CN103474859A - Terminal manufacturing method as well as manufacturing method of terminals and cores of electronic parts and components - Google Patents
Terminal manufacturing method as well as manufacturing method of terminals and cores of electronic parts and components Download PDFInfo
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- CN103474859A CN103474859A CN2013103920364A CN201310392036A CN103474859A CN 103474859 A CN103474859 A CN 103474859A CN 2013103920364 A CN2013103920364 A CN 2013103920364A CN 201310392036 A CN201310392036 A CN 201310392036A CN 103474859 A CN103474859 A CN 103474859A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Manufacturing Of Electrical Connectors (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The invention discloses a terminal manufacturing method. The terminal manufacturing method comprises the following steps: a step S1, providing a metal sheet and a base material; a step S2, dividing the base material into a plurality of stamping regions; a step S3, fixedly arranging one metal sheet on one stamping region of the base material correspondingly; a step S4, stamping the metal sheet and the base material, so that upper and lower opposite terminals are formed on the metal sheet in the base material. The invention further provides a manufacturing method of cores of electronic parts and components and terminals thereof, wherein in addition to the steps S1 to S4, the manufacturing method further comprises: a step S5, correspondingly welding the cores of the electronic parts and components on the terminals; a step S6, cutting off the terminals on which the base material are fixedly arranged, and taking out the connected cores of the electronic parts and components and the terminals; a step S7, adopting a packaging process to package, so that one part of each terminal is exposed to the side surface or the bottom of the packaging housing. The terminal manufacturing method as well as the manufacturing method of the cores of the electronic parts and components and terminals thereof can be used for lowering the manufacturing cost of the terminals of the electronic parts and components.
Description
Technical field
The present invention relates to a kind of manufacture method of electronic devices and components, particularly the manufacture method of a kind of terminal manufacture method of electronic devices and components and terminal and its electronic devices and components core body.
Background technology
Electronic devices and components, comprise plug-in unit device and surface mount device, and its structure is generally by the electronic devices and components core body, the terminal be connected with its electronic devices and components core body, and encapsulating housing forms.Wherein, terminal, also claim electrode slice, also cites approvingly pin.Wherein, electronic devices and components, can be the components and parts such as surface mount coil inductance, electric capacity, ballast, diode.When electronic devices and components are coil inductance, its core body is coil; When electronic devices and components are ballast, its electronic devices and components core body is ballast coil; When electronic devices and components are electric capacity, its core body is capacitor plate; When electronic devices and components are semiconductor diode, its core body is semiconductor two pole piece bodies.For example, surface-pasted coil inductance device, it comprises coil, the terminal be connected respectively with the two ends of coil, and the housing of encapsulation.Wherein, the core component that coil is surface-pasted coil inductance device, be called core body; Terminal generally is exposed to bottom surface or the side of encapsulating housing; Encapsulating housing generally adopts Plastic Package.
The surface-pasted coil inductance device of below take is example, and the manufacture method of electronic devices and components part core body of the prior art and its terminal is described, generally comprises following steps, as shown in Figures 1 to 3:
Step 2, on the length direction of sheet metal base material 10, stamp out the terminal 11 that many groups are connected with described sheet metal base material 10, and the quantity of every group of terminal 11 is two, and two terminals 11 are the upper and lower that distribution is arranged at the width end face of sheet metal base material 10;
The manufacture method of above-mentioned electronic devices and components part core body and its terminal, the sheet metal base material is generally the copper metal material, because terminal is directly stamping forming by sheet metal, when stamped terminals, a large amount of scrap metal of generation, thus increased the manufacturing cost of terminal.Known in conjunction with Fig. 1 to 2, in above-mentioned manufacture method, the area of the sheet metal that every group of terminal is shared is far smaller than the area of the scrap metal of producing after stamped terminals, thereby has caused a large amount of sheet metals to be wasted, thereby has increased the production cost of making electronic devices and components core body and terminal.
Summary of the invention
Technical problem to be solved by this invention is, a kind of terminal manufacture method is provided, with the manufacturing cost of the terminal that reduces electronic devices and components.
In order to solve the problems of the technologies described above, technical scheme of the present invention is: a kind of terminal manufacture method comprises the following steps:
Step S1, provide a sheet metal that is shaped as rectangle, and price is less than the strip base material of described sheet metal;
Step S2, be divided into several equal-sized rectangle Stamping Areas by the length of described base material, makes the area of each described Stamping Area be greater than the area of described sheet metal;
Step S3, be fixedly installed on a described sheet metal correspondence on one of them Stamping Area of described base material, makes the length direction setting of the length direction of described sheet metal perpendicular to described base material;
Step S4, sheet metal and base material in the described step 3 of punching press, make the sheet metal of at least one Stamping Area in described base material form upper and lower two terminals that are oppositely arranged.
Further, before described step S3, the width end face that also is included at least one Stamping Area of described base material is respectively arranged with the step of several the first location holes.
Further, before step S3, each Stamping Area that also is included in described base material is provided with first and dodges the step of position, hole, and makes sheet metal in described step S3 cover described first to dodge on the position, hole.
Further, in described step S4, also be included on each Stamping Area of base material and form second and dodge the step of position, hole.
Further, in described step S3, the mode that is fixedly installed of described sheet metal and base material adopt welding, riveted joint, crimping or glued joint in a kind of.
Terminal manufacture method of the present invention, for making the terminal of electronic devices and components, especially for the terminal of making surface mount device.Compared with prior art, terminal manufacture method of the present invention, be that the composite material punching press that adopts rectangular metal sheet and Costco Wholesale to be less than the strip base material of described sheet metal forms terminal, but not adopt sheet metal, is that the direct punching press of base material forms terminal.Manufacture method of the present invention, when punching press forms terminal, only having fraction in the punching press clout is that sheet metal clout, major part are the base material clout, and owing to adopting sheet metal, is base material in prior art, so its punching press clout is all the sheet metal clout.Be far smaller than again the Costco Wholesale of sheet metal due to the selected base material Costco Wholesale of the present invention, and the area that uses the sheet metal that forms terminal is far smaller than the metal base that forms terminal in prior art, therefore, terminal manufacture method of the present invention, its manufacturing cost is lower.
In order to solve the problems of the technologies described above, the present invention also provides a kind of electronic devices and components core body and its terminal manufacture method, comprises the following steps:
Step S1, provide a sheet metal that is shaped as rectangle, and price is less than the strip base material of described sheet metal;
Step S2, be divided into several rectangle Stamping Areas by the length of described base material, makes the area of described Stamping Area be greater than the area of described sheet metal;
Step S3, be fixedly installed on a described sheet metal correspondence on one of them Stamping Area of described base material, makes the length direction setting of the length direction of described sheet metal perpendicular to described base material;
Step S4, sheet metal and base material in the described step 3 of punching press, make the sheet metal of at least one Stamping Area in described base material form upper and lower two terminals that are oppositely arranged;
Step S5, by the two ends of an electronic devices and components core body corresponding being welded on two terminals of a Stamping Area in described base material respectively, realize the electrical connection of two terminals in an electronic devices and components core body and described base material;
Step S6, cut off the terminal be fixedly installed with described base material in described step S5, takes out electronic devices and components core body and terminal after being electrically connected;
Step S7, adopt packaging technology to carry out packaging shell to described electronic devices and components core body and terminal, makes the part of each terminal be exposed to side or the bottom of described encapsulating housing.
Further, before step S3, at least one Stamping Area that also is included in described base material is provided with first and dodges the step of position, hole, and makes sheet metal in described step S3 cover described first to dodge on the position, hole.
Further, before described step S3, the width end face that also is included at least one Stamping Area of described base material is respectively arranged with the step of several the first location holes.
Further, before described step S5, also be included in the step that region division has the second location hole that is fixedly installed of each described terminal and base material.
Further, before described step S5, also be included on each Stamping Area of described base material and form second and dodge the step of position, hole.
Compared with prior art, the manufacture method of electronic devices and components core body of the present invention and its terminal, for making electronic devices and components, especially for making surface-pasted electronic devices and components.Compared with prior art, the manufacture method of electronic devices and components core body of the present invention and its terminal, being that the composite material punching press that adopts rectangular metal sheet and Costco Wholesale to be less than the strip base material of described sheet metal forms terminal, is that the direct punching press of base material forms terminal but not adopt sheet metal.Manufacture method of the present invention, when punching press forms terminal, only having fraction in the punching press clout is that sheet metal clout, major part are the base material clout, and owing to adopting sheet metal, is base material in prior art, so its punching press clout is all the sheet metal clout.Be far smaller than again the Costco Wholesale of sheet metal due to the selected base material Costco Wholesale of the present invention, and the area that uses the sheet metal that forms terminal is far smaller than the metal base that forms terminal in prior art, therefore, the present invention is when making the connected terminal of electronic devices and components core body, and its manufacturing cost is lower.
The accompanying drawing explanation
Fig. 1-3rd, the manufacture method process schematic diagram of the electronic devices and components part core body of prior art and its terminal;
Fig. 4-10 are terminal manufacture method process schematic diagram of the present invention;
Figure 11-14 are the process schematic diagram of electronic devices and components core body of the present invention and its terminal manufacture method.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in detail:
Embodiment mono-
Fig. 4-10 are terminal manufacture method process schematic diagram of the present invention, please refer to Fig. 4, and the coil inductance in the present embodiment surface mount device is example, and the terminal manufacture method of the embodiment of the present invention is described.A kind of terminal manufacture method comprises the following steps:
Step S1, please refer to Fig. 5 and 6, provide a sheet metal 200 that is shaped as rectangle, and price is less than the strip plastic sheet base material 100 of described sheet metal 200;
Step S2, please refer to Fig. 7, and the length of described base material 100 is divided into to several equal-sized rectangle Stamping Areas 101, makes the area of described Stamping Area 101 be greater than the area of described sheet metal 200;
Step S3, please refer to Fig. 9, and described sheet metal 200 correspondences are fixedly installed on one of them Stamping Area 101 of described base material 100, makes the length direction setting of the length direction of described sheet metal 200 perpendicular to described base material 100;
Step S4, please refer to Figure 10, and the sheet metal 200 in the described step 3 of punching press and base material 100 make the sheet metal 200 of at least one Stamping Area 101 in described base material 100 form upper and lower two terminals that are oppositely arranged 201.
Wherein, sheet metal 200 is made for metallic copper material.
Wherein, described base material 100 adopts the per kilogram unit price to be less than metal material or the nonmetallic materials of sheet metal 200 prices.For example: can be aluminum metallic material, can be scraps of paper material, can also be the materials such as plastic sheet.
Wherein, described sheet metal 200 is selected riveting method with the mode that is fixedly installed of base material 100.
The terminal manufacture method of present embodiment, for making the terminal of surface adhered with electronic component.Terminal manufacture method of the present invention, that the composite material of formation that adopts rectangular metal sheet 200 and Costco Wholesale to be less than the strip base material 100 of described sheet metal 200 carries out punching press, forming terminal 201 at sheet metal 200 after punching press, is that the direct punching press of base material forms terminal but not adopt sheet metal.Manufacture method of the present invention, when punching press forms terminal 201, in the punching press clout, major part is the clout of base material 100, and in prior art due to after the employing sheet metal is the base material punching press, its clout is all the sheet metal clout.Due to the Costco Wholesale of the selected base material Costco Wholesale of the present invention well below sheet metal, and the area that uses the sheet metal that forms terminal is far smaller than the metal base that forms terminal in prior art, therefore, the terminal manufacture method of present embodiment, its manufacturing cost is lower.
As execution mode preferably, please refer to Fig. 7, before described step S3, the width end face that also is included at least one Stamping Area 101 of described base material 100 is respectively arranged with the step of several the first location holes 102.Wherein, the effect of the first location hole 102 has two.The one, for pulling base material, its position is moved; The 2nd, when riveted joint, directly rivet is arranged in this first location hole 102, for sheet metal 200 is fixed on to base material 100.
As execution mode preferably, please refer to Fig. 8, before step S3, each Stamping Area 101 that also is included in described base material 100 is provided with first and dodges the step of position, hole 103, and makes sheet metal 200 in described step S3 cover described first to dodge on position, hole 103.The first effect of dodging position, hole 103 is: reduce the punching press thickness of sheet metal 200, to improve the stamping quality of punched metal sheet 200, form the higher terminal 201 of quality.
As execution mode preferably, please refer to Figure 10, in described step S4, also be included in and form second on each Stamping Area 101 of described base material 100 and dodge the step of position, hole 104.The second effect of dodging position, hole 104 is, certain working space is provided, so that realize the weld job of terminal 201 and its electronic devices and components core body.
In the step S3 of present embodiment, described sheet metal 200 is not limited to riveting method with the mode that is fixedly installed of base material 100, can also adopt the modes such as welding, crimping or splicing.
Embodiment bis-
The present embodiment two is to improve and form on the basis of embodiment mono-, and the step of its terminal manufacture method is identical with embodiment mono-.The present embodiment two provides a kind of electronic devices and components core body and its terminal manufacture method, please refer to Figure 11, comprises the following steps:
Step S1, please refer to Fig. 5 and 6, provide a sheet metal 200 that is shaped as rectangle, and price is less than the strip plastic sheet base material 100 of described sheet metal 200;
Step S2, please refer to Fig. 7, and the length of described base material 100 is divided into to several equal-sized rectangle Stamping Areas 101, makes the area of described Stamping Area 101 be greater than the area of described sheet metal 200;
Step S3, please refer to Fig. 9, and described sheet metal 200 correspondences are fixedly installed on one of them Stamping Area 101 of described base material 100, makes the length direction setting of the length direction of described sheet metal 200 perpendicular to described base material 100;
Step S4, please refer to Figure 10, and the sheet metal 200 in the described step 3 of punching press and base material 100 make the sheet metal 200 of at least one Stamping Area 101 in described base material 100 form upper and lower two terminals that are oppositely arranged 201.
Step S5, please refer to Figure 13, by the two ends of an electronic devices and components core body 300 corresponding being welded on two terminals 201 of a Stamping Area 101 in described base material 100 respectively, realize the electrical connection of two terminals 201 in electronic devices and components core 300 bodies and described base material 100;
Step S6, please refer to Figure 14, cuts off the terminal 201 be fixedly installed with described base material 100 in described step S5, takes out electronic devices and components core body 300 and terminal 201 after being electrically connected;
Step S7, adopt packaging technology to carry out packaging shell to described electronic devices and components core body 300 and terminal 201, makes the part of each terminal 201 be exposed to side or the bottom of described encapsulating housing.
Wherein, above step S1 to S4 makes the step of terminal 201 in the present embodiment two, and its manufacture method is identical with above-described embodiment one.The terminal of above-described embodiment one is the manufacture method of execution mode preferably, is adapted to equally in the present embodiment two.
As execution mode preferably, please refer to Figure 12, in the present embodiment two, before described step S5, also be included in the step that region division has the second location hole 105 that is fixedly installed of each described terminal 201 and base material 100.Wherein, the effect of the second location hole 105 is as follows: the one, drag the base material that forms terminal after punching press for holder; The 2nd, in described step S5, realize playing the restriction effect in the weld job of electronic devices and components core body and terminal, prevent from being fixedly connected with the base material 100 positions skews of terminal 201; The 3rd, play the effect that limits position in described step S6, while preventing from cutting off operation, base material 100 position skews, to avoid cutting off the precision of operation, thus the electronic devices and components core body 300 after raising taking-up electrical connection and the quality of terminal 201.
Wherein, the electronic devices and components core body 300 in the present embodiment two is surface-pasted inductance coil, but is not limited to surface-pasted coil inductance, can also be the components and parts such as surface mount electric capacity, choke, diode.When electronic devices and components are coil inductance, its core body is coil; When electronic devices and components are ballast, its electronic devices and components core body is ballast coil; When electronic devices and components are electric capacity, its core body is capacitor plate; When electronic devices and components are semiconductor diode, its core body is semiconductor two pole piece bodies.
The electronic devices and components core body of the present embodiment two and the manufacture method of its terminal, for making surface-pasted coil inductance.Compared with prior art, the manufacture method of electronic devices and components core body of the present invention and its terminal, being that the composite material punching press that adopts rectangular metal sheet 200 and Costco Wholesale to be less than the strip base material 100 of described sheet metal 200 forms terminal 201, is that the direct punching press of base material 100 forms terminal 201 but not adopt sheet metal 200.Manufacture method of the present invention, when punching press forms terminal 201, only having fraction in the punching press clout is that sheet metal clout, major part are the base material clout, and owing to adopting sheet metal, is base material in prior art, so its punching press clout is all the sheet metal clout.Be far smaller than again the Costco Wholesale of sheet metal due to the selected base material Costco Wholesale of the present invention, and the area that uses the sheet metal that forms terminal is far smaller than the metal base that forms terminal in prior art, therefore, the present invention is when making the connected terminal of electronic devices and components core body, and its manufacturing cost is lower.
Claims (10)
1. a terminal manufacture method comprises the following steps:
Step S1, provide a sheet metal that is shaped as rectangle, and price is less than the strip base material of described sheet metal;
Step S2, be divided into several equal-sized rectangle Stamping Areas by the length of described base material, makes the area of described Stamping Area be greater than the area of described sheet metal;
Step S3, be fixedly installed on a described sheet metal correspondence on one of them Stamping Area of described base material, makes the length direction setting of the length direction of described sheet metal perpendicular to described base material;
Step S4, sheet metal and base material in the described step 3 of punching press, make the sheet metal of at least one Stamping Area in described base material form upper and lower two terminals that are oppositely arranged.
2. terminal manufacture method according to claim 1, is characterized in that, before described step S3, the width end face that also is included at least one Stamping Area of described base material is respectively arranged with the step of several the first location holes.
3. terminal manufacture method according to claim 1, it is characterized in that, before step S3, each Stamping Area that also is included in described base material is provided with first and dodges the step of position, hole, and makes sheet metal in described step S3 cover described first to dodge on the position, hole.
4. terminal manufacture method according to claim 1, is characterized in that, in described step S4, also is included on each Stamping Area of described base material and forms second and dodge the step of position, hole.
5. terminal manufacture method according to claim 1, is characterized in that, in described step S3, the mode that is fixedly installed of described sheet metal and base material adopt welding, riveted joint, crimping or glued joint in a kind of.
6. an electronic devices and components core body and its terminal manufacture method comprise the following steps:
Step S1, provide a sheet metal that is shaped as rectangle, and price is less than the strip base material of described sheet metal;
Step S2, be divided into several rectangle Stamping Areas by the length of described base material, makes the area of described Stamping Area be greater than the area of described sheet metal;
Step S3, be fixedly installed on a described sheet metal correspondence on one of them Stamping Area of described base material, makes the length direction setting of the length direction of described sheet metal perpendicular to described base material;
Step S4, sheet metal and base material in the described step 3 of punching press, make the sheet metal of at least one Stamping Area in described base material form upper and lower two terminals that are oppositely arranged;
Step S5, by the two ends of an electronic devices and components core body corresponding being welded on two terminals of a Stamping Area in described base material respectively, realize the electrical connection of two terminals in an electronic devices and components core body and described base material;
Step S6, cut off the terminal be fixedly installed with described base material in described step S5, takes out electronic devices and components core body and terminal after being electrically connected;
Step S7, adopt packaging technology to carry out packaging shell to described electronic devices and components core body and terminal, makes the part of each terminal be exposed to side or the bottom of described encapsulating housing.
7. electronic devices and components core body according to claim 6 and its terminal manufacture method, it is characterized in that, before step S3, at least one Stamping Area that also is included in described base material is provided with first and dodges the step of position, hole, and makes sheet metal in described step S3 cover described first to dodge on the position, hole.
8. electronic devices and components core body according to claim 6 and its terminal manufacture method, is characterized in that, before described step S3, the width end face that also is included at least one Stamping Area of described base material is respectively arranged with the step of several the first location holes.
9. electronic devices and components core body according to claim 6 and its terminal manufacture method, is characterized in that, before described step S5, also is included in the step that region division has the second location hole that is fixedly installed of each described terminal and base material.
10. electronic devices and components core body according to claim 6 and its terminal manufacture method, is characterized in that, before described step S5, also is included on each Stamping Area of described base material and forms second and dodge the step of position, hole.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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CN201310392036.4A CN103474859B (en) | 2013-09-02 | 2013-09-02 | The manufacture method of terminal manufacture method and terminal and electronic devices and components core body |
JP2013221187A JP5824495B2 (en) | 2013-09-02 | 2013-10-24 | Terminal manufacturing method, and terminal and electronic component core manufacturing method |
TW102143405A TW201511055A (en) | 2013-09-02 | 2013-11-28 | Terminal manufacturing method as well as manufacturing method of terminals and cores of electronic parts and components |
Applications Claiming Priority (1)
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CN201310392036.4A CN103474859B (en) | 2013-09-02 | 2013-09-02 | The manufacture method of terminal manufacture method and terminal and electronic devices and components core body |
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CN103474859A true CN103474859A (en) | 2013-12-25 |
CN103474859B CN103474859B (en) | 2015-11-25 |
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CN201310392036.4A Active CN103474859B (en) | 2013-09-02 | 2013-09-02 | The manufacture method of terminal manufacture method and terminal and electronic devices and components core body |
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JP (1) | JP5824495B2 (en) |
CN (1) | CN103474859B (en) |
TW (1) | TW201511055A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103746208A (en) * | 2014-01-09 | 2014-04-23 | 青岛钜祥精密模具有限公司 | Contact elastic piece and high-precision manufacturing method thereof |
CN104753495A (en) * | 2015-03-28 | 2015-07-01 | 烟台大明电子科技有限公司 | Metal sheet grounding three lead surface mount quartz resonator and production technology thereof |
CN105719787A (en) * | 2014-12-20 | 2016-06-29 | 东光株式会社 | Surface-mount inductor and method for manufacturing the same |
CN108989511A (en) * | 2018-09-25 | 2018-12-11 | 苏州昀冢电子科技有限公司 | A kind of pedestal and voice coil motor with electronic component |
CN109287074A (en) * | 2018-09-25 | 2019-01-29 | 苏州昀冢电子科技有限公司 | A kind of production technology of the pedestal with electronic component |
CN113571992A (en) * | 2021-08-09 | 2021-10-29 | 东莞市彩历上自动化设备科技有限公司 | Terminal laminating machine |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6406338B1 (en) * | 1999-07-08 | 2002-06-18 | Yazaki Corporation | Board terminal and method of producing same |
CN1357948A (en) * | 2000-12-07 | 2002-07-10 | 富士康(昆山)电脑接插件有限公司 | Electric connector and manufacture of its terminal and core seat |
CN101471525A (en) * | 2007-12-29 | 2009-07-01 | 富士康(昆山)电脑接插件有限公司 | Terminal material belt and method of manufacturing the same |
CN102742096A (en) * | 2010-02-03 | 2012-10-17 | 矢崎总业株式会社 | Method for producing connector terminal and method for assembling multi-stage connector |
CN202585048U (en) * | 2011-12-14 | 2012-12-05 | 东莞大锋塑胶五金有限公司 | Improved network transformer terminal |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101044608B1 (en) * | 2009-05-29 | 2011-06-29 | 오세종 | Process for molding composite inductors |
TW201234395A (en) * | 2011-02-11 | 2012-08-16 | Superworld Electronics Co Ltd | Injection molding shielding type inductor manufacturing method |
-
2013
- 2013-09-02 CN CN201310392036.4A patent/CN103474859B/en active Active
- 2013-10-24 JP JP2013221187A patent/JP5824495B2/en not_active Expired - Fee Related
- 2013-11-28 TW TW102143405A patent/TW201511055A/en not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6406338B1 (en) * | 1999-07-08 | 2002-06-18 | Yazaki Corporation | Board terminal and method of producing same |
CN1357948A (en) * | 2000-12-07 | 2002-07-10 | 富士康(昆山)电脑接插件有限公司 | Electric connector and manufacture of its terminal and core seat |
CN101471525A (en) * | 2007-12-29 | 2009-07-01 | 富士康(昆山)电脑接插件有限公司 | Terminal material belt and method of manufacturing the same |
CN102742096A (en) * | 2010-02-03 | 2012-10-17 | 矢崎总业株式会社 | Method for producing connector terminal and method for assembling multi-stage connector |
CN202585048U (en) * | 2011-12-14 | 2012-12-05 | 东莞大锋塑胶五金有限公司 | Improved network transformer terminal |
Cited By (14)
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---|---|---|---|---|
CN103746208A (en) * | 2014-01-09 | 2014-04-23 | 青岛钜祥精密模具有限公司 | Contact elastic piece and high-precision manufacturing method thereof |
CN103746208B (en) * | 2014-01-09 | 2017-01-04 | 青岛钜祥精密模具有限公司 | Contact flat spring and method for high-precision manufacturing thereof |
CN105719787A (en) * | 2014-12-20 | 2016-06-29 | 东光株式会社 | Surface-mount inductor and method for manufacturing the same |
CN105719787B (en) * | 2014-12-20 | 2019-03-19 | 株式会社村田制作所 | Surface mount inductor and its manufacturing method |
CN104753495A (en) * | 2015-03-28 | 2015-07-01 | 烟台大明电子科技有限公司 | Metal sheet grounding three lead surface mount quartz resonator and production technology thereof |
CN104753495B (en) * | 2015-03-28 | 2017-10-20 | 烟台明德亨电子科技有限公司 | A kind of sheet metal is grounded three wire surfaces patch quartz resonator and its production technology |
CN109287074A (en) * | 2018-09-25 | 2019-01-29 | 苏州昀冢电子科技有限公司 | A kind of production technology of the pedestal with electronic component |
CN108989511A (en) * | 2018-09-25 | 2018-12-11 | 苏州昀冢电子科技有限公司 | A kind of pedestal and voice coil motor with electronic component |
CN114980560A (en) * | 2018-09-25 | 2022-08-30 | 苏州昀冢电子科技股份有限公司 | Production process of base with electronic element |
CN109287074B (en) * | 2018-09-25 | 2023-03-24 | 苏州昀冢电子科技股份有限公司 | Production process of base with electronic element |
CN108989511B (en) * | 2018-09-25 | 2023-05-12 | 苏州昀冢电子科技股份有限公司 | Base with electronic element and voice coil motor |
CN114980560B (en) * | 2018-09-25 | 2023-08-29 | 苏州昀冢电子科技股份有限公司 | Production process of base with electronic element |
CN113571992A (en) * | 2021-08-09 | 2021-10-29 | 东莞市彩历上自动化设备科技有限公司 | Terminal laminating machine |
CN113571992B (en) * | 2021-08-09 | 2024-01-12 | 东莞市彩历上自动化设备科技有限公司 | Terminal laminating machine |
Also Published As
Publication number | Publication date |
---|---|
JP2015050450A (en) | 2015-03-16 |
TWI460751B (en) | 2014-11-11 |
JP5824495B2 (en) | 2015-11-25 |
TW201511055A (en) | 2015-03-16 |
CN103474859B (en) | 2015-11-25 |
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