CN102436843A - Storage module and storage equipment - Google Patents
Storage module and storage equipment Download PDFInfo
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- CN102436843A CN102436843A CN2011103874140A CN201110387414A CN102436843A CN 102436843 A CN102436843 A CN 102436843A CN 2011103874140 A CN2011103874140 A CN 2011103874140A CN 201110387414 A CN201110387414 A CN 201110387414A CN 102436843 A CN102436843 A CN 102436843A
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Abstract
The invention relates to the technical field of storage and discloses a storage module and storage equipment comprising the storage module. The storage module comprises a substrate, an interface contact group and a circuit component group packaged on an inner side face of the substrate, wherein the interface contact group is electrically connected to the circuit component group; and the circuit component group is hierarchically laminated on the inner side face of the substrate. Compared with the prior art, the circuit component group in the storage module is hierarchically laminated on the substrate, so that a designer can distribute a hierarchical structure according to dimension of a circuit component in the circuit component group, while length of the substrate is only needed to be slightly greater than the longest hierarchical structure; therefore, a plane area of the circuit component occupying the inner side face of the substrate is greatly reduced, and an effect of reducing volume of the storage module is achieved. Moreover, the circuit component group is not needed to be reduced or other lower-capacity circuit component groups are not needed to be replaced, and the problem that the capacity of the storage module is reduced due to the reduced volume of the storage module is solved.
Description
Technical field
The present invention relates to the storing technology field, the storage facilities that relates in particular to storage module and comprise this storage module.
Background technology
Be used to store the product of data, the storage module of USB flash disk especially, miniaturization has become its Development Trend.In now, the light and handy fashion of mini storage module can be used as mobile phone or the MP3 suspension member is worn; Also can put in the wallet and carry, this light and handy product has obtained a lot of consumers' favor, yet; In the prior art, reduce the volume of storage module, then must reduce the volume of realizing the circuit module of memory function in the storage module; And then the storage capacity of storage module also can reduce thereupon.
As shown in Figure 1, be storage module 1 of the prior art in " cross-sectional view, this storage module 1 "; Its all circuit component all is distributed in substrate 101 " medial surface on, circuit component includes and stores crystal grain 103 ", control crystal grain 105 " and passive device 104 ", substrate 101 " lateral surface then be provided with the interface contact group 102 that can electrically connect with external unit "; Like this; The reduce storage module 1 if desired area of plane of " volume, then must corresponding reduce substrate 101 " that is to say; " quantity of the circuit component that is provided with on the medial surface just must reduce substrate 101, perhaps adopts the less circuit component of volume to replace.The storage volume of storage crystal grain 103 " be the maximum circuit component of volume in this circuit component, it has determined storage module 1 " is owing to be to belong to layer design together on the medial surface of storage crystal grain 103 " and other circuit component is at substrate 101 "; Promptly be distributed on the same aspect, that is to say, other circuit components have also occupied a part of substrate 101 " the area of plane; like this, if reduce the volume of storage module 1, then must adopt the less storage crystal grain 103 of volume "; And along with the minimizing of volume; The volume that stores crystal grain 103 " storage volume also can reduce thereupon, therefore, exists storage module 1 " reduces correspondingly to cause the problem of its storage volume minimizing.
Summary of the invention
The present invention is directed to deficiency of the prior art, storage module is provided, this storage module volume is less, solves storage module because of reducing the problem that volume causes storage volume to reduce.
The present invention realizes like this; Storage module; Comprise substrate, be located at said substrate lateral surface and the interface contact group that can electrically connect with external unit, be located at that said substrate medial surface is used to control and the circuit component group of storage data and be formed at said substrate medial surface and coat the packaging body of said circuit component group; Said interface contact group is electrically connected at said circuit component group, and said circuit component group is inferior superimposed in said substrate medial surface higher slice.
Further; Said circuit component group comprises the control crystal grain that is used to control, storage crystal grain and the passive device that is used for storage data; Said interface contact group comprises several metal contacts; Said metal contact, storage crystal grain and passive device are electrically connected at said control crystal grain respectively, have the gap that is used to place said control crystal grain and passive device between said storage crystal grain and the said substrate medial surface.
Further, said passive device and control crystal grain place on the said substrate medial surface, and said storage crystal grain is connected in said control crystal grain through tack coat.
Further, also comprise the support member that places said gap, said support member lower end places on the said substrate medial surface, and the upper end is connected in said tack coat.
Further, said storage crystal grain is several, and said several store crystal grain and are the superimposed shape layout of level.
Further, said storage crystal grain, passive device and metal contact are electrically connected at said control crystal grain through the conducting wire.
Further, said conducting wire comprises the pad that places on the said substrate medial surface, places the plain conductor that electrically connects with said pad on the said substrate medial surface and be used for will storing respectively crystal grain and control the gold thread that crystal grain is electrically connected to said pad.
Further, said packaging body is a colloid.
Further, the profile of said storage module is rectangular-shaped.
The present invention also provides storage facilities, and it comprises above-mentioned storage module.
Compared with prior art; Circuit component group in the storage module among the present invention is inferior superimposed at the substrate higher slice, and like this, the deviser can be according to the size Distribution Layer aggregated(particle) structure of the circuit component in the circuit component group; The area of substrate only need be slightly larger than wherein maximum hierarchical structure area and then can; Like this, can significantly reduce the area of plane that circuit component occupies the substrate medial surface, reach the effect that reduces the storage module volume; And need not reduce the circuit component group or change the less circuit component group of other capacity, solve and reduce the problem that the storage module volume causes the storage module capacity to reduce.
Description of drawings
Fig. 1 is the cut-away illustration of storage module of the prior art;
Fig. 2 is the cut-away illustration of the storage module that provides of the embodiment of the invention;
Fig. 3 is the schematic perspective view of the storage module that provides of the embodiment of the invention.
Embodiment
In order to make the object of the invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
The invention provides storage module; Comprise substrate, be located at said substrate lateral surface and the interface contact group that can electrically connect with external unit, be located at that said substrate medial surface is used to control and the circuit component group of storage data and be formed at said substrate medial surface and coat the packaging body of said circuit component group; Said interface contact group is electrically connected at said circuit component group, and said circuit component group is inferior superimposed in said substrate medial surface higher slice.
The volume of the storage module among the present invention is little, and can not influence the capacity of this storage module owing to volume is little.
Below in conjunction with concrete accompanying drawing detailed description is carried out in realization of the present invention.
Shown in Fig. 2～3, be a preferred embodiment provided by the invention.
In the present embodiment; Storage module 1 comprises substrate 101, interface contact group 102 and is used to control the also circuit component group of storage data; Interface contact group 102 in above-mentioned is arranged on the lateral surface of substrate 101; The circuit component group then is encapsulated on the medial surface of substrate 101, and the medial surface of substrate 101 and lateral surface are two planes that are oppositely arranged.Interface contact group 102 in above-mentioned is electrically connected at the circuit component group; And this interface contact group 102 can electrically connect with the equipment of outside; Like this, can realize that circuit component group and the external unit in this storage module 1 electrically connects, and then carry out data transfer, storage etc.
In order to reduce circuit component group occupied area of plane on substrate 101 medial surfaces in the storage module 1; Circuit component group in this storage module 1 is inferior superimposed at the medial surface higher slice of substrate 101; That is to say that the circuit component group is not all to be tiled on substrate 101 medial surfaces, but the circuit component in this circuit component group is divided into several types; And each type circuit component is positioned on the different hierarchical structures; Like this, with the many levels structure superposition together, just formed the above-mentioned middle level superimposed shape of circuit component group on substrate 101 medial surfaces.
Like this, when carrying out storage module 1 design, the deviser can be according to the situation of the physical dimension of each circuit component in the circuit component group; The circuit component group is formed the superimposed shape of level; Can reduce the area of plane that the circuit component group occupies substrate 101 medial surfaces, thereby, under the prerequisite that can reduce storage module 1 volume; Need the circuit component of circuit component group be replaced by the less circuit component of volume, and then can guarantee that the storage volume of storage module 1 can not reduce.
In the present embodiment; The circuit component group comprises the control crystal grain 105 that is used to control, the storage crystal grain 103 that is used for storage data and passive device 104, and control crystal grain 105 is the integrated circuit crystal grain that includes control circuit, and it is used for the operation of storage module 1 is controlled; Storing crystal grain 103 is the integrated circuit crystal grain that includes storage circuit; It is used for storage data, and its amount of capacity has directly determined the amount of capacity of storage module 1, and 102 of interface contact groups comprise several metal contacts.
In the storage module 1 of present embodiment, interface contact group 102, storage crystal grain 103 and passive device 104 all are electrically connected at control crystal grain 105 respectively, and like this, the operation of whole storage module 1 is all controlled through control crystal grain 105.
Owing to storing maximum circuit component in the circuit component group that crystal grain 103 is storage modules 1; In order to reduce the area of plane that the circuit component group occupies substrate 101 medial surfaces; Thereby realizing reducing under the prerequisite of storage module 1 volume; Can not reduce the storage volume of storage module 1; Storage crystal grain 103 encapsulation in the present embodiment is provided with the medial surface top of substrate 101, and and the medial surface of substrate 101 between have clearance space, passive device 104 and control crystal grain 105 in above-mentioned just are arranged in this clearance space.Like this, store crystal grain 103 as the ground floor structure, be placed on the circuit component that stores between crystal grain 103 and substrate 101 medial surfaces as second layer structure, this ground floor structure and second layer structure have formed the above-mentioned superimposed shape of circuit component assembly level.Like this, the surface area of whole storage module 1 just can be set according to the surface of storage module 1, its be larger than store crystal grain 103 surface area then can, practice thrift the volume of storage module 1 greatly.
Because passive device 104 need be connected on the substrate 101; So, should not be placed on the substrate 101 storing crystal grain 103 in the hierarchical structure of the circuit component group in the present embodiment, because like this; Passive device 104 also is connected on the substrate 101 simultaneously; Like this, the area of the medial surface of the substrate 101 that needs is just bigger, and the volume that dwindles this storage module 1 is not had obvious effects.
Certainly, for the ease of the volume of processing and saving storage module 1, and because storage crystal grain 103 all is surperficial comparatively smooth silicon chip with control crystal grain 105; To connect firmly in order making to store between crystal grain 103 and the control crystal grain 105, and to store the medial surface top that is encapsulated in substrate 101 that crystal grain 103 can be firm, in the present embodiment in order to make; Store between crystal grain 103 and the control crystal grain 105 and link together through tack coat 109; Under the cohesive action of tack coat 109, store crystal grain 103 and fix, even under the environment of great fluctuation process with the relative position of control crystal grain 105; Can not occur easily between the two sliding yet; And in the process that storage module 1 is bound and encapsulated, the inaccurate phenomenon that substandard product consequently occurs is avoided occurring locating in the position of the storage module 1 of also can having good positioning preferably.
Certainly, be placed on the control crystal grain 105 in order to make storage crystal grain 103 to be stabilized in more, it guarantees balance; Store also to be provided with in the gap between crystal grain 103 and substrate 101 medial surfaces and be used to support the support member 108 that stores crystal grain 103; This support member 108 places on substrate 101 medial surfaces, and the upper end is connected on the tack coat 109, like this; The connection that stores between crystal grain 103 and the support member 108 also is to accomplish through tack coat 109; Certainly, the size of support member 108 can be set according to actual conditions, does not limit.
In the present embodiment, store crystal grain 103, passive device 104 and interface contact group 102 and electrically connect control crystal grain 105 through the conducting wire.
Particularly; The plain conductor (not shown) that conducting wire in above-mentioned comprises the pad 106 that is arranged on substrate 101 medial surfaces, be arranged on substrate 101 medial surfaces and electrically connect with pad 106 and be used for to store respectively crystal grain 103 and control the gold thread 107 that crystal grain 105 is electrically connected to pad; Pad 106 on substrate 101 medial surfaces designs with the plain conductor setting in advance; Like this; As long as the point of gold thread 107 with relative position on the pad 106 coupled together with control crystal grain 105 and storage crystal grain 103 respectively, then can realize storing the electric connection respectively between crystal grain 103, passive device 104, interface contact group 102 and the control crystal grain 105.
This storage module 1 also comprises packaging body 100; This packaging body 100 is formed on the medial surface of substrate 101; It all is coated on its inside with passive device 104, storage crystal grain 103 and control crystal grain 105; Avoid passive device 104, store crystal grain 103 and control crystal grain 105 contacting, play the effect of protection with extraneous.In the present embodiment, packaging body 100 is a colloid, certainly, also can be the material of other type.
Need jumbo especially storage module 1 for some; This storage module 1 can be provided with several and store crystal grain 103; These several store crystal grain 103 and can level is superimposed be arranged together, each stores and adopts adhesive linkage to separate between crystal grain 103, and by 100 encapsulation of the packaging body in above-mentioned.
Of Fig. 3, in the present embodiment, storage module is the USB storage module, and its interface contact group 102 is a USB interface contact group, and the profile of this USB storage module is rectangular-shaped.At the other end of the relative USB interface contact of the substrate lateral surface group of USB storage module, also be provided with function expansion contact 110, be used for external pilot lamp or other function element.
Present embodiment also provides storage facilities, and this storage facilities comprises above-mentioned storage module 1, like this, can guarantee to improve the storage volume of storage facilities under the less prerequisite of storage facilities volume.
Storage facilities in above-mentioned can be equipment such as USB flash disk.
The above is merely preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of within spirit of the present invention and principle, being done, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. storage module; Comprise substrate, be located at said substrate lateral surface and the interface contact group that can electrically connect with external unit, be located at that said substrate medial surface is used to control and the circuit component group of storage data and be formed at said substrate medial surface and coat the packaging body of said circuit component group; Said interface contact group is electrically connected at said circuit component group; It is characterized in that said circuit component group is inferior superimposed in said substrate medial surface higher slice.
2. storage module as claimed in claim 1; It is characterized in that; Said circuit component group comprises the control crystal grain that is used to control, storage crystal grain and the passive device that is used for storage data; Said interface contact group comprises several metal contacts, and said metal contact, storage crystal grain and passive device are electrically connected at said control crystal grain respectively, have the gap that is used to place said control crystal grain and passive device between said storage crystal grain and the said substrate medial surface.
3. storage module as claimed in claim 2 is characterized in that, said passive device and control crystal grain place on the said substrate medial surface, and said storage crystal grain is connected in said control crystal grain through tack coat.
4. storage module as claimed in claim 3 is characterized in that, also comprises the support member that places said gap, and said support member lower end places on the said substrate medial surface, and the upper end is connected in said tack coat.
5. like each described storage module of claim 1 to 4, it is characterized in that said storage crystal grain is several, said several store crystal grain and are the superimposed shape layout of level.
6. storage module as claimed in claim 2 is characterized in that, said storage crystal grain, passive device and metal contact are electrically connected at said control crystal grain through the conducting wire.
7. storage module as claimed in claim 6; It is characterized in that said conducting wire comprises the pad that places on the said substrate medial surface, place the plain conductor that electrically connects with said pad on the said substrate medial surface and be used for will storing respectively crystal grain and control the gold thread that crystal grain is electrically connected to said pad.
8. like each described storage module of claim 1 to 4, it is characterized in that said packaging body is a colloid.
9. like each described storage module of claim 1 to 4, it is characterized in that the profile of said storage module is rectangular-shaped.
10. storage facilities is characterized in that, comprises like each described storage module of claim 1～9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103874140A CN102436843A (en) | 2011-11-29 | 2011-11-29 | Storage module and storage equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103874140A CN102436843A (en) | 2011-11-29 | 2011-11-29 | Storage module and storage equipment |
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| Publication Number | Publication Date |
|---|---|
| CN102436843A true CN102436843A (en) | 2012-05-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103874140A Pending CN102436843A (en) | 2011-11-29 | 2011-11-29 | Storage module and storage equipment |
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| CN (1) | CN102436843A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106910516A (en) * | 2015-12-30 | 2017-06-30 | 中山市江波龙电子有限公司 | Solid state hard disc component and solid state hard disc |
| CN106910518A (en) * | 2015-12-30 | 2017-06-30 | 中山市江波龙电子有限公司 | Solid state hard disc component and solid state hard disc |
| CN106910517A (en) * | 2015-12-30 | 2017-06-30 | 中山市江波龙电子有限公司 | Solid state hard disc component and solid state hard disc |
| WO2017190308A1 (en) * | 2016-05-05 | 2017-11-09 | 深圳佰维存储科技股份有限公司 | Mobile solid state disk |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2842569Y (en) * | 2005-09-15 | 2006-11-29 | 劲永国际股份有限公司 | Micro-memory-card packing structure |
| CN201270155Y (en) * | 2008-10-17 | 2009-07-08 | 华东科技股份有限公司 | Space saving U disc |
| CN101546757A (en) * | 2008-03-24 | 2009-09-30 | 华东科技股份有限公司 | Packaging structure of card type memory |
| CN202404905U (en) * | 2011-11-29 | 2012-08-29 | 深圳市江波龙电子有限公司 | Storage module and storage equipment |
-
2011
- 2011-11-29 CN CN2011103874140A patent/CN102436843A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2842569Y (en) * | 2005-09-15 | 2006-11-29 | 劲永国际股份有限公司 | Micro-memory-card packing structure |
| CN101546757A (en) * | 2008-03-24 | 2009-09-30 | 华东科技股份有限公司 | Packaging structure of card type memory |
| CN201270155Y (en) * | 2008-10-17 | 2009-07-08 | 华东科技股份有限公司 | Space saving U disc |
| CN202404905U (en) * | 2011-11-29 | 2012-08-29 | 深圳市江波龙电子有限公司 | Storage module and storage equipment |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106910516A (en) * | 2015-12-30 | 2017-06-30 | 中山市江波龙电子有限公司 | Solid state hard disc component and solid state hard disc |
| CN106910518A (en) * | 2015-12-30 | 2017-06-30 | 中山市江波龙电子有限公司 | Solid state hard disc component and solid state hard disc |
| CN106910517A (en) * | 2015-12-30 | 2017-06-30 | 中山市江波龙电子有限公司 | Solid state hard disc component and solid state hard disc |
| CN106910517B (en) * | 2015-12-30 | 2022-09-16 | 中山市江波龙电子有限公司 | Solid state disk assembly and solid state disk |
| CN106910518B (en) * | 2015-12-30 | 2022-10-25 | 中山市江波龙电子有限公司 | Solid state disk assembly and solid state disk |
| WO2017190308A1 (en) * | 2016-05-05 | 2017-11-09 | 深圳佰维存储科技股份有限公司 | Mobile solid state disk |
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Application publication date: 20120502 |