CN104093267A - PCB packaging structure based on light-quality SMT component - Google Patents
PCB packaging structure based on light-quality SMT component Download PDFInfo
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- CN104093267A CN104093267A CN201410254973.8A CN201410254973A CN104093267A CN 104093267 A CN104093267 A CN 104093267A CN 201410254973 A CN201410254973 A CN 201410254973A CN 104093267 A CN104093267 A CN 104093267A
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- Prior art keywords
- pad
- smt
- square
- pcb
- edges
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- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 229910000679 solder Inorganic materials 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 32
- 230000005670 electromagnetic radiation Effects 0.000 abstract description 9
- 238000003466 welding Methods 0.000 abstract description 8
- 239000000758 substrate Substances 0.000 abstract description 3
- 239000006071 cream Substances 0.000 description 18
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Abstract
The invention discloses a PCB packaging structure based on a light-quality SMT component. The PCB packaging structure comprises a PCB substrate, at least two SMT solder mask layer windows which are straightened to be uniformly distributed on the PCB substrate and are provided with square pad windows, and an SMT pad which is arranged in the square pad window. The SMT pad is of a symmetrical octagon structure formed by connecting four equal long edges with four equal inclined edges in an end-to-end manner. The four long edges of the SMT pad are closely attached to the four edges of the square pad windows in one-to-one correspondence, the four inclined edges of the SMT pad are in one-to-one-correspondence with the four corners of the square pad window, the included angles between the inclined edges of the SMT pad and the long edges of the SMT pad are greater than 90 degrees, and the outer edges of the SMT solder mask layer windows have the same shape and arrangement modes as the SMT pad. The advantages are as follows: the structural design is reasonable, an electromagnetic radiation source can be effectively prevented from generating, and the problems of tin connection short circuits and insufficient welding or false welding are well solved.
Description
Technical field
The present invention relates to a kind of PCB encapsulating structure, what be specifically related to is a kind of PCB encapsulating structure based on the miniature SMT components and parts of lightweight.
Background technology
At present, for the PCB encapsulating structure of lightweight microminiature SMT components and parts (as 0201,0402,0603,0805,1206,1210 classes), it exists following defect in pad layout process:
(1) SMT solder mask window and SMT pad be all square or rectangular design conventionally, SMT pad is arranged on during square pad windows, and SMT pad four edges is close to the square pad corresponding four edges of windowing, thus, the Copper Foil of pcb board itself will be because of having≤existence of the sharp-pointed or isolated area of 90 ° and cause applying copper region and produce electromagnetic radiation source (as shown in the stain in Fig. 1), and then there is electromagnetic interference (EMI).
(2) due to volume and the area constraints of pcb board itself, and SMT pad adopts square or rectangular design, thereby when having a plurality of SMT pads side by side during layout, excessive physical appearance can easily cause between adjacent S MT pad and occur connecting tin short circuit phenomenon, thereby affects function and the profile of product.
(3) because SMT pad adopts square or rectangular design, thereby when being coated with tin cream and overflow occur, due to SMT pad profile and corner excessive, tin cream easily disperses to the corner of SMT pad, and decentralization is too high, thereby causes lacking tin in the middle of pad, and then cause SMT to weld insufficient or generation dry joint, there is the problem of failure welding, but also wasted tin cream, increased production cost.
In sum, be necessary the PCB encapsulating structure of existing lightweight microminiature SMT components and parts to improve.
Summary of the invention
The object of the present invention is to provide a kind of PCB encapsulating structure based on the miniature SMT components and parts of lightweight, the PCB that mainly solves the miniature SMT components and parts of existing lightweight is encapsulated in the tin short circuit of the company of existence, failure welding in pad layout process and easily produces the problem of electromagnetic radiation source.
To achieve these goals, the technical solution used in the present invention is as follows:
PCB encapsulating structure based on the miniature SMT components and parts of lightweight, comprise pcb board base material, be at least two and stretching being distributed on this pcb board base material, and being provided with the SMT solder mask that square pad windows windows, and be arranged on the SMT pad of square pad in windowing, described SMT pad is four equal long limits and four symmetrical eight-sided formation that equal hypotenuse connects and composes from beginning to end, wherein, the four edges that square pad is windowed is close on four long limits of SMT pad one by one correspondence, four corners that four hypotenuses of SMT pad are windowed with square pad are corresponding one by one, and the angle between the hypotenuse of SMT pad and long limit is greater than 90 °, the described SMT solder mask outer peripheral shape of windowing is all identical with SMT pad with arrangement mode.
Further, in the space that four hypotenuses of described SMT pad are windowed between four corresponding corners with square pad, be equipped with copper mesh.
Again further, described copper mesh is paved with SMT pad and the square pad space between windowing.
Compared with prior art, the present invention has following beneficial effect:
(1) the present invention is symmetrical eight-sided formation by SMT pad design, compare existing square or rectangle SMT pad, its volume and area dwindle to some extent, thereby do not affecting in SMT pad function situation, so the material of making has not only been saved in design, reduced cost of manufacture, and increased the distance between four corners of adjacent S MT pad, the direct benefit of bringing is thus to have reduced the risk that connects tin, and also for pcb board base material has been vacateed more space, due to lightweight microminiature device, the area of its pcb board own is less, therefore, structural design of the present invention can be well for pad and other components and parts carry out layout and design on pcb board base material, and then enhance productivity, improve outward appearance and the function of product.
(2) the present invention adopts the SMT pad of symmetrical eight-sided formation, because the angle between its hypotenuse and long limit is greater than 90 °, thereby produce the sharp-pointed or isolated area of≤90 ° can effectively avoid PCB to apply copper time, and then avoid Copper Foil to produce electromagnetic radiation source, prevent electronic product internal component and extraneous electromagnetic interference thereof.
(3) the present invention adopts the SMT pad of symmetrical eight-sided formation, by dwindling the area of SMT pad, and removed the existence of square corner, thereby when coating tin cream, both can prevent that tin cream from excessively disperseing to corner, can limit again the flowing space of tin cream in SMT pad, make tin cream concentrate on better pad center, thereby make pad and components and parts weld together more fully, avoid occurring that SMT welds the phenomenon of insufficient or dry joint, cause the waste of scolder and tin cream.
(4) in the space of the present invention between SMT pad and square pad are windowed, be paved with copper mesh, it can effectively reduce grounding wire impedance when having good thermal diffusivity, further improves the anti-electromagnetic interference capability of pcb board.
(5) the present invention efficiently solves existing SMT pad because profile is excessive and exist the factor of corner to cause connecting the problem of tin short circuit and failure welding, it has not only significantly optimized the performance of pcb board circuit, and scolder and tin cream have been saved, reduce production cost, and avoided tin cream owing to dealing with improperly, plug-in unit pin to be polluted.
Accompanying drawing explanation
Fig. 1 is the window position view of middle electromagnetic signal radiation source of SMT solder mask.
Fig. 2 is structural representation of the present invention.
Principle schematic when Fig. 3 is existing pad structure coating tin cream.
Fig. 4 is the principle schematic of the present invention while being coated with tin cream.
Wherein, the parts name that Reference numeral is corresponding is called:
1-PCB plate substrate, 2-SMT solder mask is windowed, and the square pad of 3-is windowed, 4-SMT pad, the long limit of 41-, 42-hypotenuse, 5-copper mesh.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described, and embodiments of the present invention include but not limited to the following example.
Embodiment
As shown in Figure 2, the present invention is mainly for the PCB encapsulation of the miniature SMT components and parts of lightweight of 0201,0402,0603,0805,1206,1210 types, and it comprises that pcb board base material 1, SMT solder mask window 2 and SMT pad 4.Described SMT solder mask is windowed and is at least two, and stretching being distributed on pcb board base material 1, and each SMT solder mask is windowed and is equipped with square pad in 2 and windows 3.Described SMT pad 4 is arranged on square pad and windows in 3, and SMT pad 4 is four equal long limits 41 and four symmetrical eight-sided formation that equal hypotenuse 42 head and the tail connect and compose, wherein, four long limits of SMT pad 4 are corresponding is one by one close to window 3 four edges of square pad, and the hypotenuse of SMT pad is greater than 90 ° with the angle of growing between limit.The described SMT solder mask 2 outer peripheral shapes of windowing are all identical with SMT pad 4 with arrangement mode.
Because window 3 four edges of square pad is close on four long limits of SMT pad, thereby four hypotenuses of SMT pad and square pad window and all can have the space of a right-angled triangle between 3 corresponding four corners, the present invention is covered with copper mesh 5 in this space.
According to said structure design, in the mode of principle, set forth the effect that technical solution of the present invention is brought below, the present invention has solved electromagnetic radiation source generation simultaneously, has connected tin short circuit, SMT welding is insufficient or the problem such as dry joint, as described below respectively:
Electromagnetic radiation source:
Above-mentioned mentioning, in pcb board circuit, electromagnetic radiation source mainly concentrates on sharply (≤90 °) or isolated deposited copper region, and the present invention is from SMT bond pad shapes and structural design, because the angle between its symmetrical octagonal hypotenuse and long limit is greater than 90 °, when therefore the present invention can effectively avoid PCB to apply copper, produce the sharp-pointed or isolated area of≤90 °, and then avoid Copper Foil to produce electromagnetic radiation source, prevent electromagnetic interference, and in conjunction with the setting of copper mesh, can further improve the anti-electromagnetic interference capability of pcb board base material.
Connect tin short circuit and the insufficient or dry joint of SMT welding:
As shown in Figure 3,4, in figure, filled arrows is that risk connects tin region, the overflow area that hollow arrow is tin cream.Tradition SMT pad is at PCB element side by side during layout, volume and area constraints due to the pcb board of these type of lightweight microminiature devices such as 0201,0402,0603,0805,1206 itself, and SMT pad physical appearance is large, the short reason of distance between four corners of adjacent pad, can significantly increase the possibility that connects tin short circuit, adopt pad design of the present invention can effectively reduce the bad phenomenon that connects tin short circuit, avoid to a great extent this type of risk, realize efficient layout and the design of SMT pad on the PCB element of lightweight microminiature device.And, in the PCB of the miniature SMT components and parts of lightweight encapsulation, tradition quadrangle SMT pad is after coating tin cream, during through backflow high temperature, tin cream can fully melt, and owing to crossing fusing point and the excessive physical appearance of SMT pad of high temperature, therefore under the impact of some external factors (as air-flow or vibrations), the tin cream melting can be easy to overflow to four limits and corner (Fig. 3) of pad, causes the middle tin that lacks of pad, causes SMT to weld insufficient or generation dry joint.
Pad design of the present invention has been dwindled the physical appearance of SMT pad, after making tin cream cross fusing point, can be melted in better SMT pad center (Fig. 4), solved tin cream because of the undue problem of disperseing of the factors such as vibrations and air-flow, components and parts and SMT pad can more effectively be welded together, fully reduced the bad phenomenon of welding insufficient or dry joint.
Although structure of the present invention is simple, but due to volume and area less, thereby its design and practice being not easy, size, shape and the position of only having accurate assurance pad, and spread ingeniously copper mesh and intercept, could effectively reduce and connect tin risk, and avoid pcb board to occur electromagnetic radiation, interference, guarantee product function, and improve product appearance.Design compactness in details of the present invention is very strong, and the integral body consisting of details has significantly been optimized the performance of PCB encapsulation, for the layout of SMT pad has been brought obvious benefit.Test shows, adopts PCB encapsulating structure of the present invention, and it did not almost occur connecting the phenomenon of tin short circuit and electromagnetic interference when layout SMT pad, and therefore, the present invention compared to existing technology, has outstanding substantive distinguishing features and significant progressive.
Above-described embodiment is only a preferred embodiment of the present invention; should be in order to not limit the scope of the invention; in every case any change and polishing of having no essential meaning of having done under body design thought of the present invention and spirit; or be equal to the technical scheme of displacement; its technical problem solving is consistent with the present invention in fact, within also should belonging to protection scope of the present invention.
Claims (3)
1. the PCB encapsulating structure based on the miniature SMT components and parts of lightweight, comprise pcb board base material (1), be at least two and stretching being distributed on this pcb board base material (1), and be provided with the square pad SMT solder mask of (3) window (2) of windowing, and be arranged on the SMT pad (4) that square pad is windowed in (3), it is characterized in that: described SMT pad (4) is the symmetrical eight-sided formation that four equal long limits (41) and four equal hypotenuses (42) head and the tail connect and compose, wherein, the window four edges of (3) of square pad is close on four long limits of SMT pad (4) one by one correspondence, window four corners of (3) of four hypotenuses of SMT pad and square pad are corresponding one by one, and the angle between the hypotenuse of SMT pad (42) and long limit (41) is greater than 90 °, described SMT solder mask (2) the outer peripheral shape of windowing is all identical with SMT pad (4) with arrangement mode.
2. the PCB encapsulating structure based on the miniature SMT components and parts of lightweight according to claim 1, is characterized in that: in the space that (4) four hypotenuses of described SMT pad and square pad are windowed between four corners corresponding to (3), be equipped with copper mesh (5).
3. the PCB encapsulating structure based on the miniature SMT components and parts of lightweight according to claim 2, is characterized in that: described copper mesh (5) is paved with the space that SMT pad (4) and square pad are windowed between (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410254973.8A CN104093267B (en) | 2014-06-11 | 2014-06-11 | PCB packaging structure based on light-quality SMT component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410254973.8A CN104093267B (en) | 2014-06-11 | 2014-06-11 | PCB packaging structure based on light-quality SMT component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104093267A true CN104093267A (en) | 2014-10-08 |
| CN104093267B CN104093267B (en) | 2017-02-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410254973.8A Active CN104093267B (en) | 2014-06-11 | 2014-06-11 | PCB packaging structure based on light-quality SMT component |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1620844A (en) * | 2002-01-18 | 2005-05-25 | 日本电气株式会社 | Printed-wiring board and electronic device |
| CN202262058U (en) * | 2011-07-20 | 2012-05-30 | 青岛海信移动通信技术股份有限公司 | Printed circuit board (PCB) and mobile terminal |
| CN102843857A (en) * | 2011-06-24 | 2012-12-26 | 发那科株式会社 | Printed wiring board with lands |
| CN203040015U (en) * | 2012-12-17 | 2013-07-03 | 上海斐讯数据通信技术有限公司 | PCB bonding pad |
| CN103796433A (en) * | 2014-01-16 | 2014-05-14 | 广州兴森快捷电路科技有限公司 | Manufacturing method of circuit board mixed surface process |
| CN203942698U (en) * | 2014-06-11 | 2014-11-12 | 深圳市磊科实业有限公司 | Based on the PCB encapsulating structure of the miniature SMT components and parts of lightweight |
| US8927987B2 (en) * | 2010-05-21 | 2015-01-06 | Panasonic Corporation | Semiconductor device including external connection pads and test pads |
-
2014
- 2014-06-11 CN CN201410254973.8A patent/CN104093267B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1620844A (en) * | 2002-01-18 | 2005-05-25 | 日本电气株式会社 | Printed-wiring board and electronic device |
| US8927987B2 (en) * | 2010-05-21 | 2015-01-06 | Panasonic Corporation | Semiconductor device including external connection pads and test pads |
| CN102843857A (en) * | 2011-06-24 | 2012-12-26 | 发那科株式会社 | Printed wiring board with lands |
| CN202262058U (en) * | 2011-07-20 | 2012-05-30 | 青岛海信移动通信技术股份有限公司 | Printed circuit board (PCB) and mobile terminal |
| CN203040015U (en) * | 2012-12-17 | 2013-07-03 | 上海斐讯数据通信技术有限公司 | PCB bonding pad |
| CN103796433A (en) * | 2014-01-16 | 2014-05-14 | 广州兴森快捷电路科技有限公司 | Manufacturing method of circuit board mixed surface process |
| CN203942698U (en) * | 2014-06-11 | 2014-11-12 | 深圳市磊科实业有限公司 | Based on the PCB encapsulating structure of the miniature SMT components and parts of lightweight |
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| Publication number | Publication date |
|---|---|
| CN104093267B (en) | 2017-02-22 |
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Effective date of registration: 20240229 Address after: 337099 First Floor, Building 6, Tongjiu Road, Pingxiang Economic and Technological Development Zone, Pingxiang City, Jiangxi Province Patentee after: Wangshi Technology Co.,Ltd. Country or region after: China Address before: 518000, 4th and 5th floors of Dongfang Information Port R&D Building, No. 2 Xinxi Road, North District, High tech Zone, Nanshan District, Shenzhen, Guangdong Province Patentee before: Shenzhen Leike Industrial Co.,Ltd. Country or region before: China |
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