CN104347574A - Lead wire framework circuit and manufacturing method of lead wire framework circuit - Google Patents
Lead wire framework circuit and manufacturing method of lead wire framework circuit Download PDFInfo
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- CN104347574A CN104347574A CN201410530008.9A CN201410530008A CN104347574A CN 104347574 A CN104347574 A CN 104347574A CN 201410530008 A CN201410530008 A CN 201410530008A CN 104347574 A CN104347574 A CN 104347574A
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Abstract
The invention discloses a lead wire framework circuit, which comprises a lead wire framework and an electric element connected onto the lead wire framework, wherein the lead wire framework consists of at least two base bodies, the base bodies are connected through a base bridge, and each base body is provided with a fixing opening for fixing the electric element. The lead wire framework can be used for replacing a printed circuit board, the structure and the shape of the lead wire framework are not limited, in addition, a tin welding process is not needed between the lead wire framework and the electric element, the electric element is fixedly connected with the lead wire framework in a mechanical mode, the production cost is reduced, the environment is not polluted, and the environment protection is favorably realized.
Description
Technical field
the present invention relates to technical field of manufacturing semiconductors, be specifically related to a kind of lead frame circuit and preparation method thereof.
Background technology
circuit nearly all at present needs the passive or active element be made up of conducting wire substrate (printing board PCB).The manufacturing process of these printed circuit board (PCB)s is the processes with multi-step and secondary step based on heavy chemical industry.Fig. 1 is the manufacturing process flow diagram of printed circuit board (PCB), the manufacturing process of printed circuit board (PCB) very loaded down with trivial details, and based on heavy chemical industry, has harmful effect to environment etc.Further, due to the character of assembling process and assembly, PCB will carry out soldering and fix assembly, and common is carry out wave soldering.
the fixing not only operation trouble of soldering, and there is certain environmental pollution, and be all rely on pcb board to weld, but the manufacturing process of pcb board is based on heavy chemical industry, also has certain pollution to environment.Therefore, need a kind of do not rely on tin welding and do not rely on pcb board connect circuit.
Summary of the invention
in order to solve the problems of the technologies described above, the invention provides a kind of lead frame circuit and preparation method thereof, carry out alternative pcb board with lead frame, and electric component being fixedly connected with by machinery with lead frame.
technical scheme of the present invention is: a kind of lead frame circuit, comprise lead frame and the electric component be connected on the lead frames, described lead frame is made up of at least two matrixes, connect by base bridging between described matrix, described matrix is provided with the fixing port for holding electrical element.
further, the holddown groove that described fixing port comprises patchhole and is communicated with patchhole, the diameter of described patchhole is greater than the diameter of electric component pin, and the width of described holddown groove is less than the diameter of electric component pin.
further, described holddown groove is provided with V-type end, and the end of described V-type end is pointed end.
further, described fixing port is fixing hole, and the diameter of described fixing hole is slightly less than the diameter of pressing.
further, at least two matrixes are provided with link, and described link is provided with V-type opening, are provided with chute in described V-type opening, and the width of described chute is less than the diameter of lead-in wire.
further, the end of described V-type opening is pointed end.
further, described lead frame comprises 4 pieces of matrixes, described 4 pieces of matrixes comprise the first matrix of C type, be located at " < " type second matrix be connected and fixed by Ji Qiao and the first matrix in described first matrix, the 3rd matrix being connect the first matrix by base bridging be oppositely arranged with the first matrix, be located between described 3rd matrix and the first matrix and connect the first the 4th basic matrix by base bridging, the described first basic link being provided with V-type opening with the 3rd matrix, described first matrix, 3rd matrix and the 4th matrix are provided with fixing hole.
further, described lead frame is formed by stamped metal sheets, and in described metallic plate, punching press has at least one lead frame, and the both sides, outside of described metallic plate are provided with location hole.
further, the material of described lead frame is ferrous metal or non-ferrous metal.
the present invention also comprises another kind of scheme: a kind of manufacture method of lead frame circuit, comprises the following steps:
(1) electric component pin is inserted the patchhole on lead frame and pin is slipped into holddown groove be fixed;
(2), behind all element assembling location, connect base bridge selective rhizotomy according to circuit;
(3) corner of lead frame is cut.
the invention has the beneficial effects as follows: printed circuit board (PCB) can be replaced with this lead frame, structure and the shape of lead frame are not limit, and do not need between lead frame and electric component to carry out soldering process, electric component and lead frame are connected and fixed mechanically.Comprise some matrixes in lead frame, be connected together by base bridging between matrix, after installation step, cut, form unique electric path with this.
meanwhile, lead frame is formed by stamped metal sheets, and the both sides of metallic plate are provided with location hole, can facilitate the production of automation, enhance productivity, and accelerates the whole production cycle.
lead frame combines multiple mechanical function, eliminates the demand to various part and assembling/tin-welding process thereof, makes product more succinct, stable lasting, and moderate, is conducive to environmental protection.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described:
Fig. 1 is the Making programme of the printed circuit board (PCB) of prior art;
Fig. 2 is the structural representation of lead frame of the present invention;
Fig. 3 is the structural representation that the inner core of the wire of lead frame of the present invention is connected with lead frame;
Fig. 4 is the assembling schematic diagram of lead frame circuit of the present invention;
Fig. 5 is the Making programme of lead frame circuit of the present invention.
wherein: 1, metallic plate, 2, fixing hole, 3, location hole, 4, lead frame, the 51, first matrix, the 52, second matrix, 53, the 3rd matrix, the 54, the 4th matrix, 510, V-type opening, 511, chute, 6, Ji Qiao, 7, patchhole, 8, holddown groove, 21, inductance, 22, electric capacity, 23, resistance, 91, insulation crust, 92, inner core.
Embodiment
below in conjunction with accompanying drawing, the specific embodiment of the invention is described.
sheet Metal Forming Technology is a kind of standard fabrication methods producing the metallic article of any shape.Lead frame of the present invention can adopt Sheet Metal Forming Technology manufacture, and flat rubber belting metallic plate carries out punching press by required shape, needs bending contact in some cases.
be illustrated in figure 2 the structural representation of lead frame of the present invention, die-cutly on metallic plate 1 number of 4 certain lead frames of lead frame 4(is had to be come die-cut according to the length of metallic plate), the outer Side Cutting of metallic plate 1 has location hole 3, may be used for automatization high speed production.Lead frame 4 comprises 4 pieces of matrixes: the first matrix 51, second matrix 52, the 3rd matrix 53, the 4th matrix 54, first matrix 51 is C type, first matrix 51 is provided with link, link is provided with V-type opening 510, chute 511 is provided with in V-type opening 510, the width of chute 511 is less than the diameter of lead-in wire, fixes thus connect other unit for breaking.One end of C type is provided with patchhole 7, is communicated with holddown groove 8 in patchhole 7, and the diameter of patchhole 7 is greater than the diameter of electric component pin, and the width of holddown groove 8 is less than the diameter of electric component pin, may be used for breaking and fixes.Second matrix 52 is located in the first matrix 51 for " < " type, and the second matrix 52 is connected in the first matrix 51, second matrix 52 by three base bridges 6 and is provided with three patchholes 7 and holddown groove 8.3rd matrix 53 to be oppositely arranged with the first matrix 51 and to be connected by a base bridge 6, and the 3rd matrix 53 is also provided with the link identical with the first matrix 51, is also provided with a patchhole 7 and holddown groove 8.4th matrix 54 is located between the 3rd matrix 53 and the first matrix 51, connected first basic by a base bridge 6,4th matrix 54 is provided with a patchhole 7 and holddown groove 8, first matrix 51, the 3rd matrix 53 and the 4th matrix 54 are provided with fixing hole 2, the diameter of fixing hole 2 is slightly less than the diameter of pressing, may be used for fixing pressing.Certain this mechanical fixed structure also can be other fixed structure, and the structure of above-mentioned lead frame is also a kind of exemplary structure of the present invention, also comprises other structures.
when the wire connected is provided with insulation crust, the end of V-type opening 210 can be set to pointed end, for cutting insulation crust, the inner core of wire is connected (as shown in Figure 3) with lead frame.Other positions of certain lead frame 4 also can be provided with such structure, such as, holddown groove 8 are provided with V-type end, and the end of V-type end is pointed end.
fig. 4 is the assembling schematic diagram of lead frame circuit of the present invention, and inductance 21, electric capacity 22, resistance 23 can come reasonably to install according to the length of fixing port.The size of pin and holddown groove 8 is for guaranteeing that correct contact force and confining force are very important.To be that Wuxi is soldered connect for this, but according to Material selec-tion also laser weldable, and soldering and electric resistance welding or ultrasonic bonding, to guarantee machinery and electrical connection.
lead frame 4 needs reasonably to be arranged in the framework of blank band, can improve the utilance of metallic plate like this.Along with the loop cycle of lead frame is produced, cut in different blanking die profiles.At the end of this operation, in last assembling process, lead frame is located easily via location hole 3.
the material of lead frame can be ferrous metal or non-ferrous metal, and such as copper, due to the electric of its uniqueness and mechanical performance, is usually used in electrical connection.This non-ferrous metal is available in a large number, but restriction has limitation compared with ferrous metal or ferroalloy, because it is more expensive.Printed circuit board (PCB) utilizes copper to be formed to need the low-resistance little circuit of high conductivity.Ferrous material has lower conductivity and higher resistance, but can compensate the deficiency of this respect by large scale, reduces costs further.
assembling process is as shown in Figure 5:
electric component pin in assembling process is bending, inserts the patchhole 7 in lead frame and slip into holddown groove 8 to be fixed.Behind all assembling parts location, the base bridge 6 of lead frame will by selective rhizotomy, and result defines unique electrical connection; Finally cut the corner of lead frame, and corner is placed in a plastic casing insulated (not showing) herein.
more than show and describe general principle of the present invention, principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not by the restriction of above-mentioned example; what describe in above-mentioned example and specification just illustrates principle of the present invention; the present invention also has various changes and modifications without departing from the spirit and scope of the present invention, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection range is defined by appending claims and equivalent thereof.
Claims (10)
1. a lead frame circuit, it is characterized in that, comprise lead frame and the electric component be connected on the lead frames, described lead frame is made up of at least two matrixes, connect by base bridging between described matrix, described matrix is provided with the fixing port for holding electrical element.
2. lead frame circuit according to claim 1, it is characterized in that, the holddown groove that described fixing port comprises patchhole and is communicated with patchhole, the diameter of described patchhole is greater than the diameter of electric component pin, and the width of described holddown groove is less than the diameter of electric component pin.
3. lead frame circuit according to claim 2, is characterized in that, described holddown groove is provided with V-type end, and the end of described V-type end is pointed end.
4. lead frame circuit according to claim 1, is characterized in that, described fixing port is fixing hole, and the diameter of described fixing hole is slightly less than the diameter of pressing.
5. lead frame circuit according to claim 1, is characterized in that, at least two matrixes are provided with link, and described link is provided with V-type opening, is provided with chute in described V-type opening, and the width of described chute is less than the diameter of lead-in wire.
6. lead frame circuit according to claim 5, is characterized in that, the end of described V-type opening is pointed end.
7. the lead frame circuit according to any one of claim 1-6, it is characterized in that, described lead frame comprises 4 pieces of matrixes, described 4 pieces of matrixes comprise the first matrix of C type, be located at " < " type second matrix be connected and fixed by Ji Qiao and the first matrix in described first matrix, the 3rd matrix being connect the first matrix by base bridging be oppositely arranged with the first matrix, be located between described 3rd matrix and the first matrix and connect the first the 4th basic matrix by base bridging, the described first basic link being provided with V-type opening with the 3rd matrix, described first matrix, 3rd matrix and the 4th matrix are provided with fixing hole.
8. the lead frame circuit according to any one of claim 1-6, is characterized in that, described lead frame is formed by stamped metal sheets, and in described metallic plate, punching press has at least one lead frame, and the both sides, outside of described metallic plate are provided with location hole.
9. the lead frame circuit according to any one of claim 1-6, is characterized in that, the material of described lead frame is ferrous metal or non-ferrous metal.
10. a manufacture method for lead frame circuit, is characterized in that, comprises the following steps:
(1) electric component pin is inserted the patchhole on lead frame and pin is slipped into holddown groove be fixed;
(2), behind all element assembling location, connect base bridge selective rhizotomy according to circuit;
(3) corner of lead frame is cut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410530008.9A CN104347574B (en) | 2014-10-10 | 2014-10-10 | Lead wire framework circuit and manufacturing method of lead wire framework circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410530008.9A CN104347574B (en) | 2014-10-10 | 2014-10-10 | Lead wire framework circuit and manufacturing method of lead wire framework circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104347574A true CN104347574A (en) | 2015-02-11 |
| CN104347574B CN104347574B (en) | 2017-04-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410530008.9A Active CN104347574B (en) | 2014-10-10 | 2014-10-10 | Lead wire framework circuit and manufacturing method of lead wire framework circuit |
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| CN (1) | CN104347574B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2023547456A (en) * | 2020-12-04 | 2023-11-10 | モレックス エルエルシー | High power electronic devices and methods for manufacturing the same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201392836Y (en) * | 2009-03-25 | 2010-01-27 | 沈富德 | Flatly packaged half-control bridge arm device |
| CN201374332Y (en) * | 2009-03-25 | 2009-12-30 | 沈富德 | Multifunction flat package four lead frame |
| CN202678416U (en) * | 2012-07-02 | 2013-01-16 | 深圳市蓝科电子有限公司 | Light emitting diode lead frame |
| CN204167311U (en) * | 2014-10-10 | 2015-02-18 | 苏州技泰精密部件有限公司 | Lead frame circuit |
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| Publication number | Publication date |
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| CN104347574B (en) | 2017-04-26 |
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