CN203942698U - Based on the PCB encapsulating structure of the miniature SMT components and parts of lightweight - Google Patents
Based on the PCB encapsulating structure of the miniature SMT components and parts of lightweight Download PDFInfo
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- CN203942698U CN203942698U CN201420307345.7U CN201420307345U CN203942698U CN 203942698 U CN203942698 U CN 203942698U CN 201420307345 U CN201420307345 U CN 201420307345U CN 203942698 U CN203942698 U CN 203942698U
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- pad
- smt
- square
- pcb
- utility
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- 229910000679 solder Inorganic materials 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 12
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 7
- 230000002093 peripheral effect Effects 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 32
- 230000005670 electromagnetic radiation Effects 0.000 abstract description 9
- 239000006071 cream Substances 0.000 description 18
- 238000003466 welding Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses a kind of PCB encapsulating structure based on the miniature SMT components and parts of lightweight, comprise pcb board base material, be at least two and stretching being distributed on this pcb board base material, and being provided with the SMT solder mask that square pad windows windows, and be arranged on the SMT pad of square pad in windowing, SMT pad is four symmetrical eight-sided formation that the equal long limit hypotenuse head and the tail equal with four connect and compose, wherein, the four edges that square pad is windowed is close on four long limits of SMT pad one by one correspondence, four corners that four hypotenuses of SMT pad are windowed with square pad are corresponding one by one, and the angle between the hypotenuse of SMT pad and long limit is greater than 90 °, the SMT solder mask outer peripheral shape of windowing is all identical with SMT pad with arrangement mode.The utility model reasonable in design, can effectively prevent that electromagnetic radiation source from producing, and has solved well the problem that connects tin short circuit and weld insufficient or dry joint.
Description
Technical field
The utility model relates to a kind of PCB encapsulating structure, and what be specifically related to is a kind of PCB encapsulating structure based on the miniature SMT components and parts of lightweight.
Background technology
At present, for the PCB encapsulating structure of lightweight microminiature SMT components and parts (as 0201,0402,0603,0805,1206,1210 classes), it exists following defect in pad layout process:
(1) SMT solder mask window and SMT pad be all square or rectangular design conventionally, SMT pad is arranged on during square pad windows, and SMT pad four edges is close to the square pad corresponding four edges (as shown in Figure 1) of windowing, thus, the Copper Foil of pcb board itself will be because of having≤existence of the sharp-pointed or isolated area of 90 ° and cause applying copper region and produce electromagnetic radiation source (as shown in the stain in Fig. 2), and then there is electromagnetic interference (EMI).
(2) due to volume and the area constraints of pcb board itself, and SMT pad adopts square or rectangular design, thereby when having multiple SMT pads side by side when layout, excessive physical appearance can easily cause between adjacent S MT pad and occur connecting tin short circuit phenomenon, thereby affects function and the profile of product.
(3) because SMT pad adopts square or rectangular design, thereby in the time being coated with tin cream and overflow occur, due to SMT pad profile and corner excessive, tin cream easily disperses to the corner of SMT pad, and decentralization is too high, thereby causes lacking tin in the middle of pad, and then cause SMT to weld insufficient or generation dry joint, there is the problem of failure welding, but also wasted tin cream, increased production cost.
In sum, be necessary the PCB encapsulating structure of existing lightweight microminiature SMT components and parts to improve.
Utility model content
The purpose of this utility model is to provide a kind of PCB encapsulating structure based on the miniature SMT components and parts of lightweight, and the PCB that mainly solves the miniature SMT components and parts of existing lightweight is encapsulated in the tin short circuit of the company of existence, failure welding in pad layout process and easily produces the problem of electromagnetic radiation source.
To achieve these goals, the technical solution adopted in the utility model is as follows:
Based on the PCB encapsulating structure of the miniature SMT components and parts of lightweight, comprise pcb board base material, be at least two and stretching being distributed on this pcb board base material, and being provided with the SMT solder mask that square pad windows windows, and be arranged on the SMT pad of square pad in windowing, described SMT pad is four symmetrical eight-sided formation that the equal long limit hypotenuse head and the tail equal with four connect and compose, wherein, the four edges that square pad is windowed is close on four long limits of SMT pad one by one correspondence, four corners that four hypotenuses of SMT pad are windowed with square pad are corresponding one by one, and the angle between the hypotenuse of SMT pad and long limit is greater than 90 °, the described SMT solder mask outer peripheral shape of windowing is all identical with SMT pad with arrangement mode.
Further, in the space that four hypotenuses of described SMT pad and square pad are windowed between four corresponding corners, be equipped with copper mesh.
Again further, described copper mesh is paved with SMT pad and the square pad space between windowing.
Compared with prior art, the utlity model has following beneficial effect:
(1) the utility model is symmetrical eight-sided formation by SMT pad design, compare existing square or rectangle SMT pad, its volume and area dwindle to some extent, thereby do not affecting in SMT pad function situation, so the material of making has not only been saved in design, reduce cost of manufacture, and increase the distance between four corners of adjacent S MT pad, the direct benefit of bringing is thus to have reduced the risk that connects tin, and also for pcb board base material has been vacateed more space, due to lightweight microminiature device, the area of its pcb board own is less, therefore, structural design of the present utility model can be well for pad and other components and parts carry out layout and design on pcb board base material, and then enhance productivity, improve outward appearance and the function of product.
(2) the utility model adopts the SMT pad of symmetrical eight-sided formation, because the angle between its hypotenuse and long limit is greater than 90 °, thereby can effectively avoid PCB to apply producing the sharp-pointed or isolated area of≤90 ° when copper, and then avoid Copper Foil to produce electromagnetic radiation source, prevent electronic product internal component and extraneous electromagnetic interference thereof.
(3) the utility model adopts the SMT pad of symmetrical eight-sided formation, by dwindling the area of SMT pad, and remove the existence of square corner, thereby in the time of coating tin cream, both can prevent that tin cream from excessively disperseing to corner, can limit again the flowing space of tin cream in SMT pad, make tin cream concentrate on better pad center, thereby make pad and components and parts weld together more fully, avoid occurring that SMT welds the phenomenon of insufficient or dry joint, cause the waste of scolder and tin cream.
(4) in the space of the utility model between SMT pad and square pad are windowed, be paved with copper mesh, it can effectively reduce grounding wire impedance in having good thermal diffusivity, further improves the anti-electromagnetic interference capability of pcb board.
(5) the utility model efficiently solves existing SMT pad because profile is excessive and exist the factor of corner to cause connecting the problem of tin short circuit and failure welding, it has not only significantly optimized the performance of pcb board circuit, and scolder and tin cream are saved, reduce production cost, and avoided tin cream owing to dealing with improperly, plug-in unit pin to be polluted.
Brief description of the drawings
Fig. 1 is the schematic diagram of existing pad structure.
Fig. 2 is the window position view of middle electromagnetic signal radiation source of SMT solder mask.
Fig. 3 is structural representation of the present utility model.
Principle schematic when Fig. 4 is existing pad structure coating tin cream.
Principle schematic when Fig. 5 is the utility model coating tin cream.
Wherein, the parts name that Reference numeral is corresponding is called:
1-PCB plate substrate, 2-SMT solder mask is windowed, and the square pad of 3-is windowed, 4-SMT pad, the long limit of 41-, 42-hypotenuse, 5-copper mesh.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail, and execution mode of the present utility model includes but not limited to the following example.
Embodiment
As shown in Figure 3, the utility model is mainly for the PCB encapsulation of the miniature SMT components and parts of lightweight of 0201,0402,0603,0805,1206,1210 types, and it comprises that pcb board base material 1, SMT solder mask window 2 and SMT pad 4.Described SMT solder mask is windowed and is at least two, and stretching being distributed on pcb board base material 1, and each SMT solder mask is windowed and is equipped with square pad in 2 and windows 3.Described SMT pad 4 is arranged on square pad and windows in 3, and SMT pad 4 is four symmetrical eight-sided formation that equal long limit 41 hypotenuse 42 head and the tail equal with four connect and compose, wherein, four long limits of SMT pad 4 are corresponding is one by one close to window 3 four edges of square pad, and the hypotenuse of SMT pad is greater than 90 ° with the angle of growing between limit.The described SMT solder mask 2 outer peripheral shapes of windowing are all identical with SMT pad 4 with arrangement mode.
Because window 3 four edges of square pad is close on four long limits of SMT pad, thereby four hypotenuses of SMT pad and square pad window and all can have the space of a right-angled triangle between 3 corresponding four corners, the utility model is covered with copper mesh 5 in this space.
According to said structure design, set forth in the mode of principle the effect that technical solutions of the utility model are brought below, the utility model has solved electromagnetic radiation source generation simultaneously, has connected tin short circuit, SMT welding is insufficient or the problem such as dry joint, as described below respectively:
Electromagnetic radiation source:
Above-mentioned mentioning, in pcb board circuit, electromagnetic radiation source mainly concentrates on sharply (≤90 °) or isolated deposited copper region, and the utility model is from SMT bond pad shapes and structural design, because the angle between its symmetrical octagonal hypotenuse and long limit is greater than 90 °, therefore when the utility model can effectively avoid PCB to apply copper, produce the sharp-pointed or isolated area of≤90 °, and then avoid Copper Foil to produce electromagnetic radiation source, prevent electromagnetic interference, and in conjunction with the setting of copper mesh, can further improve the anti-electromagnetic interference capability of pcb board base material.
Connect tin short circuit and the insufficient or dry joint of SMT welding:
As shown in Figure 4,5, in figure, filled arrows is that risk connects tin region, the overflow area that hollow arrow is tin cream.Tradition SMT pad is at PCB element side by side when layout, due to volume and the area constraints of the pcb board of these type of lightweight microminiature devices such as 0201,0402,0603,0805,1206 itself, and SMT pad physical appearance is large, the short reason of distance between four corners of adjacent pad, can significantly increase the possibility that connects tin short circuit, adopt pad design of the present utility model can effectively reduce the bad phenomenon that connects tin short circuit, avoid to a great extent this type of risk, realize efficient layout and the design of SMT pad on the PCB element of lightweight microminiature device.And, in the PCB of the miniature SMT components and parts of lightweight encapsulation, tradition quadrangle SMT pad is after coating tin cream, during through backflow high temperature, tin cream can fully melt, and owing to crossing fusing point and the excessive physical appearance of SMT pad of high temperature, therefore under the impact of some external factors (as air-flow or vibrations), the tin cream melting can be easy to overflow to four limits and corner (Fig. 4) of pad, causes the middle tin that lacks of pad, causes SMT to weld insufficient or generation dry joint.
Pad design of the present utility model has been dwindled the physical appearance of SMT pad, after making tin cream cross fusing point, can be melted in better SMT pad center (Fig. 5), solve tin cream because of the undue problem of disperseing of the factors such as vibrations and air-flow, components and parts and SMT pad can more effectively be welded together, fully reduced the bad phenomenon of welding insufficient or dry joint.
Although the utility model structure is simple, but due to volume and area less, thereby its design and practice being not easy, only have size, shape and the position of accurate assurance pad, and spread ingeniously copper mesh and intercept, could effectively reduce and connect tin risk, and avoid pcb board to occur electromagnetic radiation, interference, guarantee product function, and improve product appearance.Design compactness in the utility model details is very strong, and the entirety being made up of details has significantly been optimized the performance of PCB encapsulation, for the layout of SMT pad has been brought obvious benefit.Test shows, adopts PCB encapsulating structure of the present utility model, and it did not almost occur connecting the phenomenon of tin short circuit and electromagnetic interference in the time of layout SMT pad, and therefore, the utility model compared to existing technology, has substantial feature and progress.
Above-described embodiment is only a kind of preferred embodiment of the present utility model; should be in order to not limit protection range of the present utility model; in every case any change and polishing of having no essential meaning of having done under body design thought of the present utility model and spirit; or be equal to the technical scheme of displacement; its technical problem solving is consistent with the utility model in fact, within also should belonging to protection range of the present utility model.
Claims (3)
1. the PCB encapsulating structure based on the miniature SMT components and parts of lightweight, comprise pcb board base material (1), be at least two and stretching being distributed on this pcb board base material (1), and be provided with the square pad SMT solder mask of (3) window (2) of windowing, and be arranged on the SMT pad (4) that square pad is windowed in (3), it is characterized in that: described SMT pad (4) is four symmetrical eight-sided formation that equal long limit (41) hypotenuse (42) head and the tail equal with four connect and compose, wherein, the window four edges of (3) of square pad is close on four long limits of SMT pad (4) one by one correspondence, window four corners of (3) of four hypotenuses of SMT pad and square pad are corresponding one by one, and the angle between the hypotenuse of SMT pad (42) and long limit (41) is greater than 90 °, described SMT solder mask (2) the outer peripheral shape of windowing is all identical with SMT pad (4) with arrangement mode.
2. the PCB encapsulating structure based on the miniature SMT components and parts of lightweight according to claim 1, is characterized in that: in the space that (4) four hypotenuses of described SMT pad and square pad are windowed between four corners corresponding to (3), be equipped with copper mesh (5).
3. the PCB encapsulating structure based on the miniature SMT components and parts of lightweight according to claim 2, is characterized in that: described copper mesh (5) is paved with the space that SMT pad (4) and square pad are windowed between (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420307345.7U CN203942698U (en) | 2014-06-11 | 2014-06-11 | Based on the PCB encapsulating structure of the miniature SMT components and parts of lightweight |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420307345.7U CN203942698U (en) | 2014-06-11 | 2014-06-11 | Based on the PCB encapsulating structure of the miniature SMT components and parts of lightweight |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203942698U true CN203942698U (en) | 2014-11-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420307345.7U Expired - Lifetime CN203942698U (en) | 2014-06-11 | 2014-06-11 | Based on the PCB encapsulating structure of the miniature SMT components and parts of lightweight |
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| Country | Link |
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| CN (1) | CN203942698U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104093267A (en) * | 2014-06-11 | 2014-10-08 | 深圳市磊科实业有限公司 | PCB packaging structure based on light-quality SMT component |
-
2014
- 2014-06-11 CN CN201420307345.7U patent/CN203942698U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104093267A (en) * | 2014-06-11 | 2014-10-08 | 深圳市磊科实业有限公司 | PCB packaging structure based on light-quality SMT component |
| CN104093267B (en) * | 2014-06-11 | 2017-02-22 | 深圳市磊科实业有限公司 | PCB packaging structure based on light-quality SMT component |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |