CN104767396B - SPM and its manufacture method - Google Patents
SPM and its manufacture method Download PDFInfo
- Publication number
- CN104767396B CN104767396B CN201510130308.2A CN201510130308A CN104767396B CN 104767396 B CN104767396 B CN 104767396B CN 201510130308 A CN201510130308 A CN 201510130308A CN 104767396 B CN104767396 B CN 104767396B
- Authority
- CN
- China
- Prior art keywords
- radiator
- wiring
- spm
- pin
- power component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 72
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 230000004888 barrier function Effects 0.000 claims abstract description 58
- 229920005989 resin Polymers 0.000 claims description 43
- 239000011347 resin Substances 0.000 claims description 43
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 36
- 238000007789 sealing Methods 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 23
- 229910052802 copper Inorganic materials 0.000 claims description 22
- 239000010949 copper Substances 0.000 claims description 22
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 20
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 19
- 229910052799 carbon Inorganic materials 0.000 claims description 19
- 239000002131 composite material Substances 0.000 claims description 18
- 239000011889 copper foil Substances 0.000 claims description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
- 238000004140 cleaning Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 239000011810 insulating material Substances 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 8
- 238000012360 testing method Methods 0.000 claims description 8
- 239000006071 cream Substances 0.000 claims description 7
- 238000004080 punching Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 238000007731 hot pressing Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 claims description 5
- 230000010354 integration Effects 0.000 claims description 4
- 230000002787 reinforcement Effects 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 6
- 230000008569 process Effects 0.000 description 50
- 238000010586 diagram Methods 0.000 description 17
- 229910000831 Steel Inorganic materials 0.000 description 15
- 239000010959 steel Substances 0.000 description 15
- 229910052782 aluminium Inorganic materials 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 238000013461 design Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000002585 base Substances 0.000 description 5
- 230000005611 electricity Effects 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 238000012797 qualification Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- -1 copper Chemical class 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004078 waterproofing Methods 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 210000003739 neck Anatomy 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 230000003319 supportive effect Effects 0.000 description 1
- 238000001149 thermolysis Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Abstract
The present invention discloses a kind of SPM and its manufacture method, the power component and non-power element that the SPM includes wiring, is arranged on wiring precalculated position, papery radiator as carrier, radiator front is arranged on surface of insulating layer covered with insulating barrier, wiring；The back side of radiator is at least provided with the gauffer for radiating in the position of the corresponding power component.The present invention improves the radiating effect, electrical property and heat endurance of SPM, reduces cost.
Description
Technical field
The present invention relates to SPM technical field, more particularly to a kind of specific application scenario such as convertible frequency air-conditioner,
By transmitting SPM and its manufacture method that modular form is packaged.
Background technology
SPM (IPM, Intelligent Power Module) is a kind of by power electronics and integrated circuit
The power drive class product that technology combines.SPM integrates device for power switching and high-voltage driving circuit,
And interior keep the failure detector circuits such as overvoltage, overcurrent and overheat.On the one hand SPM receives MCU control letter
Number, driving subsequent conditioning circuit work, on the other hand send the state detection signal of system back to MCU.SPM is with Qi Gaoji
The advantages such as Cheng Du, high reliability win increasing market, are particularly suitable for the frequency converter and various inversions electricity of motor
Source.
The structure of existing SPM such as Fig. 1 (A), Fig. 1 (B) and Fig. 1 (C) are shown.Fig. 1 (A) is existing intelligence
The top view of energy power model 100, Fig. 1 (B) are Fig. 1 (A) X-X ' line profiles, and Fig. 1 (C) is after Fig. 1 (A) removes resin
Schematic diagram.
As shown in Fig. 1 (A), Fig. 1 (B) and Fig. 1 (C), existing SPM 100 has following structure, and it includes：
Circuit substrate 106；Insulating barrier 107 on the surface of circuit substrate 106；The wiring 108 formed on insulating barrier 107；Cover
It is placed on the solder mask 110 of insulating barrier 107 and the ad-hoc location of wiring 108；It is fixed on by tin cream 112 on wiring 108
Power component 109 and non-power element 104；Connect the metal of non-power element 104, power component 109 and wiring 108
Line 105；The pin 101 being connected with wiring 108；At least one side of circuit substrate 106 is sealed by sealing resin 102, in order to
Sealing is improved, the entire surface of circuit substrate 106 can all be sealed.
Because SPM 100 is generally operational in hot environment, and power component 109 can be sent at work
Substantial amounts of heat, causes the junction temperature of power component 109 very high, although circuit substrate 106 has thermolysis, because insulating barrier
107 presence, cause the overall thermal resistance of SPM 100 higher.Also, due to the heat conduction of circuit substrate 106, make power
The heat transfer of element 109 is into other devices, the temperature drift that can not ignore the electrical parameter of other devices.
Therefore, existing SPM long-term work at high temperature, can seriously reduce its service life, and can shadow
The stability of performance is rung, in extreme circumstances, SPM can be caused to be lost in the course of the work because internal components overheat
Control blast, causes casualties and property loss.
The content of the invention
It is a primary object of the present invention to provide it is a kind of it is simple in construction, beneficial to radiating, the high SPM of reliability
And its manufacture method.
In order to achieve the above object, the present invention proposes a kind of SPM, including wiring, is arranged on the electricity
Road connects up the power component and non-power element in precalculated position, in addition to：As the papery radiator of carrier, the radiator
Simultaneously as front covered with insulating barrier, the wiring is arranged on the one side away from radiator on the insulating barrier；It is described
The another side of radiator is at least provided with the gauffer for radiating as the back side in the position of the corresponding power component.
Preferably, the gauffer covers the whole back side of the radiator.
Preferably, through hole is additionally provided with the radiator, the through hole runs through the radiator and insulating barrier；The circuit
Between the edge of the edge of wiring and the through hole, and, have between the edge of the edge of the insulating barrier and the through hole
Setpoint distance.
Preferably, the SPM also includes：For connecting the wiring, the power component and described non-
Power component is to form the metal wire of related circuit.
Preferably, the SPM also includes configuring being connected at the power model edge, with the wiring
And the pin to stretch out as input and output.
Preferably, the wiring, the power component and non-power element, metal wire, and the pin and electricity
The coupling part of road wiring is by resin-encapsulated；The resin fills the through hole.
Preferably, the wiring forms one or more weld pads at an at least edge for the insulating barrier；It is described more
Edge of the individual weld pad along the insulating barrier is aligned with；The pin is fixed by the weld pad, and is connected with the wiring
Connect.
Preferably, the back side of the radiator does not configure the position of the gauffer by resin-encapsulated.
Preferably, the radiator and gauffer are wet type carbon composite functional paper.
Preferably, the radiator is Nian Jie with the gauffer or is made into integration.
Preferably, the thickness of the radiator is 1.5mm~2.5mm；The thickness of the radiator is more than the gauffer
Thickness.
Preferably, the power component, the non-power element, the wiring, the circuit of metal wire composition,
With bridge heap, compressor inversion and Active PFC function, or with bridge heap, compressor inversion, Active PFC
And blower fan inversion function.
The embodiment of the present invention also proposes a kind of SPM manufacture method, comprises the following steps：
Papery radiator is formed, in the front covering insulating barrier of the radiator, wiring is formed in surface of insulating layer
And weld pad, cover gauffer at the back side of the radiator；
Surface-mounted power component, non-power element in the wiring, and in the surface-mounted of the weld pad
Ready-made pin；
Connection between the power component, non-power element and the wiring is formed by corresponding electricity by metal wire
Road；
The front of the radiator is sealed by sealing resin.
Preferably, it is described to be connected by metal wire between the power component, non-power element and the wiring
Also include before the step of forming corresponding circuit：
The radiator for being equipped with each element is placed in cleaning machine and cleaned.
Preferably, surface-mounted power component, the non-power element in wiring, and the table in the weld pad
Face also includes before assembling the step of ready-made pin：
The independent pin with coating is made；Specifically include：
Copper base material is chosen, to Copper base material by way of punching press or etching, pin in a row is made, passes through reinforcement between pin
Muscle connects；
Nickel dam and nickeltin layer are sequentially formed in the pin surface, obtains the pin with coating.
Preferably, also include after described the step of being sealed the front of the radiator by sealing resin：
The Trim Molding of the pin is carried out, and carries out functions of modules test.
Preferably, also include after described the step of being sealed the front of the radiator by sealing resin：
The back side of the radiator is not covered to the position seals of gauffer by sealing resin.
Preferably, the formation papery radiator, insulating barrier is covered in the front of the radiator, in surface of insulating layer shape
Into wiring and weld pad, include the step of the back side of the radiator covers gauffer：
The wet type carbon composite that preliminary dimension is chosen according to the circuit layout of setting forms papery radiator；
In the front of radiator, using insulating materials and copper material, by way of hot pressing, it is formed at insulating materials described
The surface of radiator is simultaneously used as the insulating barrier, copper material is formed at the surface of the insulating barrier as copper foil layer；
The ad-hoc location of the copper foil layer is eroded, remainder forms wiring and weld pad；
Gauffer is formed using wet type carbon composite, the back side of the radiator is adhered to by high temperature resistant glue.
Preferably, it is described to form gauffer using wet type carbon composite, the radiating is adhered to by high temperature resistant glue
Also include before the step of back side of device：
Specified location between the wiring forms through hole, and the through hole runs through the insulating barrier and the radiating
Device；The through hole is filled in resin-sealing step by the resin.
Preferably, surface-mounted power component, the non-power element in wiring, and the table in the weld pad
The step of face assembling ready-made pin, includes：
The power component, non-power element and pin are fixed by tin cream or elargol.
A kind of SPM proposed by the present invention and its manufacture method, introduced in SPM and be used as carrier
Papery radiator, and radiating gauffer is set at the back side of papery radiator, area of dissipation is significantly greatly increased, insulating barrier without using
Highly heat-conductive material can meet power component cooling requirements；And most of heat of power component is shed and non-conducting rapidly
To non-power element, non-power element is set to always work in low temperature environment, the temperature drift of non-power element greatly reduces, and improves
The electrical property and heat endurance of SPM；The present invention is using the lighter papery radiator of weight, load used during to processing
Tool requires low, and positioning is easy, reduces manufacturing cost, improves process qualification rate；Save and dissipate power component attachment to internal
The process of hot device, reduce equipment investment expense.
Brief description of the drawings
Fig. 1 (A) is the top view of existing SPM；
Fig. 1 (B) is Fig. 1 (A) X-X ' line profiles；
Fig. 1 (C) is that Fig. 1 (A) removes the schematic diagram after resin；
Fig. 2 (A) is the rear view of intelligent function module preferred embodiment of the present invention；
Fig. 2 (B) is the sectional view of Fig. 2 (A) X-X ' lines；
Fig. 2 (C) is that intelligent function module of the embodiment of the present invention removes the front plan view after sealing resin；
Fig. 3 (A) is the front view of papery radiator in the process of the embodiment of the present invention first；
Fig. 3 (B) is the sectional view of Fig. 3 (A) X-X ' lines；
Fig. 3 (C) is to form the schematic diagram of insulating barrier and copper foil layer in the front of papery radiator；
Fig. 3 (D) is the schematic diagram that wiring is formed on the copper foil layer shown in Fig. 3 (C)；
Fig. 3 (E) is the sectional view of Fig. 3 (D) X-X ' lines；
Fig. 3 (F) is the schematic diagram that through hole is formed on Fig. 3 (D) wiring；
Fig. 3 (G) is the schematic diagram to form radiating gauffer；
Fig. 3 (H) is the structural representation at the back side that gauffer is adhered to papery radiator；
Fig. 4 (A) is the schematic diagram that pin in a row is made in the process of the embodiment of the present invention second；
Fig. 4 (B) is the structural representation of single pin in Fig. 4 (A)；
Fig. 4 (C) is with cambered single pin schematic diagram；
Fig. 5 (A) is the intelligent work(of assembling power component, non-power element and pin in the process of the embodiment of the present invention the 3rd
The side view of rate module；
Fig. 5 (B) is Fig. 5 (A) top view；
Fig. 6 (A) is in the process of the embodiment of the present invention the 5th, makes power component, non-power element, radiator by metal wire
The side view of connection is formed between wiring；
Fig. 6 (B) is Fig. 6 (A) top view；
Fig. 7 is the profile for sealing papery radiator in the process of the embodiment of the present invention the 6th by sealing resin using mould；
Fig. 8 is the schematic diagram of pin Trim Molding in the process of the embodiment of the present invention the 7th；
Fig. 9 is manufacturing process's schematic diagram of the present embodiment SPM.
In order that technical scheme is clearer, clear, it is described in further detail below in conjunction with accompanying drawing.
Embodiment
It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not intended to limit the present invention.
As it was previously stated, existing SPM, because radiating effect is bad, long-term work at high temperature, can seriously drop
Its low service life, and the stability of intelligent object performance can be influenceed.
The present invention is it is considered that in the specific application scenario such as convertible frequency air-conditioner, although high heat conductive insulating layer and increase radiator
Can solve the heat dissipation problem of SPM, still, be radiated from high heat conductive insulating layer, one side cost is very high, separately
One side is substantial amounts of because high heat conductive insulating layer has used to mix and causes SPM hardness very big, so as to add intelligence
The manufacture difficulty of energy power model；If increasing radiator inside SPM, power component is mounted on radiator
On, it on the one hand can increase the cost of raw material, on the other hand also increase the technology difficulty of SPM；If in intelligent work(
Rate module-external increases radiator, and radiator is mounted on the back side of SPM, due to what is coordinated with SPM
There are other heater elements on application circuit, same radiator is installed if all heater elements, radiator face can be increased
Product, so as to improve application cost, installs radiator if all heater elements, then can increase assembly difficulty respectively.Therefore select
Difficulty is generated with the application of high heat conductive insulating layer and increase radiator to SPM, is unfavorable for intelligent power
Popularization of the module in the civilian occasion such as convertible frequency air-conditioner.
Based on above-mentioned consideration, the embodiment of the present invention sets at the back side of papery radiator and dissipated by introducing papery radiator
Hot gauffer, the elements such as insulating barrier, wiring, power component, non-power element are formed in the front of papery radiator, and completed
Processing in order, because papery heatsink weight is lighter, carrier used requires low during to processing, and positioning is easy, so as to reduce
Manufacturing cost, improve process qualification rate；Save power component attachment to the process of Inner heat sink, reduce equipment investment expense
With；Further, since setting radiating gauffer at the back side of papery radiator, area of dissipation is significantly greatly increased, and is using common insulating barrier
On the premise of, SPM and its heat generating components of application platform is obtained good radiating effect, and each pyrotoxin
Between heat interference it is seldom so that SPM stable performance, and then improve the reliability of SPM；Except this it
Outside, papery radiator is also convenient for transporting.
Specifically, reference picture 2 (A), Fig. 2 (B) and Fig. 2 (C), Fig. 2 (A) are intelligent function module preferred embodiments of the present invention
Rear view；Fig. 2 (B) is the sectional view of Fig. 2 (A) X-X ' lines；Fig. 2 (C) is that intelligent function module of the embodiment of the present invention is gone
Fall the front plan view after sealing resin.
As shown in Fig. 2 (A), Fig. 2 (B) and Fig. 2 (C), a kind of SPM 10 of proposition of the embodiment of the present invention, this reality
Apply example by with bridge heap, compressor inversion, Active PFC, blower fan inversion function SPM 10 exemplified by said
It is bright, the application scenario for not needing blower fan inversion function, blower fan Converting Unit is removed, other parts are identical.
The present embodiment SPM 10 includes as the papery radiator 17 of carrier, wiring 18, is arranged on institute
State the power component 19 and non-power element 14 in the precalculated position of wiring 18；Wherein：
The one side of the radiator 17 is as front, and another side is as the back side.
It is arranged on remote on the insulating barrier 21 covered with insulating barrier 21, the wiring 18 in the front of radiator 17
The one side of radiator 17.
At the back side of the radiator 17, the position of the corresponding power component 19 is at least provided with the wrinkle for radiating
Pleat 17A, that is to say, that must have gauffer 17A in the lower section of power component 19, be made with the radiating reached to power component 19
With.
Certainly, as a kind of embodiment, for the manufacturing process of simplified intelligent power model 10, can be radiated in papery
The back side of device 17 all covers gauffer 17A；And in order to save gauffer 17A dosage, can also be only in the particular portion of radiator 17
Set up separately and put gauffer 17A.
Wherein, the radiator 17 and gauffer 17A can use wet type carbon composite functional paper.
The radiator 17 can be bonded by high temperature glue with the gauffer 17A, or can also both be made into integration.
In addition, for the ease of radiating, through hole 22 is additionally provided with radiator 17, the through hole 22 runs through the radiator 17
With insulating barrier 21.
The through hole 22 is arranged on the ad-hoc location of radiator 17, specifically, makes through hole 22 positioned at the device for forming pyrotoxin
And circuit and not forming between the device of pyrotoxin and circuit so that heat interference is seldom between 19 each pyrotoxin of power component, and
Most of heat of power component 19 is shed without being transmitted to non-power element 14 rapidly so that the performance of SPM 10
It is stable, improve the reliability of SPM 10.
In order to prevent the mismachining tolerance of through hole 22, make between the edge of wiring 18 and the edge of the through hole 22, and,
There is setpoint distance (subsequent detailed) between the edge of the insulating barrier 21 and the edge of the through hole 22.
In addition, the SPM 10 also includes：For connecting the wiring 18, the and of the power component 19
The non-power element 14 is to form the metal wire 15 of related circuit.
Here, the power component 19, the non-power element 14, the wiring 18, the metal wire 15 form
Circuit, there is bridge heap, compressor inversion and Active PFC function, or with bridge heap, compressor inversion, power factor (PF)
Correction and blower fan inversion function, make all heating circuits of the application fields such as convertible frequency air-conditioner concentrate in together while radiate；This reality
Apply example by with bridge heap, compressor inversion, Active PFC, blower fan inversion function SPM 10 exemplified by said
It is bright, the application scenario for not needing blower fan inversion function, blower fan Converting Unit is removed, other parts are identical.
As shown in Fig. 2 (A) and Fig. 2 (C), circuit unit 1001 realizes that bridge heap function, circuit unit 1002 realize compressor
Inversion function, circuit unit 1003 realize that blower fan inversion function is realized in Active PFC, circuit unit 1004.
Here, the bridge heap, the drive part of the compressor inversion, the drive part of the Active PFC, institute
The drive part of blower fan inversion is stated between other control sections by the through hole 22 to be isolated.
In addition, the SPM 10 also includes：Configuration is in the power model edge and the wiring 18
The pin 11 for connecting and stretching out as input and output.
Here, it can be configured according to the internal circuit of SPM 10 layout and peripheral applications needs, the pin 11
In an edge of SPM 10, two edges, three edges or four edges.
In the present embodiment, the wiring 18, the power component 19 and non-power element 14, metal wire 15, with
And the coupling part of the pin 11 and wiring 18 is encapsulated by sealing resin 12；The resin 12 fills out the through hole 22
Fill.
As a kind of embodiment, the position of the gauffer 17A is not configured at the back side of the radiator 17 by resin yet
12 encapsulation, that is, the gauffer 17A of the back side of radiator 17 configuration is caused to expose from resin 12.
In addition, the wiring 18 can form one or more weld pad 18A at an at least edge for insulating barrier 21；If
For multiple weld pad 18A, then edges of the multiple weld pad 18A along the insulating barrier 21 is aligned with；The pin 11 passes through institute
State weld pad 18A to fix, and be connected with the wiring 18.
10 each inscape of SPM of the embodiment of the present invention detailed below：
Wherein, papery radiator 17 is wet type carbon composite functional paper, can be answered by powder and the Fiber Shape Carbon Material
Graphite is processed into conjunction, and tolerable more than the 350 DEG C high temperature of the wet type carbon composite can be simultaneously folded into any as needed
Shape, obtain the radiating gauffer 17A.In order to improve corrosion resistance and waterproof, surface can carry out water-proofing treatment.
The papery radiator 17 can be made into integration with the radiating gauffer 17A, can also be with the radiating gauffer 17A
It is bonded by high temperature glue.
Wherein, the two sides of papery radiator 17 is smooth, and the in irregular shape of gauffer 17A of radiating；The papery radiator
17 and radiating gauffer 17A can also be the wet type carbon composite using different-thickness, wherein, in order to increase mechanical strength,
Papery radiator 17 uses thicker wet type carbon composite, and its thickness is preferably 1.5mm~2.5mm, thin in actual design
Place's thickness may be designed as 1.5mm, and thickness can be 2.5mm at thickness, in order to reduce cost and increase gauffer 17A density, radiating
Gauffer 17A employs relatively thin wet type carbon composite, and as a kind of preferred scheme, thickness may be designed as 0.5mm.
The insulating barrier 21 can use conventional insulating materials, can add silica, silicon nitride, carborundum etc. and mix
It is miscellaneous to improve thermal conductivity, here, doping can be spherical or angular, by hot pressing mode, be pressed together on the table of papery radiator 17
Face, i.e., it is positive.
The wiring 18 is made up of metals such as copper, the ad-hoc location being formed on insulating barrier 21, according to power needs,
The thickness of wiring 18 may be designed to 0.035mm or 0.07mm etc., in general SPM 10, pay the utmost attention to set
0.07mm is counted into, 0.07mm thickness is used in the present embodiment.In addition, at the edge of the insulating barrier 21, formed with by described
The weld pad 18A that wiring 18 is formed.Here, multiple weld pads being aligned with are set near one side of the insulating barrier 21
18A, according to function needs, also multiple weld pad 18A being aligned with can be set in multiple adjacent edges of the insulating barrier 21.
The through hole 22 has 1mm between the wiring 18, and with the insulating barrier 21 and wiring 18
Distance above, the through hole 22 runs through the insulating barrier 21 and the papery radiator 17, in the SPM 10
After being encapsulated by sealing resin 12, the through hole 22 is filled up completely with by sealing resin 12；The through hole 22 is positioned at composition pyrotoxin
Device and circuit, with not forming between the device of pyrotoxin and circuit, because the thermal conductivity of sealing resin 12 dissipates far below papery
The thermal conductivity of hot device 17, thus can be formed being thermally isolated each pyrotoxin, the transverse direction between pyrotoxin and non-pyrotoxin is thermally isolated,
Also, thus the bottom of pyrotoxin substantially increases longitudinal heat conduction efficiency of each pyrotoxin, through hole because having gauffer 17A
22 cause SPM 10 reaches to be thermally isolated.
In addition, effect is thermally isolated in order to increase, as the first design method, the length of each through hole 22, can design
To grow as far as possible；As second of design method, in order to improve the hardness of papery radiator 17, the length of through hole 22 can be designed as
5mm~6mm, for second of design method, the distance between each through hole 22 may be designed as 0.5~1mm, is thermally isolated to improve
Effect, the transverse width of each through hole 22, may be designed as 3mm~3.5mm, in order to reduce the volume of SPM 10, often
The transverse width of individual through hole 22 may be designed as 1mm~2.5mm.
The power component 19 and non-power element 14 are fixed on wiring 18 circuit as defined in composition.Here,
The power component 19 can use the elements such as IGBT pipes, high-voltage MOSFET pipe, high pressure FRD pipes, high-voltage diode, the power
Element 19 is connected by metal wire 15 with the grade of wiring 18；The non-power element 14 is using integrated circuit, transistor or two
The passive element such as the active components such as pole pipe or electric capacity or resistance, the active component installed up etc. by metal wire 15 with
Wiring 18 connects.
The metal wire 15 can be aluminum steel, gold thread or copper cash, be made by binding between each power component 19, each non-power
Electrical connection is established between element 14, between each wiring 18；In addition, metal wire 15 can be also used for making pin 11 and electricity
Electrical connection is established between road wiring 18 or power component 19, non-power element 14.Connection for power component 19, it can adopt
With 300 μm~400 μm of aluminum steel, the electrical connection for non-power element 14,38 μm~125 μm of aluminum steel can be used, if deposited
In the connection across through hole 22, it is preferred to use more than 250 μm of aluminum steel.
The pin 11 is fixed on the weld pad 18A at 18 1 edges of wiring, and it has is carried out with outside
Input, the effect of output.
As a kind of embodiment, it can be designed to that one side of SPM 10 sets a plurality of pin 11, pin 11
Welded with weld pad 18A by the conductive electrical binding agent such as scolding tin.Pin 11 can use the metals such as copper to be made, and copper surface passes through
Chemical plating and plating form one layer of nickeltin layer, and the thickness of alloy-layer is generally 5 μm, and coating can protect copper not to be corroded oxygen
Change, and weldability can be improved.
The sealing resin 12 can be moulded by transmitting mould mode using thermosetting resin 12, it is possible to use injection mould mode
Moulded using thermoplastic resin 12.Here, all elements on the surface of papery radiator 17 are fully sealed in the resin 12, i.e., only
One side of the sealing with element, another side are completely exposed.Through hole 22 on papery radiator 17 is then filled up completely with by resin 12.
Compared with prior art, the SPM 10 of the embodiment of the present invention has the advantages that：
1st, because the back side of SPM 10 of the present invention has radiating gauffer 17A, area of dissipation is significantly greatly increased, and insulate
Layer 21 can meet the cooling requirements of power component 19 without using highly heat-conductive material.
2nd, SPM 10 is provided with bridge heap, compressor inversion function, or with bridge heap, compressor inversion, wind
Machine inversion function, all heating circuits of the application fields such as convertible frequency air-conditioner are made to concentrate in together while radiate.
If the 3, radiating gauffer 17A is located at the lower section of power component 19, most of heat of heater element is set to be shed rapidly
Without being transmitted to non-power element 14, non-power element 14 is set to always work in low temperature environment, the temperature drift of non-power element 14
Greatly reduce, the electrical property and heat endurance of SPM 10 are improved, because the back side of the papery radiator 17 is removed
Configuration gauffer 17A part is also sealed, and the watertightness and air-tightness of SPM 10 of the invention are improved, carry
Long-term reliability in high complicated applications environment.
It is simple installation, simple in construction if the gauffer 17A of the 4, radiating integrally covers the whole back side of SPM 10, and
Area of dissipation can be rolled up, the heat of heater element is quickly scattered and disappeared, and due to the back side of SPM 10
It is completely exposed, improves the thermal diffusivity of SPM 10.
5th, Qiao Dui, the drive part of compressor inversion, the drive part of Active PFC, the drive part of blower fan inversion
Isolated between other control sections (including non-power element 14 etc.) by through hole 22, not only make the heat interference of each heating part very
Low, most heats are scattered and disappeared by gauffer 17A, and the temperature of control section is maintained at a low state, are avoided
Because the hydraulic performance decline of SPM 10 caused by the temperature drift of control section.
6th, radiator structure is paper material, in light weight so that the overall weight of SPM 10 reduces, and is easy to long-distance fortune
Defeated and worker assembling；Because SPM 10 of the present invention possesses radiator 17 in itself, therefore need not in application process, outside
Radiator 17 is connect again, and difficulty and application cost are applied in reduction, improve assembling quality.
From the foregoing, the SPM 10 of the present invention is reducing cost simultaneously, reliability and performance are improved, and
And may be designed to define with the existing function of SPM 10 and pin 11 compatible, it is easy to the popularization of SPM 10 should
With.
In addition, one embodiment of the invention also proposes a kind of manufacture method of SPM 10, including：
Step S1, papery radiator 17 is formed, insulating barrier 21 is covered in the front of the radiator 17, in the table of insulating barrier 21
Face forms wiring 18 and weld pad 18A, in the back side of the radiator 17 covering gauffer 17A；
Specifically, the wet type carbon composite for preliminary dimension being chosen according to the circuit layout of setting forms papery radiator
17。
In the front of radiator 17, using insulating materials and copper material, by way of hot pressing, insulating materials is set to be formed at institute
State the surface of radiator 17 and be used as the insulating barrier 21, copper material is formed at the surface of the insulating barrier 21 as copper foil layer.
Afterwards, the ad-hoc location of copper foil layer is eroded, remainder forms wiring 18 and weld pad 18A.
Specified location between the wiring 18 forms through hole 22, the through hole 22 through the insulating barrier 21 and
The radiator 17；The through hole 22 is filled in resin 12 seals step by the resin 12.
Gauffer 17A is formed using wet type carbon composite, the back of the body of the radiator 17 is adhered to by high temperature resistant glue
Face.
Step S2, surface-mounted power component 19, non-power element 14 in the wiring 18, and in the weldering
Pad 18A surface-mounted ready-made pin 11；
Step S3, by metal wire 15 by between the power component 19, non-power element 14 and the wiring 18
Connection forms corresponding circuit；
Step S4, the front of the radiator 17 is sealed by sealing resin 12.
Further, can also include before step S3：
Step S5, the radiator 17 for being equipped with each element is placed in cleaning machine and cleaned.
Further, can also include before step S2：
Step S6, the independent pin 11 with coating is made.
Specifically, first, Copper base material is chosen, to Copper base material by way of punching press or etching, pin 11 in a row is made, draws
Connected between pin 11 by reinforcement.
Then, nickel dam and nickeltin layer are sequentially formed on the surface of pin 11, obtains the pin 11 with coating.
Further, also include after above-mentioned steps S4：
Step S7, carries out the Trim Molding of the pin 11, and carries out functions of modules test.
The manufacturing process of the present embodiment SPM 10 is described in detail referring to the drawings：
As a kind of preferred embodiment, the manufacture method of SPM 10 of the present invention can include：Papery is formed to dissipate
The process of hot device 10 and the gauffer 17 that radiates, press and wiring 18, weld pad 18A, the work for forming through hole 22 are formed on insulating barrier 21
Sequence；The process that power component 19, non-power element 14 and pin 11 are configured on wiring 18；The process of cleaning；Use metal
The process that line 15 connects the non-power element 14, power component 19 and the wiring 16；The process toasted and moulded；It is right
The process that pin 11 is molded；The process for carrying out functional test.Specific process chart is as shown in Figure 9.
Illustrate the details of each operation below.
First process：Reference picture 3 (A), Fig. 3 (B), Fig. 3 (C), Fig. 3 (D), Fig. 3 (E), Fig. 3 (F), Fig. 3 (G) and Fig. 3
(H)。
Fig. 3 (A) is the front view of papery radiator in intelligent function module of the embodiment of the present invention；
Fig. 3 (B) is the sectional view of Fig. 3 (A) X-X ' lines；
Fig. 3 (C) is to form the schematic diagram of insulating barrier and copper foil layer in the front of papery radiator；
Fig. 3 (D) is the schematic diagram that wiring is formed on the copper foil layer shown in Fig. 3 (C)；
Fig. 3 (E) is the sectional view of Fig. 3 (D) X-X ' lines；
Fig. 3 (F) is the schematic diagram that through hole is formed on Fig. 3 (D) wiring；
Fig. 3 (G) is the schematic diagram to form radiating gauffer；
Fig. 3 (H) is the structural representation at the back side that gauffer is adhered to papery radiator.
The process of the embodiment of the present invention first is to form sizeable wet type carbon composite, is answered based on the wet type carbon
Condensation material forms papery radiator 17, the process that through hole 22 and the gauffer 17A that radiates are formed on papery radiator 17.
First, the sectional view 3 (B) of reference picture 3 (A) and the X-X ' lines along Fig. 3 (A), circuit layout design as needed
Sizeable papery radiator 17, in general SPM, the size of one piece of SPM can be chosen
64mm × 30mm, thickness are 1.5mm wet type carbon composite, then the high temperature resistant by tolerable temperature more than 300 DEG C
Glue, the same material rectangular that assembling thickness is 0.5mm at the back side of above-mentioned 64mm × 30mm rectangles papery radiator, as radiating
Gauffer.
With reference to figure 3 (C), using insulating materials and copper material with angular or spherical doping, by way of hot pressing simultaneously,
Make insulating materials be formed at the surface (front) of the papery radiator 17 as the insulating barrier 21, copper material be formed at it is described absolutely
The surface of edge layer 21 is as copper foil layer 18B.
Here, in order to improve voltage endurance, the thickness of the insulating barrier 21 can be designed as 110 μm, in order to improve radiating
Characteristic, the thickness of the insulating barrier 21 can be designed as 70 μm.Here, in order to improve through-current capability, the thickness of the copper foil layer 18B
Degree can be designed to 0.07mm, in order to reduce cost, the thickness of the copper foil layer 18B can be designed to 0.035mm or
0.0175mm。
The sectional view 3 (E) of X-X ' lines with reference to figure 3 (D) and along Fig. 3 (D), copper foil layer 18B ad-hoc location is eroded,
Remainder is wiring 18 and weld pad 18A.
With reference to figure 3F), by punching press, shearing, turn mode, the ad-hoc location between the wiring 18 such as to wear and formed
Through hole 22, the through hole 22 run through the insulating barrier 21 and the papery radiator 17, after forming through hole 22, it is contemplated that use wind
Rifle cleans to remained on surface, can also be cleaned using supersonic cleaning machine.
With reference to figure 3 (G), irregular shape is formed using the wet type carbon composite that thickness is 0.5mm, is dissipated as described
Hot gauffer 17A.The corrosion protection such as coating marine glue, water-proofing treatment are carried out to two sides.
With reference to figure 3 (H), using high temperature resistant glue of the tolerable temperature more than 300 DEG C, by the radiating gauffer 17A adhesions
At the back side of the papery radiator 17.
Second process：Reference picture 4 (A), Fig. 4 (B) and Fig. 4 (C), Fig. 4 (A) are in intelligent function module of the embodiment of the present invention
Make the schematic diagram of pin in a row；Fig. 4 (B) is the structural representation of single pin in Fig. 4 (A)；Fig. 4 (C) is with cambered
Single pin schematic diagram.
The process that the second process of the present invention is formed into the independent pin 11 with coating.
Each pin 11 is to use Copper base material, and by way of punching press or etching, the row as shown in Fig. 4 (A) is made
Pin 11, in the present embodiment, pin 11 are connected by 12 single pin units by reinforcement 11A；As shown in Fig. 4 (B),
Single pin units are that length C is 25mm, and width K is 1.5mm, and thickness H is 1mm strip；Sometimes, for ease of assembling,
Certain radian can also be suppressed in pin units wherein one end, as shown in Fig. 4 (C).
Then, nickel dam is formed in pin surface by the method for chemical plating, specifically included：
By nickel salt and sodium hypophosphite mixed solution, and appropriate complexing agent is with the addition of, forming given shape
Copper material surface forms nickel dam, and metallic nickel has very strong passivation ability, can be quickly generated one layer of very thin passivating film, can resist big
Gas, alkali and some sour corrosion.Nickel plating crystallization is superfine small, and nickel layer thickness is generally 0.1 μm.
Then by hydrosulphate technique, at room temperature by the copper material for having formed shape and nickel dam be immersed in positive tin from
It is powered in the plating solution of son, forms nickeltin layer on nickel dam surface, alloy-layer general control is at 5 μm, the formation of alloy-layer
Greatly improve the protectiveness and solderability of pin.
3rd process：With reference to figure 5 (A) and Fig. 5 (B), Fig. 5 (A) is that power component, non-power are assembled in the embodiment of the present invention
The side view of the SPM of element and pin；Fig. 5 (B) is Fig. 5 (A) top view.
The present invention the 3rd process be the surface-mounted power component 19 of the wiring 18, non-power element 14 and
The process of the surface-mounted pins 11 of weld pad 18A.
First, by stencil printer, using steel mesh, to the certain bits of the wiring 18 on the insulating barrier 21
Put and carry out tin cream application with the weld pad 18A；Here, climbing tin height to improve, the steel mesh of 0.15mm thickness can be used, in order to
The risk that power device 19 and non-power element 14 shift is reduced, the steel mesh of 0.12mm thickness can be used.In the present embodiment, use
The height of power component 19 be 0.07mm, for lighter component, so steel mesh thickness can select 0.12mm thickness
Steel mesh, other suitable dimensions can also be used in other embodiments, are not limited thereto.
Then, with reference to side view Fig. 5 (A) and top view Fig. 5 (B), power component 19, non-power element 14 and pin are carried out
11 installation, power component 19 and non-power element 14 can be directly placed at the ad-hoc location of the wiring 18, and pin
11 one end are placed on the weld pad 18A, and the other end needs carrier 20 to be fixed, and the carrier 20 passes through the materials such as compound stone
Material is made.
Here, carrier 20 needs to carry out bottom hollow processing, expose the radiating gauffer 17A, the papery radiator
Not contacted by the position of the radiating gauffer 17A coverings with the carrier 20 for 17 dorsal edges at least 1mm plays a supportive role.
Then, the insulating barrier 21 being put on the carrier 20 passes through Reflow Soldering, tin cream solidification, the non-power element
14 and the pin 11 fixed.
In said process, as a kind of preferred embodiment, the tin cream that solution temperature is 280 DEG C can be selected.
It should be noted that in other embodiments, it is also an option that elargol or silver paste replace above-mentioned tin cream.
4th process：
The 4th process of the present invention is the process for cleaning papery radiator 17.
The papery radiator 17 is put into cleaning machine first and cleaned, rosin remained during by Reflow Soldering etc. helps weldering
The foreign matters such as the aluminum steel remained when agent and punching press are cleaned, close in the arrangement of the wiring 18 according to the non-power element 14
Degree, the form that cleaning can be combined by spray or ultrasound or both are carried out.
During cleaning, the pin 11 is clamped by mechanical arm, the papery radiator 17 is placed in rinse bath, and to be noted
Meaning not allow mechanical arm to touch the papery radiator 17, because the papery radiator 17 enbrittles and easy deformation, such as
Fruit mechanical arm clamps the papery radiator 17, in vibrations caused by cleaning, easily causes the papery radiator 17 and occurs
Burst apart.
5th process：Reference picture 6 (A) and Fig. 6 (B), Fig. 6 (A) are in the process of the embodiment of the present invention the 5th, pass through metal wire
Make the side view that connection is formed between power component, non-power element, radiator and wiring；Fig. 6 (B) is Fig. 6 (A) vertical view
Figure.
The 5th process of the present invention is by metal wire (can also turn into binding line), makes the power component 19, NOT function
The process that connection is formed between rate element 14, radiator 13 and the wiring 18.
According to through-current capability needs, the aluminum steel of appropriate diameter is selected as metal wire, it is integrated for being controlled for signal
Circuit, it is also contemplated that be used as metal wire using gold thread.In the present embodiment, aluminum steel is all selected, in general, to the power
The bonding of element 19 uses 350 μm~400 μm of aluminum steel, and 38 μm~200 μm are used to the bonding of the non-power element 14
Aluminum steel, 350 μm~400 μm of aluminum steel is used to the bonding of the radiator 13.
Product after the completion of this process is referred to side view Fig. 6 (A) and top view Fig. 6 (B).
Wherein make to connect between power component 19, non-power element 14, radiator 13 and wiring 18 by metal wire, shape
Into corresponding circuit.
As shown in Fig. 6 (B), the circuit unit 1001 realizes that the bridge heap function, the circuit unit 1002 realize institute
State compressor inversion function, the circuit unit 1003 realizes the Active PFC function, the circuit unit 1004 is real
The existing blower fan inversion function.
6th process：Reference picture 7
The 6th process of the present invention is the process that the papery radiator 17 is sealed by sealing resin 12.Fig. 7 represents to use
Mould 50 is sealed the profile of the process of the papery radiator 17 by sealing resin 12.
Specifically, first, the papery radiator 17 is toasted in oxygen-free environment, baking time is no less than 2
Hour, 125 DEG C of baking temperature and selection.
Afterwards, the papery radiator 17 for having configured pin 11 is transported between the upper mould 44 and lower mould 45 of mould.Pass through
The specific part of pin 11 is contacted with fixing device 46, carry out the positioning of papery radiator 17, papery radiator 17 is not covered
Lid gauffer 17A marginal portion is equal with the top of lower mould 45.
During matched moulds, the papery radiator 17 is placed in the die cavity for be formed at mould inside, is then injected by cast gate 53
Sealing resin 12.The method sealed can use transmits mould molding or the note using thermosetting resin using thermosetting resin
Enter mould molding.Moreover, from after cast gate 53 injects sealing resin 12, the gas of mold cavity is externally discharged by exhaust outlet 54.
Here, the through hole 22 is filled up completely with by the resin 12.
Here, the back side of the papery radiator 17 is close on lower mould 45, in order to strengthen being bonded, can also increase in upper mould
Thimble, but still have a small amount of sealing resin 12 and enter between the back side of papery radiator 17 and lower mould 45, therefore, it is being stripped
Afterwards, it is necessary to carry out laser-induced thermal etching or grinding, a small amount of sealing resin 12 for remaining in the back side of papery radiator 17 is removed,
The back side of the papery radiator 17 is set to expose from the sealing resin 12, and the back side above section of the papery radiator 17
Sealed by sealing resin 12.
7th process：Reference picture 8, Fig. 8 are the schematic diagrames of pin Trim Molding in the process of the embodiment of the present invention the 7th.
7th process of the invention is the process for carrying out the Trim Molding of pin 11 and carrying out functions of modules test, intelligent work(
Rate module is completed through thus process as product.
In preceding process transmits mould mold assembly step, the other parts in addition to pin 11 are made all to be sealed by resin 12.This
The length and shape needs that process uses according to pin, for example, can the position of dotted line 51 in fig. 8 external pin 11 is cut
It is disconnected, definite shape can be also bent into sometimes, be easy to subsequently assemble.
Then SPM 10 is put into test equipment, carries out conventional electric parameters testing, generally comprise insulation
The test events such as pressure-resistant, quiescent dissipation, delay time, test passes person are finished product.
Using above-mentioned operation, that is, complete the SPM 10 shown in Fig. 2 (A), Fig. 2 (B) and Fig. 2 (C).
SPM of the embodiment of the present invention and its manufacture method, the paper as carrier is introduced in SPM
Matter radiator, and radiating gauffer is set at the back side of papery radiator, area of dissipation is significantly greatly increased, and insulating barrier is led without using height
Hot material can meet power component cooling requirements；And most of heat of power component by it is rapid shed it is non-without being transmitted to
Power component, non-power element is set to always work in low temperature environment, the temperature drift of non-power element greatly reduces, and improves intelligence
The electrical property and heat endurance of power model；The present invention is using the lighter papery radiator of weight, and carrier used will during to processing
Ask low, positioning is easy, reduces manufacturing cost, improves process qualification rate；Save and Inner heat sink is arrived into power component attachment
Process, reduce equipment investment expense.
The preferred embodiments of the present invention are above are only, are not intended to limit the scope of the invention, it is every to utilize this hair
Equivalent structure or the flow conversion that bright specification and accompanying drawing content are made, or directly or indirectly it is used in other related technology necks
Domain, it is included within the scope of the present invention.
Claims (17)
1. a kind of SPM, including wiring, it is arranged on the power component in the wiring precalculated position and non-
Power component, it is characterised in that also include：As the papery radiator of carrier, the one side of the radiator covers as front
There is insulating barrier, the wiring is arranged on the one side away from radiator on the insulating barrier；The another side of the radiator is made
For the back side, the position of the corresponding power component is at least provided with the gauffer for radiating, the back side of the radiator is not matched somebody with somebody
The position of the gauffer is put by resin-encapsulated；Position between the power component, non-power element and the wiring
Through hole is installed, the through hole runs through the radiator and insulating barrier；The through hole is filled by resin.
2. SPM according to claim 1, it is characterised in that the gauffer covers the whole of the radiator
The back side.
3. SPM according to claim 1 or 2, it is characterised in that the edge of the wiring with it is described
Between the edge of through hole, and, there is setpoint distance between the edge of the edge of the insulating barrier and the through hole.
4. SPM according to claim 3, it is characterised in that also include：For connect the wiring,
The power component and the non-power element are to form the metal wire of related circuit.
5. SPM according to claim 4, it is characterised in that also include configuration on the power model side
Edge, the pin for being connected and being stretched out as input and output with the wiring.
6. SPM according to claim 5, it is characterised in that the wiring, the power component and
Non-power element, metal wire, and the coupling part of the pin and wiring is by resin-encapsulated.
7. SPM according to claim 5, it is characterised in that the wiring in the insulating barrier extremely
A few edge forms one or more weld pads；Edge of the multiple weld pad along the insulating barrier is aligned with；The pin leads to
Cross the weld pad to fix, and be connected with the wiring.
8. SPM according to claim 1 or 2, it is characterised in that the radiator and gauffer are wet type
Carbon composite functional paper.
9. SPM according to claim 8, it is characterised in that the radiator it is Nian Jie with the gauffer or
It is made into integration.
10. SPM according to claim 8, it is characterised in that the thickness of the radiator be 1.5mm~
2.5mm；The thickness of the radiator is more than the thickness of the gauffer.
11. SPM according to claim 4, it is characterised in that the power component, non-power member
Part, the wiring, the circuit of metal wire composition, have bridge heap, compressor inversion and Active PFC function,
Or there is bridge heap, compressor inversion, Active PFC and blower fan inversion function.
12. a kind of SPM manufacture method, it is characterised in that comprise the following steps：
Papery radiator is formed, in the front covering insulating barrier of the radiator, wiring and weldering are formed in surface of insulating layer
Pad, gauffer is covered at the back side of the radiator；
Surface-mounted power component, non-power element in the wiring, and in the surface-mounted advance of the weld pad
Manufactured pin；
Connection between the power component, non-power element and the wiring is formed by corresponding circuit by metal wire；
Position between the power component, non-power element and the wiring forms through hole, and the through hole runs through
The insulating barrier and the radiator；
The front of the radiator is sealed by sealing resin, the through hole is filled by the resin, will by sealing resin
The back side of the radiator does not cover the position seals of gauffer.
13. according to the method for claim 12, it is characterised in that it is described by metal wire by the power component, NOT function
Also include before the step of connection forms corresponding circuit between rate element and the wiring：
The radiator for being equipped with each element is placed in cleaning machine and cleaned.
14. according to the method for claim 12, it is characterised in that surface-mounted power component in the wiring,
Non-power element, and also include before the step of surface-mounted ready-made pin of the weld pad：
The independent pin with coating is made；Specifically include：
Copper base material is chosen, to Copper base material by way of punching press or etching, pin in a row is made, is connected between pin by reinforcement
Connect；
Nickel dam and nickeltin layer are sequentially formed in the pin surface, obtains the pin with coating.
15. according to the method for claim 14, it is characterised in that it is described by sealing resin by the front of the radiator
Also include after the step of sealing：
The Trim Molding of the pin is carried out, and carries out functions of modules test.
16. according to the method any one of claim 12-15, it is characterised in that the formation papery radiator, in institute
The front covering insulating barrier of radiator is stated, wiring and weld pad is formed in surface of insulating layer, is covered at the back side of the radiator
The step of lid gauffer, includes：
The wet type carbon composite that preliminary dimension is chosen according to the circuit layout of setting forms papery radiator；
In the front of radiator, using insulating materials and copper material, by way of hot pressing, insulating materials is set to be formed at the radiating
The surface of device is simultaneously used as the insulating barrier, copper material is formed at the surface of the insulating barrier as copper foil layer；
The ad-hoc location of the copper foil layer is eroded, remainder forms wiring and weld pad；
Gauffer is formed using wet type carbon composite, the back side of the radiator is adhered to by high temperature resistant glue.
17. according to the method for claim 16, it is characterised in that the surface-mounted power component in wiring,
Non-power element, and include in the step of surface-mounted ready-made pin of the weld pad：
The power component, non-power element and pin are fixed by tin cream or elargol.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510130308.2A CN104767396B (en) | 2015-03-23 | 2015-03-23 | SPM and its manufacture method |
| PCT/CN2016/077143 WO2016150391A1 (en) | 2015-03-23 | 2016-03-23 | Smart power module and manufacturing method therefor |
| US15/559,834 US10615155B2 (en) | 2015-03-23 | 2016-03-23 | Intelligent power module and manufacturing method thereof |
| JP2018500841A JP6500162B2 (en) | 2015-03-23 | 2016-03-23 | Intelligent power module and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510130308.2A CN104767396B (en) | 2015-03-23 | 2015-03-23 | SPM and its manufacture method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104767396A CN104767396A (en) | 2015-07-08 |
| CN104767396B true CN104767396B (en) | 2017-11-14 |
Family
ID=53649065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510130308.2A Expired - Fee Related CN104767396B (en) | 2015-03-23 | 2015-03-23 | SPM and its manufacture method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104767396B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10615155B2 (en) | 2015-03-23 | 2020-04-07 | Gd Midea Airconditioning Equipment Co., Ltd. | Intelligent power module and manufacturing method thereof |
| CN109194243A (en) * | 2018-10-31 | 2019-01-11 | 广东美的制冷设备有限公司 | Electric appliance and intelligent power module |
| CN111834350B (en) * | 2019-04-18 | 2023-04-25 | 无锡华润安盛科技有限公司 | IPM packaging method and bonding method in IPM packaging |
| CN114975405A (en) * | 2022-05-27 | 2022-08-30 | 盛合晶微半导体(江阴)有限公司 | Wafer packaging system and preparation method thereof |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101443904B (en) * | 2006-03-13 | 2010-11-10 | 株式会社丰田自动织机 | Base for power module |
| WO2011025020A1 (en) * | 2009-08-31 | 2011-03-03 | 阿波製紙株式会社 | Paper sheet radiator |
| CN102339818B (en) * | 2010-07-15 | 2014-04-30 | 台达电子工业股份有限公司 | Power module and manufacture method thereof |
| CN203232866U (en) * | 2012-12-26 | 2013-10-09 | 广东美的电器股份有限公司 | Intelligent power module |
| CN104112719B (en) * | 2013-08-22 | 2017-02-08 | 广东美的制冷设备有限公司 | Hybrid integrated circuit module and manufacturing method thereof |
| CN204481692U (en) * | 2015-03-23 | 2015-07-15 | 广东美的制冷设备有限公司 | Intelligent power module |
-
2015
- 2015-03-23 CN CN201510130308.2A patent/CN104767396B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN104767396A (en) | 2015-07-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104835794B (en) | SPM and its manufacture method | |
| CN204481692U (en) | Intelligent power module | |
| CN104795374B (en) | SPM and its manufacture method | |
| CN100539308C (en) | Electronic installation | |
| CN104767417B (en) | Control circuit, intelligent power module and its manufacturing method of intelligent power module | |
| CN205752150U (en) | Semiconductor device | |
| CN102201449B (en) | Low-heat-resistance packaging structure of power MOS (Metal Oxide Semiconductor) device | |
| CN104767396B (en) | SPM and its manufacture method | |
| CN104112719B (en) | Hybrid integrated circuit module and manufacturing method thereof | |
| CN104303299B (en) | Method for manufacturing semiconductor device and semiconductor device | |
| CN105531817B (en) | Semiconductor module module unit and semiconductor module | |
| CN106024651A (en) | Intelligent power module and manufacturing method thereof | |
| CN104795378B (en) | Intelligent power module and its manufacture method | |
| CN104766842B (en) | SPM and its manufacture method | |
| CN206116377U (en) | Intelligent power module | |
| CN104795388B (en) | SPM and its manufacture method | |
| CN106098652A (en) | A kind of SPM and manufacture method thereof | |
| CN105047623B (en) | SPM and its manufacture method | |
| CN104752373B (en) | intelligent power module and its manufacturing method | |
| CN204559407U (en) | Intelligent power module | |
| CN104795974A (en) | Intelligent power module, control circuit of intelligent power module and manufacturing method of intelligent power module | |
| CN106024652A (en) | Intelligent power module and manufacturing method thereof | |
| CN106298698A (en) | A kind of SPM and manufacture method thereof | |
| CN106158801A (en) | A kind of SPM and manufacture method thereof | |
| CN204596778U (en) | Intelligent power module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171114 |