacturing a solder sheet according to the shape of the contact part of the packaging cover plate and the base; the shape of the soldering lug is the same as that of the contact part of the packaging cover plate and the base, then the soldering lug is fixed on the packaging cover plate in a spot welding mode, and then the packaging cover plate and the base are overlapped and fixed by a clamp; the clamp adopts a molybdenum clamp to clamp and fix the whole product; fixing the clamped solder with a cover plate and a base, then placing the fixed solder into a sintering furnace, extracting air and moisture in the sintering furnace through the temperature of 130 ℃ and vacuumizing 75s, then heating and preheating at the constant temperature of 230 ℃, enabling the cover plate and the solder to be heated and expanded in the preheating stage, enabling the moisture and the air in the sintering furnace to be easily discharged, enabling the moisture attached to the sintering furnace, the cover plate and the base to be fully extracted in the preheating stage through the cyclic operation of nitrogen filling 55s → vacuumizing 80s → nitrogen filling 55s → vacuumizing 80s, finally sintering and sealing through the temperature of 350 ℃, and firstly filling nitrogen 35s and then vacuumizing 40s during sealing; the method comprises the steps of melting solder at high temperature, then vacuumizing for the second time, completely pumping out moisture and air generated by melting the solder, cooling to reduce the generation of bubbles on a sealing surface, then reducing the temperature at 130 ℃, vacuumizing for 69s to discharge gas and moisture discharged in the melting process of the solder, then precooling for 49 seconds at the temperature of 130 ℃ under the condition of continuously filling protective gas, then closing a sintering furnace for natural cooling, and cooling under the condition of keeping filling gas, so that the sealing surface can be prevented from entering air or moisture in the cooling process.
Example 2, taking the sealing process of SOT-23C ceramic patch as an example,
Manufacturing a solder sheet according to the shape of the contact part of the packaging cover plate and the base; the shape of the soldering lug is the same as that of the contact part of the packaging cover plate and the base, then the soldering lug is fixed on the packaging cover plate in a spot welding mode, and then the packaging cover plate and the base are overlapped and fixed by a clamp; the clamp adopts a molybdenum clamp to clamp and fix the whole product; fixing the clamped solder with a cover plate and a base, then placing the fixed solder into a sintering furnace, extracting air and moisture in the sintering furnace through the temperature of 145 ℃ and vacuumizing 110s, then heating and keeping the temperature constant at 255 ℃ for preheating, enabling the cover plate and the solder to be heated and expanded in the preheating stage, enabling the moisture and the air in the preheating stage to be easily discharged, and enabling the attached moisture in the sintering furnace, the cover plate and the base to be fully extracted in the preheating stage through the cyclic operation of filling nitrogen 65s → vacuumizing 110s → filling nitrogen 65s → vacuumizing 110s in the preheating stage, finally sintering and sealing through the temperature of 370 ℃, and firstly filling nitrogen 45s and then vacuumizing 45s during sealing; the method comprises the steps of melting solder at high temperature, then vacuumizing for the second time to completely pump out moisture and air generated by melting the solder, cooling to reduce the generation of bubbles on a sealing surface, then reducing the temperature at 150 ℃, vacuumizing for 75s to discharge gas and moisture discharged in the melting process of the solder, precooling for 60 seconds at 150 ℃ under the condition of continuously filling protective gas, then closing a sintering furnace for natural cooling, and cooling under the condition of keeping filling gas, so that the sealing surface can be prevented from entering air or moisture in the cooling process.
Claims (1)
1. A melting sealing process for reducing melting sealing cavities of an electronic element cover plate comprises the steps of manufacturing solder sheets, fixing the solder sheets, sintering, melting sealing and cooling, and comprises the following specific steps:
Manufacturing a solder sheet, wherein the solder sheet is manufactured according to the shape of the contact part of the packaging cover plate and the base;
Fixing the solder sheet, namely fixing the solder sheet on the packaging cover plate in a spot welding mode, and then fixing the packaging cover plate and the base by a clamp after overlapping;
Sintering and sealing, namely fixing the solder with the cover plate and the base, then placing the fixed solder into a sintering furnace, exhausting at the temperature of 100-160 ℃, wherein the exhausting time is 60-120 s, and vacuumizing the sintering furnace in the exhausting process; heating and keeping the temperature constant at 200-270 ℃ for preheating, finally sintering and sealing at 340-380 ℃, wherein the sintering furnace is subjected to the circulation operations of vacuumizing and filling protective gas all the time in the preheating and sintering sealing processes, the circulation times are 4-8 times, the single time of filling the protective gas is 40-70 s, the single time of vacuumizing is 60-120 s, and the protective gas is nitrogen;
And cooling, namely pre-cooling for 40-70 seconds at the temperature of 100-160 ℃ under the condition of continuously filling protective gas after vacuumizing for 60-80 s, and then closing the sintering furnace for natural cooling.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710633679.1A CN107378166B (en) | 2017-07-28 | 2017-07-28 | Fusion sealing process for reducing fusion sealing holes of electronic element cover plate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710633679.1A CN107378166B (en) | 2017-07-28 | 2017-07-28 | Fusion sealing process for reducing fusion sealing holes of electronic element cover plate |
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| CN107378166A CN107378166A (en) | 2017-11-24 |
| CN107378166B true CN107378166B (en) | 2019-12-10 |
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| CN111128757B (en) * | 2019-12-31 | 2021-12-14 | 中国电子科技集团公司第四十七研究所 | Method for controlling water vapor and hydrogen content in integrated circuit sealed cavity |
| CN111037139B (en) * | 2019-12-31 | 2021-12-14 | 中国电子科技集团公司第四十七研究所 | Control method for sealing voidage of large-size circuit |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102528199A (en) * | 2011-12-10 | 2012-07-04 | 中国振华集团永光电子有限公司 | Welding method for sealed package of electronic components |
| CN103252548A (en) * | 2013-05-20 | 2013-08-21 | 临海市志鼎电子科技有限公司 | Once welding method for power semiconductor module |
| CN104002003A (en) * | 2014-06-10 | 2014-08-27 | 北京时代民芯科技有限公司 | Low-voidage vacuum brazing chip mounting technique free of loads |
| WO2015011785A1 (en) * | 2013-07-23 | 2015-01-29 | 千住金属工業株式会社 | Soldering apparatus and vacuum-soldering method |
| CN106825825A (en) * | 2017-03-26 | 2017-06-13 | 中国电子科技集团公司第十六研究所 | A kind of penetration rate welding method high for the assembling of microwave and millimeter wave device |
-
2017
- 2017-07-28 CN CN201710633679.1A patent/CN107378166B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102528199A (en) * | 2011-12-10 | 2012-07-04 | 中国振华集团永光电子有限公司 | Welding method for sealed package of electronic components |
| CN103252548A (en) * | 2013-05-20 | 2013-08-21 | 临海市志鼎电子科技有限公司 | Once welding method for power semiconductor module |
| WO2015011785A1 (en) * | 2013-07-23 | 2015-01-29 | 千住金属工業株式会社 | Soldering apparatus and vacuum-soldering method |
| CN104002003A (en) * | 2014-06-10 | 2014-08-27 | 北京时代民芯科技有限公司 | Low-voidage vacuum brazing chip mounting technique free of loads |
| CN106825825A (en) * | 2017-03-26 | 2017-06-13 | 中国电子科技集团公司第十六研究所 | A kind of penetration rate welding method high for the assembling of microwave and millimeter wave device |
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