CN202262058U - Printed circuit board (PCB) and mobile terminal - Google Patents
Printed circuit board (PCB) and mobile terminal Download PDFInfo
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- CN202262058U CN202262058U CN2011202564481U CN201120256448U CN202262058U CN 202262058 U CN202262058 U CN 202262058U CN 2011202564481 U CN2011202564481 U CN 2011202564481U CN 201120256448 U CN201120256448 U CN 201120256448U CN 202262058 U CN202262058 U CN 202262058U
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- pad
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Abstract
The utility model discloses a printed circuit board (PCB) and a mobile terminal. The PCB comprises a welding pad for welding a component, and a green oil region, wherein the size of the welding pad of the component is marked as A according to the standard packaging library; the size of the welding pad welded on the PCB is greater than A; and the size of a green oil window in the green oil region is equal to A. The area of the welding pad is increased to enhance the adhesive force of the PCB, thereby solving the problem of high fall-off tendency of the welding pad without adding a shielding cover or taking any other protective measure; and the utility model has the advantage of simple design, and can not increase the cost. The impact resistance of the welding pad can also be enhanced by increasing the width of a wire led from the flange welding pad. In addition, the arrangement compactness on the PCB is enhanced to disperse the impact of external force, thereby enhancing the impact resistance of the welding pad and the component on the welding pad without increasing extra cost.
Description
Technical field
The utility model belongs to the printed circuit board technology field, specifically, and the portable terminal that relates to a kind of pad design of printed circuit board and adopt said Printed Circuit Board Design.
Background technology
Along with the develop rapidly of communications industry, the competition more and more fierce in portable terminal market, miniaturization has become an importance of portable terminal product competition.Because resistance, electric capacity and triode device are the maximum components and parts of usage quantity in the circuit, therefore, an important method that reduces printed circuit board (being pcb board) size just is to use the components and parts of small size encapsulation.At present, the components and parts of 0201 encapsulation are used widely owing to its package dimension is little, and according to the dimensioning of standard packaging storehouse regulation, its pad size of components and parts of 0201 encapsulation is defined as 0.25*0.35mm
2In a single day the components and parts of these small size encapsulation are welded on the very near position of distance P CB panel edges, in the process of producing, test, transporting, when receiving external impacts, cause components and parts to take place together with the phenomenon that the pad monoblock comes off easily.Components and parts come off can influence the complete machine performance, also can cause complete machine to be scrapped when serious, thereby causes the increase of maintenance and design cost.For fear of the generation of this phenomenon, the method that adopts at present is that the components and parts near the small size encapsulation at pcb board edge are placed in the position that is not subject to external impacts, such as method such as being placed in the radome.
The major defect of prior art is embodied in following three aspects usually:
(1) because in present pcb board design, the components and parts usage quantity of small size encapsulation is numerous.Along with portable terminal gradually to intelligent, miniaturization development, make that also its circuit design scheme is increasingly sophisticated, the pcb board area is more and more littler, therefore need be laid near the quantity of the components and parts of edges of boards also just more and more.Will on the pcb board of limited area, accomplish the components and parts of all small size encapsulation are all protected with radome, obviously be very difficult.
(2) if the employing radome all protects the components and parts that all small sizes encapsulate, not only can take the too much space of pcb board, and can increase hardware cost.
(3) improving constantly along with manufacturing process; The components and parts of small size encapsulation can be by in the design that is applied to pcb board more and more widely; The size of corresponding standard soldering board also can be more and more littler, so the anti-impact force of pad also can descend the problem that easier generation pad comes off thereupon.
Therefore, how not increasing on the basis that pcb board takes up room as far as possible, significantly improving the impact resistance of pad, preventing that components and parts from taking place together with the phenomenon that the pad monoblock comes off, is the subject matter that present board design personnel need solve.
Summary of the invention
The purpose of the utility model is to provide a kind of printed circuit board, through pad on it and green oil zone are carried out particular design, thereby has strengthened the impact resistance of pad.
For solving the problems of the technologies described above, the utility model adopts following technical scheme to be achieved:
A kind of printed circuit board comprises the pad and the green oil zone that are used for welding component, and according to the size marking in the standard packaging storehouse, the pad size of said components and parts is labeled as A; Wherein, the size that is welded on the said pad on the said printed circuit board is greater than A, and the size of the green oil window of offering in the green oil zone equals A.
Preferably, said green oil window is over against the middle position of pad.
Further, the difference of the length of the length of said pad and size marking A equals width poor of width and the size marking A of pad.
In order further to improve the anti-impact force of pad, when said pad is arranged on the edge of printed circuit board, use the lead of diameter between the width in the actual welding zone of 0.2mm and pad to draw lead as pad, be welded on the described pad.
Further again, said pad is drawn stressed in the opposite direction that direction should be with said pad of lead.
Preferably, the said pad diameter of drawing lead equates with the width in the actual welding zone of pad.
Certainly, also can adopt other means to come further to strengthen the holding capacity of pad, for example: the pad compactness that will be used to weld small size encapsulation components and parts is laid in described printed circuit board, promptly concentrates to be laid in together, and forms array, to disperse stress point.
Wherein, all corresponding assembly welding dish of described each components and parts, and one of them pad in each assembly welding dish is laid in the position of closing on the external force stress point, and all the other pads are laid in the position away from the external force stress point.For the situation of all corresponding two pads of each components and parts, can one of them pad be closed on the external force stress point, the another one pad is arranged in matrix array away from the external force stress point with this, to disperse external impacts, improves the holding capacity of pad.
Based on above-mentioned printed circuit plate structure; The utility model also provides a kind of portable terminal that adopts said Printed Circuit Board Design; Comprise and be arranged on pad and the green oil zone that is used for welding component on the printed circuit board; According to the size marking in the standard packaging storehouse, the pad size of said components and parts is labeled as A; Wherein, the size that is welded on the said pad on the said printed circuit board is greater than A, and the size of the green oil window of offering in the green oil zone equals A.Through the area of increase pad, and utilize the size in green oil window qualification actual welding zone to remain unchanged, thereby, obviously improved the adhesive force of pad, solved the stressed caducous problem of small size pad satisfying under the prerequisite of welding requirements.
Compared with prior art; The advantage and the good effect of the utility model are: the printed circuit board of the utility model improves its adhesive force through enlarging bonding pad area; Thereby need not to increase safeguard measures such as radome and can solve the caducous problem of pad; Simplicity of design can not cause the increase of cost.On the other hand, through increasing the width of drawing lead on the edges of boards pad, also can reach the effect that improves the pad anti-impact force.In addition, the utility model also through improve the compactness that components and parts are put on pcb board, disperses external impacts, thereby need not the impact resistance that extra increase cost can strengthen pad and go up components and parts.The various anti-lost pad design scheme that the utility model proposed is particularly useful for not only can catering to portable terminal to the miniaturization Development Trend, and helping controlling the complete machine cost of portable terminal in the small size pcb board design of portable terminals such as mobile phone.
After the detailed description in conjunction with advantages the utility model execution mode, other characteristics of the utility model and advantage will become clearer.
Description of drawings
Fig. 1 is the pad of existing printed circuit board and the schematic layout pattern in green oil zone;
Fig. 2 is the pad of the printed circuit board that proposes of the utility model and the schematic layout pattern in green oil zone;
The sketch map of Fig. 3 other a kind of structural design that to be the printed circuit board that proposes of the utility model adopt for the anti-impact force that improves pad;
The sketch map of Fig. 4 the third structural design that to be the printed circuit board that proposes of the utility model adopt for the anti-impact force that improves pad.
Embodiment
Describe in detail below in conjunction with the embodiment of accompanying drawing the utility model.
In order to improve the impact resistance of pad, the utility model provides multiple effective solution, set forth one by one through a plurality of embodiment below.
Embodiment one, proves that through correlation test the pulling-out force of pad is to be directly proportional with the area of pad, and proportionality coefficient is 3kg/cm
2The resistance device of standard 0201 encapsulation, according to the size marking in the standard packaging storehouse, the area of each pad that it is corresponding is 0.25*0.35mm
2So the stretching resistance of each pad is 0.25*0.35*3*10
-2=2.625g.If the area of pad is increased to 0.35*0.45mm
2, stretching resistance can be brought up to 0.35*0.45*3*10 so
-2=4.725g.Each components and parts calculates according to two pads, and stretching resistance will promote 160%, therefore, enlarges bonding pad area and can obviously improve its adhesive force.
When the design printed circuit board, need from the standard packaging storehouse, search the desired pad size of these components and parts of welding according to the components and parts of being selected for use.As shown in Figure 1, around pad 1 green oil zone 2, green oil is the liquid photopolymerizable solder resist, is coated on the circuit and base material 4 that need not weld on the printed circuit board, plays the effect of insulation.2 design green oils are windowed in the green oil zone, confirm the size of green oil window 3 according to the size of pad 1.Resistance device with 0201 encapsulation is that example describes, and need use two pads 1 when welding the resistance device of this standard packaging, and as shown in Figure 1, the area of each pad is 0.25*0.35mm
2To this pad size, when the design green oil was windowed, according to present conventional design scheme, the size of green oil window 3 generally was designed to 0.35*0.45mm
2, each limit and pad 1 are all reserved the gap of 0.05mm.
In order to promote the anti-impact force of pad 1, present embodiment adopts the size that green oil window 3 is reduced into former pad, on the basis of former pad size, suitably enlarges the method for bonding pad area, improves the adhesive force of pad 1.As shown in Figure 2, suppose that the dimensioning of pad is A according to the regulation in mark encapsulation storehouse; The size that enlarges pad 1 so makes it greater than A, and the size of green oil window 3 is set at A, and thus one; The welding disking area that is limited green oil window 3 is actual welding region, and obviously welding region does not change, but the contact area of pad 1 and base material 4 is improved; Therefore the adhesive force of pad 1 is improved, and can resist bigger impulsive force.
In order further to improve the shock resistance effect of pad 1; When suitably enlarging pad 1 size, should follow following principle: make the difference of length of length and the size marking A of pad 1 equal width poor of width and the size marking A of pad 1, and green oil window 3 should be positioned at the middle position of pad 1.Identical distance should be left with each limit of green oil window 3 after dwindling in each limit of pad 1 after promptly enlarging, just is positioned at the central authorities of pad 1 to guarantee the actual welding zone.With 0201 packaged device is that example describes, and according to the size marking of standard database, the dimensioning A of pad is 0.25mm*0.35mm, and the green oil window is 0.35mm*0.45mm, and is promptly as shown in Figure 1.After adopting the design of present embodiment; Oversized with pad 1; Such as the dimensioning 0.35mm*0.45mm that is increased to the green oil window, dwindle the size 0.25mm*0.35mm that green oil window 3 is of a size of former pad simultaneously, promptly as shown in Figure 2; Can make the stretching resistance of each pad 1 rise to 4.725g thus, the stretching resistance of two pads promotes 160%.
Present embodiment utilizes the size in the actual welding zone of green oil window qualification pad, increases the area of pad simultaneously, improves the adhesive force of pad, thereby has solved the problem that the small size pad is prone to fall.
Embodiment two, and referring to shown in Figure 3, present embodiment proposes a kind of design that improves the pad anti-impact force to the isolated components and parts that are provided with of edges of boards.When pad 1 must be arranged on the edge of printed circuit board, can be employed in increased pad on the direction that pad 1 maybe be stressed and draws the stretching resistance that the method for lead 5 diameters improves pad 1.Promptly; Can use the lead of diameter between 0.2mm and pad 1 width to draw lead 5 as pad; Be welded on the described pad 1, and pad draws stressed in the opposite direction that direction should be with said pad 1 of lead 5, the wide lead that equates such as the width that can adopt diameter with pad 1 is drawn lead 5 as pad and is welded on the described pad 1; And from pad 1, possibly a stressed side draw, to increase the holding capacity of 1 pair of external force of pad.Through receiving force direction to increase the stretching resistance of pad, can prevent components and parts equally when receiving external impacts, the phenomenon that causes pad to break away from substrate takes place.
When adopting the design of present embodiment, pad 1 can design according to the pairing size marking of standard components and parts with the size of green oil window 3.Certainly; Also can come further to improve the impact resistance of pad according to the method for embodiment one through the area that increases pad 1; At this moment; The diameter that pad is drawn lead 5 preferably equates with the width in the actual welding zone of pad 1, and is promptly wide with green oil window 3, with enhancing pad 1 and on the shock resistance effect of components and parts.
Embodiment three, and referring to shown in Figure 4, present embodiment is solving on the pad anticreep problem, and the components and parts to small size encapsulation such as 0201 or 0503 propose to adopt the array disposing way to disperse the design of stress point.That is, concentrated being placed in together of components and parts with the small size encapsulation that needs on the pcb board to lay at one, forms array with its pad 1 compact layout.Because each components and parts needs two pads to accomplish welding at least; In the pairing assembly welding dish of each components and parts one of them is laid in the position of closing on external force stress point F, and all the other pads can be laid in the position away from external force stress point F, are arranged in the form of matrix array with this; When receiving external impacts; Can impulsive force be distributed on a plurality of components and parts, thereby the stretching resistance of pad 1 is multiplied, reduce the infringement that it is caused.
Same; When adopting the design of present embodiment; Pad 1 not only can design according to the pairing size marking of standard components and parts with the size of green oil window 3, also can come further to improve the impact resistance of pad 1 according to the method for embodiment one through the area that increases pad 1.Need be laid in the situation at pcb board edge for said pad array, can also further adopt embodiment two described methods, receive pad on the force direction to draw the width of lead, come further to promote the impact resistance of pad 1 through increase.
Adopt the above-mentioned design that the utility model proposed, need not safeguard measures such as increasing radome on the pcb board can effectively solve pad and on the problem of components and parts anticreep, thereby help the miniaturization Design of pcb board.Be applied in the Printed Circuit Board Design of portable terminal, can effectively dwindle the volume of its pcb board, reduce its complete machine cost.
Certainly; The above only is a kind of preferred implementation of the utility model, for those skilled in the art, under the prerequisite that does not break away from the utility model principle; Can also make some improvement and retouching, these improvement and retouching also should be regarded as the protection range of the utility model.
Claims (10)
1. a printed circuit board comprises the pad and the green oil zone that are used for welding component, and according to the size marking in the standard packaging storehouse, the pad size of said components and parts is labeled as A; It is characterized in that: the size that is welded on the said pad on the said printed circuit board is greater than A, and the size of the green oil window of offering in the green oil zone equals A.
2. printed circuit board according to claim 1 is characterized in that: said green oil window is over against the middle position of pad.
3. printed circuit board according to claim 2 is characterized in that: the difference of the length of the length of said pad and size marking A equals width poor of width and the size marking A of pad.
4. according to each described printed circuit board in the claim 1 to 3; It is characterized in that: when said pad is arranged on the edge of printed circuit board; Use the lead of diameter between the width in the actual welding zone of 0.2mm and pad to draw lead, be welded on the described pad as pad.
5. printed circuit board according to claim 4 is characterized in that: what said pad was drawn lead draws the stressed in the opposite direction of direction and said pad.
6. printed circuit board according to claim 5 is characterized in that: the diameter that said pad is drawn lead equates with the width in the actual welding zone of pad.
7. according to each described printed circuit board in the claim 1 to 3, it is characterized in that: the pad compactness that will be used to weld small size encapsulation components and parts is laid in described printed circuit board, and forms array.
8. printed circuit board according to claim 7; It is characterized in that: all corresponding assembly welding dish of each described components and parts; And one of them pad in each assembly welding dish is laid in the position of closing on the external force stress point, and all the other pads are laid in the position away from the external force stress point.
9. printed circuit board according to claim 4 is characterized in that: the pad compactness that will be used to weld small size encapsulation components and parts is laid in described printed circuit board, and forms array.
10. a portable terminal is characterized in that: include like the described printed circuit board of each claim in the claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202564481U CN202262058U (en) | 2011-07-20 | 2011-07-20 | Printed circuit board (PCB) and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202564481U CN202262058U (en) | 2011-07-20 | 2011-07-20 | Printed circuit board (PCB) and mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202262058U true CN202262058U (en) | 2012-05-30 |
Family
ID=46123231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202564481U Expired - Fee Related CN202262058U (en) | 2011-07-20 | 2011-07-20 | Printed circuit board (PCB) and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202262058U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104093267A (en) * | 2014-06-11 | 2014-10-08 | 深圳市磊科实业有限公司 | PCB packaging structure based on light-quality SMT component |
| CN105636350A (en) * | 2015-12-29 | 2016-06-01 | 广东欧珀移动通信有限公司 | Flexible printed circuit board and mobile terminal |
| WO2016095578A1 (en) * | 2014-12-15 | 2016-06-23 | 中兴通讯股份有限公司 | Pcb board |
| CN106376175A (en) * | 2016-08-31 | 2017-02-01 | 深圳天珑无线科技有限公司 | Printed circuit board and mobile terminal |
| CN110662351A (en) * | 2019-09-30 | 2020-01-07 | 广西天山电子股份有限公司 | Connect reliable PCB board |
-
2011
- 2011-07-20 CN CN2011202564481U patent/CN202262058U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104093267A (en) * | 2014-06-11 | 2014-10-08 | 深圳市磊科实业有限公司 | PCB packaging structure based on light-quality SMT component |
| CN104093267B (en) * | 2014-06-11 | 2017-02-22 | 深圳市磊科实业有限公司 | PCB packaging structure based on light-quality SMT component |
| WO2016095578A1 (en) * | 2014-12-15 | 2016-06-23 | 中兴通讯股份有限公司 | Pcb board |
| CN105636350A (en) * | 2015-12-29 | 2016-06-01 | 广东欧珀移动通信有限公司 | Flexible printed circuit board and mobile terminal |
| CN106376175A (en) * | 2016-08-31 | 2017-02-01 | 深圳天珑无线科技有限公司 | Printed circuit board and mobile terminal |
| CN110662351A (en) * | 2019-09-30 | 2020-01-07 | 广西天山电子股份有限公司 | Connect reliable PCB board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20190720 |
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| CF01 | Termination of patent right due to non-payment of annual fee |