WO2016095578A1

WO2016095578A1 - Pcb board

Info

Publication number: WO2016095578A1
Application number: PCT/CN2015/090284
Authority: WO
Inventors: 校焕庆; 郭耀斌; 杨卫卫; 王峰; 段斌; 张晓毅; 孙文昌
Original assignee: 中兴通讯股份有限公司
Priority date: 2014-12-15
Filing date: 2015-09-22
Publication date: 2016-06-23
Also published as: CN204335161U

Abstract

Provided is a PCB board, comprising a bottom layer (100) arranged to mount power amplification elements (10), wherein an annular solder restraint (20) surrounding a power amplification element (10) is arranged on the mount position of the bottom layer (100) corresponding to the power amplification element (10). Accordingly, the competitive rate of the products is increased and the costs are reduced.

Description

PCB board

Technical field

The embodiments of the present invention relate to, but are not limited to, the technical field of power amplifiers, and in particular, to a PCB (Printed Circuit Board) board.

Background technique

With the development of wireless communication technology, the demand for high performance and high index makes every link in the manufacturing process of wireless communication equipment more important, especially the power amplifier part that determines the overall performance of wireless base station products. The RF power amplifier tube is the key to determine the performance of the power amplifier. Therefore, ensuring the welding effect of the power amplifier tube and giving full play to its RF performance is a top priority.

The traditional PCB design has no special treatment in the slotted part of the bottom power amplifier tube, which often causes the high temperature liquid solder in the SMT (Surface Mount Technology) process to spread away from the power amplifier tube without any constraint. The welding cavity of the power amplifier tube has a high void rate and the grounding effect is deviated, which leads to the phenomenon that the power amplifier has low power, low efficiency, linearity and other radio frequency performance cannot be realized normally in mass production.

Utility model content

The following is an overview of the topics detailed in this document. This Summary is not intended to limit the scope of the claims.

The embodiment of the present invention provides a PCB board, which can solve the technical problem that the high-temperature liquid solder of the related art spreads away from the power amplifier tube without any constraint.

Embodiments of the present invention provide a PCB board including a bottom layer disposed to mount a power amplifier component, and a mounting position corresponding to the power amplifier component on the bottom layer is provided with an annular solder constraint surrounding the power amplifier component.

Optionally, wherein the solder constraint is a green oil spacer.

Optionally, a periphery of the solder constraining member is provided with a tin bath for draining the flux.

Optionally, a barrier separating the two power amplifier elements is further disposed in the solder constraint member.

In the embodiment of the present invention, by providing a solder constraining member on the bottom layer of the PCB board, an effective solder resist constraint is formed in the SMT process, and the solder of the power amplifier component is limited to the solder constraining member to the maximum extent, thereby effectively preventing the high temperature liquid solder from moving away from the power amplifier component. The direction is diffused and gathered in the solder constraining part at the bottom of the power amplifier component, thereby improving the power of the power amplifier, improving the efficiency of the power amplifier, and avoiding the phenomenon that the radio frequency performance such as the linearity difference cannot be normally realized.

Other aspects will be apparent upon reading and understanding the drawings and detailed description.

BRIEF abstract

1 is a schematic structural view of a PCB board according to an embodiment of the present invention;

2 is a schematic structural view of a PCB board according to another embodiment of the present invention.

Embodiment of the present invention

It is understood that the embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The embodiment of the present invention provides a PCB board. Referring to FIG. 1 , in an alternative embodiment, the PCB board includes a bottom layer 100 disposed to mount the power amplifier component 10 , and the bottom layer 100 is mounted corresponding to the power amplifier component 10 . The location is provided with an annular solder constraint 20 that surrounds the power amplifier component 10.

In the embodiment of the present invention, the PCB board refers to a board that has not been mounted with components, and includes a multi-layer board, and the bottom layer 100 is disposed to mount a power amplifier component (for example, a power amplifier tube, etc.) 10. The solder constraining member 20 may be a ring that is configured to prevent the liquid solder from diffusing away from the power amplifier element, and the material may be green oil or other material that can achieve the equivalent function of the green oil. In this embodiment, by providing the solder constraining member 20 on the bottom layer 100 of the PCB board, an effective solder resist constraint is formed in the SMT process, and the solder of the power amplifier component 10 is limited to the solder constraining member 20 to the maximum extent, thereby effectively preventing the high temperature liquid solder from being far away. The direction of the power amplifier component is diffused and gathered in the solder constraining member 20 at the bottom of the power amplifier component, thereby improving the power of the power amplifier, improving the efficiency of the power amplifier, and avoiding the phenomenon that the radio frequency performance such as the linearity difference cannot be normally realized.

In an alternate embodiment, the solder constraint 20 is a green oil spacer. The green oil is a material for isolating the solder. The PCB board in the embodiment of the present invention can be used before the power amplifier component 10 is attached. The bottom layer 100 of the PCB is provided with a green oil spacer to form an effective constraint around the power amplifier element 10.

In order to ensure the welding effect of the power amplifier tube and maximize the performance of the RF power amplifier tube, in an alternative embodiment, the solder constraining member 20 is provided with a tin leakage groove (not shown) for venting the flux. The drain tin bath is configured to provide a bleed passage for the high temperature gas flux. In the embodiment of the present invention, an effective solder resist constraint is formed by adding a green oil spacer around the power amplifier component of the bottom layer of the PCB board, and the solder is limited to the green oil spacer in the SMT process, thereby effectively preventing the high temperature liquid solder from moving away from the power amplifier. The direction of the tube is diffused and gathered in the green oil spacer at the bottom of the power amplifier tube. At the same time, the leakage tank is provided near the green oil spacer to provide a venting passage for the high-temperature gas flux, thereby fully ensuring the welding of the power tube. The effect is to maximize the performance of the RF power amplifier tube.

In the embodiment of the present invention, one device (ie, power amplifier component) can be provided with a green oil ring. If the two devices are far apart, they can be set as two independent green oil rings. If the distance is close, the device can also be designed as one. Green oil ring. Referring to FIG. 2, in an alternative embodiment of the present invention, in consideration of the fact that the two devices are far apart, the solder restraint 20 is further provided with a barrier 21 separating the two power amplifier elements 10. Since the barrier 21 is provided, a solder constraint is also formed between the two power amplifier elements 10 to avoid conduction between the two power amplifier components 10, thereby improving product yield.

Through mass production verification, through the above structure of the embodiment of the present invention, the welding cavity ratio of the power amplifier tube can be reduced by 20%-30%, and the improvement is obvious; the overall void ratio is controlled within 15%; combined with the use of the leakage tin tank, fully ensured The welding effect of the power amplifier tube, the overall power of the embodiment of the utility model is increased by 0.3dB-0.5dB, the overall efficiency is improved by 0.5%--1.5%, the overall linear optimization is 1dB-3dB, and the production yield is improved. 2%-5%, maximize the performance of RF power amplifier tubes, reduce production costs and enhance product competitiveness.

Industrial applicability

Claims

A PCB board comprising a bottom layer disposed to mount a power amplifier component, wherein a mounting position of the corresponding power amplifier component on the bottom layer is provided with an annular solder constraint surrounding the power amplifier component.
The PCB board of claim 1, wherein the solder constraint is a green oil spacer.
The PCB board according to claim 1 or 2, further comprising a solder bath having a drain groove for venting the flux.
The PCB board of claim 3, further comprising a barrier separating the two power amplifier elements from the solder constraint.
A PCB board according to claim 1 or 2, wherein there are two power amplifier elements, each power amplifier element being provided as an annular solder constraint surrounding the power amplifier element.