CN202996843U - Novel solar diode assembly structure - Google Patents
Novel solar diode assembly structure Download PDFInfo
- Publication number
- CN202996843U CN202996843U CN2012205150270U CN201220515027U CN202996843U CN 202996843 U CN202996843 U CN 202996843U CN 2012205150270 U CN2012205150270 U CN 2012205150270U CN 201220515027 U CN201220515027 U CN 201220515027U CN 202996843 U CN202996843 U CN 202996843U
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- CN
- China
- Prior art keywords
- solar chip
- boss
- wire
- chip
- solar
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
Abstract
The utility model provides a solar diode assembly structure. Compared with a conventional assembly structure, welding contact surfaces of wires and a chip are relatively large in the assembly structure, so heat radiation capability is better, junction temperature is lower, and cost is lower. The assembly structure comprises a solar chip and an upper boss wire and a lower boss wire respectively welded on a right surface and a back surface of the solar chip. The right surface of the solar chip is provided with window edges, and the back surface of the solar chip is not provided with the window edges. The assembly structure is characterized in that a boss of the upper boss wire which is welded on the right surface of the solar chip is a platform, and a whole platform has a cuboid structure with a rectangular cross section. A boss bottom of the upper boss wire is welded inside the window edges on the right surface of the solar chip. A boss of the lower boss wire is a platform, and a whole platform has a cuboid structure with a rectangular cross section. Area of a boss top surface of the lower boss wire is larger than or equal to area of the back surface of the solar chip.
Description
Technical field
The utility model relates to the assembling of solar diode, specifically is applied on solar panel.
Background technology
Traditional solar diode package assembly as shown in Figure 1, the cross sectional shape of its convex platform wire 2 and lower convex platform wire 1 is trapezoidal, this kind method for packing can not effectively utilize the solder side of chip and lead-in wire to come the heat radiation ability, the welding contact-making surface of wire and chip is larger, heat-sinking capability is better, and junction temperature is controlled lower.Owing to being subjected to the chip single face to contain window, the inner edge of window can not be connected in welding process with the outside, otherwise can the company's of causing utmost point, forms to lose efficacy.When wire was designed to the contact-making surface of trapezoid cross section boss, production cost can increase.
The utility model content
The utility model provides a kind of solar diode package assembly for above-mentioned deficiency of the prior art, compares the traditional group assembling structure, and the welding contact-making surface of this package assembly wire and chip is larger, and heat-sinking capability is better, and junction temperature is controlled lower, and cost is lower simultaneously.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of new type solar energy diode package assembly, comprise solar chip and be welded on respectively convex platform wire and the lower convex platform wire of solar chip positive and negative, the front of solar chip is provided with edge of window, and the back side of solar chip does not have edge of window; It is characterized in that: the boss that is welded on the convex platform wire in solar chip front is platform, and this platform and integrally is rectangular structure, and its cross section is rectangle; The boss bottom surface of convex platform wire is welded in the edge of window in solar chip front;
The boss of above-mentioned lower convex platform wire is similarly platform, and this platform and integrally is rectangular structure, and its cross section is rectangle; The area of the boss end face of lower convex platform wire is more than or equal to the area at the solar chip back side.
Be further: the front with edge of window of above-mentioned solar chip is the positive pole of solar chip, and described solar chip is not the negative pole of solar chip with the back side of edge of window.
Be further: above-mentioned solar chip, be welded on the upper lower convex platform wire of solar chip positive and negative and be solidified with the black glue that is formed by epoxy-plastic packaging material.
The beneficial effects of the utility model are:
A kind of new type solar energy diode of the utility model package assembly, be made into rectangular configuration by the boss cross section with wire, can effectively reduce junction temperature 1, can well improve the higher problem of junction temperature, promote the chip ability of diode, avoid the chip capacity loss that causes because of the welding assembly problem.Wire designs from the trapezoid boss change in design to rectangular boss on making and can effectively reduce the copper material cost in addition, and can not create an impression because reducing copper material, removes unnecessary copper material and can increase the welding contact-making surface, finally plays reducing costs, the effect of improving performance.
Description of drawings
Fig. 1 is the welding manner of protosun energy diode wire;
Fig. 2 is the welding manner of the utility model solar diode wire;
Fig. 3 is the front schematic view of solar chip.
Description of reference numerals:
1-lower convex platform wire, 2-convex platform wire, 3-deceives glue, the 4-solar chip, the 5-edge of window, the 41-solar chip is positive, the 42-solar chip back side.
Embodiment
Below in conjunction with drawings and Examples, the utility model embodiment is described:
As shown in Figure 2 and Figure 3, it shows the structure of an embodiment of the present utility model, in the present embodiment, comprise solar chip 4 and be welded on respectively convex platform wire 2 and the lower convex platform wire 1 of solar chip 4 positive and negatives, the front of solar chip 4 is provided with edge of window 5, and the back side of solar chip 4 does not have edge of window; The boss that is welded on the convex platform wire 2 in solar chip front is platform, and this platform and integrally is rectangular structure, and its cross section is rectangle; The boss bottom surface of convex platform wire 2 is welded in the edge of window 5 in solar chip 4 fronts; The improvement of the present embodiment is that boss cross sectional shape with the package assembly of original solar diode is by the trapezoidal rectangular configuration that changes into, will be clear that, in Fig. 2 and Fig. 1, identical Reference numeral only means that its title is identical, can not judge that both structures are identical with effect with Reference numeral.
The boss of above-mentioned lower convex platform wire 1 is similarly platform, and this platform and integrally is rectangular structure, and its cross section is rectangle; The area of the boss end face of lower convex platform wire 1 is more than or equal to the area at solar chip 4 back sides.
Solar diode pin client requires very high to the use control of junction temperature at present, be about between the 120-140 degree according to the chip difference, and traditional welding assembly structure (Fig. 1) junction temperature requires higher 10-30 degree centigrade left and right relatively, can effectively reduce junction temperature 10-20 degree centigrade by the utility model assembly welding, can well improve the higher problem of junction temperature, promote the chip ability of diode, avoid the chip capacity loss that causes because of the welding assembly problem.Go between in addition from the trapezoid boss change in design to rectangular boss design can effectively reduce the copper material cost on making, and can not create an impression because reducing copper material, removes unnecessary copper material and can increase the welding contact-making surface, finally plays reducing costs, the effect of improving performance.
Generally, the front with edge of window 5 of above-mentioned solar chip 4 is the positive pole of solar chip, and described solar chip 4 is not the negative pole of solar chip with the back side of edge of window.
Generally, above-mentioned solar chip 4, be welded on the upper lower convex platform wire of solar chip 4 positive and negatives and be solidified with the black glue 3 that is formed by epoxy-plastic packaging material.Described black glue 3 is epoxy-plastic packaging material, main component is that epoxy resin and other additives are some, wire-weld tabs-chip-weld tabs-wire utilizes the welding of weld tabs composition by this order, after black glue utilizes 190 degree left and right heating, formation semi-solid flow sexual state is injected in die hole, is solidificated on diode assembly by after cooling.Diode after assembling is mainly used on solar panel.
The above has done detailed description to the utility model preferred implementation by reference to the accompanying drawings; but the utility model is not limited to above-mentioned execution mode, and all improvement in the ken that those of ordinary skills were possessed of carrying out as the basis take thought of the present utility model all drop in protection range of the present utility model.
Do not break away from design of the present utility model and scope and can make many other changes and remodeling.Should be appreciated that the utility model is not limited to specific execution mode, scope of the present utility model is defined by the following claims.
Claims (3)
1. new type solar energy diode package assembly, comprise solar chip (4) and be welded on respectively convex platform wire (2) and the lower convex platform wire (1) of solar chip (4) positive and negative, the front of solar chip (4) is provided with edge of window (5), and the back side of solar chip (4) does not have edge of window; It is characterized in that: the boss that is welded on the convex platform wire (2) in solar chip front is platform, and this platform and integrally is rectangular structure, and its cross section is rectangle; The boss bottom surface of convex platform wire (2) is welded in the positive edge of window (5) of solar chip (4);
The boss of above-mentioned lower convex platform wire (1) is similarly platform, and this platform and integrally is rectangular structure, and its cross section is rectangle; The area of the boss end face of lower convex platform wire (1) is more than or equal to the area at solar chip (4) back side.
2. a kind of new type solar energy diode package assembly as claimed in claim 1, it is characterized in that: the front of the band edge of window (5) of described solar chip (4) is the positive pole of solar chip, and described solar chip (4) is not the negative pole of solar chip with the back side of edge of window.
3. a kind of new type solar energy diode package assembly as claimed in claim 1 is characterized in that: described solar chip (4), be welded on the upper lower convex platform wire of solar chip (4) positive and negative and be solidified with the black glue (3) that is comprised of epoxy-plastic packaging material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012205150270U CN202996843U (en) | 2012-10-08 | 2012-10-08 | Novel solar diode assembly structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012205150270U CN202996843U (en) | 2012-10-08 | 2012-10-08 | Novel solar diode assembly structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202996843U true CN202996843U (en) | 2013-06-12 |
Family
ID=48567978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012205150270U Expired - Fee Related CN202996843U (en) | 2012-10-08 | 2012-10-08 | Novel solar diode assembly structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202996843U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104037148B (en) * | 2014-05-23 | 2017-02-01 | 南通皋鑫科技开发有限公司 | Low-rejection-rate axial diode lead and soldering method of low-rejection-rate axial diode lead |
-
2012
- 2012-10-08 CN CN2012205150270U patent/CN202996843U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104037148B (en) * | 2014-05-23 | 2017-02-01 | 南通皋鑫科技开发有限公司 | Low-rejection-rate axial diode lead and soldering method of low-rejection-rate axial diode lead |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130612 Termination date: 20211008 |