CN103894697A - High-power IGBT module soldering device - Google Patents
High-power IGBT module soldering device Download PDFInfo
- Publication number
- CN103894697A CN103894697A CN201410168459.2A CN201410168459A CN103894697A CN 103894697 A CN103894697 A CN 103894697A CN 201410168459 A CN201410168459 A CN 201410168459A CN 103894697 A CN103894697 A CN 103894697A
- Authority
- CN
- China
- Prior art keywords
- liner plate
- fixing tool
- weld tabs
- soldering
- igbt module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/18—Sheet panels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a high-power IGBT module soldering device. The soldering device comprises a soldering lug fixing tool, a liner plate fixing tool and a positioning pin, wherein the soldering lug is consistent with a soldering lug in thickness and provided with a through groove for fixing the soldering lug; a through groove for fixing the liner plate to be welded is formed in the liner plate fixing tool; a through groove used for fixing a liner plate to be welded is formed in the liner plate fixing tool; the soldering lug fixing tool and the liner plate fixing tool are respectively provided with a positioning hole corresponding to the positioning pin. Formed sheet soldering flux (soldering lug) without scaling powder is adopted and put in the specific tool, so that positions of an area to be soldered, the sheet material and a liner plate element to be soldered are fixed to solder an IGBT module through the soldering lug; after soldering, it is unnecessary to clean a soldered product because no scaling powder exists, and therefore not only can module assembly efficiency be improved, but also product reliability can be improved.
Description
Technical field
The present invention relates to electronic devices and components field, particularly a kind of high-power IGBT module welder.
Background technology
Power model is in the time of encapsulation at present, conventionally adopt soldering paste to weld substrate, first paste solder coating to soldered pedestal, again the components and parts that will weld (band liner plate) are placed on paste scolder, finally the pedestal assembling and liner plate are put into soldering furnace, carry out the welding of product, but in soldering paste, contain a large amount of scaling powders, after welding cleaning, residual scaling powder can make the reliability decrease of module, for the high-power IGBT (Insulated Gate Bipolar Transistor insulated gate bipolar transistor) of high reliability, because bonding area is large, need the solder paste amounts of use many, can can residual a large amount of scaling powders at element surface and welding equipment inwall after having welded, make water cleaning equipment be difficult to scaling powder on element to clean up completely, residual scaling powder will directly have influence on product long-term reliability.Because sheet moulding scolder (weld tabs) does not exist scaling powder, after having welded, do not need to clean, can reduce matting on the one hand, on the other hand, after welding, can welding cavity not produced and be polluted, there is not welding assisted agent residuals in the product of welding, can not affect the reliability of product yet.Thereby, for high reliability module, as high-power IGBT module, adopt weld tabs welding more guaranteed to product quality.But in the time that weld tabs welds, there is no adhesiveness between element, weld tabs material and substrate, in assembling and welding process, relative position easily changes, cause welding failure or welding quality to guarantee.
Summary of the invention
Based on the deficiencies in the prior art, the problem to be solved in the present invention is to provide a kind of high-power IGBT module welder.
For solving the problems of the technologies described above, the invention provides a kind of high-power IGBT module welder, comprise substrate, it also comprises weld tabs fixing tool, liner plate fixing tool and alignment pin; Described weld tabs fixing tool is provided with the run-though space one of fixing weld tabs; Described liner plate fixing tool is provided with the run-though space two of fixing liner plate to be welded; When use, weld tabs fixing tool overlays on substrate, and liner plate fixing tool overlays on weld tabs fixing tool; The alignment pin on substrate is fixed in one end, through default locating hole on weld tabs fixing tool and liner plate fixing tool.
As a kind of high-power IGBT module of the present invention welder preferred version on the one hand: described weld tabs fixing tool and described weld tabs consistency of thickness; Described liner plate fixing tool and described liner plate consistency of thickness to be welded, to reach better fixed effect.
The present invention can be fixed on the region that substrate welds weld tabs and with the liner plate of soldered element.Can, according to the substrate of different size and liner plate element, adopt the moulding flaky material of different size and thickness, and the welding tooling of the different sizes of design, realize the welding of different size product.
Tool of the present invention has the following advantages:
1. the product surface obtaining does not have the residues such as scaling powder, and product reliability is high
2. the product that welding obtains, does not need to clean, and can raise the efficiency, cost-saving
3. the product layer uniformity obtaining is relatively good, can improve the reliability of product
4. the pollution of scaling powder to equipment be can reduce, the life-span of welding equipment and the stability of Product jointing improved
Describe the present invention in detail below in conjunction with accompanying drawing, it illustrates principle of the present invention as the part of this description by embodiment, and other aspects of the present invention, feature and advantage thereof will become very clear by this detailed description.
Accompanying drawing explanation
The accompanying drawing that forms a part of the present invention is used to provide a further understanding of the present invention, and schematic description and description of the present invention is used for explaining the present invention, does not form inappropriate limitation of the present invention.
Fig. 1 is that the present invention only places the view after weld tabs fixing tool on substrate;
Fig. 2 is that the present invention places the view after weld tabs on the basis of Fig. 1;
Fig. 3 is that the present invention places the view after liner plate on the basis of Fig. 2;
Fig. 4 is that the present invention places the view after liner plate fixing tool on the basis of Fig. 3;
Fig. 5 is overall explosive view of the present invention.
In Fig. 1-5, the corresponding relation of Reference numeral is:
1-substrate, 2-alignment pin, 3-weld tabs fixing tool,
4-weld tabs, 5-liner plate to be welded, 6-liner plate fixing tool,
7-run-though space one, 8-run-though space two.
The specific embodiment
It should be noted that, in the situation that not conflicting, the feature in embodiment and embodiment in the present invention can combine mutually.Describe below with reference to the accompanying drawings and in conjunction with the embodiments the present invention in detail.For sake of convenience, hereinafter as occur " on ", D score " left side " " right side " printed words, only represent consistent with the upper and lower, left and right direction of accompanying drawing itself, structure is not played to restriction effect.
As Figure 1-5, a kind of high-power IGBT module welder, it comprises weld tabs fixing tool 3, liner plate fixing tool 6 and alignment pin 2; Described weld tabs fixing tool 3 and weld tabs 4 consistency of thickness, and be provided with the through slot of fixing weld tabs 4; Described liner plate fixing tool 6 and liner plate to be welded 5 consistency of thickness, and be provided with the through slot of fixing liner plate 5 to be welded; On described weld tabs fixing tool 3 and liner plate fixing tool 6, be equipped with the locating hole with alignment pin 2 correspondences.
When use, first on substrate to be welded 1, put alignment pin 2, then by putting weld tabs fixing tool 3 with the locating hole of alignment pin 2 correspondences, the weld tabs locating area that can guarantee like this weld tabs fixing tool 3 is corresponding one by one with the soldered regional location of substrate 1, as shown in Figure 1.
Then, weld tabs 4 is put into weld tabs locating area, then on weld tabs 4, place liner plate 5 to be welded, as shown in Figures 2 and 3.
Then again by putting liner plate fixing tool 6 with the locating hole of alignment pin 2 correspondences, liner plate fixing tool 6 can make liner plate to be welded 5 positions fix, and guarantees the accurate location in assembling and welding process.
Finally the device assembling is put in vacuum brazing stove and is welded, realize the sheet scolder welding of IGBT module.
Compared with prior art, this welding adopts the moulding sheet scolder (weld tabs) that there is no scaling powder, flaky material is put in specific frock, make soldered region, flaky material relative fixing with soldered liner plate position of components, realize the welding of IGBT module weld tabs, after welding, there is not scaling powder, welding product do not need to clean yet, and both can improve module assembled efficiency, can improve the reliability of product yet.
The foregoing is only preferred embodiment of the present invention, in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (3)
1. a high-power IGBT module welder, comprises substrate (1), it is characterized in that: also comprise weld tabs fixing tool (3), liner plate fixing tool (6) and alignment pin (2); Described weld tabs fixing tool (3) is provided with the run-though space one (7) of fixing weld tabs (4); Described liner plate fixing tool (6) is provided with the run-though space two (8) of fixing liner plate to be welded (5); When use, it is upper that weld tabs fixing tool (3) overlays substrate (1), and liner plate fixing tool (6) overlays on weld tabs fixing tool (3); The alignment pin (2) on substrate (1) is fixed in one end, through weld tabs fixing tool (3) and the upper default locating hole of liner plate fixing tool (6).
2. high-power IGBT module welder according to claim 1, is characterized in that: described weld tabs fixing tool (3) and described weld tabs (4) consistency of thickness.
3. high-power IGBT module welder according to claim 1, is characterized in that: described liner plate fixing tool (6) and described liner plate to be welded (5) consistency of thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410168459.2A CN103894697A (en) | 2014-04-25 | 2014-04-25 | High-power IGBT module soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410168459.2A CN103894697A (en) | 2014-04-25 | 2014-04-25 | High-power IGBT module soldering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103894697A true CN103894697A (en) | 2014-07-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410168459.2A Pending CN103894697A (en) | 2014-04-25 | 2014-04-25 | High-power IGBT module soldering device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103894697A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106803488A (en) * | 2015-11-26 | 2017-06-06 | 株洲南车时代电气股份有限公司 | A kind of power model welder |
| CN107768271A (en) * | 2016-08-18 | 2018-03-06 | 株洲中车时代电气股份有限公司 | A kind of IGBT module side frame fastening method and its frock |
| US20200180060A1 (en) * | 2016-11-08 | 2020-06-11 | Flex Ltd | Wave solder pallets for optimal solder flow and methods of manufacturing |
| EP3741562A2 (en) | 2019-05-02 | 2020-11-25 | Audi AG | Method for producing a semiconductor module |
| CN112439962A (en) * | 2020-11-10 | 2021-03-05 | 中国科学院合肥物质科学研究院 | Assembly tool and assembly method for detector in aerospace craft |
| CN112475502A (en) * | 2019-09-12 | 2021-03-12 | 高尔科技股份有限公司 | Solder ring positioning method |
| CN113478149A (en) * | 2021-07-21 | 2021-10-08 | 浙江新纳陶瓷新材有限公司 | Ceramic substrate and metal ring welding tool |
| CN114284160A (en) * | 2021-11-19 | 2022-04-05 | 南瑞联研半导体有限责任公司 | IGBT module power terminal welding positioning assembly and method |
| CN116984814A (en) * | 2023-09-28 | 2023-11-03 | 上海林众电子科技有限公司 | IGBT module welding jig |
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| JP2004314138A (en) * | 2003-04-17 | 2004-11-11 | Shimada Phys & Chem Ind Co Ltd | Soldering apparatus |
| CN101890605A (en) * | 2010-07-08 | 2010-11-24 | 株洲南车时代电气股份有限公司 | Power semiconductor chip welding device |
| JP2012104520A (en) * | 2010-11-05 | 2012-05-31 | Mitsubishi Electric Corp | Component float preventing tool |
| CN103177995A (en) * | 2013-02-21 | 2013-06-26 | 西安永电电气有限责任公司 | Positioning plate for one-off welding of IGBT (insulated gate bipolar transistor) |
| CN203390459U (en) * | 2013-08-01 | 2014-01-15 | 株洲南车时代电气股份有限公司 | Welding fixture for fixing platy soldering flux onto IGBT (insulated gate bipolar transistor) module substrate |
-
2014
- 2014-04-25 CN CN201410168459.2A patent/CN103894697A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004314138A (en) * | 2003-04-17 | 2004-11-11 | Shimada Phys & Chem Ind Co Ltd | Soldering apparatus |
| CN101890605A (en) * | 2010-07-08 | 2010-11-24 | 株洲南车时代电气股份有限公司 | Power semiconductor chip welding device |
| JP2012104520A (en) * | 2010-11-05 | 2012-05-31 | Mitsubishi Electric Corp | Component float preventing tool |
| CN103177995A (en) * | 2013-02-21 | 2013-06-26 | 西安永电电气有限责任公司 | Positioning plate for one-off welding of IGBT (insulated gate bipolar transistor) |
| CN203390459U (en) * | 2013-08-01 | 2014-01-15 | 株洲南车时代电气股份有限公司 | Welding fixture for fixing platy soldering flux onto IGBT (insulated gate bipolar transistor) module substrate |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106803488B (en) * | 2015-11-26 | 2019-10-29 | 株洲南车时代电气股份有限公司 | A kind of power module welder |
| CN106803488A (en) * | 2015-11-26 | 2017-06-06 | 株洲南车时代电气股份有限公司 | A kind of power model welder |
| CN107768271A (en) * | 2016-08-18 | 2018-03-06 | 株洲中车时代电气股份有限公司 | A kind of IGBT module side frame fastening method and its frock |
| CN107768271B (en) * | 2016-08-18 | 2020-03-27 | 株洲中车时代电气股份有限公司 | IGBT module side frame fastening method and tool thereof |
| US20200180060A1 (en) * | 2016-11-08 | 2020-06-11 | Flex Ltd | Wave solder pallets for optimal solder flow and methods of manufacturing |
| US11348896B2 (en) | 2019-05-02 | 2022-05-31 | Audi Ag | Method for producing a semiconductor module by using adhesive attachment prior to sintering |
| EP3741562A2 (en) | 2019-05-02 | 2020-11-25 | Audi AG | Method for producing a semiconductor module |
| CN112475502A (en) * | 2019-09-12 | 2021-03-12 | 高尔科技股份有限公司 | Solder ring positioning method |
| CN112439962A (en) * | 2020-11-10 | 2021-03-05 | 中国科学院合肥物质科学研究院 | Assembly tool and assembly method for detector in aerospace craft |
| CN112439962B (en) * | 2020-11-10 | 2022-05-10 | 中国科学院合肥物质科学研究院 | Assembly tool and assembly method for detector in aerospace craft |
| CN113478149A (en) * | 2021-07-21 | 2021-10-08 | 浙江新纳陶瓷新材有限公司 | Ceramic substrate and metal ring welding tool |
| CN113478149B (en) * | 2021-07-21 | 2023-09-19 | 浙江新纳陶瓷新材有限公司 | Ceramic substrate and metal ring welding tool |
| CN114284160A (en) * | 2021-11-19 | 2022-04-05 | 南瑞联研半导体有限责任公司 | IGBT module power terminal welding positioning assembly and method |
| CN116984814A (en) * | 2023-09-28 | 2023-11-03 | 上海林众电子科技有限公司 | IGBT module welding jig |
| CN116984814B (en) * | 2023-09-28 | 2024-03-26 | 上海林众电子科技有限公司 | IGBT module welding jig |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140702 |