CN202632774U - Universal serial bus device - Google Patents

Universal serial bus device Download PDF

Info

Publication number
CN202632774U
CN202632774U CN2012202634775U CN201220263477U CN202632774U CN 202632774 U CN202632774 U CN 202632774U CN 2012202634775 U CN2012202634775 U CN 2012202634775U CN 201220263477 U CN201220263477 U CN 201220263477U CN 202632774 U CN202632774 U CN 202632774U
Authority
CN
China
Prior art keywords
circuit board
serial bus
golden finger
universal serial
bus device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2012202634775U
Other languages
Chinese (zh)
Inventor
侯建飞
徐健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ruida Technology (suzhou) Co Ltd
Original Assignee
Ruida Technology (suzhou) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ruida Technology (suzhou) Co Ltd filed Critical Ruida Technology (suzhou) Co Ltd
Priority to CN2012202634775U priority Critical patent/CN202632774U/en
Application granted granted Critical
Publication of CN202632774U publication Critical patent/CN202632774U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Abstract

The utility model relates to a universal serial bus device which comprises a first circuit board, a second circuit board, a memory chip, a control chip and a plastic package shell, wherein the first circuit board is provided with a front end and a rear end arranged opposite to each other, a first surface and a second surface arranged opposite to each other, and a plurality of first golden fingers formed on the first circuit board in a row, and the first golden fingers are provided with first electric contact surfaces exposed externally from the first surface; the second circuit board is provided with a head end and a tail end arranged opposite to each other, an upper surface and a lower surface arranged opposite to each other, and a plurality of second golden fingers formed on the second circuit board in a row in the rear parts of the first golden fingers, and the second golden fingers are provided with second electric contact surfaces exposed externally and located above the first golden fingers along the thickness direction of the first circuit board; the memory chip and the control chip are arranged on the second surface; and the plastic package shell is at least arranged on the second surface and packages the memory chip and the control chip. The universal serial bus device provided by the utility model is simple in structure and longer in service life, and the production and manufacturing cost can be lowered.

Description

Universal serial bus device
Technical field
The utility model relates to a kind of universal serial bus device, relates in particular to a kind of USB flash memory driver.
Background technology
USB (Universal Serial Bus; USB) be a serial bus standard that connects computer system and external unit; It also is a kind of IO interface technical manual; Be widely used in information communication products such as PC and mobile device, and extend to other association areas such as photographic goods, DTV (STB), game machine.
Since releasing the USB1.0 version in 1996, experienced USB1.1, USB2.0 version, developed into the USB3.0 version at present.The key distinction of each version is the difference of peak transfer rate.USB1.0 version transfer rate the earliest is 1.5Mbps (192KB/s), is mainly used in human interface device, for example keyboard, mouse, joystick etc.The USB1.1 transfer rate of releasing in 1998 has reached 12Mbps (1.5MB/s), is known as USB at full speed.And the USB2.0 transfer rate of releasing in 2000 has more obtained promoting further, reaches the high speed of 480Mbps (60MB/s).At present up-to-date USB3.0 is known as the have 5Gbps hypervelocity speed of (640MB/s), is 10 times of USB 2.0.
(USB Flash Drive UFD) claims USB flash disk again to the USB flash memory driver, is a kind of miniature high power capacity mobile storage product that need not phisical drive that adopts USB interface.The storage medium that its adopts is flash memory (Flash Memory), does not need extra driver, but driver and storage medium are united two into one, as long as connect the USB interface storage read-write data independently just on the computer.With USB3.0 correspondingly, at present the UFD of latest generation is UFD3.0.
In the traditional U FD3.0 structure, golden finger is arranged in two rows, and first row is made up of 4 Metal Contact sheets, as long as these 4 Metal Contact sheets are used for the product of the version below the compatible USB3.0.Second ranking is made up of 5 Metal Contact sheets in the first row rear, this 5 Metal Contact sheets extra increase in order to adapt to USB3.0.And at present, back 5 Metal Contact sheets of row are generally processed shell fragment earlier, directly are welded on the pcb board then.But under long plugging condition, 5 Metal Contact sheets of shell fragment form are easy to generate fatigue, cause losing efficacy, and in the preparation process, its preparation technology are generally also complicated, so its manufacturing cost is also higher.
In view of this, be necessary existing universal serial bus device is improved to address the above problem.
The utility model content
The purpose of the utility model is to provide a kind of universal serial bus device, and it is simple in structure, and serviceable life is longer, and manufacturing cost is lower.
For realizing above-mentioned utility model purpose, the utility model adopts following technical scheme: a kind of universal serial bus device comprises:
First circuit board; Have the front-end and back-end that are oppositely arranged, first surface that is oppositely arranged and second surface and be molded over some first golden fingers that are arranged into a row on the said first circuit board, said first golden finger has the first electrical surface of contact that outwards exposes from first surface;
Second circuit board; Be soldered on the first surface of first circuit board; Said second circuit board has head end and tail end, the upper surface that is oppositely arranged and the lower surface that is oppositely arranged and is molded on the said second circuit board and some second golden fingers that are arranged in a row in the first golden finger rear, and said second golden finger has and is exposed to the external world and along the second electrical surface of contact that is positioned at first golden finger top on the first circuit board thickness direction;
Storage chip and control chip are arranged on the second surface;
And the plastic packaging housing, be arranged on the second surface at least, and seal the residence and state storage chip and control chip.
Further improvement as the utility model; Said second circuit board is shorter in length than the length of said first circuit board; Said second golden finger is plates, and outwards projection exceeds the head end of said second circuit board and abuts on the first surface of said first circuit board.
As the further improvement of the utility model, the lower surface of said second circuit board is welded on the first surface of said first circuit board with the surface-welding mode.
As the further improvement of the utility model, the quantity of said first golden finger is 4, and the quantity of said second golden finger is 5, and the arrangement mode of said first golden finger and second golden finger meets USB 3.0 interface standards.
As the further improvement of the utility model, said universal serial bus device also comprises and is arranged on said second circuit board not by the power supply module and the crystal oscillator of the part of plastic packaging housing package.
Compared with prior art; The beneficial effect of the utility model is: through two circuit board welding being superposeed and directly on two circuit boards, forming two row's golden fingers; Make that the universal serial bus device of the utility model is simple in structure; Easily manufactured, serviceable life is longer, and can reduce manufacturing cost.
Description of drawings
Fig. 1 is the structural representation of universal serial bus device among the utility model one embodiment.
Fig. 2 is the exploded view of universal serial bus device among Fig. 1.
Fig. 3 is the structural representation of first circuit board among Fig. 1.
Fig. 4 is the structural representation of second circuit board among Fig. 1.
Fig. 5 is the manufacturing process flow diagram of universal serial bus device among Fig. 1.
Embodiment
See also Fig. 1 to 4, the universal serial bus device of the utility model one embodiment comprises circuit board assemblies (not indicating), is encapsulated in the plastic packaging housing 2 on the circuit board assemblies and is arranged on the power supply module 3 on the circuit board assemblies.This power supply module 3 is exposed to the external world.Be described in detail in the face of each parts in the present embodiment and the mutual relationship between each parts down.
Second circuit board that circuit board assemblies comprises first circuit board 11, electrically connect with first circuit board 11 12, storage chip 13 and control chip 14 and crystal oscillator 15, the length that is shorter in length than first circuit board 11 of second circuit board 12.Realize that with second circuit board 12 binary channels is connected through this first circuit board 11.The concrete structure of these each parts of circuit board assemblies is following:
First circuit board 11 has front end 111 and rear end 112, first surface 113 that is oppositely arranged and the second surface 114 that is oppositely arranged and is molded over 4 first golden fingers 115 that are arranged into a row on the first surface 113.4 first golden fingers 115 have the first electrical surface of contact 1151 that outwards exposes from first surface 113.
Second circuit board 12 has head end 121 and tail end 122, upper surface 123 that is oppositely arranged and the lower surface 124 that is oppositely arranged and is molded on the second circuit board 12 and 5 second golden fingers 125 that are arranged in a row in first golden finger, 115 rears.5 second golden fingers 125 have and are exposed to the external world and along the second electrical surface of contact 1251 that is positioned at first golden finger, 115 tops on first circuit board 11 thickness directions.At this, second golden finger 115 is plates, and outwards projection exceeds the head end 121 of second circuit board 12 and abuts on the first surface 113 of first circuit board 11.At this, the lower surface 124 of second circuit board 12 is welded on the first surface 113 of first circuit board 11 with the surface-welding mode.
Storage chip 13 is arranged on the second surface 114 with control chip 14.This storage chip 13 is welded on the second surface 114 with the surface-welding mode with control chip 14.Except that present embodiment, storage chip 13 also can be for a plurality of with control chip 14.
Crystal oscillator 15 is welded on the upper surface 123 of second circuit board 12 with the surface-welding mode.
Above-mentioned first golden finger 115 is near the front end 111 of first circuit board 11, and the arrangement mode of first golden finger 115 and second golden finger 125 meets USB 3.0 interface standards.In the present embodiment; Because first circuit board 11 is welding stack design with second circuit board 12 and directly on first circuit board 11 and second circuit board 12, forms first golden finger 115 and second golden finger 125 respectively; So this universal serial bus device compared with prior art; Have simple in structurely, serviceable life is longer, and can reduce the advantage of manufacturing cost.
Plastic packaging housing 2 is arranged on the second surface 114, and seals storage chip 13 and control chip 14.At this, the part of upper surface 123 for not sealed by plastic packaging housing 2.Because the above-mentioned crystal oscillator 15 of having mentioned is arranged on upper surface 123, so crystal oscillator 15 is exposed to the external world.This plastic packaging housing 2 adopts Shooting Technique to realize.
Power supply module 3 is electrically connected on the upper surface 123 of second circuit board 12 of circuit board assemblies.Because upper surface 123 is not by the part of plastic packaging housing 2 packages, so this power supply module 3 is exposed to the external world.Power supply module 3 is welded on the upper surface 123 with the surface-welding mode.In the present embodiment; Because plastic packaging housing 2 is not sealed circuit board assemblies fully and power supply module 3 is exposed to the external world; So the universal serial bus device in the present embodiment is compared with prior art, not only reduced overall dimensions, reduced manufacturing cost; Also improve heat dispersion, also helped the maintenance in later stage.Except that above-mentioned advantage, because power supply module 3 is separately positioned on two different surface with storage chip 13 and control chip 14, so also reduced crosstalking between the signal.
Need to prove that at this it is identical with the reason that this power supply module 3 is exposed to the external world that crystal oscillator 15 is designed to be exposed to extraneous reason.Certainly also can be for this crystal oscillator 15 and power supply module with storage chip 13 and control chip 14 the same being arranged on the second surface 114, and seal through plastic packaging housing 2.
Except that above-mentioned parts; In circuit board assemblies, also comprise electric capacity (not indicating), resistance passive devices 17 such as (not indicating); In the present embodiment, this passive device 17 equally is arranged on the upper surface 123 with power supply module 3, crystal oscillator 15, promptly is exposed to the external world.Through passive device 17 is exposed to the external world, can reduces technology and reduce cost.Certainly, except that present embodiment, also can be with passive device 17 with storage chip 13 and control chip 14 the same being arranged on the second surface 114, and seal through plastic packaging housing 2.And to plastic packaging housing 2, this plastic packaging housing 2 also can be sealed upper surface 123.
Please combine below to see that process chart shown in Figure 5 does detailed description to the manufacturing approach of the universal serial bus device in the foregoing description.
One channel plate array (step 511) is provided; To adapt to extensive manufacturing; In the present embodiment, channel plate array comprises several and on same plane, arranges the first circuit board 11 that is provided with that every first circuit board 11 has identical construction; And the product technology of follow-up formation is also identical; So below only with wherein one be that example describes, like Fig. 2, the structure shown in 3, first circuit board 11 has the front end that is oppositely arranged 111 with rear end 112, first surface 113 that is oppositely arranged and second surface 114 and be molded over 4 first golden fingers 115 that are arranged into a row on the first circuit board 11.4 first golden fingers 115 have the first electrical surface of contact 1151 that outwards exposes from first surface 113.
A storage chip 13 and a control chip 14 (step 512) are provided.Storage chip 13 and control chip 14 are welded to the surface-welding mode on the second surface 114 of first circuit board 11 (step 513).At this, the electron device that this storage chip 13 and control chip 14 are used always for those skilled in the art is not so be elaborated to it at this.Except that present embodiment, also can a plurality of storage chips 13 be welded on the second surface 114 with control chip 14.
Please combine Fig. 2, between storage chip 13, control chip 14 and first circuit board 11,16 realize electrically connecting (step 514) through going between.
On the second surface 114 of first circuit board 11, form plastic casing 2 (step 515) through injection mo(u)lding, be arranged on storage chip 13 and control chip 14 on the second surface 114 to seal through above-mentioned steps.
Another channel plate array (step 521) is provided; To adapt to extensive manufacturing, in the present embodiment, this another channel plate array comprises several and on same plane, arranges the second circuit board 12 that is provided with; Every second circuit board 12 has identical construction; And the product technology of follow-up formation is also identical, thus following only with wherein one be that example describes, like Fig. 2, the structure shown in 4; The length that is shorter in length than first circuit board 11 of second circuit board 12, the width of second circuit board 12 is identical with the width of first circuit board 11.Second circuit board 12 has head end 121 and tail end 122, upper surface 123 that is oppositely arranged and the lower surface 124 that is oppositely arranged and is molded over 5 second golden fingers 125 that are arranged into a row on the second circuit board 12; 5 second golden fingers 125 have the second electrical surface of contact 1251 that is exposed to the external world; At this; Second golden finger 115 is plates, and outwards projection exceeds the head end 121 of second circuit board 12 and abuts on the first surface 113 of first circuit board 11.
Passive device 17 (step 522) is provided, and passive device 17 is welded on the upper surface 123 of second circuit board 12 (step 523).Well known to those of ordinary skill in the art is, passive device 17 is for active member, and mainly being meant does not influence the signal essential characteristic, only lets signal pass through and the passive device that do not change, has generally included resistance, electric capacity etc.In this embodiment, passive device 17 can (Surface Mounted Technology SMT) be welded on the upper surface 123 through the surface-welding technology.Promptly the corresponding position on upper surface 123 is placed scolder in advance; Then, passive device 17 mounts the relevant position of upper surface 123; Make solder fusing through Reflow Soldering equipment, thereby passive device 17 is welded on the upper surface 123 securely.Because the SMT technology is well known to those of ordinary skill in the art, so the applicant no longer gives unnecessary details at this.
Power supply module 3 and crystal oscillator 15 (step 524) are provided, and power supply module 3 and crystal oscillator 15 are welded to the surface-welding mode on the upper surface 123 of second circuit board 12 (step 525).Electrically connect (step 526) through lead-in wire (not shown) between power supply module 3, crystal oscillator 15 and the second circuit board 12.
The first circuit board 11 and second circuit board 12 (step 53) of welding through accomplishing above-mentioned steps respectively; Mainly be that lower surface 124 with second circuit board 12 is welded on the first surface 113 of first circuit board 11 with the surface-welding mode; And make the golden finger 115 of winning near front end 111; Second golden finger 125 is positioned at the rear of first golden finger 115, and the second electrical surface of contact 1251 is along being positioned at the first electrical surface of contact, 1151 tops on first circuit board 11 thickness directions.Second golden finger 125 abuts on the first surface 113 of first circuit board 11.At this, meet USB 3.0 interface standards at the arrangement mode of 4 first golden fingers 115 on the first circuit board 11 and 5 second golden fingers 125 on second circuit board 12.
At last, on plastic packaging housing 2, carry out laser marking, like information (step 54) such as mark exabyte, memory capacity.Subsequently, with product cutting (step 55),, accomplish the manufacturing of product then through electric performance test packing (step 56).
Although be the example purpose; The preferred implementation of the utility model is disclosed; But those of ordinary skill in the art will recognize, under situation about not breaking away from by the scope of the disclosed the utility model of appending claims and spirit, various improvement, increase and replacement are possible.

Claims (5)

1. universal serial bus device, it is characterized in that: this device comprises:
First circuit board; Have the front-end and back-end that are oppositely arranged, first surface that is oppositely arranged and second surface and be molded over some first golden fingers that are arranged into a row on the said first circuit board, said first golden finger has the first electrical surface of contact that outwards exposes from first surface;
Second circuit board; Be soldered on the first surface of first circuit board; Said second circuit board has head end and tail end, the upper surface that is oppositely arranged and the lower surface that is oppositely arranged and is molded on the said second circuit board and some second golden fingers that are arranged in a row in the first golden finger rear, and said second golden finger has and is exposed to the external world and along the second electrical surface of contact that is positioned at first golden finger top on the first circuit board thickness direction;
Storage chip and control chip are arranged on the second surface;
And the plastic packaging housing, be arranged on the second surface at least, and seal the residence and state storage chip and control chip.
2. universal serial bus device according to claim 1; It is characterized in that: said second circuit board is shorter in length than the length of said first circuit board; Said second golden finger is plates, and outwards projection exceeds the head end of said second circuit board and abuts on the first surface of said first circuit board.
3. universal serial bus device according to claim 1 and 2 is characterized in that: the lower surface of said second circuit board is welded on the first surface of said first circuit board with the surface-welding mode.
4. universal serial bus device according to claim 1 and 2; It is characterized in that: the quantity of said first golden finger is 4; The quantity of said second golden finger is 5, and the arrangement mode of said first golden finger and second golden finger meets USB 3.0 interface standards.
5. universal serial bus device according to claim 1 is characterized in that: said universal serial bus device also comprises and is arranged on said second circuit board not by the power supply module and the crystal oscillator of the part of plastic packaging housing package.
CN2012202634775U 2012-06-06 2012-06-06 Universal serial bus device Expired - Fee Related CN202632774U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012202634775U CN202632774U (en) 2012-06-06 2012-06-06 Universal serial bus device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012202634775U CN202632774U (en) 2012-06-06 2012-06-06 Universal serial bus device

Publications (1)

Publication Number Publication Date
CN202632774U true CN202632774U (en) 2012-12-26

Family

ID=47385938

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012202634775U Expired - Fee Related CN202632774U (en) 2012-06-06 2012-06-06 Universal serial bus device

Country Status (1)

Country Link
CN (1) CN202632774U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103474089A (en) * 2012-06-06 2013-12-25 智瑞达科技（苏州）有限公司 Universal serial bus device and manufacturing method thereof
TWI484406B (en) * 2013-05-13 2015-05-11 Phison Electronics Corp Flash drive

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103474089A (en) * 2012-06-06 2013-12-25 智瑞达科技（苏州）有限公司 Universal serial bus device and manufacturing method thereof
TWI484406B (en) * 2013-05-13 2015-05-11 Phison Electronics Corp Flash drive

Similar Documents

Publication Publication Date Title
CN102646606B (en) Packaging method of integrated circuit (IC) card module
CN104576557A (en) Semiconductor package devices including interposer openings
CN102194768B (en) Substrate, package substrates, semiconductor package part and manufacture method thereof
US20130062783A1 (en) Chip packaging structure and manufacturing method for the same
CN202632774U (en) Universal serial bus device
CN103474089A (en) Universal serial bus device and manufacturing method thereof
CN104020536A (en) Method for packaging optical transceiver module
CN103426869B (en) Package on package and manufacture method thereof
CN203553611U (en) Surface mount packaging of laser diode
CN201374327Y (en) Ceramic small-shape shell
CN102646645B (en) Packaging structure and manufacturing method thereof
CN202721119U (en) Improved triode lead frame
CN205318847U (en) Solid state hard drives storage module and solid state hard drives
CN202677853U (en) Universal serial bus (USB) device
CN203055893U (en) Re-wiring thermal enhanced FCQFN packaging device
CN103473200A (en) Universal serial bus device and manufacturing method thereof
CN201425939Y (en) Flip chip IC package structure
CN102376666B (en) A kind of ball grid array package structure and manufacture method thereof
CN204167636U (en) The black colloid of a kind of mobile phone USB flash disk
CN101483164B (en) Semi-conductor encapsulation structure
CN213816118U (en) Packaging structure of SMD linear constant current IC
CN203617268U (en) AAQFN packaging member capable of enhancing heat dissipating function
CN2927357Y (en) Electric connector
CN217086565U (en) Novel radiating COB packaging structure
CN220138312U (en) Compact dual chip power device

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20121226

Termination date: 20150606

EXPY Termination of patent right or utility model