CN205050834U - Field power amplifier encapsulated circuit - Google Patents
Field power amplifier encapsulated circuit Download PDFInfo
- Publication number
- CN205050834U CN205050834U CN201520860127.0U CN201520860127U CN205050834U CN 205050834 U CN205050834 U CN 205050834U CN 201520860127 U CN201520860127 U CN 201520860127U CN 205050834 U CN205050834 U CN 205050834U
- Authority
- CN
- China
- Prior art keywords
- slide glass
- pin
- plastic
- fin
- sealed body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model discloses a field power amplifier encapsulated circuit, including lead frame and plastic -sealed body, the lead frame includes the fin, has offered the fixed orifices on the fin, and the plastic -sealed body cover is established on the slide glass is distinguished, and slide glass district one end is connected with the fin, and muscle bonded portion in being equipped with is connected to the slide glass district other end on the middle pin with middle pin. The fin is equipped with the breach with the both sides of slide glass district junction, and go up the cover and is equipped with the plastic -sealed body in the slide glass district. Muscle bonded portion in being equipped with on the middle pin, the surface of well muscle bonded portion be the plane, and the tip of middle pin and side pin is equipped with the pin and cuts the muscle and block the district. The utility model discloses a through the combination fastness that setting up of breach can increase between lead frame and the plastic -sealed body, the steadiness of improvement plastic -sealed body. The bonded region can be strengthened for graphic settings in the surface of well muscle bonded portion, but the copper wire of the most volumes of bonded has reduced the copper wire simultaneously and has appeared disconnected risk at subsequent plastic envelope in -process to the life of extension product.
Description
Technical field
The utility model relates to electronic information technical field, is specifically related to a kind of field power amplifier encapsulated circuit.
Background technology
In prior art, because of fin and slide glass district junction non-notch or breach less, product there will be the phenomenon that lead frame and plastic-sealed body depart from encapsulation after machine, thus reduces qualification rate and the stability of product.In addition, in order to be connected with pin by chip, in conventional lead frame, the surface, bonding region of pin mostly is curved surface setting, and copper wire number bonding on pin is reduced, and copper wire there will be the risk of fracture of wire in follow-up plastic packaging process.
Utility model content
In order to solve the problems of the technologies described above, the utility model provides a kind of reduces fracture of wire risk, encapsulate firmly field power amplifier encapsulated circuit.
In order to reach above-mentioned technique effect, the technical solution of the utility model is as follows:
A kind of field power amplifier encapsulated circuit, comprise lead frame and plastic-sealed body, lead frame comprises fin, fin offers fixing hole, plastic-sealed body is set in slide glass district, one end, slide glass district is connected with fin, the slide glass district other end is connected with interim pins, interim pins is provided with middle muscle bonding part, interim pins connects side pin, dowel is provided with between side pin and interim pins, article 6, side pin is connected with interim pins, side pin is provided with pin bonding part, slide glass district is provided with chip, chip is provided with copper wire, copper wire is connected with middle muscle bonding part, copper wire is connected with pin bonding part, the surface of middle muscle bonding part is plane, the both sides of fin and junction, slide glass district are provided with breach.
Its beneficial effect is: fin and both sides, junction, slide glass district breach the binding strength that can increase between lead frame and plastic-sealed body is set, improve the steadiness of plastic-sealed body, after making product encapsulate upper machine, not easily occur the phenomenon that lead frame and plastic-sealed body ftracture or depart from.The surface of middle muscle bonding part is that arranging of plane can strengthen bond area, the copper wire of bonding greater number, reduces the risk that fracture of wire appears in copper wire in follow-up plastic packaging process simultaneously.
In some embodiments, the end of interim pins and side pin is provided with pin and cuts muscle and block district.
Its beneficial effect is: pin is cut the setting that muscle blocks district and can be realized, and according to different demands, interim pins and side pin is blocked growth pin circuit or short pin circuit, can improve efficiency of assembling, reduce costs.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the utility model is further described.
Fig. 1 is the structural representation of a kind of power amplifier encapsulated circuit disclosed in the utility model;
Fig. 2 is the schematic side view of Fig. 1.
Corresponding component title in figure represented by numeral:
1. lead frame, 2. plastic-sealed body, 3. fin, 4, fixing hole, 5. slide glass district, 6. breach, 7. interim pins, 8. side pin, 9. in muscle bonding part, 10. pin bonding part, 11. pins cut muscle and block district, 12. dowels, 13. chips, 14. copper wires.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the utility model is described in further detail:
As shown in Fig. 1 ~ 2, the utility model discloses a kind of field power amplifier encapsulated circuit, comprises lead frame 1 and plastic-sealed body 2.Lead frame 1 comprises fin 3, fin 3 offers fixing hole 4.Plastic-sealed body 2 is set in slide glass district 5.One end, slide glass district 5 is connected with fin 3, and slide glass district 5 other end is connected with interim pins 7.Interim pins 7 is provided with middle muscle bonding part 9, and the surface of middle muscle bonding part 9 is plane.Interim pins 7 connects side pin 8, and side pin 8 is connected by dowel 12 with interim pins 7.In the present embodiment, interim pins 7 is connected with six side pins 8.Side pin 8 is provided with pin bonding part 10, and interim pins 7 and the end of side pin 8 are provided with pin and cut muscle and block district 11.Slide glass district 5 is provided with chip 13.Chip 13 is provided with copper wire 14.Copper wire 14 is connected with middle muscle bonding part 9.Copper wire 14 is connected with pin bonding part 10.Fin 3 is provided with breach 6 with the both sides of junction, slide glass district 5.
Operation principle is as follows:
Slide glass district 5 for carrying the chip 13 of electronic devices and components, the copper wire 14 of bonding some on chip 13 pressure point position, copper wire 14 other end connect in muscle bonding part 9 and pin bonding part 10.The surface of middle muscle bonding part 9 is that arranging of plane can strengthen bond area, and the copper wire 14 of bonding greater number, reduces the risk that fracture of wire appears in copper wire 14 in follow-up plastic packaging process simultaneously.Interim pins 7 and the end of side pin 8 are provided with pin and cut muscle and block district 11, pin can be cut muscle and block district 11 and block, make interim pins 7 and side pin 8 block growth pin circuit or short pin circuit, can improve efficiency of assembling, reduce costs according to different demands.Can by Product jointing on corresponding object with side pin 8 by interim pins 7.Then encapsulate with plastic-sealed body 2 pairs of chips 13, fin 3 and both sides, junction, slide glass district 5 breach 6 the binding strength that can increase between lead frame 1 and plastic-sealed body 2 is set, improve the steadiness of plastic-sealed body 2, after making product encapsulate upper machine, not easily occur the phenomenon that lead frame 1 and plastic-sealed body 2 ftracture or depart from.Certain heat can be produced after product encapsulation energising, this heat can be distributed by fin 3.Finally by fixing hole 4, product is mounted on corresponding object.
Below be only preferred implementation of the present utility model; it should be pointed out that for the person of ordinary skill of the art, under the prerequisite not departing from the utility model creation design; can also make some distortion and improvement, these all belong to protection range of the present utility model.
Claims (2)
1. a field power amplifier encapsulated circuit, it is characterized in that, comprise lead frame (1) and plastic-sealed body (2), described lead frame (1) comprises fin (3), described fin (3) offers fixing hole (4), described plastic-sealed body (2) is set in slide glass district (5), described slide glass district (5) one end is connected with fin (3), described slide glass district (5) other end is connected with interim pins (7), described interim pins (7) is provided with middle muscle bonding part (9), the surface of described middle muscle bonding part (9) is plane, described interim pins (7) connects side pin (8), described side pin (8) is connected by dowel (12) with interim pins (7), described side pin (8) is provided with pin bonding part (10), described slide glass district (5) is provided with chip (13), described chip (13) is provided with copper wire (14), described copper wire (14) is connected with middle muscle bonding part (9), described copper wire (14) is connected with pin bonding part (10), described fin (3) is provided with breach (6) with the both sides of slide glass district (5) junction.
2. according to claim 1 power amplifier encapsulated circuit, is characterized in that, the end of described interim pins (7) and side pin (8) is provided with pin and cuts muscle and block district (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520860127.0U CN205050834U (en) | 2015-10-30 | 2015-10-30 | Field power amplifier encapsulated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520860127.0U CN205050834U (en) | 2015-10-30 | 2015-10-30 | Field power amplifier encapsulated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205050834U true CN205050834U (en) | 2016-02-24 |
Family
ID=55344380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520860127.0U Active CN205050834U (en) | 2015-10-30 | 2015-10-30 | Field power amplifier encapsulated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205050834U (en) |
-
2015
- 2015-10-30 CN CN201520860127.0U patent/CN205050834U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |