CN205881892U - Intelligent power module - Google Patents

Abstract

The utility model provides an intelligent power module, intelligent power module includes: circuit wiring layer as the carrier, the circuit wiring layer has upper surface and the lower surface relative with this upper surface, the back -off and weld in the upper surface preset position's on circuit wiring layer circuit component, paste adorn in the radiator of the power component among the circuit component, and cover the upper surface on circuit wiring layer with circuit component, and make radiator part surface exposure's sealing layer. No longer needing the metal substrate, but processing through reuse's bottom plate fixed circuit wiring layer, carry out the end through the resin and fix, no longer need metal nation alignment, saved the cost, expose the circuit wiring back and fin in the resin outside completely, furthest improves the radiating effect, and the clearance between circuit wiring exposes completely, and the moisture is difficult to adhere to to, even invade in the outside moisture, because do not have the metal wire, be difficult to constitute and corroded.

Description

A kind of SPM

Technical field

This utility model belongs to electronic device manufacturing process field, particularly relates to a kind of SPM.

Background technology

SPM (Intelligent Power Module, IPM) is a kind of by power electronics and integrated circuit The power drive series products that technology combines.IPM integrates device for power switching and high-voltage driving circuit, and in kept Voltage, overcurrent and the failure detector circuit such as overheated.IPM mono-aspect receives the control signal of MCU, drives subsequent conditioning circuit work, On the other hand the state detection signal of system is sent back to MCU.Compared with traditional discrete scheme, IPM is with its high integration, highly reliable Property etc. advantage win increasing market, be particularly suitable for driving the converter of motor and various inverter, be that frequency conversion is adjusted Speed, metallurgical machinery, electric propulsion, servo-drive, a kind of desired power level electronic device of frequency-conversion domestic electric appliances.

SPM typically can be operated in severe operating mode, such as the off-premises station of convertible frequency air-conditioner, hot and humid shape Under state, high temperature can make SPM internal temperature raise, complete by described sealing resin for existing SPM The structure sealed, internal being very easy to of SPM produces heat localization, high humidity can make aqueous vapor pass through described sealing resin with Gap between pin enters the internal circuit of described SPM, the high temperature within described SPM make from Son, particularly chloride ion and bromide ion migrate under the effect of aqueous vapor, and metal wire is produced corrosion, and this corrosion often goes out Now metal wire and component or metal wire and the joint portion of described wiring, cause open circuit, to SPM structure Become fatal damages, time serious, can make SPM that explosion accident out of control occurs, be applied to environment structure infringement, cause weight Big economic loss.

It addition, SPM has the device of different capacity, for the device of different capacity, the material of metal wire is with thick The most different, add the difficulty of processing of SPM, buy different nation's line equipment and also add processing cost, and And, the combination of multiple nation Wiring technology makes the manufacture first-pass yield step-down of described SPM, produces yield and is difficult to improve.Finally The cost causing described SPM remains high, and have impact on the popularization and application of SPM.

Utility model content

This utility model aims to solve the problem that the deficiencies in the prior art, it is provided that the SPM of a kind of high reliability, can be Ensure that SPM reduces the cost of SPM while having more good contact reliability.

This utility model is achieved in that a kind of SPM, including:

As the circuit-wiring layer of carrier, described circuit-wiring layer has upper surface and the following table relative with this upper surface Face；

Back-off is also welded in the component in upper surface precalculated position of described circuit-wiring layer；

The radiator of the power component being mounted in described component；And

Cover the upper surface of described circuit-wiring layer and described component, and make described heat sink part surface exposure Sealant.

Further, also include that pin, described circuit-wiring layer include by antermarginal pin pad, described pin and institute State pin pad connect and extend outside described wiring.

Further, described pin surface is coated with coating.

Further, described power component is Planar power device.

Further, described radiator is fin.

Further, described sealant is resin bed.

Above-mentioned SPM provides the benefit that: be no longer necessary to metal basal board, solid by the base plate of repeatable utilization Determine circuit-wiring layer to be processed, finally fixed by resin, it is no longer necessary to metal bonding line, provide cost savings, by electricity Road wired back and fin are completely exposed outside resin, improve radiating effect to greatest extent, and the gap between wiring is complete Full exposure, dampness is difficult to adhere to, and, even if invading in outside moisture, because the most there is not metal wire, it is difficult to constitute corrosion.

Accompanying drawing explanation

The top view of the SPM that Fig. 1 (A) provides for the embodiment of the present invention；

Fig. 1 (B) is the profile in Fig. 1 (A) along X-X ' line；

Fig. 1 (C) is the top view after the SPM of the present invention removes sealant；

Fig. 1 (D) is the lower surface top view of the SPM of the present invention；

The manufacturing process flow diagram of the SPM that Fig. 2 provides for the embodiment of the present invention；

Fig. 3 (A), 3 (B) be respectively SPM of the present invention manufacture method in make vertical view and the side of wiring Depending on operation schematic diagram；

Fig. 4 (A) is the size indication figure of pin；

Fig. 4 (B) is the operation schematic diagram making pin；

Fig. 5 is the operation schematic diagram being mounted on fin in the bottom of power component

Fig. 6 (A) is the operation schematic diagram configuring wiring on base；

Fig. 6 (B) and 6 (C) is respectively assembly circuit element, the side-looking of pin and overlooks operation schematic diagram；

Fig. 7 is the sealing process schematic diagram of the manufacture method of SPM；

Fig. 8 is the detection operation schematic diagram of the manufacture method of SPM；

Fig. 9 is the process flow chart of the manufacture method of SPM.

Detailed description of the invention

In order to make the technical problems to be solved in the utility model, technical scheme and beneficial effect clearer, below In conjunction with drawings and Examples, this utility model is further elaborated.Should be appreciated that described herein being embodied as Example, only in order to explain this utility model, is not used to limit this utility model.

As shown in Fig. 1 (A), Fig. 1 (B), Fig. 1 (C), Fig. 1 (D), SPM includes circuit-wiring layer (circuit cloth Line) 18, the circuit that constitutes of component 14, radiator 15, and be arranged in the pin 11 at described wiring 18 edge, and seal This circuit and described component 14 and the sealant 12 of described wiring 18 upper surface are completely covered.Wherein, Fig. 1 (A) is The upper surface top view of SPM 10 of the present utility model, described radiator 15 exposes from upper surface, and Fig. 1 (B) is edge The sectional view of the X-X ' line of Fig. 1 (A), Fig. 1 (C) is the vertical view after removing the described sealant 12 covering described component 14 Figure, Fig. 1 (D) is the lower surface top view of SPM 10 of the present utility model, and described wiring 18 is showed from following table Go out.

Circuit-wiring layer 18 as the carrier of SPM 10, described circuit-wiring layer 18 have upper surface and with this The lower surface that upper surface is relative；Component 14 back-off is also welded in the upper surface precalculated position of described circuit-wiring layer 18；Dissipate Hot device 15 is mounted on the power component in described component 14；Sealant 12 cover described circuit-wiring layer 18 upper surface and Described component 18, and make described radiator 15 part surface exposed.

Specifically, power component is Planar power device, as IGBT manages, it is necessary to use LIGBT.Radiator 15 is heat radiation Sheet, fin surface can consider to carry out electrosilvering process, increases soaking into property.Sealant 12 is sealing resin layer.

Further, at least one edge close of wiring 18, there is the special circuit for configuration pin 11 Wiring, referred to as pin pad 18A.Pin 11 pin pad 18A connects and from the described outer extension of wiring 18.Described pin 11 Surface is coated with coating.

The such each element of following description.

Wiring 18 is made by the form of punching press or etching by the copper material that thickness is more than 5 ounces, in order to anti- Oxidation, the upper surface of described wiring 18 can carry out gold-plated process, for cost, the upper surface of described wiring 18 Can also carry out silver-plated process, or be transported by vacuum or nitrogen gas packing, upper surface does not deals with.

Described component 14 is fixed on described wiring 18 by upside-down mounting.Described component 14 use transistor or The active components such as diode or the passive element such as electric capacity or resistance.It addition, be mounted on by the radiator 15 being made up of copper etc. The element back side that the caloric values such as power component are big.

Here, be designed to be provided with a plurality of pin 11 on one side, it has the effect such as carrying out inputting, export with outside. Pin 11 and pin pad 18A are welded by electrical binding agents of conduction such as scolding tin.

Pin 11 typically uses the metals such as copper to make, and copper surface forms one layer of nickeltin layer by chemical plating and plating, The thickness of alloy-layer is generally 5 μm, and coating can protect copper not to be corroded oxidation, and can improve weldability.

Described sealant 12 can use thermosetting resin molding to be used as injecting mould mode by transmission mould mode and use Thermoplastic resin moulds.Here, described sealant 12 fully seals all elements in the one side of described wiring 18, and wrap Wrap up in most of degree of depth of described wiring 18, only expose fraction wiring lower surface 18B, wiring lower surface 18B The degree of depth typically can consider to be designed to 0.5 ounce, if the wiring lower surface 18B degree of depth is too small, is likely to result in this The SPM 10 of utility model is follow-up be welded and fixed during be difficult to be wrapped up by solders such as tin creams, if under wiring The surface 18B degree of depth is excessive, tin cream during being likely to result in that SPM 10 of the present utility model is follow-up and being welded and fixed Climbing stannum height can not fully wrapped around wiring lower surface 18B；Here, described radiator 15 exposes from described sealant 12, The heat making power component is quickly scattered and disappeared.

SPM provides the benefit that: be no longer necessary to metal basal board, by the fixing electricity of the base plate of repeatable utilization Road wiring layer is processed, and is finally fixed by resin, it is no longer necessary to metal bonding line, provides cost savings, by circuit cloth The line back side and fin are completely exposed outside resin, improve radiating effect to greatest extent, and the gap between wiring is the most sudden and the most violent Dew, dampness is difficult to adhere to, and, even if invading in outside moisture, because the most there is not metal wire, it is difficult to constitute corrosion.

With reference to Fig. 2, the manufacture method of described SPM is described, comprises the following steps:

Step S110, utilizes sheet metal to make the circuit-wiring layer as carrier；

Step S120, in the surface-mounted component of described circuit-wiring layer, wherein, described component is with back-off Mode is assembled；

Step S120, the power component in described component mounts radiator；

Step S140, in the Surface coating sealant of described circuit-wiring layer, covers described component and makes described At least part of surface exposure of radiator.

Step S140 is particularly as follows: be arranged around thermosetting resin frame on the surface of described circuit-wiring layer；Hard in described heat Property resin frame in the range of inject thermoplastic resin to seal described circuit-wiring layer and component.

Also included before step S120: make the step of the pin of independent band coating.This step specifically includes: choose Copper base material, to Copper base material by the way of punching press or etching, is made pin in a row, is connected by reinforcement between pin；Institute State pin surface and sequentially form nickel dam and nickeltin layer, obtain the pin of band coating.

Before step S140 further comprising the steps of: remove and remain in the scaling powder of described insulating barrier.

Being positioned by base, the difficulty of location when reducing plastic packaging, bottom is completely exposed, and reduces during injecting glue upper and lower The surface thickness great disparity difficulty to state modulator, eliminates metal wire bonding and matting, saves equipment investment, improve Production efficiency, reduces technique management and control requirement, makes the manufacture difficulty of SPM decline to a great extent, and fine ratio of product is carried Height, reduce further the cost of SPM.

In more specifically embodiment, in conjunction with Fig. 3 (A) to Fig. 9, the manufacture method of SPM includes following work Sequence.

First operation, with reference to Fig. 3 (A) and 3 (B):

First operation of the present utility model is the operation as this utility model feature, and this operation is at sizeable copper The operation of wiring is formed on substrate.

First, with reference to Fig. 3 (A) and the sectional view 3 (B) of the X-X ' line prolonging Fig. 3 (A), circuit layout design as required, For general SPM, circuit layout not should be greater than 64mm × 30mm.Produce suitable diel to stamp out Specific shape.Also high-speed steel can be used to use the rotating speed of 5000 revs/min, gong cutter and aluminum as material, motor by gong cutter Material plane at right angles descends the specific shape of cutter stroke.Also can pass through etch tool, etch specific shape by chemical reaction.

Here, this given shape is exactly described wiring 18.

In the occasion that antagonism oxidation requirements is the highest, can be by the way of electrogilding or chemistry turmeric, at described circuit cloth Line 18 surface forms layer gold.

Here, the thickness of the copper coin for manufacturing described wiring 18 should be not less than 5 ounces, it is ensured that can be with follow-up Described resin 12 has bigger contact area, makes described SPM 10 finished product have higher fixed effect.

Second operation, with reference to Fig. 4 (A) and Fig. 4 (B):

Second operation of the present utility model is the operation as this utility model feature, and this operation is formed into independent band plating The operation of the pin 11 of layer.

Each pin 11 is to use Copper base material, and making length C is 25mm, and width K is 1.5mm, and thickness H is the strip of 1mm Shape, as shown in Fig. 4 (A)；Here, for ease of assembling, one end suppresses certain radian wherein, as shown in Fig. 4 (B)；

Then nickel dam is formed by the method for chemical plating: by nickel salt and sodium hypophosphite mixed solution, and with the addition of suitable When chelating agent, form nickel dam on the copper material surface forming given shape, at metallic nickel there is the strongest passivation ability, can be fast Fast-growing becomes one layer of very thin passivating film, can resist the corrosion of air, alkali and some acid.Nickel plating crystallization is superfine little, nickel layer thickness one As be 0.1 μm；

Then pass through hydrosulphate technique, at room temperature the copper material forming shape and nickel dam is immersed in positive stannum from Being energized in the plating solution of son, form nickeltin layer on nickel dam surface, nickel layer thickness general control is in 5 μm, and the formation of nickel dam is very big Improve protectiveness and solderability；

Arriving this, described pin 11 has manufactured.

Here, described pin 11 of the present utility model is single pin one by one, the entire row being different from current art is drawn Foot, because the described wiring 18 that described pin 11 is fixed on only is wrapped by resin portion, impact strength has Limit, single pin avoids the operation of excision reinforcement, it is possible to reduces and to SPM 10 of the present utility model is The impact of system property.

3rd operation, with reference to Fig. 5:

3rd operation of the present utility model is the operation as this utility model feature, and this operation is will to produce radiator 15, and the bottom of L-type power component 14 is mounted on the operation on described radiator 15.

Radiator 15 may be designed as the copper sheet that thickness is about 1.5mm, is made by the way of punching press or etching, copper Sheet is silver-plated by the way of plating, and silver thickness is it is contemplated that be designed as 22～30 μm.

Then by eutectic technology, with the high temperature tin cream of fusing point more than 300 DEG C, it is contemplated that use field village brand, by L-type merit The back side of rate element 14 is mounted on described radiator 15.Here, L-type power device 14 is planar power device, this kind All electrodes of power device are all located at the front of power device, the electrode in front in following operation with described wiring 18 It is connected.

Here, the eutectic flatness of described power device 14 considers to control at < 0.1mm.

4th operation, with reference to Fig. 6 (A), 6 (B) and 6 (C):

3rd operation of the present utility model is the operation as this utility model feature, and this operation is to configure on base plate 16 Described wiring 18, and in component described in described wiring 18 surface upside-down mounting 14 and the work of the described pin 11 of configuration Sequence.

First, producing such as the base plate 16 of Fig. 6 (A), described base plate 16 can use the rustless steel of high intensity to be made, On the surface of described base plate 16, the depression 17 that with good grounds described wiring 18 shape is dug out, the width of described depression 17 is bigger In the width of corresponding described wiring 18, the degree of depth of described depression 17 is about 0.5 ounce.

Secondly, with reference to side view Fig. 6 (B) and top view Fig. 6 (C), the wiring 18 made is placed on the described end The described recess of correspondence of plate 16, and by stencil printer, use steel mesh, the ad-hoc location of described wiring 18 is carried out Tin cream application, steel mesh can use the thickness of 0.13mm.By equipment such as SMT machine or DA machines, carry out component 14, including Configuring the component 14 of described radiator 15, and the installation of pin 11, described component 14 can directly be inverted in described electricity The ad-hoc location of road wiring 18, pin 11 then one end to be placed on described pad 18A, and it is solid that the other end needs carrier 20 to carry out Fixed, described carrier 20 is made by materials such as synthesis stones.

Then, the described base plate 16 being put on described carrier 20 is solidified by Reflow Soldering, tin cream, described component 14 He Described pin 11 is fixed.

5th operation, with reference to Fig. 7:

5th operation of the present utility model is the operation as this utility model feature, with reference to Fig. 7, this operation be illustrate by The operation of sealing resin potted circuit wiring 18.Fig. 7 represents that using mould 50 to be sealed by sealing resin 12 is carried by base plate 16 The profile of the operation of wiring 18.

First, toasting wiring 18 in oxygen-free environment, baking time is no less than 2 hours, baking temperature With selection 125 DEG C.

The base plate 16 of good for configuration described wiring 18 is transported to model 44 and 45.By making the specific part of pin 11 Contact with fixing device 46, carry out the location of base plate 16.

During matched moulds, it is being formed in the die cavity within mould 50 placement base plate 16, is then being injected sealing resin by cast gate 53 Form sealant 12.The method carrying out sealing can use and uses the transmission mould molding of thermosetting resin or use thermosetting resin Injection mould moulds.And, the corresponding gas from sealing resin 12 mold cavity of cast gate 53 injection is discharged into by air vent 54 Outside.

Here, described upper mold 44 should contact with described radiator 15, described lower mold 45 should contact with base plate 16.

6th operation, with reference to Fig. 8:

This utility model the 6th operation is by the molding of described pin 11 and the operation of functions of modules test, intelligent power mould Block completes as goods through thus operation.

I.e. transmitting mould mold assembly step in front operation makes other parts in addition to pin 11 all be sealed by resin 12.This operation According to the length used and shape needs, such as, in the position of dotted line 51, external pin 11 is bent into definite shape, it is simple to after Continuous assembling.

Then module is put in test equipment, carry out the electric parameters testing of routine, because described pin 11 is separate, There may be part pin after molding not in same level, impact contact, so it is generally required to first carrying out test machine gold hands Refer to the engaged test with pin, if engaged test is not passed through, need described pin 11 is trimmed process, until contact is surveyed After pinging, then carry out electrical characteristics test, including the test events such as pressure, the quiescent dissipation of insulating, delay time, test passes Person is finished product.

Utilize above-mentioned operation, complete the SPM 10 shown in Fig. 2.

These are only preferred embodiment of the present utility model, not in order to limit this utility model, all in this practicality Any amendment, equivalent and the improvement etc. made within novel spirit and principle, should be included in guarantor of the present utility model Within the scope of protecting.

Claims (6)

1. a SPM, it is characterised in that including:

As the circuit-wiring layer of carrier, described circuit-wiring layer has upper surface and the lower surface relative with this upper surface；

Back-off is also welded in the component in upper surface precalculated position of described circuit-wiring layer；

The radiator of the power component being mounted in described component；And

Cover the upper surface of described circuit-wiring layer and described component, and make the sealing of described heat sink part surface exposure Layer.

2. SPM as claimed in claim 1, it is characterised in that also include that pin, described circuit-wiring layer include By antermarginal pin pad, described pin is connected with described pin pad and extends outside described wiring.

3. SPM as claimed in claim 2, it is characterised in that described pin surface is coated with coating.

4. SPM as claimed in claim 1, it is characterised in that described power component is Planar power device.

5. SPM as claimed in claim 1, it is characterised in that described radiator is fin.

6. SPM as claimed in claim 1, it is characterised in that described sealant is resin bed.