CN208489186U - A kind of ultra high density SOT23 supporting structure suitable for Discrete device packaging - Google Patents
A kind of ultra high density SOT23 supporting structure suitable for Discrete device packaging Download PDFInfo
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- CN208489186U CN208489186U CN201821271352.0U CN201821271352U CN208489186U CN 208489186 U CN208489186 U CN 208489186U CN 201821271352 U CN201821271352 U CN 201821271352U CN 208489186 U CN208489186 U CN 208489186U
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- sot23
- discrete device
- supporting structure
- high density
- ultra high
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Abstract
The utility model relates to integrated antenna package technical fields, in particular to a kind of ultra high density SOT23 supporting structure suitable for Discrete device packaging, including a coil type bar shaped substrate, multiple carrier units are set on coil type bar shaped substrate, multiple carrier units are on the coil type bar shaped substrate in the matrix arrangement of 27 × 60 rows of column, wherein, it is counted from 1 row carrier unit of end, every 3 row carrier units, one plastic packaging runner is set, it arranges 3 row carrier units on the both sides of every plastic packaging runner, the vertical one third etc. of the coil type bar shaped substrate divides at line position muscle in setting respectively, the both sides of the middle muscle are respectively distributed 9 column carrier units.Compared with prior art, the ultra high density SOT23 supporting structure suitable for Discrete device packaging of the utility model increases the arrangement density of carrier unit, improve production efficiency, reduce packaging cost, it can chip placement on rectangle Ji Dao and first lead foot, using very flexibly, it is particularly suitable for the encapsulation of discrete device.
Description
[technical field]
It is the utility model relates to integrated antenna package technical field, in particular to a kind of suitable for the super of Discrete device packaging
High density SOT23 supporting structure.
[background technique]
Chip package is a kind of technology for being packaged the plastics of integrated circuit insulation or ceramic material, not only acts as peace
It puts, fix, sealing, protecting the effect of chip and increased thermal conductivity energy, but also being to link up the chip interior world and external circuit
Bridge.Discrete device and IC are two opposite concepts, and discrete device is the chip with simple function, and IC is to be integrated with
The complicated integrated circuit of a variety of device functions, the two is mutually irreplaceable, and be respectively widely used field.Divide at present
Vertical device is mainly diode, triode, metal-oxide-semiconductor product, and with the further maturation of technique, chip size is smaller and smaller, single
The number of die integrated on a disk is more and more.The encapsulation unit price of discrete device is lower and lower, in order to adapt to this trend, mentions
High packaging density promotes packaging efficiency, and compression packaging cost is the project there is an urgent need to research at present.
Current SOT23 is encapsulated based on strip-type, and number of rows is based on 8 rows, the carrier unit of single tablet after cutting
Number only several hundred, the efficiency of plastic packaging rib cutting process is very low.
[utility model content]
In order to overcome the above problem, the utility model proposes what one kind can effectively solve the above problems to be suitable for discrete device
The ultra high density SOT23 supporting structure of encapsulation.
The utility model solves a kind of technical solution that above-mentioned technical problem provides: providing a kind of suitable for discrete device
The ultra high density SOT23 supporting structure of encapsulation, including a coil type bar shaped substrate are arranged on the coil type bar shaped substrate multiple
Carrier unit, the multiple carrier unit is on the coil type bar shaped substrate in the matrix arrangement of 27 × 60 rows of column, wherein
It is counted from 1 row carrier unit of end, one plastic packaging runner is set every 3 row carrier units, the both sides of every plastic packaging runner are each
It arranges 3 row carrier units, the vertical one third etc. of the coil type bar shaped substrate divides at line position muscle in setting respectively, described
The both sides of middle muscle are respectively distributed 9 column carrier units.
Preferably, the carrier unit includes for placing the rectangle Ji Dao of master chip, being distributed in the two sides rectangle Ji Dao
Two first lead feet and the second terminal pin for being distributed in the other side rectangle Ji Dao, the interior pin and rectangle base of second terminal pin
Island is connected.
Preferably, the width of the first lead foot is the half of rectangle base island width, and secondary core is placed on first lead foot
Piece.
Preferably, the outer pin of the first lead foot and the second terminal pin is connected by lever, forms carrier unit
Whole support construction.
Preferably, the chip is bonded with the rectangle Ji Dao using elargol or eutectic is connect.
Preferably, it is connected between the chip and first lead foot and the second terminal pin by bonding wire.
Preferably, the outer pin of the first lead foot and the second terminal pin is connected by scolding tin with pcb board.
Compared with prior art, the ultra high density SOT23 supporting structure suitable for Discrete device packaging of the utility model
The arrangement density of carrier unit is increased, the carrier unit of 27 × 60 rows of column of setting on coil type bar shaped substrate, every after cutting
Independent tablet has 1620 carrier units, and the installation unit density of single piece is improved close to 5 times, die bond, wire bonding process
Index times number is less, more efficient, and plastic packaging process presses identical modulus calculation, and daily production capacity improves 4 times or more, rib cutting process
It is calculated by identical punching speed, daily production capacity improves 4 times or so, reduces packaging cost；On rectangle Ji Dao and first lead foot
Can chip placement, master chip is placed on rectangle Ji Dao, secondary chip is placed on first lead foot, application is very flexible, especially
It is suitble to the encapsulation of discrete device.
[Detailed description of the invention]
Fig. 1 is that a kind of structure of the ultra high density SOT23 supporting structure suitable for Discrete device packaging of the utility model is shown
It is intended to；
Fig. 2 is enlarged drawing at A in Fig. 1.
[specific embodiment]
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used for explaining
The utility model is not used to limit the utility model.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute in the utility model embodiment
It is only limitted to the relative position in given view, rather than absolute position.
In addition, the description for being such as related to " first ", " second " in the present invention is used for description purposes only, and cannot manage
Solution is its relative importance of indication or suggestion or the quantity for implicitly indicating indicated technical characteristic.Define as a result, " the
One ", the feature of " second " can explicitly or implicitly include at least one of the features.It is " more in the description of the present invention,
It is a " it is meant that at least two, such as two, three etc., unless otherwise specifically defined.
Referring to Fig. 1, a kind of ultra high density SOT23 supporting structure suitable for Discrete device packaging of the utility model,
Including a coil type bar shaped substrate 1, multiple carrier units 2, the multiple carrier unit are set on the coil type bar shaped substrate 1
2 be in matrix arrangement on the coil type bar shaped substrate 1, and the multiple carrier unit 2 is specifically in the matrix of 27 × 60 rows of column
Formula arrangement.Wherein, it is counted from 1 row carrier unit 2 of end, a plastic packaging runner 3, every modeling is set every 3 row carrier units 2
It respectively arranges 3 row carrier units 2 on the both sides of envelope runner 3.When plastic packaging, plastic packaging material enters from plastic packaging runner 3, separately flows into the branch on both sides
It is dynamic to flow into subsequent afterflow from gum-injecting port for 2 gum-injecting port of frame unit, until plastic packaging material fills up all carrier units 2, it is final entire suitable
Ultra high density SOT23 supporting structure for Discrete device packaging is all filled up by plastic packaging material.The coil type bar shaped substrate 1 erects
Divide at line position muscle 4 in being arranged respectively to one third etc., for improving the intensity of coil type bar shaped substrate 1.The middle muscle 4
Both sides are respectively distributed 9 column carrier units 2.
The ultra high density SOT23 supporting structure suitable for Discrete device packaging uses coil type bar shaped substrate 1, solid
It can work continuously when crystalline substance charging, cut into the independent tablet of a rule after the completion of die bond, be convenient for subsequent plastic packaging operation.Winding
The carrier unit 2 of 27 × 60 rows of column of setting on formula bar shaped substrate 1, every independent tablet has 1620 carrier units 2 after cutting.
Referring to Fig. 2, the carrier unit 2 includes for placing the rectangle base island 21 of chip, being distributed in rectangle base island 21
Two first lead feet 23 of two sides and the second terminal pin 22 for being distributed in 21 other side of rectangle base island, second terminal pin 22
Interior pin is connected with rectangle base island 21, and master chip is placed on rectangle base island 21, and the first lead foot 23 can be used for placing pair
Chip, the width of first lead foot 23 are the half of 21 width of rectangle base island.First lead foot 23 and the second terminal pin 22 it is outer
Pin is connected by lever 24, forms the whole support construction of carrier unit 2.Chip and rectangle base island 21 use elargol
Bonding or eutectic connection, are connected between chip and first lead foot 23 and the second terminal pin 22 by bonding wire, chip, first lead
Foot 23, the second terminal pin 22 and bonding wire finally are wrapped up to form independent protection structure by plastic packaging material in plastic packaging.Wherein,
The outer pin of first lead foot 23 and the second terminal pin 22 is connected by scolding tin with pcb board.
Compared with prior art, the ultra high density SOT23 supporting structure suitable for Discrete device packaging of the utility model
The arrangement density of carrier unit is increased, the carrier unit 2 of 27 × 60 rows of column of setting, every after cutting on coil type bar shaped substrate 1
The independent tablet of item has 1620 carrier units 2, and the installation unit density of single piece is improved close to 5 times, die bond, wire bonding process
Index times number is less, more efficient, and plastic packaging process presses identical modulus calculation, and daily production capacity improves 4 times or more, rib cutting process
It is calculated by identical punching speed, daily production capacity improves 4 times or so, reduces packaging cost；Rectangle base island 21 and first lead foot
On 23 can chip placement, master chip is placed on rectangle base island 21, secondary chip is placed on first lead foot 23, application is very clever
It is living, it is particularly suitable for the encapsulation of discrete device.
The above is only the preferred embodiment of the present invention, and therefore it does not limit the scope of the patent of the utility model,
All any modifications made within the design of the utility model, equivalent replacement and improvement etc. should be included in the utility model
Scope of patent protection in.
Claims (7)
1. a kind of ultra high density SOT23 supporting structure suitable for Discrete device packaging, which is characterized in that including a coil type item
Multiple carrier units are arranged on the coil type bar shaped substrate in shape substrate, and the multiple carrier unit is in the coil type bar shaped
In the matrix arrangement of 27 × 60 rows of column on substrate, wherein count from 1 row carrier unit of end, set every 3 row carrier units
Set a plastic packaging runner, the both sides of every plastic packaging runner are arranged 3 row carrier units, and vertical the three of the coil type bar shaped substrate
Middle muscle is respectively set at/mono- bisector position, the both sides of the middle muscle are respectively distributed 9 column carrier units.
2. being suitable for the ultra high density SOT23 supporting structure of Discrete device packaging as described in claim 1, which is characterized in that
The carrier unit include for place the rectangle Ji Dao of master chip, be distributed in the two sides rectangle Ji Dao two first lead feet and point
It is distributed in the second terminal pin of the other side rectangle Ji Dao, the interior pin of second terminal pin is connected with rectangle Ji Dao.
3. being suitable for the ultra high density SOT23 supporting structure of Discrete device packaging as claimed in claim 2, which is characterized in that
The width of the first lead foot is the half of rectangle base island width, and secondary chip is placed on first lead foot.
4. being suitable for the ultra high density SOT23 supporting structure of Discrete device packaging as claimed in claim 2, which is characterized in that
The outer pin of the first lead foot and the second terminal pin is connected by lever, forms the support construction of carrier unit entirety.
5. being suitable for the ultra high density SOT23 supporting structure of Discrete device packaging as claimed in claim 2, which is characterized in that
The chip is bonded with the rectangle Ji Dao using elargol or eutectic is connect.
6. being suitable for the ultra high density SOT23 supporting structure of Discrete device packaging as claimed in claim 2, which is characterized in that
It is connected between the chip and first lead foot and the second terminal pin by bonding wire.
7. being suitable for the ultra high density SOT23 supporting structure of Discrete device packaging as claimed in claim 2, which is characterized in that
The outer pin of the first lead foot and the second terminal pin is connected by scolding tin with pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821271352.0U CN208489186U (en) | 2018-08-07 | 2018-08-07 | A kind of ultra high density SOT23 supporting structure suitable for Discrete device packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821271352.0U CN208489186U (en) | 2018-08-07 | 2018-08-07 | A kind of ultra high density SOT23 supporting structure suitable for Discrete device packaging |
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| CN208489186U true CN208489186U (en) | 2019-02-12 |
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| CN201821271352.0U Active CN208489186U (en) | 2018-08-07 | 2018-08-07 | A kind of ultra high density SOT23 supporting structure suitable for Discrete device packaging |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110211941A (en) * | 2019-05-22 | 2019-09-06 | 深圳市信展通电子有限公司 | High density IDF type lead frame |
-
2018
- 2018-08-07 CN CN201821271352.0U patent/CN208489186U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110211941A (en) * | 2019-05-22 | 2019-09-06 | 深圳市信展通电子有限公司 | High density IDF type lead frame |
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Address after: 518000 The whole building on the first floor of the factory building of Xinhao Second Industrial Zone, Xintian Community, Fuhai Street, Baoan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Xinzhantong Electronics Co., Ltd. Address before: 2.3.4th Floor, Building A4, Hepingsiyuan Industrial Zone 2, Fuyong Street, Baoan District, Shenzhen, Guangdong, 518000 Patentee before: SHENZHEN XINZHANTONG ELECTRONICS CO.,LTD. |