CN111092057B - Packaging method for densely-arranged semiconductor chips of terminal of Internet of things - Google Patents
Packaging method for densely-arranged semiconductor chips of terminal of Internet of things Download PDFInfo
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- CN111092057B CN111092057B CN201911274837.4A CN201911274837A CN111092057B CN 111092057 B CN111092057 B CN 111092057B CN 201911274837 A CN201911274837 A CN 201911274837A CN 111092057 B CN111092057 B CN 111092057B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000004065 semiconductor Substances 0.000 title claims abstract description 14
- 239000000853 adhesive Substances 0.000 claims abstract description 24
- 230000001070 adhesive effect Effects 0.000 claims abstract description 24
- 239000004033 plastic Substances 0.000 claims abstract description 14
- 238000007789 sealing Methods 0.000 claims description 14
- 239000003292 glue Substances 0.000 claims description 11
- 239000000565 sealant Substances 0.000 claims description 10
- 238000009413 insulation Methods 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 11
- 238000010586 diagram Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention discloses a packaging method of densely-arranged semiconductor chips for terminals of Internet of things, belonging to the field of semiconductor packaging, and the packaging method comprises that the upper surface of a lower shell is provided with a placing groove, the upper surface of the lower shell is fixedly connected with two groups of conductive posts which are respectively arranged at two sides of the placing groove, a through hole is arranged in the lower shell and is arranged below the conductive posts, pins are arranged in the through hole, the upper ends of the pins are fixedly connected with the conductive posts, an adhesive is bonded at the bottom of the placing groove, a chip is arranged in the placing groove, the lower end of the chip is bonded with the adhesive, the upper surface of the chip is connected with the conductive posts through a plurality of wires, the indirect connection between the chip and the pins can be realized, so that the pins can not drag the chip to cause the chip to shake or damage, and the mode of elastic packaging is adopted during plastic packaging, so that the fixing effect can be achieved, and the chip cannot be damaged.
Description
Technical Field
The invention relates to the field of semiconductor packaging, in particular to a packaging method for densely-arranged semiconductor chips of terminals of the Internet of things.
Background
Packaging technology is necessary and critical for the chip, because the chip must be isolated from the outside to prevent the chip circuit from being corroded by impurities in the air to cause the electrical performance degradation, and on the other hand, the packaged chip is more convenient to mount and transport, and the performance of the chip and the design and manufacture of the PCB connected with the chip are directly affected by the quality of the packaging technology.
At present, the semiconductor chip packaging modes are different in size, most of the connection modes of the chip and the pins are directly connected, the pins extend out of the packaging shell, so that the pins can be carelessly pulled during installation or transportation, the chip in the packaging shell can be easily pulled, the connection part of the chip and the pins can be easily torn off, in addition, the plastic shell is required to press the chip during the final plastic packaging of the chip, and the chip can be easily damaged if the downward pressure is not well controlled in the process.
Disclosure of Invention
1. Technical problem to be solved
The invention aims to provide a packaging method for densely-arranged semiconductor chips of terminals of the Internet of things, which can realize indirect connection between the chips and pins so as to prevent the pins from dragging the chips to cause chip shaking or damage, and can play a role in fixing and not damage the chips by adopting an elastic packaging mode during plastic packaging.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
A packaging method for densely arranged semiconductor chips for terminals of the Internet of things comprises a lower shell, wherein a placing groove is formed in the upper surface of the lower shell, two groups of conductive columns are fixedly connected to the upper surface of the lower shell and are respectively arranged on two sides of the placing groove, a through hole is formed in the lower shell and is arranged below the conductive columns, a pin is placed in the through hole, the upper end of the pin is fixedly connected with the conductive columns, an adhesive is bonded to the bottom of the placing groove, a chip is placed in the placing groove, the lower end of the chip is bonded with the adhesive, the upper surface of the chip is connected with the conductive columns through a plurality of conducting wires, an upper shell is inserted into the upper side of the lower shell, two inserting grooves matched with the upper shell are formed in the upper surface of the lower shell, and limiting rods are fixedly connected to the lower ends of two sides of the upper shell, the limiting rod is inserted into the slot, a limiting groove matched with the limiting rod is formed in the side wall of the slot, a plurality of vertically arranged elastic rods are fixedly connected to the side wall of the lower end of the upper shell, and an insulating plate is fixedly connected between the lower ends of the elastic rods;
the packaging method comprises the following steps: s1, uniformly coating the adhesive in the placing groove, placing the cut chip on the adhesive, slightly pressing the chip downwards to enable the adhesive to be fully contacted with the bottom of the chip, and standing for a period of time to wait for the adhesive to be cured;
s2, connecting the chip and the conductive pole by the wire, because the lower end of the conductive pole is connected with the pin, the wire indirectly connects the chip and the pin;
s3, pressing the upper shell on the lower shell, inserting the limit rod at the lower end of the upper shell into the slot, wherein the width of the upper end of the slot is smaller than that of the limit rod, so that the hook part of the limit rod can be squeezed by the slot wall to shrink, when the hook part of the limit rod moves downwards to the limit slot, the plasticity of the limit rod restores the deformation, and the hook part of the limit rod is clamped into the limit slot, thereby realizing the connection between the upper shell and the lower shell, and the insulation board props against the upper surface of the chip when the upper shell is pressed downwards;
s4, finally, sealing the gap where the pin penetrates through the through hole by using insulating glue to prevent the pin from shaking, and sealing the gap between the upper shell and the slot by using sealing glue to package and protect the chip;
connect chip and pin through leading electrical pillar to indirect connected mode protects the chip, goes up the elastic rod between casing and the chip, and the elastic rod can play the effect of elastic adjustment when pushing down the plastic envelope like this to avoid going up the casing and crushing the chip.
Further, the elastic rod includes the first body of rod, the first body of rod is hollow structure, the second body of rod has been inserted in the first body of rod, and the second body of rod runs through the lower extreme lateral wall setting of the first body of rod, the mounting hole has been seted up to the upper end lateral wall of the second body of rod, and the bottom of mounting hole passes through the upper end inner wall fixed connection of spring and the first body of rod, and when last casing pushed down, the insulation board supported the chip, received in the first body of rod of extrusion second body of rod indentation, the spring was compressed simultaneously, and the elasticity of the spring to the second body of rod makes the insulation board support the chip in the standing groove with the realization fixed like this, even the casing continues to move down that the pressure is too big, so the second body of rod can play the buffer protection effect to the chip by the flexible characteristic, can directly not crushed.
Furthermore, the side wall of the second rod body positioned in the first rod body is fixedly connected with a stop block, the stop block is of an annular structure, and the stop block is blocked by the side wall of the lower end of the first rod body, so that the second rod body cannot be separated from the first rod body.
Furthermore, the shape of perforation is the L type, and perforation's lower extreme opening part is filled with insulating cement, because there is a corner in the L type perforation, like this when leaking when the pin outside is dragged, the pore wall of corner can play the effect of countering mutually and prevent to reach and lead electrical pillar, and insulating cement plays insulating effect, also plays sealed effect simultaneously.
Furthermore, the slot is filled with a sealant, the sealant is located in a gap between the upper shell and the side wall of the slot, a gap is formed between the shell wall of the upper shell and the slot, and the sealant is used for sealing the gap so as to prevent external impurities from permeating into the chip through the gap.
Furthermore, the limiting rod is arranged in an inclined mode, the upper end of the limiting rod is in the shape of a hook which is bent outwards, the limiting rod is plastic and can deform after being subjected to external force, the external force restores to deform after disappearing, and the hook portion of the limiting rod can be clamped into the limiting groove due to the characteristic, so that the upper shell and the lower shell are connected, the packaging purpose is achieved, and the structure is simple and the fixing effect is good.
Furthermore, the lower shell, the upper shell and the limiting rod are made of plastic materials, and the plastic has insulating characteristics, is a good insulator and is low in manufacturing cost.
Furthermore, the adhesive is made of epoxy resin materials, and the epoxy resin has good bonding performance, good functionality and low price, and is widely used in the field of electronic appliances.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) connect chip and pin through leading electrical pillar to indirect connected mode protects the chip, goes up the elastic rod between casing and the chip, and the elastic rod can play the effect of elastic adjustment when pushing down the plastic envelope like this to avoid going up the casing and crushing the chip.
(2) When last casing pushed down, the insulation board supported the chip, received the first body of rod of extrusion second body of rod indentation, and the spring is compressed simultaneously, and the elasticity of the spring to the second body of rod makes the insulation board support the chip in order to realize fixed like this, even pressure is too big to cause the casing to continue to move down in the standing groove, the flexible characteristic of second body of rod elasticity just so can play the buffering guard action to the chip, can directly not crushed.
(3) The stop block is blocked by the side wall of the lower end of the first rod body, so that the second rod body cannot be separated from the first rod body.
(4) Because the L-shaped through hole is provided with the turn, when the pin leaking outside is dragged, the hole wall of the turn can play a role of resisting against each other so as to prevent the conductive column from being affected, and the insulating glue plays an insulating role and also plays a sealing role.
(5) A gap is formed between the shell wall of the upper shell and the slot, and the sealant is used for sealing the gap so as to prevent external impurities from permeating the chip through the gap.
(6) The limiting rod has plasticity, can take place deformation after receiving external force, and external force resumes deformation after disappearing, and this characteristic makes the hook portion of limiting rod block in the spacing groove to the realization is connected of casing and lower casing, reaches the purpose of encapsulation, and simple structure and fixed effectual.
(7) The plastic has insulating property, is a good insulator and has low manufacturing cost.
(8) The epoxy resin has good bonding performance, good functionality and low price, and is widely used in the field of electronic and electric appliances.
Drawings
FIG. 1 is a schematic view of an integrated package structure according to the present invention;
FIG. 2 is a schematic structural diagram of a first packaging step of the present invention;
FIG. 3 is a structural diagram of a second packaging step according to the present invention;
FIG. 4 is a schematic structural diagram of a third packaging step of the present invention;
FIG. 5 is a structural diagram of a fourth packaging step according to the present invention;
FIG. 6 is a schematic view of the structure of the elastic rod of the present invention;
fig. 7 is a schematic view of the structure at a in fig. 5.
The reference numbers in the figures illustrate:
the structure comprises a lower shell 1, a conductive column 2, a through hole 3, a pin 4, a placing groove 5, an adhesive 6, a chip 7, a lead 8, an upper shell 9, a slot 10, a limiting rod 11, a limiting groove 12, an elastic rod 13, a first rod body 1301, a second rod body 1302, a mounting hole 1303, a spring 1304, an insulating plate 14, insulating glue 15, sealant 16 and a stop block 17.
Detailed Description
The drawings in the embodiments of the invention will be combined; the technical scheme in the embodiment of the invention is clearly and completely described; obviously; the described embodiments are only some of the embodiments of the invention; but not all embodiments, are based on the embodiments of the invention; all other embodiments obtained by a person skilled in the art without making any inventive step; all fall within the scope of protection of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
referring to fig. 1-7, a method for packaging densely-arranged semiconductor chips for terminals of the internet of things includes a lower housing 1, referring to fig. 1, a placing groove 5 is formed on an upper surface of the lower housing 1, two sets of conductive posts 2 are fixedly connected to the upper surface of the lower housing 1, two groups of conductive posts 2 are respectively arranged at two sides of the placing groove 5, a through hole 3 is arranged in the lower shell 1, the through hole 3 is L-shaped, the opening at the lower end of the through hole 3 is filled with insulating glue 15, because the L-shaped through hole 3 has a turn, when the pin 4 leaking outside is pulled, the wall of the turn can play a counter-balancing role to prevent the pin 2 from being affected by the turn, the insulating glue 15 plays an insulating role, meanwhile, the sealing function is also achieved, the through hole 3 is arranged below the conductive column 2, the pin 4 is placed in the through hole 3, and the upper end of the pin 4 is fixedly connected with the conductive column 2;
referring to fig. 2-5, an adhesive 6 is bonded to the bottom of the placement groove 5, the adhesive 6 is made of an epoxy resin material, the epoxy resin has good bonding performance, good functionality and low price, and is widely used in the field of electronic and electrical devices, a chip 7 is placed in the placement groove 5, the lower end of the chip 7 is bonded to the adhesive 6, the upper surface of the chip 7 is connected to the conductive posts 2 through a plurality of wires 8, an upper shell 9 is inserted into the upper side of the lower shell 1, two slots 10 matched with the upper shell 9 are formed in the upper surface of the lower shell 1, a sealant 16 is filled in the slots 10, the sealant 16 is located in a gap between the upper shell 9 and the side walls of the slots 10, a gap is formed between the wall of the upper shell 9 and the slots 10, and the sealant 16 is used for sealing the gap to prevent external impurities from permeating into the chip 7 through the gap;
referring to fig. 7, the lower ends of the two sides of the upper housing 9 are fixedly connected with limit rods 11, the limit rods 11 are arranged in an inclined manner, the upper ends of the limit rods 11 are in the shape of hooks which are bent outwards, the limit rods 11 have plasticity and can deform after being subjected to external force, and the external force recovers the deformation after disappearing, so that the hooks of the limit rods 11 can be clamped into the limit grooves 12 to realize the connection of the upper housing 9 and the lower housing 1, and the packaging purpose is achieved, the structure is simple, the fixing effect is good, the limit rods 11 are inserted into the slots 10, the limit grooves 12 matched with the limit rods 11 are formed in the side walls of the slots 10, the lower housing 1, the upper housing 9 and the limit rods 11 are made of plastic materials, and the plastic has the insulating property, is a good insulator, and is low in manufacturing cost;
referring to fig. 6, a plurality of vertically disposed elastic rods 13 are fixedly connected to a lower sidewall of the upper case 9, each elastic rod 13 includes a first rod 1301, each first rod 1301 is of a hollow structure, a second rod 1302 is inserted into each first rod 1301, each second rod 1302 penetrates through the lower sidewall of each first rod 1301, a stopper 17 is fixedly connected to a sidewall of each second rod 1302 located in each first rod 1301, each stopper 17 is of an annular structure, each stopper 17 is stopped by the lower sidewall of each first rod 1301, so that each second rod 1302 does not separate from each first rod 1301, a mounting hole 1303 is formed in the upper sidewall of each second rod 1302, the bottom of each mounting hole 1303 is fixedly connected to the upper inner wall of each first rod 1301 through a spring 1304, when the upper case 9 is pressed down, the insulating plate 14 abuts against the chip 7, the second rod 1302 is compressed into the first rod 1301 under the action of extrusion, and the spring 1304 is compressed, like this the elasticity of spring 1304 to the second body of rod 1302 makes insulating board 14 support chip 7 in standing groove 5 in order to realize fixedly, even the too big casing 9 that causes of pressure continues to move down, the flexible characteristic of elasticity of the second body of rod 1302 just so can play the buffering guard action to chip 7, can directly not crushed, and fixedly connected with insulating board 14 between the lower extreme of a plurality of elastic stems 13.
The packaging method of the invention comprises the following steps:
s1, uniformly spreading the adhesive 6 in the placing groove 5, placing the cut chip 7 on the adhesive 6, slightly pressing the chip 7 downward so that the adhesive 6 can sufficiently contact with the bottom of the chip 7, and standing for a period of time to wait for the adhesive 6 to cure;
s2, connecting the chip 7 and the conductive pillar 2 by the wire 8, wherein the lower end of the conductive pillar 2 is connected to the pin 4, so that the wire 8 indirectly connects the chip 7 and the pin 4;
s3, pressing the upper shell 9 on the lower shell 1, inserting the limit rod 11 at the lower end of the upper shell 9 into the slot 10, because the width of the upper end of the slot 10 is smaller than that of the limit rod 11, the hook part of the limit rod 11 can be extruded by the slot wall of the slot 10 to shrink, when the hook part of the limit rod 11 moves downwards to the limit slot 12, the plasticity of the limit rod 11 enables the limit rod 11 to recover the deformation, at the moment, the hook part of the limit rod 11 is clamped into the limit slot 12, so that the upper shell 9 is connected with the lower shell 1, when the shell 9 is pressed downwards, the insulation plate 14 is propped against the upper surface of the chip 7, because the elastic rod 13 has the elastic telescopic capacity, the insulation plate 14 can play a role of fixing the chip 7, and the chip 7 cannot be damaged due to overlarge pressure;
s4, finally, sealing the gap where the pin 4 penetrates through the through hole 3 by using an insulating glue 15 so as to prevent the pin 4 from shaking, and sealing the gap between the upper shell 9 and the slot 10 by using a sealing glue 16 so as to package and protect the chip 7;
it can realize the indirect connection of chip 7 and pin 4 to pin 4 leads to chip 7 to lead to the fact chip 7 to rock or damage, adopts the mode of elastic packaging in addition when the plastic envelope, can play fixed effect, can not damage chip 7 again.
The above; but are merely preferred embodiments of the invention; the scope of the invention is not limited thereto; any person skilled in the art is within the technical scope of the present disclosure; the technical scheme and the improved concept of the invention are equally replaced or changed; are intended to be covered by the scope of the present invention.
Claims (4)
1. The packaging method for the densely arranged semiconductor chips of the terminals of the Internet of things comprises a lower shell (1), and is characterized in that: the upper surface of the lower shell (1) is provided with a placing groove (5), the upper surface of the lower shell (1) is fixedly connected with two groups of conductive posts (2), the two groups of conductive posts (2) are respectively arranged at two sides of the placing groove (5), a through hole (3) is formed in the lower shell (1), the through hole (3) is arranged below the conductive posts (2), the through hole (3) is L-shaped, an opening at the lower end of the through hole (3) is filled with insulating glue (15), a pin (4) is arranged in the through hole (3), the upper end of the pin (4) is fixedly connected with the conductive posts (2), the bottom of the placing groove (5) is bonded with an adhesive (6), a chip (7) is arranged in the placing groove (5), the lower end of the chip (7) is bonded with the adhesive (6), the upper surface of the chip (7) is connected with the conductive posts (2) through a plurality of conducting wires (8), the upper side of the lower shell (1) is inserted with an upper shell (9), the upper surface of the lower shell (1) is provided with two slots (10) matched with the upper shell (9), the slots (10) are filled with sealant (16), the sealant (16) is positioned in a gap between the upper shell (9) and the side walls of the slots (10), the lower ends of the two sides of the upper shell (9) are fixedly connected with limiting rods (11), the limiting rods (11) are inserted in the slots (10) for arrangement, the side walls of the slots (10) are provided with limiting grooves (12) matched with the limiting rods (11), the side walls of the lower ends of the upper shell (9) are fixedly connected with a plurality of vertically arranged elastic rods (13), insulation plates (14) are fixedly connected between the lower ends of the elastic rods (13), each elastic rod (13) comprises a first rod body (1301), and the first rod body (1301) is of a hollow structure, a second rod body (1302) is inserted into the first rod body (1301), the second rod body (1302) penetrates through the lower end side wall of the first rod body (1301), a mounting hole (1303) is formed in the upper end side wall of the second rod body (1302), the bottom of the mounting hole (1303) is fixedly connected with the upper end inner wall of the first rod body (1301) through a spring (1304), a stop block (17) is fixedly connected to the side wall of the second rod body (1302) in the first rod body (1301), and the stop block (17) is of an annular structure;
the packaging method comprises the following steps: s1, uniformly coating the adhesive (6) in the placing groove (5), putting the cut chip (7) on the adhesive (6), slightly pressing the chip (7) downwards to enable the adhesive (6) to be fully contacted with the bottom of the chip (7), and standing for a period of time to wait for the adhesive (6) to be cured;
s2, connecting the chip (7) and the conductive column (2) by a lead (8), wherein the lead (8) indirectly connects the chip (7) and the pin (4) because the lower end of the conductive column (2) is connected with the pin (4);
s3, pressing the upper shell (9) on the lower shell (1), inserting the limit rod (11) at the lower end of the upper shell (9) into the slot (10), because the width of the upper end of the slot (10) is less than that of the limiting rod (11), the hook part of the limiting rod (11) can be extruded by the slot wall of the slot (10) to shrink, when the hook part of the limiting rod (11) moves downwards to the limiting groove (12), the limiting rod (11) restores to deform due to the plasticity of the limiting rod, the hook part of the limiting rod (11) is clamped into the limiting groove (12) at the moment, so that the upper shell (9) is connected with the lower shell (1), while the upper shell (9) is pressed down, the insulating plate (14) is propped against the upper surface of the chip (7), the elastic rod (13) has elastic expansion capability, so that the insulating plate (14) can play a role in fixing the chip (7) and cannot damage the chip (7) due to overlarge pressure;
and S4, finally, sealing the gap where the pin (4) penetrates through the through hole (3) by using insulating glue (15) so as to prevent the pin (4) from shaking, and sealing the gap between the upper shell (9) and the slot (10) by using sealing glue (16) so as to package and protect the chip (7).
2. The method for packaging the densely-arranged semiconductor chips for the terminals of the internet of things according to claim 1, wherein the method comprises the following steps: the limiting rod (11) is obliquely arranged, and the upper end of the limiting rod (11) is in the shape of a hook which is bent outwards.
3. The method for packaging the densely-arranged semiconductor chips for the terminals of the internet of things according to claim 1, wherein the method comprises the following steps: the lower shell (1), the upper shell (9) and the limiting rod (11) are all made of plastic materials.
4. The method for packaging the densely-arranged semiconductor chips for the terminals of the internet of things according to claim 1, wherein the method comprises the following steps: the adhesive (6) is made of epoxy resin materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911274837.4A CN111092057B (en) | 2019-12-12 | 2019-12-12 | Packaging method for densely-arranged semiconductor chips of terminal of Internet of things |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911274837.4A CN111092057B (en) | 2019-12-12 | 2019-12-12 | Packaging method for densely-arranged semiconductor chips of terminal of Internet of things |
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| CN111092057A CN111092057A (en) | 2020-05-01 |
| CN111092057B true CN111092057B (en) | 2022-04-29 |
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| CN112782548B (en) * | 2020-12-25 | 2023-09-19 | 上海华力集成电路制造有限公司 | Antistatic test machine of charging device model and test board applied to antistatic test machine |
| CN115101480B (en) * | 2022-08-24 | 2022-11-04 | 广东长华科技有限公司 | Thin and light semiconductor packaging structure |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009200416A (en) * | 2008-02-25 | 2009-09-03 | Mitsubishi Electric Corp | Semiconductor apparatus and method of manufacturing the same |
| CN208418619U (en) * | 2018-07-12 | 2019-01-22 | 上海兴为视觉科技股份有限公司 | A kind of LED filament encapsulating structure that colour rendering is high |
| CN109300859A (en) * | 2018-09-18 | 2019-02-01 | 陈广焕 | A kind of protectiveness chip package frame |
| CN109962147A (en) * | 2019-03-05 | 2019-07-02 | 扬州联华电子科技有限公司 | A kind of metal substrate LED core chip package with pooling feature |
| CN209169128U (en) * | 2018-12-19 | 2019-07-26 | 深圳市美浦森半导体有限公司 | A kind of semiconductor chip equipped with encapsulating structure |
-
2019
- 2019-12-12 CN CN201911274837.4A patent/CN111092057B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009200416A (en) * | 2008-02-25 | 2009-09-03 | Mitsubishi Electric Corp | Semiconductor apparatus and method of manufacturing the same |
| CN208418619U (en) * | 2018-07-12 | 2019-01-22 | 上海兴为视觉科技股份有限公司 | A kind of LED filament encapsulating structure that colour rendering is high |
| CN109300859A (en) * | 2018-09-18 | 2019-02-01 | 陈广焕 | A kind of protectiveness chip package frame |
| CN209169128U (en) * | 2018-12-19 | 2019-07-26 | 深圳市美浦森半导体有限公司 | A kind of semiconductor chip equipped with encapsulating structure |
| CN109962147A (en) * | 2019-03-05 | 2019-07-02 | 扬州联华电子科技有限公司 | A kind of metal substrate LED core chip package with pooling feature |
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| CN111092057A (en) | 2020-05-01 |
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