CN206774534U - A kind of dual-channel audio High-power amplifier circuit encapsulating structure - Google Patents
A kind of dual-channel audio High-power amplifier circuit encapsulating structure Download PDFInfo
- Publication number
- CN206774534U CN206774534U CN201720431799.9U CN201720431799U CN206774534U CN 206774534 U CN206774534 U CN 206774534U CN 201720431799 U CN201720431799 U CN 201720431799U CN 206774534 U CN206774534 U CN 206774534U
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- CN
- China
- Prior art keywords
- pin
- power amplifier
- amplifier circuit
- channel audio
- dual
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of dual-channel audio High-power amplifier circuit encapsulating structure, belong to semiconductor devices and integrated antenna package field, the encapsulating structure includes：Plastic-sealed body and lead frame, plastic-sealed body is arranged on the lead frames, lead frame includes fin and external pin, slide glass area is provided with fin, slide glass area is used to carry dual-channel audio High-power amplifier circuit chip, the end both sides connection U-shaped folder of fin, external pin includes interim pins and side pin, interim pins are connected with slide glass area, and side pin is located at the outside edges in slide glass area, and the U-shaped folder that the end both sides of the fin of lead frame are connected makes frame structure more firm.
Description
Technical field
Semiconductor devices and integrated antenna package field are the utility model is related to, especially a kind of dual-channel audio is high-power
Power amplifier encapsulating structure.
Background technology
Encapsulated circuit not only plays a part of installation, fixed, sealing, protection chip and enhancing electric heating property etc., and
And be also wired to by the contact on chip on the pin of package casing, these pins can be connected with other devices again
Connect, so as to realize the connection of inside chip and external circuit.Lead frame is as in semiconductor components and devices and integrated antenna package
Extremely one of crucial part, it plays support chip, the important function of work calories and connection external circuit of scattering and disappearing.
In the prior art, the structure of lead frame is generally not sufficiently stable, and is easily deformed, and due to circuit encapsulating structure
Encapsulation volume it is generally larger, product there is also the phenomenon that lead frame and plastic-sealed body depart from encapsulation after machine.
Utility model content
The present inventor is regarding to the issue above and technical need, it is proposed that a kind of dual-channel audio High-power amplifier circuit package
Structure.Using this encapsulating structure lead frame can be made more firm, be less prone to deformation.
The technical solution of the utility model is as follows：
A kind of dual-channel audio High-power amplifier circuit encapsulating structure, it is characterised in that encapsulating structure includes：Plastic-sealed body and
Lead frame, plastic-sealed body are arranged on the lead frames, and lead frame includes fin and external pin, and slide glass is provided with fin
Area, slide glass area are used to carry dual-channel audio High-power amplifier circuit chip, and the end both sides connection U-shaped folder of fin is external
Pin includes interim pins and side pin, and interim pins are connected with slide glass area, and side pin is located at the outside edges in slide glass area.
Its further technical scheme is that fixed hole position is offered on plastic-sealed body.
Its further technical scheme is that the end of interim pins is provided with middle muscle bonding part, and the end of side pin is provided with
Pin bonding part, the pressure point position of dual-channel audio High-power amplifier circuit chip are bonded with copper wire, and the other end of copper wire is with
Muscle bonding part connects with pin bonding part.
Advantageous effects of the present utility model are：
1st, the end both sides connection U-shaped folder of the fin of lead frame, the setting of U-shaped folder make frame structure more firm, no
Easily deform, while be easy to later stage rib cutting.
2nd, fixed hole position is offered on plastic-sealed body, the setting of fixed hole position can fix product on a heat sink in user
When so that product and radiator are in close contact, so that product can preferably radiate.
3rd, the end of interim pins is provided with middle muscle bonding part, and the end of side pin is provided with pin bonding part so that can be with
A number of copper wire is bonded on chip pressure point position, the copper wire other end is connected with middle muscle bonding part and pin bonding part.
Brief description of the drawings
Fig. 1 is the structural representation of dual-channel audio High-power amplifier circuit encapsulating structure of the present utility model.
Fig. 2 is the structural representation of dual-channel audio High-power amplifier circuit encapsulating structure of the present utility model.
Corresponding component in figure represented by numeral is entitled：
1. plastic-sealed body, 2. lead frames, 3. fin, 4. slide glass areas, 5. fixed hole positions, 6.U types folder, 7. interim pins,
8. muscle bonding part, 10. pin bonding parts in side pin, 9..
Embodiment
Specific embodiment of the present utility model is described further below in conjunction with the accompanying drawings.
As illustrated in fig. 1 and 2, the utility model discloses a kind of dual-channel audio High-power amplifier circuit encapsulating structure, bag
Plastic-sealed body 1 and lead frame 2 are included, plastic-sealed body 1 is set on lead frame 2, and lead frame 2 includes fin 3 and external pin,
Slide glass area 4 is provided with fin 3, slide glass area 4 is used for the chip for carrying electronic component, and in the utility model, slide glass area 4 uses
In carrying dual-channel audio High-power amplifier circuit chip.Encapsulating structure encapsulation can produce certain heat after being powered, and especially exist
When assembling dual-channel audio High-power amplifier circuit chip (2*7w), it should take into full account that its power radiates caused by big, lead to for this
This heat can be distributed by crossing fin 3.
The end both sides connection U-shaped folder 6 of fin 3, the setting of U-shaped folder 6 make frame structure more firm, are less prone to change
Shape.External pin includes interim pins 7 and side pin 8, and interim pins 7 are connected with slide glass area 4, and side pin 8 is located at slide glass
The outside edges in area 4.The end of interim pins 7 is provided with middle muscle bonding part 9, and the end of side pin 8 is provided with pin bonding part 10,
The pressure point position of dual-channel audio High-power amplifier circuit chip is bonded with copper wire, the other end of copper wire and middle muscle bonding part 9 and
Pin bonding part 10 is connected, and the quantity for the copper wire that the utility model is bonded to chip pressure point position is not construed as limiting.
It should be noted that encapsulating structure disclosed in the utility model is by the way that plastic-sealed body 1 is set in into lead frame 2
On, chip is packaged using plastic-sealed body 1 made, in lead frame 2, interim pins 7 and side pin 8 are to pass through
What dowel was connected,, can also be by dowel except plastic-sealed body 1 is set on lead frame 2 when making overall package structure
Cut-out so that in overall package structure, each external pin is all mutual independent mutually disjunct, subsequently through interim pins
7 and side pin 8 by Product jointing to corresponding object.Optionally, fixed hole position 5 is further opened with plastic-sealed body 1, it is fixed
The setting of hole position 5 can be when user fixes product on a heat sink so that product and radiator are in close contact, so as to product
Can preferably it radiate.
The above is only preferred embodiment of the present utility model, and the utility model is not limited to above example.It can manage
Solution, those skilled in the art do not depart from it is of the present utility model spirit and design on the premise of directly export or associate other
Improve and change, be considered as being included within the scope of protection of the utility model.
Claims (3)
1. a kind of dual-channel audio High-power amplifier circuit encapsulating structure, it is characterised in that the encapsulating structure includes：Plastic-sealed body
(1) it is set in lead frame (2), the plastic-sealed body (1) on the lead frame (2), the lead frame (2) includes radiating
Piece (3) and external pin, the fin (3) is interior to be provided with slide glass area (4), and the slide glass area (4) is used to carry dual-channel audio
High-power amplifier circuit chip, the end both sides connection U-shaped folder (6) of the fin (3), the external pin include intervalve
Pin (7) and side pin (8), the interim pins (7) are connected with slide glass area (4), and the side pin (8) is located at the slide glass
The outside edges in area (4).
2. dual-channel audio High-power amplifier circuit encapsulating structure according to claim 1, it is characterised in that the plastic packaging
Fixed hole position (5) is offered on body (1).
3. dual-channel audio High-power amplifier circuit encapsulating structure according to claim 1, it is characterised in that the centre
The end of pin (7) is provided with middle muscle bonding part (9), and the end of the side pin (8) is provided with pin bonding part (10), described double
The pressure point position of channel audio High-power amplifier circuit chip is bonded with copper wire, and the other end of the copper wire is bonded with the middle muscle
Portion (9) and the pin bonding part (10) connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720431799.9U CN206774534U (en) | 2017-04-21 | 2017-04-21 | A kind of dual-channel audio High-power amplifier circuit encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720431799.9U CN206774534U (en) | 2017-04-21 | 2017-04-21 | A kind of dual-channel audio High-power amplifier circuit encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206774534U true CN206774534U (en) | 2017-12-19 |
Family
ID=60634395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720431799.9U Expired - Fee Related CN206774534U (en) | 2017-04-21 | 2017-04-21 | A kind of dual-channel audio High-power amplifier circuit encapsulating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206774534U (en) |
-
2017
- 2017-04-21 CN CN201720431799.9U patent/CN206774534U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171219 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |