CN202721119U - Improved triode lead frame - Google Patents
Improved triode lead frame Download PDFInfo
- Publication number
- CN202721119U CN202721119U CN 201220216321 CN201220216321U CN202721119U CN 202721119 U CN202721119 U CN 202721119U CN 201220216321 CN201220216321 CN 201220216321 CN 201220216321 U CN201220216321 U CN 201220216321U CN 202721119 U CN202721119 U CN 202721119U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- bearing platform
- utility
- chip bearing
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model provides an improved triode lead frame which comprises a plurality of frame units, wherein the upper end of each frame unit is a radiating fin, and the radiating fin is provided with a circular through hole. According to the improved triode lead frame of the utility model, binding force between the lead frame and a plastic housing and a chip is enhanced, exterior steam or dust is prevented from entering into the frame, and thus, the performance of a product is substantially improved.
Description
Technical field
The utility model relates to a kind of follow-on lead frame of triode.
Background technology
Follow the development of electronic market, the integrated level of semiconductor components and devices is more and more higher, and its memory space, conversion speed and power increases rapidly, yet volume is but more and more less.This trend has been accelerated the development of semiconductor device packaging technique, so the importance of semiconductor device packaging technique has been subjected to the concern of manufacturing enterprise.The high integration of semiconductor device and the increase of memory are also so that the also corresponding increase of the quantity of input and output binding post, and also so that the number of lead-in wire increases accordingly, this layout that just requires to go between also must be accurately then.
Lead frame is the skeleton in the semiconductor packages, and it mainly is made of three parts: fin, chip bearing platform and pin.Wherein for chip provides mechanical support, pin then is to connect chip to the electric path of circuit board to the chip bearing platform in encapsulation process.The function of lead frame is vital, and chip is in encapsulation process and in using, often because the pad rosin joint, and steam or have corrosive liquid and enter chip, or plastic casing gets loose with metallic support and directly causes the triode inefficacy.For the demand of satisfying the market development, lead frame structurally, need continuous improvement on the function.
The utility model content
In order to overcome the technical problem that exists in the prior art, the utility model provides following technical scheme:
A kind of follow-on lead frame of triode comprises several frame units, and each frame unit upper end is fin, and described fin is provided with a manhole.
Further described fin bottom is the chip bearing platform, is provided with the zigzag groove between described fin and described chip bearing platform.
Further, described chip bearing platform positive and negative is equipped with rectangular channel along the edge, also is provided with trapezoidal groove in the inboard of described rectangular channel.
Further, the pin more than 2 of linking to each other with described chip bearing platform, the head of described pin is 60 ° pointed design.
The beneficial effect that the utility model brings is: pass to design and strengthened adhesion between lead frame and plastic casing, the chip, also can stop outside steam or dust to enter framework, greatly improved the performance of product.
Description of drawings
The lead frame structure schematic diagram that Fig. 1 provides for the utility model embodiment one
The lead frame A-A cross section structure schematic diagram that Fig. 2 provides for the utility model embodiment one
The lead frame B-B cross section structure schematic diagram that Fig. 3 provides for the utility model embodiment one
The lead frame structure schematic diagram that Fig. 4 provides for the utility model embodiment two
The lead frame C-C cross section structure schematic diagram that Fig. 5 provides for the utility model embodiment two
The lead frame D-D cross section structure schematic diagram that Fig. 6 provides for the utility model embodiment two
Embodiment
The below is to elaborating preferred embodiment of the present utility model by reference to the accompanying drawings, thereby so that advantage of the present utility model and feature can be easier to be it will be appreciated by those skilled in the art that protection range of the present utility model made more explicit defining.
Embodiment one
Such as Fig. 1, Fig. 2, shown in Figure 3, a kind of follow-on lead frame of triode, this lead frame comprises several frame units, be connected by upper muscle 4, middle muscle 5, end muscle 6 between the described adjacent frame unit, each described frame unit upper end is fin 1, described fin bottom is chip bearing platform 2, and what link to each other with described chip bearing platform is pin 3.
Wherein, be provided with manhole 11 at described fin 1, be provided with zigzag groove 12 between described fin 1 and the described chip bearing platform 2.Described chip bearing platform 2 positive and negatives are equipped with rectangular channel 21 and also are provided with trapezoidal groove 22 in the inboard of described front rectangular channel along the edge.
Wherein, described pin is comprised of left side pin 31, middle pin 32, right side pin 33, and the head of described pin is 60 ° pointed design.
Embodiment two
Such as Fig. 4, Fig. 5, shown in Figure 6, a kind of follow-on lead frame of triode, this lead frame comprises several frame units, be connected by upper muscle d, middle muscle e, end muscle f between the described adjacent frame unit, each described frame unit upper end is fin a, described fin bottom is chip bearing platform b, and that link to each other with described chip bearing platform is pin c.
Wherein, be provided with manhole a1 at described fin a, be provided with zigzag groove a2 between described fin a and the described chip bearing platform b.Described chip bearing platform b positive and negative is equipped with rectangular channel b1 and also is provided with trapezoidal groove b2 in the inboard of described front rectangular channel along the edge.
Wherein, described pin is comprised of left side pin c1, right side pin c2, and the head of described pin is 60 ° pointed design.
Can find out by embodiment one and two, be provided with the weld strength that a manhole can increase lead frame and chip at fin.Between described fin and described chip bearing platform, be provided with zigzag groove, can stop entering of outside liquid and dust.Described chip bearing platform positive and negative is equipped with rectangular channel along the edge, be used for strengthening and plastic casing between snap-in force.Also be provided with trapezoidal groove in the inboard of described front rectangular channel and be used for stoping entering of outside liquid dust.The head of described pin is 60 ° pointed design, convenient follow-up cut-out and the plug of triode.
The above; it only is one of embodiment of the present utility model; but protection range of the present utility model is not limited to this; any those of ordinary skill in the art are in the disclosed technical scope of the utility model; variation or the replacement that can expect without creative work all should be encompassed within the protection range of the present utility model.Therefore, protection range of the present utility model should be as the criterion with the protection range that claims were limited.
Claims (4)
1. a follow-on lead frame of triode comprises several frame units, and each frame unit upper end is fin, it is characterized in that, described fin is provided with a manhole.
2. a kind of follow-on lead frame of triode according to claim 1 is characterized in that, described fin bottom is the chip bearing platform, is provided with the zigzag groove between described fin and described chip bearing platform.
3. a kind of follow-on lead frame of triode according to claim 2 is characterized in that, described chip bearing platform positive and negative is equipped with rectangular channel along the edge, also is provided with trapezoidal groove in the inboard of described rectangular channel.
4. a kind of follow-on lead frame of triode according to claim 2 is characterized in that, the pin more than 2 of linking to each other with described chip bearing platform, and the head of described pin is 60 ° pointed design.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220216321 CN202721119U (en) | 2012-05-15 | 2012-05-15 | Improved triode lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220216321 CN202721119U (en) | 2012-05-15 | 2012-05-15 | Improved triode lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202721119U true CN202721119U (en) | 2013-02-06 |
Family
ID=47622929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220216321 Expired - Fee Related CN202721119U (en) | 2012-05-15 | 2012-05-15 | Improved triode lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202721119U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103606541A (en) * | 2013-11-08 | 2014-02-26 | 张轩 | Plastic split lead frame |
| CN103928421A (en) * | 2014-03-27 | 2014-07-16 | 张轩 | Lead frame with sawtooth-shaped waterproof grooves |
| CN105895592A (en) * | 2016-06-24 | 2016-08-24 | 扬州扬杰电子科技股份有限公司 | Frame, diode comprising same and processing technology of diode |
| CN107994003A (en) * | 2017-12-01 | 2018-05-04 | 泰州友润电子科技股份有限公司 | A kind of improved TO-220EW lead frames |
-
2012
- 2012-05-15 CN CN 201220216321 patent/CN202721119U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103606541A (en) * | 2013-11-08 | 2014-02-26 | 张轩 | Plastic split lead frame |
| CN103928421A (en) * | 2014-03-27 | 2014-07-16 | 张轩 | Lead frame with sawtooth-shaped waterproof grooves |
| CN105895592A (en) * | 2016-06-24 | 2016-08-24 | 扬州扬杰电子科技股份有限公司 | Frame, diode comprising same and processing technology of diode |
| CN107994003A (en) * | 2017-12-01 | 2018-05-04 | 泰州友润电子科技股份有限公司 | A kind of improved TO-220EW lead frames |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202721119U (en) | Improved triode lead frame | |
| CN203554842U (en) | Circuit board sealing structure | |
| US10388329B2 (en) | SSD storage module, SSD component, and SSD | |
| CN201374327Y (en) | Ceramic small-shape shell | |
| CN203746628U (en) | Network transformer | |
| CN203553129U (en) | Integrated circuit package with anti-shock function | |
| CN102612307B (en) | One easily welds radome | |
| CN202444695U (en) | RCD (Resistance, Capacitance and Diode) buffer circuit printed substrate, buffer circuit board and buffer circuit | |
| CN102222660B (en) | Double-lead-frame multi-chip common package body and manufacturing method thereof | |
| CN104363698B (en) | The row leaded package and encapsulation design method and wiring board of wiring board | |
| CN205376511U (en) | USB flash disk memory body IC chip is close apart from encapsulating | |
| CN103474089A (en) | Universal serial bus device and manufacturing method thereof | |
| CN202632774U (en) | Universal serial bus device | |
| CN204167636U (en) | The black colloid of a kind of mobile phone USB flash disk | |
| CN203553131U (en) | Flat integrated circuit packaging structure with lead in appearance | |
| CN205902276U (en) | Small -size PCB board mounting structure of efficient | |
| CN203368298U (en) | A shell-entering pouring-sealing-type module power supply | |
| CN204315552U (en) | Chip package structure | |
| CN202068020U (en) | Fastener structure | |
| CN203968078U (en) | The Miniature Quartz with ground lead | |
| CN202958076U (en) | Board-level interconnection structure and electrical equipment | |
| CN203013718U (en) | Photovoltaic bypass diode | |
| CN202523700U (en) | AAP power module | |
| US10714148B2 (en) | SSD storage module, SSD component, and SSD | |
| CN202857142U (en) | Circuit board and anti-offset pad structure thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| DD01 | Delivery of document by public notice |
Addressee: Suzhou Taijia Electronics Co., Ltd. Document name: Notification to Pay the Fees |
|
| DD01 | Delivery of document by public notice |
Addressee: Suzhou Taijia Electronics Co., Ltd. Document name: Notification of Termination of Patent Right |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130206 Termination date: 20160515 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |