CN203554842U - Circuit board sealing structure - Google Patents
Circuit board sealing structure Download PDFInfo
- Publication number
- CN203554842U CN203554842U CN201320685079.7U CN201320685079U CN203554842U CN 203554842 U CN203554842 U CN 203554842U CN 201320685079 U CN201320685079 U CN 201320685079U CN 203554842 U CN203554842 U CN 203554842U
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- CN
- China
- Prior art keywords
- upper cover
- circuit board
- lower cover
- groove
- glue
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses a circuit board sealing structure comprising a circuit board, and an upper cover and a lower cover which are arranged on the external side of the circuit board. The connecting part of the upper cover and the lower cover is provided with sealing glue. The upper cover is provided with an upper cover protruding stand. Two sides of the upper cover protruding stand are respectively provided with a groove A and a groove B. The connecting part of the lower cover and the upper cover is provided with a lower cover protruding stand and an external protruding edge. A glue-guiding groove used for accommodating the sealing glue is formed by the upper cover and the lower cover protruding stand in a staggered-connection way via the upper cover protruding stand. The connecting part of the upper cover and the lower cover of an electronic product is arranged to be an F-glue-groove structure, and the sealing glue is filled in gaps of the two F-glue-groove structures so that a sealing effect is realized. With adoption of the structure, contact area of the sealing glue and the upper cover and the lower cover of the product can be increased, sealing effect is great and contact of the circuit board and the upper cover and the lower cover of the product due to the fact that sealing glue overflows to the edge of the circuit board can be effectively avoided simultaneously, and thus an original structural design reducing electromagnetic interference is not adversely influenced.
Description
Technical field
The utility model belongs to technical field of electronic products, specifically relates to a kind of circuit board hermetically-sealed construction.
Background technology
As everyone knows, in order to make electronic product energy water proof and dust proof, improve the performance and used life of product, all need electronic product to seal, prevent that circuit board in electronic product from normally working because water inlet or other material affect product.At present to a lot of with the seal form of electronic product, for the electronic product that adopts fluid sealant to seal, normally adopt general fixing structure, as shown in Figure 1, seam 11 is set on upper cover 1, when assembling product, make the seam 11 on upper cover 1 form with lower cover 3 die cavity 12 that a section configuration becomes concave shape, then in along circuit board 4 edges to die cavity 12, beating 2 pairs of products of fluid sealant seals, this sealing means makes the contact area between fluid sealant 2 and product upper cover 1 and lower cover 3 less, sealing effectiveness is poor, and fluid sealant 2 easily overflows to circuit board 4 edges, cause circuit board 4 and product upper cover 1 and lower cover 3 loose contacts, can not effectively reduce the intensity of the electromagnetic interference of electronic devices and components generation.
Utility model content
For addressing the above problem, the utility model provides a kind of circuit board hermetically-sealed construction.
The purpose of this utility model is achieved by following technical solution.
A kind of circuit board hermetically-sealed construction, comprise circuit board and be placed in upper cover and the lower cover in circuit board outside, junction at upper cover and lower cover is provided with fluid sealant, described upper cover is provided with upper cover boss, in upper cover boss both sides, be respectively arranged with groove A and groove B, the connecting portion of described lower cover and upper cover is provided with lower cover boss and outward flange, described upper cover by the dislocation of upper cover boss and lower cover boss be connected to form hold fluid sealant lead glue groove.
The upper cover boss covering on described, groove A and groove B are arranged to F type structure.
The lower cover boss covering under described and outward flange are arranged to F type structure.
The described glue groove of leading is F structure.
The beneficial effects of the utility model are:
Compared with prior art, the utility model is by the connecting portion of electronic product upper cover and lower cover being arranged to F glue groove structure, and fluid sealant is filled in the space of two F type glue groove structures, plays sealing function.Adopt this structure can increase the contact area between fluid sealant and product upper cover and lower cover, sealing effectiveness is better, effectively avoid fluid sealant to overflow to board edge affect contacting of circuit board and product upper and lower covers simultaneously, structural design generation harmful effect that can be to original reduction electromagnetic interference.
Accompanying drawing explanation
Fig. 1 is traditional circuit-board sealed structural representation;
Fig. 2 is that the utility model is played the package assembly schematic diagram after fluid sealant;
Fig. 3 is the A place structure for amplifying schematic diagram of Fig. 2;
Fig. 4 is the package assembly schematic diagram that the utility model is not broken fluid sealant;
Fig. 5 is the B place structure for amplifying schematic diagram of Fig. 4;
Fig. 6 is superstructure schematic diagram in the utility model;
Fig. 7 is lower cover structure schematic diagram in the utility model.
In figure: 1-upper cover, 2-fluid sealant, 3-lower cover, 4-circuit board, 5-leads glue groove, 11-seam, 12-die cavity, 101-upper cover boss, 102-groove A, 103-groove B, 301-lower cover boss, 302-outward flange.
Embodiment
Below in conjunction with accompanying drawing, further describe the technical solution of the utility model, but described in claimed scope is not limited to.
As shown in Figures 2 to 7, a kind of circuit board hermetically-sealed construction described in the utility model, comprise circuit board 4 and be placed in upper cover 1 and the lower cover 3 in circuit board 4 outsides, junction at upper cover 1 and lower cover 3 is provided with fluid sealant 2, described upper cover 1 is provided with upper cover boss 101, in upper cover boss 101 both sides, be respectively arranged with groove A102 and groove B103, described lower cover 3 is provided with lower cover boss 301 and outward flange 302 with the connecting portion of upper cover 1, described upper cover 1 by upper cover boss 101 and 301 dislocation of lower cover boss be connected to form hold fluid sealant 2 lead glue groove 5.Adopt the technical program, by leading glue groove 5 in upper cover 1 and the junction formation of lower cover 3, in leading glue groove 5, fill up fluid sealant 2, thereby play the effect of sealing.Adopt this structure can increase the contact area between fluid sealant 2 and product upper cover 1 and lower cover 3, sealing effectiveness is better, effectively avoid fluid sealant 2 to overflow to the contacting of circuit board 4 edge effect circuit boards 4 and product upper cover 1 and lower cover 3 simultaneously, thereby can not cause the structural design generation harmful effect to original reduction electromagnetic interference.
As shown in Figure 6, upper cover boss 101, groove A102 and the groove B103 on described upper cover 1 is arranged to F type structure.
As shown in Figure 7, the lower cover boss on described lower cover 3 301 is arranged to F type structure with outward flange 302.
As shown in Figure 5, described in, lead glue groove 5 for F structure.
Adopt technique scheme, because upper cover 1 and the junction of lower cover 3 adopt the structure that is similar to alphabetical F to cooperatively interact, what formation was similar to alphabetical F leads glue groove 5, then fluid sealant 2 is filled in to leading in glue groove 5 of F type structure, and the space of upper cover 1 and lower cover 3 is filled up, thereby play better sealing function.
Claims (4)
1. a circuit board hermetically-sealed construction, comprise circuit board (4) and be placed in upper cover (1) and the lower cover (3) in circuit board (4) outside, junction at upper cover (1) and lower cover (3) is provided with fluid sealant (2), it is characterized in that: described upper cover (1) is provided with upper cover boss (101), in upper cover boss (101) both sides, be respectively arranged with groove A(102) and groove B(103), described lower cover (3) is provided with lower cover boss (301) and outward flange (302) with the connecting portion of upper cover (1), described upper cover (1) by the dislocation of upper cover boss (101) and lower cover boss (301) be connected to form hold fluid sealant (2) lead glue groove (5).
2. a kind of circuit board hermetically-sealed construction according to claim 1, is characterized in that: the upper cover boss (101) on described upper cover (1), groove A(102) and groove B(103) be arranged to F type structure.
3. a kind of circuit board hermetically-sealed construction according to claim 1, is characterized in that: the lower cover boss (301) on described lower cover (3) is arranged to F type structure with outward flange (302).
4. a kind of circuit board hermetically-sealed construction according to claim 1, is characterized in that: described in lead glue groove (5) for F structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320685079.7U CN203554842U (en) | 2013-10-31 | 2013-10-31 | Circuit board sealing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320685079.7U CN203554842U (en) | 2013-10-31 | 2013-10-31 | Circuit board sealing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203554842U true CN203554842U (en) | 2014-04-16 |
Family
ID=50472896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320685079.7U Expired - Fee Related CN203554842U (en) | 2013-10-31 | 2013-10-31 | Circuit board sealing structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203554842U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104933400A (en) * | 2015-03-26 | 2015-09-23 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module, manufacturing method thereof and fingerprint sensing device |
| CN104955307A (en) * | 2015-06-29 | 2015-09-30 | 奥捷五金(江苏)有限公司 | Mobile electronic product and metal middle frame thereof |
| CN106534410A (en) * | 2016-11-04 | 2017-03-22 | 广东欧珀移动通信有限公司 | Terminal, shell assembly and production method thereof |
| CN110545639A (en) * | 2019-07-21 | 2019-12-06 | 南京金龙客车制造有限公司 | air tightness protection device of vehicle control unit |
| CN114531813A (en) * | 2022-03-08 | 2022-05-24 | 江西吉安奥海科技有限公司 | Waterproof charger and preparation method thereof |
-
2013
- 2013-10-31 CN CN201320685079.7U patent/CN203554842U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104933400A (en) * | 2015-03-26 | 2015-09-23 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module, manufacturing method thereof and fingerprint sensing device |
| CN104955307A (en) * | 2015-06-29 | 2015-09-30 | 奥捷五金(江苏)有限公司 | Mobile electronic product and metal middle frame thereof |
| CN106534410A (en) * | 2016-11-04 | 2017-03-22 | 广东欧珀移动通信有限公司 | Terminal, shell assembly and production method thereof |
| CN110545639A (en) * | 2019-07-21 | 2019-12-06 | 南京金龙客车制造有限公司 | air tightness protection device of vehicle control unit |
| CN114531813A (en) * | 2022-03-08 | 2022-05-24 | 江西吉安奥海科技有限公司 | Waterproof charger and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140416 Termination date: 20151031 |
|
| EXPY | Termination of patent right or utility model |