CN104347574B - Lead wire framework circuit and manufacturing method of lead wire framework circuit - Google Patents
Lead wire framework circuit and manufacturing method of lead wire framework circuit Download PDFInfo
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- CN104347574B CN104347574B CN201410530008.9A CN201410530008A CN104347574B CN 104347574 B CN104347574 B CN 104347574B CN 201410530008 A CN201410530008 A CN 201410530008A CN 104347574 B CN104347574 B CN 104347574B
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Abstract
The invention discloses a lead wire framework circuit, which comprises a lead wire framework and an electric element connected onto the lead wire framework, wherein the lead wire framework consists of at least two base bodies, the base bodies are connected through a base bridge, and each base body is provided with a fixing opening for fixing the electric element. The lead wire framework can be used for replacing a printed circuit board, the structure and the shape of the lead wire framework are not limited, in addition, a tin welding process is not needed between the lead wire framework and the electric element, the electric element is fixedly connected with the lead wire framework in a mechanical mode, the production cost is reduced, the environment is not polluted, and the environment protection is favorably realized.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, and in particular to a kind of lead frame circuit and preparation method thereof.
Background technology
At present almost all of circuit is needed by conducting wire substrate（Printing board PCB）The passive or active unit for constituting
Part.The manufacturing process of these printed circuit board (PCB)s is a process with multi-step and secondary step based on weight chemical industry.
Fig. 1 is the manufacturing process flow diagram of printed circuit board (PCB), and the manufacturing process of printed circuit board (PCB) is very loaded down with trivial details, and is with weight chemical industry
Based on, there is harmful effect to environment etc..Also, due to assembling process and the property of component, PCB will carry out soldering
Carry out fixation kit, common is to carry out wave soldering.
Not only operation trouble is fixed in soldering, and with certain environmental pollution, and be all to rely on pcb board to be welded
Connect, but the manufacturing process of pcb board is that based on weight chemical industry, also have certain pollution to environment.Accordingly, it would be desirable to a kind of
It is independent of tin welding and is independent of the circuit of pcb board connection.
The content of the invention
In order to solve above-mentioned technical problem, the present invention provides a kind of lead frame circuit and preparation method thereof, uses lead frame
Frame is substituting pcb board, and electrical equipment is connected with lead frame by being mechanically fixed.
Technical scheme of the present invention is：A kind of lead frame circuit, including lead frame and it is connected to lead
Electrical equipment on framework, the lead frame is made up of at least two matrixes, is connect by base bridging between described matrix, described
Matrix is provided with for the fixing port of holding electrical element.
Further, the fixing port includes patchhole and the fixing groove connected with patchhole, the diameter of the patchhole
More than the diameter of electrical equipment pin, the width of the fixing groove is less than the diameter of electrical equipment pin.
Further, the fixing groove is provided with V-type end, and the end at the V-type end is pointed end.
Further, the fixing port is fixing hole, and the diameter of the fixing hole is slightly less than the diameter of pressing.
Further, at least two matrixes are provided with connection end, and the connection end is provided with V-type opening, the V-type opening
Chute is inside provided with, the width of the chute is less than the diameter of lead.
Further, the end of the V-type opening is pointed end.
Further, described lead frame includes 4 pieces of matrixes, and 4 pieces of matrixes include the first matrix of c-type, are located at
The second matrix of " ＜ " type for being connected by Ji Qiao and the first matrix in first matrix, is oppositely arranged with the first matrix
3rd matrix of the first matrix is connect by base bridging, first is connect by base bridging between the 3rd matrix and the first matrix
The 4th basic matrix, described first is provided with the connection end of V-type opening with the 3rd matrix substantially, first matrix, the 3rd
Matrix and the 4th matrix are provided with fixing hole.
Further, described lead frame is stamped to form by metallic plate, is stamped with least one in the metallic plate and is drawn
Wire frame, the outside both sides of the metallic plate are provided with location hole.
Further, the material of the lead frame is ferrous metal or non-ferrous metal.
Present invention additionally comprises another kind of scheme：A kind of manufacture method of lead frame circuit, comprises the following steps：
（1）Electrical equipment pin is inserted the patchhole on lead frame and pin is slipped into into fixing groove and is fixed；
（2）All element groups are set behind position, are connected base bridge selective rhizotomy according to circuit；
（3）Cut the corner of lead frame.
The invention has the beneficial effects as follows：Printed circuit board (PCB), the structure and shape of lead frame can be replaced with the lead frame
Shape is not limited, and soldering process need not be carried out between lead frame and electrical equipment, and electrical equipment passes through machine with lead frame
Tool mode is connected.In lead frame include some matrixes, be connected together by base bridging between matrix, installation step it
Afterwards, cut, the electric path of uniqueness is formed with this.
Meanwhile, lead frame is stamped to form by metallic plate, and the both sides of metallic plate are provided with location hole, can facilitate automatization
Production, improve production efficiency accelerates whole production cycle.
Lead frame combines various mechanical functions, eliminates the demand to various parts and its assembling/tin-welding process,
Make product more succinct, stable lasting and moderate, be conducive to environmental conservation.
Description of the drawings
Below in conjunction with the accompanying drawings and embodiment the invention will be further described：
Fig. 1 is the Making programme of the printed circuit board (PCB) of prior art；
Fig. 2 is the structural representation of lead frame of the present invention；
Fig. 3 is the structural representation that the inner core of the wire of lead frame of the present invention and lead frame are connected；
Fig. 4 is the assembling schematic diagram of lead frame circuit of the present invention；
Fig. 5 is the Making programme of lead frame circuit of the present invention.
Wherein：1st, metallic plate, 2, fixing hole, 3, location hole, 4, lead frame, the 51, first matrix, the 52, second matrix,
53rd, the 3rd matrix, the 54, the 4th matrix, 510, V-type opening, 511, chute, 6, Ji Qiao, 7, patchhole, 8, fixing groove, 21, electricity
Sense, 22, electric capacity, 23, resistance, 91, insulation crust, 92, inner core.
Specific embodiment
Below in conjunction with the Description of Drawings specific embodiment of the invention.
Sheet Metal Forming Technology is a kind of standard fabrication methods of the metallic article of generation any shape.The lead frame of the present invention can
To be manufactured using Sheet Metal Forming Technology, punching press is carried out by required shape on flat rubber belting metallic plate, needed in some cases curved
Song contact.
The structural representation of lead frame of the present invention is illustrated in figure 2, punching on metallic plate 1 there are 4 lead frames 4（When
So the number of lead frame is the length according to metallic plate being punched）, the outer Side Cutting of metallic plate 1 has location hole 3, Ke Yiyong
In automatization high speed production.Lead frame 4 includes 4 pieces of matrixes：First matrix 51, the second matrix 52, the 3rd matrix 53, the 4th base
Body 54, the first matrix 51 is c-type, and the first matrix 51 is provided with connection end, and connection end is provided with V-type opening 510, in V-type opening 510
Be provided with chute 511, the width of chute 511 less than lead diameter, for breaking fixation so as to connecting other units.C-type
One end is provided with patchhole 7, patchhole 7 and is communicated with fixing groove 8, the diameter with diameter greater than electrical equipment pin of patchhole 7,
The width of fixing groove 8 can be used for breaking and fix less than the diameter of electrical equipment pin.Second matrix 52 is located at for " ＜ " type
In one matrix 51, the second matrix 52 connects the first matrix 51 by three base bridges 6, and in the second matrix 52 three patchholes are provided with
7 and fixing groove 8.What the 3rd matrix 53 was oppositely arranged with the first matrix 51 and was connected by a base bridge 6, the 3rd matrix 53 also sets
It is equipped with and the identical connection end of the first matrix 51, is additionally provided with a patchhole 7 and fixing groove 8.4th matrix 54 is located at the 3rd
Between the matrix 51 of matrix 53 and first, first is connected substantially by a base bridge 6, the 4th matrix 54 is provided with a patchhole 7
With fixing groove 8, fixing hole 2 is provided with the first matrix 51, the 3rd matrix 53 and the 4th matrix 54, the diameter of fixing hole 2 is smaller
In the diameter of pressing, can be used for fixing pressing.Certainly this mechanical fixed structure can also be other fixed structures, and on
The structure of lead frame a kind of exemplary structure also simply of the invention is stated, also including other structures.
When the wire of connection is provided with insulation crust, the end of V-type opening 210 can be set to pointed end, for cutting
Insulation crust is cut, the inner core for making wire is connected with lead frame（As shown in Figure 3）.Certainly other positions of lead frame 4 also may be used
To be provided with such structure, for example, fixing groove 8 is provided with V-type end, the end at V-type end is pointed end.
Fig. 4 is the assembling schematic diagram of lead frame circuit of the present invention, and inductance 21, electric capacity 22, resistance 23 can be according to fixations
Mouthful length reasonably being installed.The size of pin and fixing groove 8 is very for correct contact force and retentivity is guaranteed
Important.This is one and connects without soldering, but is selected also use laser welding, soldering and electric resistance welding or supersonic welding according to material
Connect, to guarantee to be mechanically and electrically.
Lead frame 4 needs reasonably to be arranged in the utilization rate that metallic plate can be so improved in the framework of blank band.
As the loop cycle of lead frame is produced, cut in different blanking die profiles.At the end of the operation, in last dress
With process, lead frame is easy to be positioned by location hole 3.
The material of lead frame can be ferrous metal or non-ferrous metal, such as copper due to its uniqueness electrically and mechanically
Performance, is usually used in electrical connection.This non-ferrous metal can use in a large number, but restriction has limitation compared with ferrous metal or ferroalloy,
It is more expensive because of its.Printed circuit board (PCB) is to be formed to need the low-resistance little circuit of high conductivity using copper.Ferrous material has relatively low
Electric conductivity and higher resistance, but can with large scale compensate this respect deficiency, come further reduces cost.
Assembling process is as shown in Figure 5：
Electrical equipment pin in assembling process is bending, inserts the patchhole 7 in lead frame and slips into solid
Determine groove 8 to be fixed.All parts groups are set behind position, and the base bridge 6 of lead frame will be cut off by selectivity, as a result define uniqueness
Electrical connection；The corner of lead frame is finally cut, and corner is placed in the cabinet of an insulation（Do not show herein
Show）.
Ultimate principle, principal character and the advantages of the present invention of the present invention has been shown and described above.The technology of the industry
Personnel simply illustrate the present invention it should be appreciated that the present invention is not limited by examples detailed above described in examples detailed above and description
Principle, without departing from the spirit and scope of the present invention the present invention also have various changes and modifications, these change and
Improvement is both fallen within scope of the claimed invention.The claimed scope of the invention is by appending claims and its equivalent
Thing is defined.
Claims (9)
1. a kind of lead frame circuit, it is characterised in that including lead frame and connection electrical equipment on the lead frames, institute
State lead frame to be made of metal, be made up of at least two matrixes, connect by base bridging between described matrix, described matrix is arranged
Have for the fixing port of holding electrical element, the electrical equipment is remaining after cutting off with the matrix of lead frame and by selectivity
Ji Qiao constitutes electric path, and the fixing port includes patchhole and the fixing groove connected with patchhole, the diameter of the patchhole
More than the diameter of electrical equipment pin, the width of the fixing groove is less than the diameter of electrical equipment pin.
2. lead frame circuit according to claim 1, it is characterised in that the fixing groove is provided with V-type end, the V
The end at type end is pointed end.
3. lead frame circuit according to claim 1, it is characterised in that the fixing port is fixing hole, the fixation
The diameter in hole is slightly less than the diameter of pressing.
4. lead frame circuit according to claim 1, it is characterised in that at least two matrixes are provided with connection end, institute
State connection end and be provided with V-type opening, chute is provided with the V-type opening, the width of the chute is less than the diameter of lead.
5. lead frame circuit according to claim 4, it is characterised in that the end of the V-type opening is pointed end.
6. the lead frame circuit according to any one of claim 1-5, it is characterised in that described lead frame includes 4
Block matrix, 4 pieces of matrixes include the first matrix of c-type, are located in first matrix and are connected with the first matrix by Ji Qiao
Fixed the second matrix of " ＜ " type, the 3rd matrix that the first matrix is connect by base bridging being oppositely arranged with the first matrix, located at institute
State and the 4th matrix of the first matrix, first matrix and the 3rd base are connect by base bridging between the 3rd matrix and the first matrix
Body is provided with the connection end of V-type opening, and first matrix, the 3rd matrix and the 4th matrix are provided with fixing hole.
7. the lead frame circuit according to any one of claim 1-5, it is characterised in that described lead frame is by metal
Plate is stamped to form, and at least one lead frame is stamped with the metallic plate, and the outside both sides of the metallic plate are provided with positioning
Hole.
8. the lead frame circuit according to any one of claim 1-5, it is characterised in that the material of the lead frame is
Ferrous metal or non-ferrous metal.
9. a kind of manufacture method of lead frame circuit, it is characterised in that comprise the following steps：
（1）Electrical equipment pin is inserted the patchhole on lead frame and pin is slipped into into fixing groove and is fixed；
（2）All element groups are set behind position, are connected base bridge selective rhizotomy according to circuit；
（3）Cut the corner of lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410530008.9A CN104347574B (en) | 2014-10-10 | 2014-10-10 | Lead wire framework circuit and manufacturing method of lead wire framework circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410530008.9A CN104347574B (en) | 2014-10-10 | 2014-10-10 | Lead wire framework circuit and manufacturing method of lead wire framework circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104347574A CN104347574A (en) | 2015-02-11 |
| CN104347574B true CN104347574B (en) | 2017-04-26 |
Family
ID=52502865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410530008.9A Active CN104347574B (en) | 2014-10-10 | 2014-10-10 | Lead wire framework circuit and manufacturing method of lead wire framework circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104347574B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022118288A1 (en) * | 2020-12-04 | 2022-06-09 | Molex, Llc | High-power electronics devices and methods for manufacturing same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201374332Y (en) * | 2009-03-25 | 2009-12-30 | 沈富德 | Multifunction flat package four lead frame |
| CN201392836Y (en) * | 2009-03-25 | 2010-01-27 | 沈富德 | Flatly packaged half-control bridge arm device |
| CN202678416U (en) * | 2012-07-02 | 2013-01-16 | 深圳市蓝科电子有限公司 | Light emitting diode lead frame |
| CN204167311U (en) * | 2014-10-10 | 2015-02-18 | 苏州技泰精密部件有限公司 | Lead frame circuit |
-
2014
- 2014-10-10 CN CN201410530008.9A patent/CN104347574B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201374332Y (en) * | 2009-03-25 | 2009-12-30 | 沈富德 | Multifunction flat package four lead frame |
| CN201392836Y (en) * | 2009-03-25 | 2010-01-27 | 沈富德 | Flatly packaged half-control bridge arm device |
| CN202678416U (en) * | 2012-07-02 | 2013-01-16 | 深圳市蓝科电子有限公司 | Light emitting diode lead frame |
| CN204167311U (en) * | 2014-10-10 | 2015-02-18 | 苏州技泰精密部件有限公司 | Lead frame circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022118288A1 (en) * | 2020-12-04 | 2022-06-09 | Molex, Llc | High-power electronics devices and methods for manufacturing same |
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| Publication number | Publication date |
|---|---|
| CN104347574A (en) | 2015-02-11 |
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