CN108012441A - A kind of the in situ of dual-in-line integrated circuit substitutes implementation method - Google Patents
A kind of the in situ of dual-in-line integrated circuit substitutes implementation method Download PDFInfo
- Publication number
- CN108012441A CN108012441A CN201711415659.3A CN201711415659A CN108012441A CN 108012441 A CN108012441 A CN 108012441A CN 201711415659 A CN201711415659 A CN 201711415659A CN 108012441 A CN108012441 A CN 108012441A
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- CN
- China
- Prior art keywords
- integrated circuit
- dual
- line
- situ
- surface mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
The present invention proposes that a kind of the in situ of dual-in-line integrated circuit substitutes implementation method, finds surface mount integrated circuit according to the function of dual-in-line integrated circuit out of stock, the function of the surface mount integrated circuit found includes the function of dual-in-line integrated circuit；The surface mount integrated circuit found is mounted in switching printed board, mount the switching printed board of completion and multi-tap by welding assembly together with；The originally position of assembling dual-in-line integrated circuit is assembled on circuit board after the completion of welding assembly, completes the replacement in situ of dual-in-line integrated circuit out of stock.The present invention can electrically and on the basis of structure design realize the function of original circuit board not changing original circuit board.
Description
Technical field
The present invention relates to circuit assembly design field, is specially that a kind of the in situ of dual-in-line integrated circuit substitutes realization side
Method, the solution out of stock as circuit assembly device.
Background technology
Field, with the continuous development of semiconductor technology, electronic component are designed and assemble in computer electronic equipment
Iteration is very fast, causes the update of electronic product also very fast, and the electronic product of some military industries will be kept once shaping
The prolonged fighting capacity of army is stablized, then needs electronic product long service, so occur as soon as some electronic products and do not have because of halt production
There is the problem of electronic component spare part.In order to keep equipment stability and reliability, it is necessary to not change the situation of primary circuit plate
Under, a kind of alternative route is found, is solved the problems, such as because electronic product is because stopping production without electronic component spare part.
The content of the invention
Existing in the prior art to solve the problems, such as, the present invention proposes that a kind of in situ substitute of dual-in-line integrated circuit is realized
Method, can electrically and on the basis of structure design realize the function of original circuit board not changing original circuit board.
The technical scheme is that：
A kind of the in situ of dual-in-line integrated circuit substitutes implementation method, it is characterised in that：According to biserial out of stock
The function of straight cutting integrated circuit finds surface mount integrated circuit, and the function of the surface mount integrated circuit found is straight comprising biserial
Insert the function of integrated circuit；The surface mount integrated circuit found is mounted in switching printed board, mounts the switching print of completion
Making sheet and multi-tap by welding assembly together with；Original assembling dual-in-line is assembled on circuit board after the completion of welding assembly
The position of integrated circuit, completes the replacement in situ of dual-in-line integrated circuit out of stock.
Further preferred solution, a kind of the in situ of dual-in-line integrated circuit substitute implementation method, its feature exists
In：The first pad corresponding with surface mount integrated circuit is designed in the TOP faces of the switching printed board, and is drawn from the first pad
There is single track, track leads to the second pad corresponding with multi-tap in switching printed board；The spacing of second pad
Set according to the lead pin pitch of multi-tap and position.
Further preferred solution, a kind of the in situ of dual-in-line integrated circuit substitute implementation method, its feature exists
In：Multi-tap side is designed with welding pin corresponding with the second pad of printed board of transferring, and opposite side is designed with and circuit
The welding pin that the spacing of plate dual-in-line pin matches with size；Multi-tap housing uses insulating materials.
Further preferred solution, a kind of the in situ of dual-in-line integrated circuit substitute implementation method, its feature exists
In：The apparent size of the surface mount integrated circuit of selection is less than the apparent size of dual-in-line integrated circuit out of stock.
Beneficial effect
The present invention finds the surface mount integrated circuit of corresponding function according to the function of dual-in-line integrated circuit out of stock, leads to
Cross switching printed board and multi-tap, surface mount integrated circuit, switching printed board are welded with multi-tap together with, complete
The replacement in situ of congenerous dual-in-line integrated circuit.The present invention can be applied in dual-in-line integrated circuit plate cut-off, without
On the engineer application for changing original design circuit board.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention will become in the description from combination accompanying drawings below to embodiment
Substantially and it is readily appreciated that, wherein：
Fig. 1 is the structure diagram of switching printed board in the present invention；
Fig. 2 is the structure diagram of multi-tap in the present invention；
Fig. 3 is the dual-in-line integrated circuit use state diagram in situ substituted in the present invention.
Embodiment
The embodiment of the present invention is described below in detail, the embodiment is exemplary, it is intended to for explaining the present invention, and
It is not considered as limiting the invention.
The in situ of dual-in-line integrated circuit substitutes one embodiment as shown in FIG. 1 to 3 in the present invention：Dual-in-line collection
Being formed into circuit substitute (Fig. 3) in situ including three parts, surface mount integrated circuit (30) is mounted in switching printed board (20),
Mount switching printed board and the multi-tap (10) completed by welding assembly together with, which is assemblied in after the completion of welding
On circuit board on dual-in-line integrated circuit position out of stock, the replacement in situ of dual-in-line integrated circuit out of stock is completed.
Surface mount integrated circuit (30) in the present invention is selected according to the principle of dual-in-line integrated circuit out of stock,
The function of surface mount integrated circuit is considered during selection will contain the function of dual-in-line integrated circuit out of stock, due to congenerous not
Integrated circuit with encapsulation is more, the apparent size of preferred surface mount integrated circuit to be less than dual-in-line out of stock and integrates electricity
The apparent size on road.
Printed board of transferring in the present invention is the electric component of connection surface attachment integrated circuit and multi-tap, and switching is printed
The first pad corresponding with surface mount integrated circuit is designed in plate TOP faces, and the first pad is according to surface mount device pin definitions
Design；First pad leads to single track, and track leads to second of corresponding welding multi-tap in switching printed board
Pad；The spacing of second pad is set according to the lead pin pitch of multi-tap and position.
Multi-tap is used to connect switching printed board and circuit board in the present invention, and multi-tap is according to out of stock double on circuit board
The clipping room of row straight cutting integrated circuit is away from turn that matched pin, wherein side design and switching printed board are designed with prong sizes
Connect pad to welding pin, the welded pipe that opposite side design matches with the spacing of circuit board dual-in-line pin with size
Foot.The Socket casing of carrying pin use insulating materials, the thickness with the pin at switching soldering of printed boards end according to printed board of transferring
Degree design, ensures that pin stretches out the plate face of switching printed board, the welding pin extension elongation with the multi-tap of welding circuit board
According to the board thickness design of circuit board, ensure that pin stretches out the plate face of switching printed board.
Although the embodiment of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art are not departing from the principle of the present invention and objective
In the case of above-described embodiment can be changed within the scope of the invention, change, replace and modification.
Claims (4)
1. a kind of the in situ of dual-in-line integrated circuit substitutes implementation method, it is characterised in that：According to dual-in-line collection out of stock
Function into circuit finds surface mount integrated circuit, and the function of the surface mount integrated circuit found is integrated comprising dual-in-line
The function of circuit；The surface mount integrated circuit found is mounted in switching printed board, mount the switching printed board of completion with
Multi-tap by welding assembly together；Original assembling dual-in-line is assembled on circuit board after the completion of welding assembly and integrates electricity
The position on road, completes the replacement in situ of dual-in-line integrated circuit out of stock.
2. a kind of the in situ of dual-in-line integrated circuit substitutes implementation method according to claim 1, it is characterised in that：It is described
The first pad corresponding with surface mount integrated circuit is designed in the TOP faces of switching printed board, and is led to individually from the first pad
Track, track lead to switching printed board on the second pad corresponding with multi-tap；The spacing of second pad according to turn
The lead pin pitch of combination hub and position are set.
3. a kind of the in situ of dual-in-line integrated circuit substitutes implementation method according to claim 2, it is characterised in that：Switching
Socket side is designed with welding pin corresponding with the second pad of printed board of transferring, and opposite side is designed with straight with circuit board biserial
It is intubated the welding pin that the spacing of foot and size match；Multi-tap housing uses insulating materials.
4. a kind of the in situ of dual-in-line integrated circuit substitutes implementation method according to claim 3, it is characterised in that：Selection
Surface mount integrated circuit apparent size be less than dual-in-line integrated circuit out of stock apparent size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711415659.3A CN108012441A (en) | 2017-12-25 | 2017-12-25 | A kind of the in situ of dual-in-line integrated circuit substitutes implementation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711415659.3A CN108012441A (en) | 2017-12-25 | 2017-12-25 | A kind of the in situ of dual-in-line integrated circuit substitutes implementation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108012441A true CN108012441A (en) | 2018-05-08 |
Family
ID=62060946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711415659.3A Pending CN108012441A (en) | 2017-12-25 | 2017-12-25 | A kind of the in situ of dual-in-line integrated circuit substitutes implementation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108012441A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108647172A (en) * | 2018-06-04 | 2018-10-12 | 北京航天时代光电科技有限公司 | A kind of burning program method of eeprom chip |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201438530U (en) * | 2008-11-21 | 2010-04-14 | 中航光电科技股份有限公司 | Rectangle straight-plugging socket for printed-plate electric connector |
| CN203103284U (en) * | 2012-12-05 | 2013-07-31 | 深圳佰维存储科技有限公司 | TSOP (Thin Small Outline Package) memory device |
| CN204465503U (en) * | 2015-01-13 | 2015-07-08 | 中国人民解放军军械工程学院 | General digital logical integrated circuit replacement module |
| CN205984963U (en) * | 2016-08-19 | 2017-02-22 | 深圳电器公司 | Chip keysets and circuit board |
-
2017
- 2017-12-25 CN CN201711415659.3A patent/CN108012441A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201438530U (en) * | 2008-11-21 | 2010-04-14 | 中航光电科技股份有限公司 | Rectangle straight-plugging socket for printed-plate electric connector |
| CN203103284U (en) * | 2012-12-05 | 2013-07-31 | 深圳佰维存储科技有限公司 | TSOP (Thin Small Outline Package) memory device |
| CN204465503U (en) * | 2015-01-13 | 2015-07-08 | 中国人民解放军军械工程学院 | General digital logical integrated circuit replacement module |
| CN205984963U (en) * | 2016-08-19 | 2017-02-22 | 深圳电器公司 | Chip keysets and circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108647172A (en) * | 2018-06-04 | 2018-10-12 | 北京航天时代光电科技有限公司 | A kind of burning program method of eeprom chip |
| CN108647172B (en) * | 2018-06-04 | 2020-04-10 | 北京航天时代光电科技有限公司 | Program burning method of EEPROM chip |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180508 |