CN202651122U - Solar energy diode - Google Patents
Solar energy diode Download PDFInfo
- Publication number
- CN202651122U CN202651122U CN 201220286700 CN201220286700U CN202651122U CN 202651122 U CN202651122 U CN 202651122U CN 201220286700 CN201220286700 CN 201220286700 CN 201220286700 U CN201220286700 U CN 201220286700U CN 202651122 U CN202651122 U CN 202651122U
- Authority
- CN
- China
- Prior art keywords
- diode
- pin
- solar energy
- backlight unit
- platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The present utility model relates to the electronic component field, especially to a solar energy diode. The diode comprises a diode chip, an upper pin, a lower pin and external layer seal glue, the upper surface of the diode chip is a window provided with frames, the upper pin comprises a round upper boss and an upper leading wire arranged above the upper boss, and the lower pin comprises a round lower platform and a lower leading wire arranged below the lower platform. The solar energy diode has good heat dissipation performance, junction temperature is reduced 10 to 20 DEG C compared to the prior solar energy diode.
Description
Technical field
The utility model relates to a kind of solar diode, particularly the good solar diode of a kind of chip cooling.
Background technology
The shape of the chip of existing solar diode normally has window at upper surface, lower surface is the plane, circular boss is adopted at two ends up and down, boss is little with the Area comparison that the chip of diode contacts, therefore, the heat that produces when diode uses is difficult for spreading out, cause the junction temperature of diode higher, the client requires very high for the junction temperature of solar diode now, be about between 120～140 ℃ according to the chip difference, junction temperature by the solar diode after the said method welding exceeds 10～30 ℃ than aforementioned 120～140 ℃ requirement, therefore, need to transform the structure of solar diode, the junction temperature when it is used reduces, and guarantees to satisfy user's demand.
Summary of the invention
The purpose of this utility model is to provide a kind of solar diode that can solve foregoing problems for the high problem of junction temperature of the existing solar diode existence described in the background technology.
A kind of solar diode, it comprises diode chip for backlight unit, upper pin, lower pin and outer sealing, the upper surface of described diode chip for backlight unit is the window with frame, upper pin comprises the upper lead-in wire of circular convex platform and convex platform top, and lower pin comprises the lower lead-in wire of circular lower platform and lower platform below.
The area of the upper surface of described lower platform is greater than the area of the lower surface of diode chip for backlight unit.
The shape size in the zone in the shape size of the lower surface of described convex platform and the diode chip for backlight unit upper surface window is corresponding.
The beneficial effects of the utility model are because the circular convex platform of upper surface welding of the diode chip for backlight unit of solar diode of the present utility model, the circular lower platform of lower surface welding, the area of the upper surface of lower platform is greater than the area of the lower surface of diode chip for backlight unit, so thermal conductivity is better, the heat conduction that diode chip for backlight unit can be produced is diffused in the external environment condition, by this design, rise to certain inhibitory action on the junction temperature to solar diode, experimental results show that, junction temperature can reduce by 10～20 ℃ when the solar diode after this mode is welded was used, and performance is more stable.
Description of drawings
Fig. 1 is schematic diagram of the present utility model;
Among the figure, 1 is diode chip for backlight unit, and 2 is convex platform, and 3 is upper lead-in wire, and 4 is lower platform, and 5 is lower lead-in wire, and 6 is outer sealing, and 7 is frame.
Embodiment
With reference to a kind of solar diode shown in Figure 1, it comprises diode chip for backlight unit 1, upper pin, lower pin and outer sealing 6, the upper surface of described diode chip for backlight unit 1 is the window 7 with frame, upper pin comprises circular convex platform 2 and the upper lead-in wire 3 of convex platform 2 tops, and lower pin comprises circular lower platform 4 and the lower lead-in wire 5 of lower platform 4 belows.
On the aforementioned schemes basis, the area of the upper surface of described lower platform 4 is greater than the area of the lower surface of diode chip for backlight unit 1; The shape size in the zone in the shape size of the lower surface of described convex platform 2 and the diode chip for backlight unit upper surface window is corresponding.
Claims (3)
1. solar diode, it comprises diode chip for backlight unit, upper pin, lower pin and outer sealing, the upper surface of described diode chip for backlight unit is the window with frame, upper pin comprises the upper lead-in wire of circular convex platform and convex platform top, and lower pin comprises the lower lead-in wire of circular lower platform and lower platform below.
2. solar diode according to claim 1, it is characterized in that: the area of the upper surface of described lower platform is greater than the area of the lower surface of diode chip for backlight unit.
3. solar diode according to claim 1 is characterized in that: the shape size in the zone in the shape size of the lower surface of described convex platform and the diode chip for backlight unit upper surface window is corresponding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220286700 CN202651122U (en) | 2012-06-18 | 2012-06-18 | Solar energy diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220286700 CN202651122U (en) | 2012-06-18 | 2012-06-18 | Solar energy diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202651122U true CN202651122U (en) | 2013-01-02 |
Family
ID=47420181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220286700 Expired - Fee Related CN202651122U (en) | 2012-06-18 | 2012-06-18 | Solar energy diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202651122U (en) |
-
2012
- 2012-06-18 CN CN 201220286700 patent/CN202651122U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130102 Termination date: 20210618 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |