CN205050832U - Audio power amplifier circuit pack - Google Patents
Audio power amplifier circuit pack Download PDFInfo
- Publication number
- CN205050832U CN205050832U CN201520858401.0U CN201520858401U CN205050832U CN 205050832 U CN205050832 U CN 205050832U CN 201520858401 U CN201520858401 U CN 201520858401U CN 205050832 U CN205050832 U CN 205050832U
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- Prior art keywords
- pin
- slide glass
- fin
- lead frame
- glass district
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model discloses an audio power amplifier circuit pack, including the lead frame body, the lead frame body includes fin, slide glass district and external pin, and fin, slide glass district and external pin are as an organic whole, have offered the locating hole on the fin, and the both sides of fin and slide glass district junction are equipped with the breach, and go up the cover and is equipped with the plastic -sealed body in the slide glass district, and external pin includes middle pin and side pin, and middle pin is distinguished with the slide glass and is connected, and muscle bonding region in being equipped with on the middle pin is equipped with the pin bonding region on the side pin. The breach set up the combination fastness that can increase between lead frame and the plastic -sealed body, be difficult for appearing the phenomenon that lead frame and plastic -sealed body break away from after making the product encapsulation operate the computer. The bonded region can be strengthened for planar the setting in the surface of well muscle bonding region, but the copper wire of the most volumes of bonded has reduced the copper wire simultaneously and has appeared disconnected risk at subsequent plastic envelope in -process. Frame construction is simple for this lead wire, the installation of being convenient for, and manufacturing cost is lower simultaneously, safe and reliable.
Description
Technical field
The utility model relates to the technical field of semiconductor packages, is specifically related to the encapsulation of a kind of audio power amplifier circuit.
Background technology
Encapsulation not only plays a part to install, fixing, sealing, protect IC and strengthen the aspects such as electric heating property; but also be wired on the pin of package casing by the contact on chip; these pins can be connected with other devices again, thus realize the connection of inside chip and external circuit.Lead frame is as one of parts very crucial in semiconductor components and devices and integrated antenna package, and it plays supporting chip, scatter and disappear work calories and the important function being connected external circuit.In prior art, because of fin and slide glass district junction non-notch or breach less, product there will be the phenomenon that lead frame and plastic-sealed body depart from encapsulation after machine.In addition, the surface, bonding region in conventional lead frame mostly is curved surface and arranges, and copper wire number bonding on pin is reduced, and copper wire there will be the risk of fracture of wire in follow-up plastic packaging process.The end of pin mostly is the straight angle and arranges, and causes external pin to be not easy to insert in circuit board.
Utility model content
In order to solve the problems of the technologies described above, the utility model provides a kind of easy encapsulation, easily inserts the audio power amplifier circuit encapsulation of circuit board.
In order to reach above-mentioned technique effect, the technical solution of the utility model is as follows:
An audio power amplifier circuit encapsulation, comprise lead frame body, lead frame body comprises fin, slide glass district and external pin, and fin, slide glass district and external pin are integrated.Fin offers location hole, and district is arranged with plastic-sealed body to slide glass, and the both sides of fin and junction, slide glass district are provided with breach, and external pin comprises interim pins and side pin, and interim pins is connected with slide glass district, and interim pins is provided with middle muscle bonding region
,the surface of middle muscle bonding region is plane, and side pin is provided with pin bonding region.Interim pins is connected with side pin, and side pin is not connected with slide glass district.
Its beneficial effect is: fin and both sides, junction, slide glass district breach the binding strength that can increase between lead frame and plastic-sealed body is set, not easily there is the phenomenon that lead frame and plastic-sealed body depart from after making product encapsulate upper machine.The surface of middle muscle bonding region is that plane arranges and can strengthen bond area, the copper wire of bonding greater number, reduces the risk that fracture of wire appears in copper wire in follow-up plastic packaging process simultaneously.
In some embodiments, external pin equi-spaced apart is arranged, and the end of external pin is provided with wedge angle.
Its beneficial effect is: external pin equi-spaced apart is arranged, and can realize arranging comparatively thick and fast, thus arrange pin as much as possible.The setting of extension tube attached foot portion wedge angle is convenient to external pin to be inserted on circuit board.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the utility model is further described.
Fig. 1 is the structural representation of the audio power amplifier circuit encapsulation of the utility model one execution mode;
Fig. 2 is the end view of the audio power amplifier circuit encapsulation of the utility model one execution mode.
Corresponding component title in figure represented by numeral:
1. lead frame, 2. plastic-sealed body, 3. fin, 4. slide glass district, 5. interim pins, 6. side pin, 7. in muscle bonding region, 8. pin bonding region, 9. location hole, 10. breach.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the utility model is described in further detail:
As shown in Fig. 1 ~ 2, the utility model discloses the encapsulation of a kind of audio power amplifier circuit, comprise lead frame body 1, lead frame body 1 comprises fin 3, slide glass district 4 and external pin, fin 3, slide glass district 4 and external pin are integrated, fin 3 offers location hole 9, slide glass district 4 is arranged with plastic-sealed body 2, fin 3 is provided with breach 10 with the both sides of junction, slide glass district 4, external pin comprises interim pins 5 and side pin 6, interim pins 5 is connected with slide glass district 4, interim pins 5 is provided with middle muscle bonding region 7, the surface of middle muscle bonding region 7 is plane, side pin 6 is provided with pin bonding region 8, interim pins 5 is connected with side pin 6, side pin 6 is not connected with slide glass district 4.External pin equi-spaced apart is arranged, and the end of external pin is provided with wedge angle.
Can produce certain heat after product encapsulation energising, this heat can be distributed by fin 3, slide glass district 4, for carrying the chip of electronic devices and components, can fill single, double chip two kinds of forms.Fin 3 and both sides, junction, slide glass district 4 breach the binding strength that can increase between lead frame 1 and plastic-sealed body 2 is set, not easily there is the phenomenon that lead frame 1 and plastic-sealed body 2 depart from after making product encapsulate upper machine.The copper wire of bonding some on chip pressure point position, muscle bonding region 7 and pin bonding region 8 during the copper wire other end connects.The surface of middle muscle bonding region 7 is that plane arranges and can strengthen bond area, the copper wire of bonding greater number, reduces the risk that fracture of wire appears in copper wire in follow-up plastic packaging process simultaneously.Can by Product jointing on corresponding object by external pin.External pin equi-spaced apart is arranged, and can realize arranging comparatively thick and fast, thus arrange pin as much as possible, the setting of extension tube attached foot portion wedge angle is convenient to external pin to be inserted on circuit board.
Below be only preferred implementation of the present utility model; it should be pointed out that for the person of ordinary skill of the art, under the prerequisite not departing from the utility model creation design; can also make some distortion and improvement, these all belong to protection range of the present utility model.
Claims (2)
1. an audio power amplifier circuit encapsulation, it is characterized in that, comprise lead frame body (1), described lead frame body (1) comprises fin (3), slide glass district (4) and external pin, described fin (3), slide glass district (4) and external pin are integrated, described fin (3) offers location hole (9), described slide glass district (4) is arranged with plastic-sealed body (2), described fin (3) is provided with breach (10) with the both sides of slide glass district (4) junction, described external pin comprises interim pins (5) and side pin (6), described interim pins (5) is connected with slide glass district (4), described interim pins (5) is provided with middle muscle bonding region (7), the surface of described middle muscle bonding region (7) is plane, described side pin (6) is provided with pin bonding region (8), described interim pins (5) is connected with side pin (6), described side pin (6) is not connected with slide glass district (4).
2. audio power amplifier circuit encapsulation according to claim 1, is characterized in that, described external pin equi-spaced apart is arranged, and the end of described external pin is provided with wedge angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520858401.0U CN205050832U (en) | 2015-10-30 | 2015-10-30 | Audio power amplifier circuit pack |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520858401.0U CN205050832U (en) | 2015-10-30 | 2015-10-30 | Audio power amplifier circuit pack |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205050832U true CN205050832U (en) | 2016-02-24 |
Family
ID=55344378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520858401.0U Active CN205050832U (en) | 2015-10-30 | 2015-10-30 | Audio power amplifier circuit pack |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205050832U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107275295A (en) * | 2017-06-05 | 2017-10-20 | 深圳市力生美半导体股份有限公司 | A kind of power IC device, method for packing and supply unit |
-
2015
- 2015-10-30 CN CN201520858401.0U patent/CN205050832U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107275295A (en) * | 2017-06-05 | 2017-10-20 | 深圳市力生美半导体股份有限公司 | A kind of power IC device, method for packing and supply unit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |