CN111076581A - Edgeless sealing method and structure for vapor chamber - Google Patents

Edgeless sealing method and structure for vapor chamber Download PDF

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Publication number
CN111076581A
CN111076581A CN201811215561.8A CN201811215561A CN111076581A CN 111076581 A CN111076581 A CN 111076581A CN 201811215561 A CN201811215561 A CN 201811215561A CN 111076581 A CN111076581 A CN 111076581A
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CN
China
Prior art keywords
plate
degassing
plate body
welding
hole
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Pending
Application number
CN201811215561.8A
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Chinese (zh)
Inventor
江文雄
汪仕明
陈志伟
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Chaun Choung Technology Corp
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Chaun Choung Technology Corp
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Publication date
Application filed by Chaun Choung Technology Corp filed Critical Chaun Choung Technology Corp
Priority to CN201811215561.8A priority Critical patent/CN111076581A/en
Publication of CN111076581A publication Critical patent/CN111076581A/en
Pending legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02Header boxes; End plates
    • F28F9/04Arrangements for sealing elements into header boxes or end plates
    • F28F9/16Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling
    • F28F9/18Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling by welding

Abstract

The invention discloses a method and a structure for edgeless sealing of a temperature-uniforming plate, wherein the method comprises the steps of preparing a hollow flat plate-shaped plate body for forming the temperature-uniforming plate, arranging at least one degassing hole on the surface of the plate body, and degassing the interior of the plate body by correspondingly arranging at least one welding pipe with a degassing pipeline inside the welding pipe to the at least one degassing hole; when the degassing is finished, the surface of the plate body is welded by the at least one welding pipe to seal the at least one degassing hole, an annular sealing part is formed at the periphery of the degassing hole, and the sealing part is tightly attached to the surface of the other inner wall of the plate body from the surface of one inner wall in the cavity of the plate body; therefore, the use of the air pipe is avoided when the temperature-equalizing plate is sealed, the appearance of the temperature-equalizing plate is more attractive, and the installation is convenient.

Description

Edgeless sealing method and structure for vapor chamber
Technical Field
The present invention relates to a plate heat pipe, and more particularly to a method and a structure for sealing a vapor chamber without edges.
Background
The function and working principle of the Vapor chamber (also called as Heat conducting plate or flat Heat Pipe) is similar to that of the Heat Pipe (Heat Pipe), and the Vapor chamber and the flat Heat Pipe are both working fluids enclosed in the Pipe body or the plate body chamber to circulate through evaporation and condensation, so as to achieve the purpose of rapid Heat transfer or uniform temperature. Therefore, it has been widely used in various fields of heat dissipation.
However, in the manufacturing process of the conventional vapor chamber, because the internal cavity of the vapor chamber needs to be degassed or vacuumized, a degassing pipe needs to be connected through the edge of the plate body to reserve a degassing port, so that the vacuum degree in the cavity can be finished after the degassing operation is conveniently carried out and the degassing port is sealed. However, the conventional method is easy to leave the structure of the degassing tube, which results in poor appearance of the formed temperature equalizing plate, and especially the protruding degassing tube is easy to affect the assembly of the temperature equalizing plate in various thin electronic products, so various related structural designs for avoiding the protrusion of the degassing tube have been proposed.
However, regardless of how far away the design is made, it is inevitable that the degassing tube still exists, and therefore, the appearance of the temperature equalization plate is more or less affected.
In view of the above, the present invention provides a method for improving and solving the above-mentioned deficiencies, and aims to provide a method for improving and solving the above-mentioned deficiencies.
Disclosure of Invention
The invention mainly aims to provide a method and a structure for sealing a temperature-equalizing plate without edges.
In order to achieve the above object, the present invention provides a method for edgeless sealing of a vapor chamber, comprising the steps of:
a) preparing a hollow flat plate body for forming a temperature-uniforming plate, wherein at least one degassing hole is formed in the surface of the plate body;
b) preparing at least one welding pipe, wherein the welding pipe is internally provided with a degassing pipeline;
c) the degassing pipeline of the at least one welded pipe corresponds to the at least one degassing hole to degas the interior of the plate body;
d) when the degassing is finished, the at least one welding pipe is used for welding the surface of the plate body to seal the at least one degassing hole.
In order to achieve the above object, the present invention further provides a borderless sealing structure of a vapor chamber, wherein at least one degassing hole is formed on the surface of a hollow flat plate-shaped plate body, a closed chamber is formed in the plate body, and an annular sealing part is formed at the periphery of the degassing hole; the sealing part is formed by electric welding and is concave into the cavity, and the sealing part is tightly attached to the other inner wall surface from one inner wall surface of the plate body in the cavity.
Compared with the temperature equalizing plate in the prior art, the temperature equalizing plate has the beneficial effects that the sealing of the temperature equalizing plate is realized, and meanwhile, the air pipe is not removed, so that the appearance of the temperature equalizing plate is more attractive, and the assembly is convenient.
Drawings
FIG. 1 is a flow chart of the steps of the present invention.
FIG. 2 is a perspective view of a welded pipe and a vapor chamber of the present invention.
FIG. 3 is a cross-sectional view of a welded tube according to the present invention for degassing a vapor chamber.
FIG. 4 is a cross-sectional view of the sealing operation of the vapor chamber with the welded tube of the present invention.
Fig. 5 is a schematic perspective view of a first embodiment of a vapor chamber according to the present invention.
FIG. 6 is a schematic perspective view of a second embodiment of a vapor chamber according to the present invention before cutting.
FIG. 7 is a schematic cut-away perspective view of a second embodiment of a vapor chamber.
FIG. 8 is a schematic perspective view of a vapor chamber according to a third embodiment of the present invention before degassing.
Fig. 9 is a schematic perspective view of a sealed vapor chamber according to a third embodiment of the present invention.
FIG. 10 is a schematic cut-away perspective view of a vapor chamber according to a third embodiment of the present invention.
Symbolic illustration in the drawings:
1, a plate body; 10 plate parts; 100 cutting edges; a protrusion 101; 11 a plate portion; 110, degassing holes; 111 a sealing part; 112 cutting edges; a 113 projection; 12 a chamber; 13 capillary tissue; 2, welding the pipe; 20 a degassing pipeline; 3 supporting the rod.
Detailed Description
For a better understanding of the nature and technical aspects of the present invention, reference should be made to the following detailed description of the invention, taken in conjunction with the accompanying drawings, which are provided for purposes of illustration and description, and are not intended to limit the invention.
Please refer to fig. 1 and fig. 2, which are a flow chart of the steps of the present invention and a perspective view of the welded pipe and the temperature-equalizing plate of the present invention, respectively. The invention provides a method for edgeless sealing of a temperature-uniforming plate and a structure thereof, which can eliminate the need of arranging an air-removing pipe on the temperature-uniforming plate, reduce unnecessary forming structures and welding processes thereof and are suitable for a thinned temperature-uniforming plate.
As shown in step S1 of fig. 1: first, a hollow flat plate-like plate body 1 for constituting a Vapor chamber (Vapor chamber) is prepared. In the embodiment of the present invention, the plate body 1 may be formed by stacking two plate portions 10, 11, and a closed cavity 12 (as shown in fig. 3) is formed between the two plate portions 10, 11, and a capillary structure 13 may be disposed on the inner wall of the cavity 12, and the edges of the two plate portions 10, 11 may be sealed by a process such as ultrasonic or electric welding. In addition, in other possible embodiments, the plate body 1 can also be formed by a tube body which is flattened into a flat shape (not shown).
As mentioned above, in step S1 of fig. 1, the present invention further includes a degassing hole 110 formed on the surface of the plate body 1; or, if necessary, the degassing holes 110 may be increased to a plurality, so as to facilitate uniform and rapid degassing operation for the isothermal plate with a large plate area. The deaeration hole 110 may be provided on the surface of either the plate portion 10 or the plate portion 11, and the position thereof may be arbitrarily adjusted or changed.
Subsequently, as shown in step S2 of fig. 1: a welded pipe 2 is prepared, and a degassing pipeline 20 is provided in the welded pipe 2, and the number of the welded pipes 2 is corresponding to the number of the degassing holes 110. In the illustrated embodiment of the present invention, the welding pipe 2 may be a welding rod of a welding machine or related welding equipment, but differs therefrom in that the welding rod (i.e., the welding pipe 2 of the present invention) has the degassing circuit 20; that is, in addition to providing the welding function, the welding pipe 2 is communicated to the machine equipment (not shown) through a degassing pipeline 20 arranged in the welding pipe, so that the inside of the welding pipe 2 is provided with the degassing pipeline 20 for degassing.
Further, as shown in fig. 3 in conjunction with step S3 of fig. 1: the welding pipe 2 is utilized to correspond to the degassing hole 110 of the plate body 1, so that the degassing pipeline 20 of the welding pipe 2 directly corresponds to the degassing hole 110 from top to bottom, and thus the inside of the plate body 1 can be degassed through the degassing pipeline 20 in the welding pipe 2. In the illustrated embodiment of the present invention, the welded pipe 2 can be used to degas the interior of the plate body 1 by placing the plate body 1 on a workbench (not shown); as shown in fig. 2 and 3, a support rod 3 and the welded pipe 2 may be used to hold the plate 1 by corresponding to each other from below and above the plate 1, so that degassing and subsequent operations can be performed with reduced contact with the plate 1.
Finally, as shown in fig. 4 in conjunction with step S4 of fig. 1: after the degassing operation of step S3 is completed, the degassing hole 110 is sealed by the welded pipe 2. The electric welding is performed by using electric energy and heating, so that the surface of the plate body 1 is locally softened, the welding pipe 2 presses the plate body 1, the degassing hole 110 is tightly sealed, and a concave annular sealing part 111 is formed on the periphery of the degassing hole 110.
As shown in fig. 5, the vapor chamber of the present invention has a concave sealing portion 111 formed on any surface (e.g., the plate portion 11) of the plate body 1 for degassing. Referring to fig. 4, the sealing portion 111 is tightly attached to another inner wall surface (e.g. the plate portion 10) in the chamber 12.
Therefore, the edgeless sealing method and the edgeless sealing structure of the temperature-uniforming plate can be obtained by the steps and the structural composition.
In addition, as shown in fig. 6 and 7, in the second embodiment of the present invention, the area occupied by the sealing portion 111 on the plate body 1 can also be reduced by cutting. That is, the two plate portions 10, 11 of the plate body 1 are formed with upper and lower mutually sealed cut edges 100, 112 at one side adjacent to the sealing portion 111; after the sealing portion 111 is formed, the cut edges 100 and 112 can be removed by cutting, thereby reducing the area occupied by the sealing portion 111. In the invention, the position of the air removal opening is preferably close to the side of the plate body.
As shown in fig. 8 to 10, in the third embodiment of the present invention, the protrusions 101 and 113 for disposing the air hole 110 can be protruded from the side edges of the two plate portions 10 and 11 of the plate body 1, respectively, and after the air hole 110 on the protrusions 101 and 113 is removed by the above steps and sealed, the protrusion portions 101 and 113 are cut off from the side edges of the plate portions 10 and 11, so as to reduce the area occupied by the sealing portion 111 on the plate body 1.
It should be understood that the above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all changes in the equivalent techniques and means made by using the contents of the specification and drawings are included in the scope of the present invention.

Claims (10)

1. A method for sealing the edgeless opening of a temperature-uniforming plate is characterized by comprising the following steps:
a) preparing a hollow flat plate body for forming a temperature-uniforming plate, wherein at least one degassing hole is formed in the surface of the plate body;
b) preparing at least one welding pipe, wherein the welding pipe is internally provided with a degassing pipeline;
c) the degassing pipeline of the at least one welding pipe corresponds to the at least one degassing hole to degas the interior of the plate body; and
d) when the degassing is finished, the surface of the plate body is welded by the at least one welding pipe to seal the at least one degassing hole.
2. The method according to claim 1, wherein the plate body in step a) is formed by stacking two plate portions, and a closed chamber is formed between the two plate portions.
3. The method of claim 2, wherein the edges of the two panels are sealed.
4. The method of claim 2 or 3, wherein the chamber has capillary tissue on its inner wall.
5. The method according to claim 1, wherein step c) further comprises holding the plate by a support rod and the welded tube corresponding to each other from below and above the plate, respectively.
6. The method of claim 1, wherein step d) further comprises forming a seal around the periphery of the degassing hole after welding.
7. The method of claim 6, wherein the step d) is performed by cutting the side of the plate body adjacent to the at least one degassing opening, and the cut portion passes through the sealed portion.
8. A kind of temperature equalization plate has no edge to seal the structure, characterized by that, there is at least one deaeration hole on the surface of a plate body in the form of hollow flat, and there is a closed chamber in the plate body, and the circumference of the deaeration hole forms a annular sealing part;
the sealing part is formed by electric welding and is concave into the cavity, and the sealing part is tightly attached to the other inner wall surface from one inner wall surface of the plate body in the cavity.
9. The rimless seal of an isothermal plate according to claim 8, wherein the plate body is formed by two plate portions stacked on each other, and the closed chamber is formed between the two plate portions.
10. The rimless seal structure of claim 9, wherein the two plate portions have protrusions protruding from the side edges of the two plate portions, the protrusions and the sealing portion formed by the periphery of the air holes being partially cut off.
CN201811215561.8A 2018-10-18 2018-10-18 Edgeless sealing method and structure for vapor chamber Pending CN111076581A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811215561.8A CN111076581A (en) 2018-10-18 2018-10-18 Edgeless sealing method and structure for vapor chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811215561.8A CN111076581A (en) 2018-10-18 2018-10-18 Edgeless sealing method and structure for vapor chamber

Publications (1)

Publication Number Publication Date
CN111076581A true CN111076581A (en) 2020-04-28

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114941957A (en) * 2022-05-06 2022-08-26 中国电子科技集团公司第十研究所 Material increase manufacturing-based liquid-filled sealing tool and method for integrally-formed temperature-equalizing plate

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04197584A (en) * 1990-11-28 1992-07-17 Dengensha Mfg Co Ltd Device for sealing vacuum vessel
JPH1082591A (en) * 1996-09-09 1998-03-31 Furukawa Electric Co Ltd:The Plate type heat pipe and its manufacture
CN1844828A (en) * 2005-04-08 2006-10-11 奇鋐科技股份有限公司 Flat type heat pipe manufacturing method
US20070261243A1 (en) * 2006-05-11 2007-11-15 Hsiu-Wei Yang Method for making plate type heat pipe
CN101451791A (en) * 2007-11-28 2009-06-10 贸晖科技股份有限公司 Temperature homogenization board and its making method
CN202014433U (en) * 2011-03-18 2011-10-19 索士亚科技股份有限公司 Isothermal vapor chamber with seal
CN106052440A (en) * 2016-07-29 2016-10-26 苏州聚力电机有限公司 Sealing structure for vapor chamber
TW201709999A (en) * 2015-09-10 2017-03-16 Auras Technology Co Ltd Method of producing improved vapor chamber achieves the purpose of improving production efficiency and saving time and labor power

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04197584A (en) * 1990-11-28 1992-07-17 Dengensha Mfg Co Ltd Device for sealing vacuum vessel
JPH1082591A (en) * 1996-09-09 1998-03-31 Furukawa Electric Co Ltd:The Plate type heat pipe and its manufacture
CN1844828A (en) * 2005-04-08 2006-10-11 奇鋐科技股份有限公司 Flat type heat pipe manufacturing method
US20070261243A1 (en) * 2006-05-11 2007-11-15 Hsiu-Wei Yang Method for making plate type heat pipe
CN101451791A (en) * 2007-11-28 2009-06-10 贸晖科技股份有限公司 Temperature homogenization board and its making method
CN202014433U (en) * 2011-03-18 2011-10-19 索士亚科技股份有限公司 Isothermal vapor chamber with seal
TW201709999A (en) * 2015-09-10 2017-03-16 Auras Technology Co Ltd Method of producing improved vapor chamber achieves the purpose of improving production efficiency and saving time and labor power
CN106052440A (en) * 2016-07-29 2016-10-26 苏州聚力电机有限公司 Sealing structure for vapor chamber

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114941957A (en) * 2022-05-06 2022-08-26 中国电子科技集团公司第十研究所 Material increase manufacturing-based liquid-filled sealing tool and method for integrally-formed temperature-equalizing plate
CN114941957B (en) * 2022-05-06 2023-10-27 中国电子科技集团公司第十研究所 Integral forming temperature equalization plate liquid filling sealing tool and method based on additive manufacturing

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Application publication date: 20200428

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