CN202958076U - Board-level interconnection structure and electrical equipment - Google Patents

Board-level interconnection structure and electrical equipment Download PDF

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Publication number
CN202958076U
CN202958076U CN 201220703540 CN201220703540U CN202958076U CN 202958076 U CN202958076 U CN 202958076U CN 201220703540 CN201220703540 CN 201220703540 CN 201220703540 U CN201220703540 U CN 201220703540U CN 202958076 U CN202958076 U CN 202958076U
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CN
China
Prior art keywords
interconnection structure
power devices
mainboard
board
function element
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Expired - Lifetime
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CN 201220703540
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Chinese (zh)
Inventor
夏国超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dimension Corp
Original Assignee
Emerson Network Power Energy Systems Noth America Inc
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Priority to CN 201220703540 priority Critical patent/CN202958076U/en
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Abstract

The utility model relates to the technical field of electrical equipment, and discloses a board-level interconnection structure and electrical equipment. The board-level interconnection structure comprises a main board, a functional element, a plurality of power devices and a small board, wherein the functional element is vertically fixed on the main board; a plurality of power devices are fixed on one side of the functional element; connecting pins of a plurality of power devices are vertically connected with the main board; gaps are formed between the connecting pins of a plurality of power devices and the functional element; the small board is inserted into the gaps between the connecting pins of a plurality of power devices and the functional element and provided with a plurality of connecting parts; and a plurality of connecting parts are connected with the connecting pins of a plurality of power devices correspondingly. Through the layout mode, an inherent gap in the electrical equipment is fully utilized; and compared with the prior art, the board-level interconnection structure has the advantages that an additional layout space is not required to be occupied, so the layout space in the electrical equipment is greatly saved, and layout density is improved.

Description

A kind of plate interconnection structure and a kind of electric equipment
Technical field
The utility model relates to the electric equipment technical field, particularly relates to a kind of plate interconnection structure and a kind of electric equipment.
Background technology
Along with the electric equipment miniaturization of products, highdensity development trend, the application that plate is interconnected in product is more and more extensive.The plate interconnection, refer to the subelement on mainboard be transferred on a platelet, by mainboard, with the plate between platelet, is connected to realize the allomeric function of mainboard, thereby reach the purpose of saving arrangement space, improving layout density.
As shown in Figure 1, existing a kind of plate interconnection structure is contact pin type, and an end of contact pin 10 is soldered on platelet 3, and the other end is soldered on mainboard 5 by the through hole welding manner, to realize the plate interconnection between platelet 3 and mainboard 5.
The defect that prior art exists is, the spacing of arranging that the spacing of arranging of contact pin 10 should be at least the most of contact pins of 2mm(is 2.54mm), contact pin 10 is connected between platelet 3 and mainboard 5 needs to take larger arrangement space, mainboard 5 and platelet 3 also need corresponding increase over against area, the layout density of inside electric appliance can't be further enhanced; In addition, the cost of contact pin is higher, does not meet the low-cost development trend of current electric equipment product.
The utility model content
The purpose of this utility model is to provide a kind of plate interconnection structure and a kind of electric equipment, in order to save the inside electric appliance arrangement space, improves layout density.
The utility model plate interconnection structure comprises:
Mainboard;
Function element, vertically be fixed in described mainboard;
A plurality of power devices, be fixed in described function element one side, the connecting pin of described a plurality of power devices is vertical connect described mainboard and and described function element between there is gap;
Platelet, be inserted in the connecting pin of described a plurality of power devices and the gap between described function element, has a plurality of connecting portions, the corresponding connection of connecting pin of described a plurality of connecting portions and described a plurality of power devices.
Optionally, described function element is radiator.
Optionally, described power device is power tube, and described connecting pin is pin.
Preferably, described connecting portion is encapsulation welding tray, corresponding being welded to connect of connecting pin of described a plurality of connecting portions and described a plurality of power devices.
Preferably, described function element and described mainboard are welded to connect.
Preferably, the connecting pin of described a plurality of power devices and described mainboard are pegged graft.
The utility model electric equipment, comprise the described plate interconnection structure of aforementioned arbitrary technical scheme.
In technical solutions of the utility model, platelet is inserted in the connecting pin of a plurality of power devices and the gap between function element, arrange vertical with mainboard, a plurality of connecting portions of platelet and the corresponding connection of the connecting pin of a plurality of power devices, this layout type takes full advantage of the intrinsic gap of inside electric appliance, than prior art, between plate, interconnection does not need additionally to take arrangement space, therefore, greatly save the arrangement space of inside electric appliance, improved layout density.
The accompanying drawing explanation
Fig. 1 is existing plate interconnection structure schematic diagram;
The plate interconnection structure schematic diagram that Fig. 2 is the utility model one embodiment;
The platelet structure schematic diagram that Fig. 3 is the utility model one embodiment;
The radiator that Fig. 4 is the utility model one embodiment and power tube structural representation.
Reference numeral:
5-mainboard 6-function element
7-power device 8-connecting pin
2-plastic casing 10-contact pin
The 3-platelet
Embodiment
In order to save the inside electric appliance arrangement space, improve layout density, the utility model embodiment provides a kind of plate interconnection structure and a kind of electric equipment.In technical solutions of the utility model, platelet is inserted in the connecting pin of a plurality of power devices and the gap between function element, arrange vertical with mainboard, a plurality of connecting portions of platelet and the corresponding connection of the connecting pin of a plurality of power devices, this layout type takes full advantage of the intrinsic gap of inside electric appliance, greatly save the arrangement space of inside electric appliance, improved layout density.For making the purpose of this utility model, technical scheme and advantage clearer, by the following examples the utility model is described in further detail.
As shown in Figure 2, Figure 3 and Figure 4, the plate interconnection structure of the utility model embodiment comprises:
Mainboard 5;
Function element 6, vertically be fixed in mainboard 5;
A plurality of power devices 7, be fixed in function element 6 one sides, the connecting pin of described a plurality of power devices 78 is vertical connect mainboard 5 and and function element 6 between there is gap;
Platelet 3, be inserted in the connecting pin 8 of described a plurality of power device 7 and the gap between function element 6, has a plurality of connecting portion (not shown)s, the corresponding connection of connecting pin 8 of described a plurality of connecting portions and described a plurality of power devices 7.
The plate interconnection structure that the utility model proposes can be applicable in various types of electric equipment products.Mainboard 5 and platelet 3 are PCB(Printed Circuit Board, and printed circuit board (PCB) is called for short PCB).The type of power device 7 is not limit, and in the embodiment shown in Figure 2, power device 7 is power tube, the pin that connecting pin 8 is power device 7.The type of function element 6 is not limit, as long as vertically be fixed in mainboard 5, and have gap between the connecting pin 8 of a plurality of power device 7 and gets final product.It is worth mentioning that, " vertically " described in the utility model embodiment, not the angle between two parts strictly accurately is defined in to 90 degree, be construed as, near the certain error scope of angle 90 degree between two parts gets final product.Because the caloric value of power device 7 is larger, usually need to carry out auxiliary heat dissipation to it, therefore, function element 6 can be the radiator of auxiliary power device 7 heat radiations.
In technical solutions of the utility model, platelet 3 is inserted in the connecting pin 8 of a plurality of power devices 7 and the gap between function element 6, setting vertical with mainboard 5, a plurality of connecting portions of platelet 3 and the corresponding connection of the connecting pin 8 of a plurality of power devices 7, this layout type takes full advantage of the intrinsic gap of inside electric appliance, than prior art, between plate, interconnection does not need additionally to take arrangement space, therefore, greatly save the arrangement space of inside electric appliance, improved layout density.
Connected mode between a plurality of connecting portions of platelet 3 and the connecting pin 8 of a plurality of power device 7 can be for multiple, in preferred embodiment of the present utility model, connecting portion on platelet 3 is encapsulation welding tray, corresponding being welded to connect of connecting pin 8 of a plurality of encapsulation welding trays and a plurality of power devices 7.In this embodiment, the specification of encapsulation welding tray should design according to the size of corresponding connecting pin 8, encapsulation welding tray adopts the mode of Surface Mount weldering to be fixedly connected with corresponding connecting pin 8, than prior art, this scheme is without perforate on mainboard 5, not only fixing comparatively firm, reliability improves, and the layout density of mainboard 5 also is improved.In addition, the another one technical advantage of this embodiment is, welding connection structure, than existing contact pin type structure, has been cancelled the setting of contact pin, can greatly reduce the cost of electric equipment, meets current low-cost development trend.
Function element 6 is not limit with the mode that is fixedly connected with of mainboard 5, for example, can be plug-in type, preferably adopts the mode be welded to connect, and reliability is higher, and adopts the mode cost be welded to connect lower.For the ease of operation, the connecting pin 8 of a plurality of power devices 7 preferably adopts the plug-in type electrical connection with mainboard 5.
The concrete assembling process of plate interconnection structure embodiment illustrated in fig. 2 is as follows:
By a plurality of power tubes (being power device 7) and radiator (being function element 6) assembling, the pin of power tube (being connecting pin 8) is positioned at the bottom of power tube plastic casing 2, and near centre position, therefore, there is certain interval between the pin of power tube and radiator, as shown in Figure 4;
Platelet 3 is erected and inserts in the pin of a plurality of power tubes and the gap between radiator, make the pin place plane parallel of plate face and a plurality of power tubes of platelet 3, and each encapsulation welding tray of platelet 3 and corresponding power tube pin positions are aimed at;
Make platelet 3 be adjacent to and contact with the pin of a plurality of power tubes, adopt the mode of Surface Mount weldering that platelet 3 is fixedly connected with the pin of a plurality of power tubes;
The radiator that completes above assembling is fixedly welded on to the relevant position on mainboard 5, the pin of a plurality of power tubes and mainboard 5 are pegged graft, thereby realize the electrical connection of mainboard 5 and platelet 3, as shown in Figure 2.
The utility model embodiment also provides a kind of electric equipment, comprises the described plate interconnection structure of aforementioned arbitrary embodiment, have higher layout density, and cost is lower.
Obviously, those skilled in the art can carry out various changes and modification and not break away from spirit and scope of the present utility model the utility model.Like this, if within of the present utility model these are revised and modification belongs to the scope of the utility model claim and equivalent technologies thereof, the utility model also is intended to comprise these changes and modification interior.

Claims (7)

1. a plate interconnection structure, is characterized in that, comprising:
Mainboard (5);
Function element (6), vertically be fixed in described mainboard (5);
A plurality of power devices (7), be fixed in described function element (6) one sides, the connecting pin (8) of described a plurality of power devices (7) vertically connect described mainboard (5) and and described function element (6) between there is gap;
Platelet (3), be inserted in the connecting pin (8) of described a plurality of power device (7) and the gap between described function element (6), has a plurality of connecting portions, the corresponding connection of connecting pin (8) of described a plurality of connecting portions and described a plurality of power devices (7).
2. plate interconnection structure as claimed in claim 1, is characterized in that, described function element (6) is radiator.
3. plate interconnection structure as claimed in claim 1, is characterized in that, described power device (7) is power tube, and described connecting pin (8) is pin.
4. plate interconnection structure as described as claim 1 ~ 3 any one, is characterized in that, described connecting portion is encapsulation welding tray, corresponding being welded to connect of connecting pin (8) of described a plurality of connecting portions and described a plurality of power devices (7).
5. plate interconnection structure as claimed in claim 4, is characterized in that, described function element (6) is welded to connect with described mainboard (5).
6. plate interconnection structure as claimed in claim 4, is characterized in that, the connecting pin (8) of described a plurality of power devices (7) is pegged graft with described mainboard (5).
7. an electric equipment, is characterized in that, comprises plate interconnection structure as described as any one in claim 1 ~ 6.
CN 201220703540 2012-12-18 2012-12-18 Board-level interconnection structure and electrical equipment Expired - Lifetime CN202958076U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220703540 CN202958076U (en) 2012-12-18 2012-12-18 Board-level interconnection structure and electrical equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220703540 CN202958076U (en) 2012-12-18 2012-12-18 Board-level interconnection structure and electrical equipment

Publications (1)

Publication Number Publication Date
CN202958076U true CN202958076U (en) 2013-05-29

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104952807A (en) * 2015-05-04 2015-09-30 嘉兴斯达半导体股份有限公司 Power semiconductor module adaptable to PCBs (printed circuit boards) in different thicknesses

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104952807A (en) * 2015-05-04 2015-09-30 嘉兴斯达半导体股份有限公司 Power semiconductor module adaptable to PCBs (printed circuit boards) in different thicknesses

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: No. 1510, Kansas Avenue, lureen, Ohio, USA

Patentee after: VERTIV ENERGY SYSTEMS, Inc.

Address before: The United States of Ohio city F Lorain Street No. 1122

Patentee before: EMERSON NETWORK POWER, ENERGY SYSTEMS, NORTH AMERICA, Inc.

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20201016

Address after: Ohio, USA

Patentee after: Dimension Corp.

Address before: 1510 Kansas Avenue, Loren, Ohio, USA

Patentee before: VERTIV ENERGY SYSTEMS, Inc.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20130529