CN109300859B - Semiconductor chip packaging frame - Google Patents
Semiconductor chip packaging frame Download PDFInfo
- Publication number
- CN109300859B CN109300859B CN201811086502.5A CN201811086502A CN109300859B CN 109300859 B CN109300859 B CN 109300859B CN 201811086502 A CN201811086502 A CN 201811086502A CN 109300859 B CN109300859 B CN 109300859B
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- Prior art keywords
- frame
- shell
- packaging frame
- fixedly connected
- clamping blocks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
Abstract
The invention relates to a semiconductor chip packaging frame which comprises a shell, a top shell, pins, a first spring, an upper protection plate, an upper packaging frame, a lower packaging frame, a chip body, threaded holes, bolts, through holes, conductive columns, leads, positioning tubes, a fixing frame, positioning columns, a damping plate, a wheel carrier, rollers, a second spring, a fixing seat, a connecting rod, a lower protection plate, a third spring, an upper clamping block, a lower clamping block, a buffer ball and sponge. The invention provides a semiconductor chip packaging frame, which aims to overcome the defects that the chip packaging frame in the prior art is lack of a protection structure and is easy to damage an internal chip when being acted by external force. The semiconductor chip packaging frame has the characteristics of firm texture, high protectiveness, capability of effectively protecting internal chips from being damaged due to external force and the like.
Description
Technical Field
The invention relates to the technical field of electronic elements, in particular to a semiconductor chip packaging frame.
Background
Chips, also known as microcircuits, microchips, and integrated circuits, are silicon chips containing integrated circuits that are small and often part of a computer or other electronic device. The chip generally refers to a carrier of an integrated circuit, and is also a result of the integrated circuit after design, manufacture, packaging and testing, while the integrated circuit is the most important part of electronic equipment, and bears the functions of operation and storage, and the application range of the integrated circuit covers almost all electronic equipment for military industry and civil use. Packaging is a process of assembling an integrated circuit into a chip final product, in short, an integrated circuit die produced by a manufacturer is placed on a substrate with a bearing function, pins are led out, and then the integrated circuit die is fixed and packaged into a whole.
Among the prior art at present, to the encapsulation of chip, all adopt and seal the mode of gluing fixedly to the connection stability of protection chip, lead wire and pin, this kind of packaging structure lacks protection architecture, when receiving external force collision and extrusion, and encapsulation frame breaks easily, thereby leads to inside chip impaired, influences leaving factory quality and life of chip.
Disclosure of Invention
The invention provides a semiconductor chip packaging frame, which aims to overcome the defects that the chip packaging frame in the prior art is lack of a protection structure and is easy to damage an internal chip when being acted by external force. The semiconductor chip packaging frame has the characteristics of firm texture, high protectiveness, capability of effectively protecting internal chips from being damaged due to external force and the like.
In order to achieve the purpose, the invention provides the following technical scheme: a semiconductor chip packaging frame comprises a shell, wherein a top shell is arranged at the top of the shell, pins are inserted into two sides of the shell, a first spring is fixedly connected to the top of an inner cavity of the shell, an upper protection plate is fixedly connected to the bottom end of the first spring, an upper packaging frame is arranged below the upper protection plate, a lower packaging frame is arranged below the upper packaging frame, a chip body is arranged between the upper packaging frame and the lower packaging frame, threaded holes are formed in two sides of the upper packaging frame and two sides of the lower packaging frame, bolts are connected in the threaded holes in a threaded manner, two through holes are formed in the upper packaging frame, two conductive columns are electrically connected to the chip body, penetrate through the through holes and extend to the upper portion of the upper packaging frame, leads are electrically connected to the conductive columns, and the other ends of the leads are electrically connected to the pins, the bottom of the lower packaging frame is fixedly connected with a plurality of positioning tubes, a fixing frame is arranged below the lower packaging frame, a plurality of positioning columns are fixedly connected onto the fixing frame, each positioning column is inserted into the positioning tube, damping plates are arranged on two sides of the fixing frame, a plurality of wheel frames are fixedly connected to the side wall, close to one side of the fixing frame, of each damping plate, the tail end of each wheel frame is movably connected with a roller through a wheel shaft, the side wall, far away from one side of the fixing frame, of each damping plate is fixedly connected with a second spring, the other end of each second spring is fixedly connected to the side wall of the inner cavity of the shell, a pair of fixing seats are fixedly connected onto the side wall of the inner cavity of the shell and the outer wall of the fixing frame, a plurality of connecting rods are movably connected between two pairs of the fixing seats, every two adjacent connecting rods, the bottom fixedly connected with of lower protection shield is a plurality of third spring, the bottom fixed connection of third spring is in the inner chamber bottom of shell, the bottom fixedly connected with of lower protection shield goes up the fixture block on a plurality of, the fixture block under the inner chamber bottom fixedly connected with of shell, go up the fixture block and all be located between two adjacent third springs with lower fixture block, just go up the fixture block and be provided with the buffering ball down between the fixture block.
Preferably, the number of the upper fixture blocks is the same as that of the lower fixture blocks, the upper fixture blocks and the lower fixture blocks are arc-shaped, the centers of the upper fixture blocks and the lower fixture blocks are located on the same straight line, and the diameters of the upper fixture blocks and the lower fixture blocks are larger than the diameter of the buffer ball.
Preferably, the number of the positioning pipes is the same as that of the positioning columns, the centers of the positioning pipes and the centers of the positioning columns are located on the same straight line, and the pipe diameters of the positioning pipes are equal to the diameters of the positioning columns.
Preferably, the top end face of the top shell is arc-shaped, and sponge is filled between the top shell and the shell.
Preferably, the bottom of the upper protection plate is provided with a plurality of hemispherical rubber blocks.
Compared with the prior art, the invention has the beneficial effects that:
1. structural design is reasonable, and the texture is sturdy and durable, can stable work for a long time, long service life.
2. The protection is strong, can effectively avoid causing the chip body impaired because of external force striking and extrusion, ensures the outgoing quality of chip.
3. Utilize the roll effect between gyro wheel and the mount lateral wall to play absorbing effect, prevent that the mount from taking place to rock about because of the atress, influence the lead wire and pin and lead the electric connection stability between the electrical pillar then.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is an enlarged view of FIG. 1 at A;
fig. 3 is an enlarged view of fig. 1 at B.
Reference numbers in the figures: the chip packaging structure comprises a shell 1, a top shell 2, a pin 3, a first spring 4, an upper protection plate 5, an upper packaging frame 6, a lower packaging frame 7, a chip body 8, a threaded hole 9, a bolt 10, a through hole 11, a conductive column 12, a lead 13, a positioning tube 14, a fixing frame 15, a positioning column 16, a damping plate 17, a wheel frame 18, a roller 19, a second spring 20, a fixing seat 21, a connecting rod 22, a lower protection plate 23, a third spring 24, an upper clamping block 25, a lower clamping block 26, a buffer ball 27 and sponge 28.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a semiconductor chip packaging frame comprises a shell 1, a top shell 2 is arranged at the top of the shell 1, the top end surface of the top shell 2 is arc-shaped, when the shell is stressed by external force, part of the stress can be decomposed, sponge 28 is filled between the top shell 2 and the shell 1, the sponge can absorb the external force and has a buffering effect, pins 3 are inserted into two sides of the shell 1, a first spring 4 is fixedly connected with the top of an inner cavity of the shell 1, an upper protection plate 5 is fixedly connected with the bottom end of the first spring 4, a plurality of hemispherical rubber blocks are arranged at the bottom of the upper protection plate 5, the rubber blocks can elastically deform when being extruded, an upper packaging frame 6 is arranged below the upper protection plate 5, a lower packaging frame 7 is arranged below the upper packaging frame 6, a chip body 8 is arranged between the upper packaging frame 6 and the lower packaging frame 7, and threaded holes 9 are arranged at two sides of the upper packaging frame 6 and the lower packaging, the threaded hole 9 is internally threaded with a bolt 10, the upper packaging frame 6 is provided with two through holes 11, the chip body 8 is electrically connected with two conductive columns 12, the conductive columns 12 penetrate through the through holes 11 and extend to the upper part of the upper packaging frame 6, the conductive columns 12 are electrically connected with a lead 13, the other end of the lead 13 is electrically connected with the pins 3, the bottom of the lower packaging frame 7 is fixedly connected with a plurality of positioning tubes 14, the lower part of the lower packaging frame 7 is provided with a fixed frame 15, the fixed frame 15 is fixedly connected with a plurality of positioning columns 16, each positioning column 16 is inserted into the positioning tube 14, the number of the positioning tubes 14 and the number of the positioning columns 16 are the same, the centers of the positioning tubes 14 and the positioning columns 16 are positioned on the same straight line, the diameter of the positioning tubes 14 is equal to the diameter of the positioning columns 16, the two sides of the fixed frame 15 are provided with damping plates 17, the, the tail end of each wheel frame 18 is movably connected with a roller 19 through a wheel shaft, the roller 19 is tangent with the side wall of the fixed frame 15, the side wall of the damping plate 17 far away from one side of the fixed frame 15 is fixedly connected with a second spring 20, the other end of the second spring 20 is fixedly connected with the side wall of the inner cavity of the shell 1, the side wall of the inner cavity of the shell 1 and the outer wall of the fixed frame 15 are fixedly connected with a pair of fixed seats 21, a plurality of connecting rods 22 are movably connected between two pairs of fixed seats 21, every two adjacent connecting rods 22 are movably connected through a rod shaft, a lower protective plate 23 is arranged below the fixed frame 15, the bottom of the lower protective plate 23 is fixedly connected with a plurality of third springs 24, the bottom of the third springs 24 is fixedly connected with the bottom of the inner cavity of the shell 1, the bottom of the lower protective plate, the upper fixture block 25 and the lower fixture block 26 are located between the two adjacent third springs 24, a buffer ball 27 is arranged between the upper fixture block 25 and the lower fixture block 26, the upper fixture block 25 and the lower fixture block 26 are identical in number and arc-shaped, the centers of the upper fixture block 25 and the lower fixture block 26 are located on the same straight line, the diameters of the upper fixture block 25 and the lower fixture block 26 are larger than the diameter of the buffer ball 27, and the buffer ball 27 is made of rubber, has elasticity, and can play a role in buffering.
The working principle is as follows: when the invention is used, a chip body 8 is arranged between an upper packaging frame 6 and a lower packaging frame 7, then bolts 10 are screwed into threaded holes 9 at two sides of the upper packaging frame 6 and the lower packaging frame 7, so as to connect the upper packaging frame 6 and the lower packaging frame 7, when in installation, two conductive columns 12 on the chip body 8 are aligned with two through holes 11 on the upper packaging frame 6 and penetrate out, then two sides of a shell 1 are inserted into pins 3, two ends of a lead 13 are respectively welded on the pins 3 and the conductive columns 12 by a spot welding gun to form a current path, a positioning tube 14 at the bottom of the lower packaging frame 7 is aligned with a positioning column 16 on a fixed frame 15, and the positioning column 16 is inserted into the corresponding positioning tube 14, so as to fix the fixed frame 15 at the bottom of the lower packaging frame 7, a lower protection plate 23 is arranged below the fixed frame 15, the protection plate 23 is contacted with the bottom surface of the fixed frame 15 under the elastic action of a third spring 24, the upper protection plate 5 contacts with the top surface of the upper packaging frame 6 under the elastic action of the first spring 4, when the chip packaging frame is impacted by external force, the chip packaging frame firstly contacts with the top shell 2 at the top of the shell 1, the top shell 2 is arc-shaped, part of stress can be decomposed, sponge is filled between the top shell 2 and the shell 1, and the sponge can absorb external impact force, thereby playing a buffering effect and avoiding the top of the shell 1 from being damaged, the bottom of the upper protection plate 5 is provided with a hemispherical rubber block, when the upper protection plate 5 extrudes the upper packaging frame 6 due to the stress, the pressure of the upper packaging frame 6 can be reduced by utilizing the elastic deformation action of the rubber block, thereby protecting the upper packaging frame 6 from being crushed, and when the lower protection plate 23 is impacted by the external force, the buffer ball 27 can also absorb the external force, playing a buffering effect and preventing the lower packaging frame 7 from being crushed, then, the chip body 8 is protected from being damaged, in addition, under the elastic action of the second spring 20, the connecting rod 22 can drive the damping plate 17 to move together with the wheel carrier 18, and the roller 19 tightly abuts against the side wall of the fixing frame 15, and a damping effect can be achieved by utilizing the rolling action between the roller 19 and the side wall of the fixing frame 15, so that the fixing frame 15 is prevented from shaking left and right due to stress, and then the stability of the electrical connection between the lead 13 and the pin 3 and the conductive column 12 is influenced.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A semiconductor chip package frame comprising a housing (1), characterized in that: the top of the shell (1) is provided with a top shell (2), pins (3) are inserted into two sides of the shell (1), the top of an inner cavity of the shell (1) is fixedly connected with a first spring (4), the bottom of the first spring (4) is fixedly connected with an upper protection plate (5), an upper packaging frame (6) is arranged below the upper protection plate (5), a lower packaging frame (7) is arranged below the upper packaging frame (6), a chip body (8) is installed between the upper packaging frame (6) and the lower packaging frame (7), threaded holes (9) are formed in two sides of the upper packaging frame (6) and the lower packaging frame (7), a bolt (10) is connected to the threaded holes (9) in an inner thread manner, two through holes (11) are formed in the upper packaging frame (6), two conductive posts (12) are electrically connected to the chip body (8), the conductive column (12) penetrates through the through hole (11) and extends to the upper part of the upper packaging frame (6), a lead (13) is electrically connected to the conductive column (12), the other end of the lead (13) is electrically connected to the pin (3), a plurality of positioning pipes (14) are fixedly connected to the bottom of the lower packaging frame (7), a fixing frame (15) is arranged below the lower packaging frame (7), a plurality of positioning columns (16) are fixedly connected to the fixing frame (15), each positioning column (16) is inserted into each positioning pipe (14), damping plates (17) are arranged on two sides of the fixing frame (15), a plurality of wheel frames (18) are fixedly connected to the side wall of each damping plate (17) close to one side of the fixing frame (15), the tail end of each wheel frame (18) is movably connected with a roller (19) through a wheel shaft, a second spring (20) is fixedly connected to the side wall of each damping plate (17) far away from one side of the fixing frame (15), the other end of the second spring (20) is fixedly connected to the side wall of the inner cavity of the shell (1), the side wall of the inner cavity of the shell (1) and the outer wall of the fixing frame (15) are fixedly connected with a pair of fixing seats (21), a plurality of connecting rods (22) are movably connected between the two pairs of fixing seats (21), every two adjacent connecting rods (22) are movably connected through a rod shaft, a lower protection plate (23) is arranged below the fixing frame (15), the bottom of the lower protection plate (23) is fixedly connected with a plurality of third springs (24), the bottom end of each third spring (24) is fixedly connected to the bottom of the inner cavity of the shell (1), a plurality of upper clamping blocks (25) are fixedly connected to the bottom of the inner cavity of the shell (1), the upper clamping blocks (25) and the lower clamping blocks (26) are both located between the two adjacent third springs (24), and a buffer ball (27) is arranged between the upper clamping block (25) and the lower clamping block (26).
2. A semiconductor chip package frame according to claim 1, wherein: the number of the upper clamping blocks (25) is the same as that of the lower clamping blocks (26), the upper clamping blocks (25) and the lower clamping blocks (26) are arc-shaped, the centers of the upper clamping blocks (25) and the lower clamping blocks (26) are located on the same straight line, and the diameters of the upper clamping blocks (25) and the lower clamping blocks (26) are larger than that of the buffer balls (27).
3. A semiconductor chip package frame according to claim 1, wherein: the number of the positioning pipes (14) is the same as that of the positioning columns (16), the centers of the positioning pipes (14) and the positioning columns (16) are located on the same straight line, and the pipe diameter of each positioning pipe (14) is equal to the diameter of each positioning column (16).
4. A semiconductor chip package frame according to claim 1, wherein: the top end face of the top shell (2) is arc-shaped, and sponge (28) is filled between the top shell (2) and the shell (1).
5. A semiconductor chip package frame according to claim 1, wherein: the bottom of the upper protection plate (5) is provided with a plurality of hemispherical rubber blocks.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811086502.5A CN109300859B (en) | 2018-09-18 | 2018-09-18 | Semiconductor chip packaging frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811086502.5A CN109300859B (en) | 2018-09-18 | 2018-09-18 | Semiconductor chip packaging frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109300859A CN109300859A (en) | 2019-02-01 |
| CN109300859B true CN109300859B (en) | 2020-08-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811086502.5A Active CN109300859B (en) | 2018-09-18 | 2018-09-18 | Semiconductor chip packaging frame |
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| CN (1) | CN109300859B (en) |
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| CN110690333B (en) * | 2019-10-17 | 2020-12-22 | 山东浮来春生物化工有限公司 | Diode packaging structure with good conductivity |
| CN110828382B (en) * | 2019-11-18 | 2021-07-02 | 长兴璟柏电子科技有限公司 | Metal glass packaging shell |
| CN111092057B (en) * | 2019-12-12 | 2022-04-29 | 袁晓华 | Packaging method for densely-arranged semiconductor chips of terminal of Internet of things |
| CN110970377B (en) * | 2019-12-18 | 2021-07-20 | 若瑞(上海)文化科技有限公司 | Packaging device convenient for packaging integrated circuit chip |
| CN111128924A (en) * | 2019-12-20 | 2020-05-08 | 天津智安微电子技术有限公司 | Integrated circuit packaging structure |
| CN113421736A (en) * | 2020-11-27 | 2021-09-21 | 深圳市欣晔永顺电子有限公司 | Energy-saving environment-friendly electronic transformer with protection function |
| CN112992796A (en) * | 2021-02-09 | 2021-06-18 | 深圳市众芯诺科技有限公司 | Intelligent visual sound box chip |
| CN113473787B (en) * | 2021-06-18 | 2022-07-12 | 南京德普达凌云信息技术有限公司 | LED display control card and display screen synchronization system |
| CN114121695B (en) * | 2022-01-27 | 2022-04-26 | 宁波鑫芯微电子科技有限公司 | Chip packaging multi-layer stacking structure and stacking method |
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| CN1135268A (en) * | 1993-11-16 | 1996-11-06 | 佛姆法克特股份有限公司 | Contact structure for interconnections, interposer, semiconductor assembly and method |
| WO2000001208A1 (en) * | 1998-06-30 | 2000-01-06 | Formfactor, Inc. | Assembly of an electronic component with spring packaging |
| CN203553129U (en) * | 2013-11-20 | 2014-04-16 | 常州唐龙电子有限公司 | Integrated circuit package with anti-shock function |
| CN207338346U (en) * | 2017-09-08 | 2018-05-08 | 刘小妹 | A kind of vibration prevention system of integrated antenna package |
-
2018
- 2018-09-18 CN CN201811086502.5A patent/CN109300859B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1135268A (en) * | 1993-11-16 | 1996-11-06 | 佛姆法克特股份有限公司 | Contact structure for interconnections, interposer, semiconductor assembly and method |
| WO2000001208A1 (en) * | 1998-06-30 | 2000-01-06 | Formfactor, Inc. | Assembly of an electronic component with spring packaging |
| CN203553129U (en) * | 2013-11-20 | 2014-04-16 | 常州唐龙电子有限公司 | Integrated circuit package with anti-shock function |
| CN207338346U (en) * | 2017-09-08 | 2018-05-08 | 刘小妹 | A kind of vibration prevention system of integrated antenna package |
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| CN109300859A (en) | 2019-02-01 |
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Effective date of registration: 20200730 Address after: No. 5 Jujin Road, Taiping Street, Xiangcheng District, Suzhou City, Jiangsu Province Applicant after: SUZHOU SMICK MICROELECTRONIC EQUIPMENT Co.,Ltd. Address before: 526500 Xintang Village, Shibian Village Committee, Yuluo Town, Fengkai County, Zhaoqing City, Guangdong Province Applicant before: Chen Guanghuan |
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