CN203553129U - Integrated circuit package with anti-shock function - Google Patents
Integrated circuit package with anti-shock function Download PDFInfo
- Publication number
- CN203553129U CN203553129U CN201320739364.2U CN201320739364U CN203553129U CN 203553129 U CN203553129 U CN 203553129U CN 201320739364 U CN201320739364 U CN 201320739364U CN 203553129 U CN203553129 U CN 203553129U
- Authority
- CN
- China
- Prior art keywords
- integrated circuit
- chip
- shock absorption
- function
- hose
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Details Of Aerials (AREA)
Abstract
The utility model relates to integrated circuit package with an anti-shock function, which comprises a chip support, an integrated circuit chip arranged on the chip support and external pins connected at two sides of the integrated circuit chip. A transparent sealing cover covers the chip support; the inner surface of the transparent sealing cover is provided with two symmetrical L-type positioning strips; two telescopic springs are clamped and embedded side by side inside the two L-type positioning strips; the other ends of the two telescopic springs are connected with a cushion; the lower surface of the cushion is provided with an arc-shaped groove staggered transversally and longitudinally; a shock absorption hose is pasted inside the arc-shaped groove; the shock absorption hose is filled with shock absorption cotton; a plurality of vent holes are uniformly arranged on the shock absorption hose; and the end surface of the shock absorption hose is contacted with the surface of the integrated circuit chip. When the integrated circuit package with an anti-shock function is adopted, good shock absorption effects are provided in the use process, and the integrated circuit chip can be prevented from being unable to operate normally in harsh environment.
Description
Technical field
The utility model relates to the field of integrated circuit, especially a kind of encapsulation of the integrated circuit with function of seismic resistance.
Background technology
Integrated antenna package not only plays bonding point and the outside effect being electrically connected in integrated circuit (IC) chip; also for integrated circuit (IC) chip provides a reliable and stable operational environment; integrated circuit (IC) chip is played to the effect of machinery or environmental protection; thereby the function that integrated circuit (IC) chip can be brought into normal play, and guarantee that it has high stability and reliability.In a word, the quality of integrated antenna package quality, very large to the good and bad relation of the overall performance of integrated circuit, therefore package application has stronger mechanical performance, good electric property, heat dispersion and chemical stability.
At present in integrated antenna package field, seldom in encapsulation process, add damping, owing to using integrated circuits for some special dimensions, in use, because integrated circuit (IC) chip is vibrated for a long time, easily cause the loosening grade of integrated circuit (IC) chip to use.
Summary of the invention
The technical problems to be solved in the utility model is: in order to overcome the problem of above-mentioned middle existence, provide a kind of encapsulation of the integrated circuit with function of seismic resistance, its project organization rationally and possess function of seismic resistance.
The utility model solves the technical scheme that its technical problem adopts: a kind of integrated antenna package with function of seismic resistance, comprise chip set and be located at the integrated circuit (IC) chip on chip set and be connected to the external pin of integrated circuit (IC) chip both sides, on described chip set, be covered with transparent cover, the inner surface of transparent cover is provided with two symmetrical L-type positioning strips, article two, in L-type positioning strip, inlay card has two coil tension springs side by side, the other end of two coil tension springs is connected with cushion pad, on the lower surface of cushion pad, offer horizontal and vertical interlaced arc groove, in arc groove, be pasted with damping hose, in damping hose, be filled with damping cotton, uniform several air-vents that offers in damping hose, the effect of air-vent is when damping hose is contacted with integrated circuit (IC) chip, can realize by air-vent each other the heat radiation of integrated circuit (IC) chip, gas enters after damping cotton and from another air-vent, discharges from air-vent, thereby formed a circulating current, the end face of damping hose contacts with the surface of integrated circuit (IC) chip.
For fear of integrated circuit (IC) chip, expose in the sun, cause the phenomenons such as the cracking of chip, be pasted with photomask on the outer surface of described transparent cover, the thickness of its photomask is 0.9 μ m.
The beneficial effects of the utility model are: described a kind of integrated antenna package with function of seismic resistance, adopt the integrated antenna package of this kind of design, in use, can possess good damping effect, avoid cannot normally moving under adverse circumstances because of integrated circuit (IC) chip.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is the overall structure schematic diagram of a kind of integrated antenna package with function of seismic resistance described in the utility model.
Accompanying drawing acceptance of the bid note is described below: 1, chip set, 2, integrated circuit (IC) chip, 3, external pin, 4, transparent cover, 5, L-type positioning strip, 6, coil tension spring, 7, cushion pad, 8, damping hose, 9, damping cotton, 10, air-vent, 11, photomask.
Embodiment
By reference to the accompanying drawings the utility model is described in further detail now.These accompanying drawings are the schematic diagram of simplification, and basic structure of the present utility model is only described in a schematic way, and therefore it only shows the formation relevant with the utility model.
A kind of integrated antenna package with function of seismic resistance as shown in Figure 1, comprise chip set 1 and be located at the integrated circuit (IC) chip 2 on chip set 1 and be connected to the external pin 3 of integrated circuit (IC) chip 2 both sides, on chip set 1, be covered with transparent cover 4, on the outer surface of transparent cover 4, be pasted with photomask 11, the thickness of its photomask 11 is 0.9 μ m, the inner surface of transparent cover 4 is provided with two symmetrical L-type positioning strips 5, article two, in L-type positioning strip 5, inlay card has two coil tension springs 6 side by side, the other end of two coil tension springs 6 is connected with cushion pad 7, on the lower surface of cushion pad 7, offer horizontal and vertical interlaced arc groove, in arc groove, be pasted with damping hose 8, in damping hose 8, be filled with damping cotton 9, in damping hose 8, offer several air-vents 10, the end face of damping hose 8 contacts with the surface of integrated circuit (IC) chip 2.
A kind of integrated antenna package with function of seismic resistance of the present utility model, when using this integrated circuit, owing in integrated circuit (IC) chip 2 when there is vibration, now spring promotion cushion pad 7 moves downward, cushion pad 7 drives damping hose 8 to move, make damping hose 8 on the surface of integrated circuit (IC) chip 2, make it effectively avoid integrated circuit (IC) chip 2 to vibrate on chip set 1, thereby affect the normal use of integrated circuit (IC) chip 2.
Take above-mentioned foundation desirable embodiment of the present utility model as enlightenment, by above-mentioned description, relevant staff can, not departing from the scope of this utility model technological thought, carry out various change and modification completely.The technical scope of this utility model is not limited to the content on specification, must determine its technical scope according to claim scope.
Claims (2)
1. one kind has the integrated antenna package of function of seismic resistance, it is characterized in that: comprise chip set (1) and be located at the integrated circuit (IC) chip (2) on chip set (1) and be connected to the external pin (3) of integrated circuit (IC) chip (2) both sides, on described chip set (1), be covered with transparent cover (4), the inner surface of transparent cover (4) is provided with two symmetrical L-type positioning strips (5), article two, in L-type positioning strip (5), inlay card has two coil tension springs (6) side by side, the other end of two coil tension springs (6) is connected with cushion pad (7), on the lower surface of cushion pad (7), offer horizontal and vertical interlaced arc groove, in arc groove, be pasted with damping hose (8), in damping hose (8), be filled with damping cotton (9), upper uniform several air-vents (10) that offer of damping hose (8), the end face of damping hose (8) contacts with the surface of integrated circuit (IC) chip (2).
2. a kind of integrated antenna package with function of seismic resistance according to claim 1, is characterized in that: on the outer surface of described transparent cover (4), be pasted with photomask (11), the thickness of its photomask (11) is 0.9 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320739364.2U CN203553129U (en) | 2013-11-20 | 2013-11-20 | Integrated circuit package with anti-shock function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320739364.2U CN203553129U (en) | 2013-11-20 | 2013-11-20 | Integrated circuit package with anti-shock function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203553129U true CN203553129U (en) | 2014-04-16 |
Family
ID=50471209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320739364.2U Expired - Fee Related CN203553129U (en) | 2013-11-20 | 2013-11-20 | Integrated circuit package with anti-shock function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203553129U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107360679A (en) * | 2017-07-07 | 2017-11-17 | 安徽禄讯电子科技有限公司 | A kind of passive device joint weathering protection device |
| CN109300859A (en) * | 2018-09-18 | 2019-02-01 | 陈广焕 | A kind of protectiveness chip package frame |
| CN109404756A (en) * | 2018-11-29 | 2019-03-01 | 山东聚芯光电科技有限公司 | A kind of high voltage LED chip with micro-structure anti-reflection film |
| CN110299327A (en) * | 2019-05-28 | 2019-10-01 | 淮南威凯机械设备有限公司 | A kind of multichip IC encapsulation |
-
2013
- 2013-11-20 CN CN201320739364.2U patent/CN203553129U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107360679A (en) * | 2017-07-07 | 2017-11-17 | 安徽禄讯电子科技有限公司 | A kind of passive device joint weathering protection device |
| CN109300859A (en) * | 2018-09-18 | 2019-02-01 | 陈广焕 | A kind of protectiveness chip package frame |
| CN109300859B (en) * | 2018-09-18 | 2020-08-28 | 苏州施密科微电子设备有限公司 | Semiconductor chip packaging frame |
| CN109404756A (en) * | 2018-11-29 | 2019-03-01 | 山东聚芯光电科技有限公司 | A kind of high voltage LED chip with micro-structure anti-reflection film |
| CN110299327A (en) * | 2019-05-28 | 2019-10-01 | 淮南威凯机械设备有限公司 | A kind of multichip IC encapsulation |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203553129U (en) | Integrated circuit package with anti-shock function | |
| CN105575416B (en) | Solid state hard disc memory module, solid state hard disc component and solid state hard disc | |
| CN101193497A (en) | Reinforced shakeproof memory | |
| CN202721119U (en) | Improved triode lead frame | |
| CN205541950U (en) | Solid state hard drives storage module , Solid state hard drives subassembly and solid state hard drives | |
| CN201450006U (en) | Semi-conductor device of integrated memory chip and control chip | |
| CN102436843A (en) | Storage module and storage equipment | |
| CN205303448U (en) | Chip packaging structure | |
| KR20110003519U (en) | Package for electronic storage device | |
| CN204577415U (en) | Bio-identification module | |
| CN204516748U (en) | A kind of QFN encapsulating structure of power device | |
| KR20140148273A (en) | Semiconductor package and method for fabricating the same | |
| CN203573978U (en) | Chip packaging structure | |
| CN103904552A (en) | Laser chip packaging structure for projection | |
| CN205692697U (en) | A kind of mold pressing Surface Mount pulse power capacitor device | |
| CN203020723U (en) | Pocket structure of carrier tape of integrated circuit component | |
| CN202374566U (en) | Multi-module printed circuit board (PCB) package and communication terminal | |
| CN104779224A (en) | QFN (Quad Fiat Nolead) packaging structure of power device | |
| CN203225247U (en) | An integrated circuit packaging body | |
| CN204167636U (en) | The black colloid of a kind of mobile phone USB flash disk | |
| CN102364680A (en) | DIP packaging lead frame | |
| CN212570990U (en) | Laminated packaging memory body | |
| CN204303820U (en) | Silicon radiation detector encapsulating structure | |
| CN202384314U (en) | Small-size semiconductor packaging structure | |
| JP2015032697A (en) | Electronic circuit module, and substrate for electronic circuit module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140416 Termination date: 20171120 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |