CN104767396A - Intelligent power module and manufacturing method thereof - Google Patents

Intelligent power module and manufacturing method thereof Download PDF

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Publication number
CN104767396A
CN104767396A CN201510130308.2A CN201510130308A CN104767396A CN 104767396 A CN104767396 A CN 104767396A CN 201510130308 A CN201510130308 A CN 201510130308A CN 104767396 A CN104767396 A CN 104767396A
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CN
China
Prior art keywords
radiator
wiring
power module
pin
gauffer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201510130308.2A
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Chinese (zh)
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CN104767396B (en
Inventor
冯宇翔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Midea Group Co Ltd
GD Midea Air Conditioning Equipment Co Ltd
Original Assignee
Midea Group Co Ltd
Guangdong Midea Refrigeration Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Midea Group Co Ltd, Guangdong Midea Refrigeration Equipment Co Ltd filed Critical Midea Group Co Ltd
Priority to CN201510130308.2A priority Critical patent/CN104767396B/en
Publication of CN104767396A publication Critical patent/CN104767396A/en
Priority to PCT/CN2016/077143 priority patent/WO2016150391A1/en
Priority to JP2018500841A priority patent/JP6500162B2/en
Priority to US15/559,834 priority patent/US10615155B2/en
Application granted granted Critical
Publication of CN104767396B publication Critical patent/CN104767396B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacturing & Machinery (AREA)

Abstract

The invention discloses an intelligent power module and a manufacturing method thereof. The intelligent power module comprises circuit wires, power components, non-power components and paper radiators serving as carriers, wherein the power components and the non-power components are arranged at the predetermined positions of the circuit wires, the front sides of the radiators re covered with insulation layers, the circuit wires are arranged on the surfaces of the insulation layers, and creases for heat dissipation are arranged at least at the positions, corresponding to the power components, of the back sides of the radiators. The heat dissipation effect, electrical performance and heat stability of the intelligent power module are improved, and cost is reduced.

Description

Intelligent Power Module and manufacture method thereof
Technical field
The present invention relates to Intelligent Power Module technical field, particularly relate to the specific application scenario such as a kind of convertible frequency air-conditioner, carry out the Intelligent Power Module that encapsulates and manufacture method thereof by transfer die form.
Background technology
Intelligent Power Module (IPM, Intelligent Power Module) is a kind of power drive series products power electronics and integrated circuit technique combined.Intelligent Power Module integrates device for power switching and high-voltage driving circuit, and in keep overvoltage, overcurrent and the failure detector circuit such as overheated.Intelligent Power Module receives the control signal of MCU on the one hand, drives subsequent conditioning circuit work, sends the state detection signal of system back to MCU on the other hand.Intelligent Power Module wins increasing market with its advantage such as high integration, high reliability, is particularly suitable for the frequency converter of drive motors and various inverter.
The structure of existing Intelligent Power Module is as shown in Fig. 1 (A), Fig. 1 (B) and Fig. 1 (C).Fig. 1 (A) is the vertical view of existing Intelligent Power Module 100, and Fig. 1 (B) is X-X ' the line profile of Fig. 1 (A), and Fig. 1 (C) is the schematic diagram after Fig. 1 (A) removes resin.
As shown in Fig. 1 (A), Fig. 1 (B) and Fig. 1 (C), existing Intelligent Power Module 100 has following structure, and it comprises: circuit substrate 106; Be located at the insulating barrier 107 on circuit substrate 106 surface; The wiring 108 that insulating barrier 107 is formed; Be covered in the solder mask 110 of insulating barrier 107 and wiring 108 ad-hoc location; Power component 109 on wiring 108 and non-power element 104 is fixed on by tin cream 112; Connect the metal wire 105 of non-power element 104, power component 109 and wiring 108; The pin 101 be connected with wiring 108; At least one side of circuit substrate 106 is sealed by sealing resin 102, in order to improve sealing, and can by whole of circuit substrate 106 all sealings.
Because Intelligent Power Module 100 is generally operational in hot environment, and power component 109 operationally can send a large amount of heat, cause the junction temperature of power component 109 very high, although circuit substrate 106 has thermolysis, but because the existence of insulating barrier 107, cause the overall thermal resistance of Intelligent Power Module 100 higher.Further, due to the heat conduction of circuit substrate 106, the heat of power component 109 is delivered in other devices, and the temperature that the electrical quantity of other devices be can not ignore is waftd.
Therefore, existing Intelligent Power Module long-term work at high temperature, seriously can reduce its useful life, and the stability of performance can be affected, in extreme circumstances, can cause Intelligent Power Module in the course of the work because of the overheated and out of control blast of internal components, cause casualties and property loss.
Summary of the invention
Main purpose of the present invention be to provide a kind of structure simple, be beneficial to the high Intelligent Power Module of heat radiation, reliability and manufacture method thereof.
In order to achieve the above object, the present invention proposes a kind of Intelligent Power Module, comprise wiring, be arranged on power component and the non-power element in described wiring precalculated position, also comprise: as the papery radiator of carrier, the one side of described radiator is coated with insulating barrier as front, and described wiring is arranged on the one side away from radiator on described insulating barrier; The another side of described radiator, as the back side, is at least provided with the gauffer for dispelling the heat in the position of the described power component of correspondence.
Preferably, described gauffer covers the whole back side of described radiator.
Preferably, described radiator is also provided with through hole, described through hole runs through described radiator and insulating barrier; Between the edge of described wiring and the edge of described through hole, and, between the edge of described insulating barrier and the edge of described through hole, there is setpoint distance.
Preferably, this Intelligent Power Module also comprises: for connecting described wiring, described power component and described non-power element to form the metal wire of related circuit.
Preferably, this Intelligent Power Module also comprises and is configured in described power model edge, is connected and stretches out as the pin of input and output with described wiring.
Preferably, described wiring, described power component and non-power element, metal wire, and the coupling part of described pin and wiring is by resin-encapsulated; Described resin is by described filling through hole.
Preferably, described wiring forms one or more weld pad at least one edge of described insulating barrier; Described multiple weld pad aims at arrangement along the edge of described insulating barrier; Described pin is fixed by described weld pad, and is connected with described wiring.
Preferably, the back side of described radiator does not configure the position of described gauffer by resin-encapsulated.
Preferably, described radiator and gauffer are wet type carbon composite functional paper.
Preferably, described radiator is bonding with described gauffer or be made into integration.
Preferably, the thickness of described radiator is 1.5mm ~ 2.5mm; The thickness of described radiator is greater than the thickness of described gauffer.
Preferably, the circuit of described power component, described non-power element, described wiring, described metal wire composition, there is bridge heap, compressor inversion and Active PFC function, or there is bridge heap, compressor inversion, Active PFC and blower fan invert function.
The embodiment of the present invention also proposes a kind of Intelligent Power Module manufacture method, comprises the following steps:
Form papery radiator, cover insulating barrier in the front of described radiator, form wiring and weld pad at surface of insulating layer, cover gauffer at the back side of described radiator;
At surface-mounted power component, the non-power element of described wiring, and at the surface-mounted ready-made pin of described weld pad;
Corresponding circuit is connected to form by between described power component, non-power element and described wiring by metal wire;
By sealing resin, the front of described radiator is sealed.
Preferably, describedly also to be comprised before being connected to form the step of corresponding circuit between described power component, non-power element and described wiring by metal wire:
The radiator being equipped with each element is placed in cleaning machine clean.
Preferably, the described surface-mounted power component at wiring, non-power element, and also comprised before the step of the surface-mounted ready-made pin of described weld pad:
Make the pin independently with coating; Specifically comprise:
Choose Copper base material, Copper base material is passed through to the mode of punching press or etching, make pin in a row, connected by reinforcement between pin;
Form nickel dam and nickeltin layer successively at described pin surface, obtain the pin being with coating.
Preferably, also comprise after the described step front of described radiator sealed by sealing resin:
Carry out the Trim Molding of described pin, and carry out functions of modules test.
Preferably, also comprise after the described step front of described radiator sealed by sealing resin:
By sealing resin, the back side of described radiator is not covered the position seals of gauffer.
Preferably, described formation papery radiator, covers insulating barrier in the front of described radiator, forms wiring and weld pad at surface of insulating layer, and the step covering gauffer at the back side of described radiator comprises:
The wet type carbon composite choosing preliminary dimension according to the circuit layout of setting forms papery radiator;
In the front of radiator, use insulating material and copper material, by the mode of hot pressing, make insulating material be formed at the surface of described radiator and as described insulating barrier, make copper material be formed at the surface of described insulating barrier as copper foil layer;
Eroded by the ad-hoc location of described copper foil layer, remainder forms wiring and weld pad;
Use wet type carbon composite to form gauffer, be adhered to the back side of described radiator by high temperature resistant glue.
Preferably, described use wet type carbon composite forms gauffer, also comprises before being adhered to the step at the back side of described radiator by high temperature resistant glue:
Assigned address between described wiring forms through hole, and described through hole runs through described insulating barrier and described radiator; Described through hole in resin-sealing step, by described resin filling.
Preferably, the described surface-mounted power component at wiring, non-power element, and comprise in the step of the surface-mounted ready-made pin of described weld pad:
By tin cream or elargol, described power component, non-power element and pin are fixed.
A kind of Intelligent Power Module that the present invention proposes and manufacture method thereof, the papery radiator of carrier is introduced as in Intelligent Power Module, and heat radiation gauffer is set at the back side of papery radiator, area of dissipation greatly increases, and insulating barrier can meet power component cooling requirements without the need to using highly heat-conductive material; And most of heat of power component by shedding rapidly, non-conducting, to non-power element, makes non-power element always work in low temperature environment, the temperature of non-power element is waftd and is greatly reduced, and improves electrical property and the thermal stability of Intelligent Power Module; The papery radiator that the present invention adopts weight lighter, to adding, carrier used requirement in man-hour is low, and location easily, reduces manufacturing cost, improves process qualification rate; Save operation power component being mounted Inner heat sink, reduce equipment investment expense.
Accompanying drawing explanation
Fig. 1 (A) is the vertical view of existing Intelligent Power Module;
Fig. 1 (B) is X-X ' the line profile of Fig. 1 (A);
Fig. 1 (C) is the schematic diagram after Fig. 1 (A) removes resin;
Fig. 2 (A) is the rear view of intelligent function module of the present invention preferred embodiment;
Fig. 2 (B) is the sectional view of the X-X ' line of Fig. 2 (A);
Fig. 2 (C) is the front plan view after embodiment of the present invention intelligent function module removes sealing resin;
Fig. 3 (A) is the front view of papery radiator in the embodiment of the present invention first operation;
Fig. 3 (B) is the sectional view of the X-X ' line of Fig. 3 (A);
Fig. 3 (C) is the schematic diagram forming insulating barrier and copper foil layer in the front of papery radiator;
Fig. 3 (D) is the schematic diagram forming wiring on the copper foil layer shown in Fig. 3 (C);
Fig. 3 (E) is the sectional view of the X-X ' line of Fig. 3 (D);
Fig. 3 (F) is the schematic diagram forming through hole on the wiring of Fig. 3 (D);
Fig. 3 (G) is the schematic diagram forming heat radiation gauffer;
Fig. 3 (H) is the structural representation at back side gauffer being sticked to papery radiator;
Fig. 4 (A) is the schematic diagram making pin in a row in the embodiment of the present invention second operation;
Fig. 4 (B) is the structural representation of single pin in Fig. 4 (A);
Fig. 4 (C) is the single pin schematic diagram with radian;
Fig. 5 (A) is in the embodiment of the present invention the 3rd operation, the end view of the Intelligent Power Module of assembling power component, non-power element and pin;
Fig. 5 (B) is the vertical view of Fig. 5 (A);
Fig. 6 (A) is in the embodiment of the present invention the 5th operation, is made power component, non-power element by metal wire, is formed the end view of connection between radiator and wiring;
Fig. 6 (B) is the vertical view of Fig. 6 (A);
Fig. 7 is in the embodiment of the present invention the 6th operation, uses mould to seal the profile of papery radiator by sealing resin;
Fig. 8 is in the embodiment of the present invention the 7th operation, the schematic diagram of pin Trim Molding;
Fig. 9 is manufacturing process's schematic diagram of the present embodiment Intelligent Power Module.
In order to make technical scheme of the present invention clearly, understand, be described in further detail below in conjunction with accompanying drawing.
Embodiment
Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
As previously mentioned, existing Intelligent Power Module due to radiating effect not good, long-term work at high temperature, serious can reduce its useful life, and can affect the stability of intelligent object performance.
The present invention considers, in specific application scenarios such as convertible frequency air-conditioners, although high heat conductive insulating layer and increase radiator can solve the heat dissipation problem of Intelligent Power Module, but, high heat conductive insulating layer is selected to dispel the heat, cost is very high on the one hand, another aspect mix and cause Intelligent Power Module hardness very large a large amount of because high heat conductive insulating layer employs, thus adds the manufacture difficulty of Intelligent Power Module; If increase radiator in Intelligent Power Module inside, by power component attachment on a heat sink, can the cost of raw material be increased on the one hand, too increase the technology difficulty of Intelligent Power Module on the other hand; If increase radiator in Intelligent Power Module outside, radiator is mounted on the back side of Intelligent Power Module, due to the application circuit that coordinates with Intelligent Power Module also having other heater elements, if install same radiator for all heater elements, radiator area can be increased, thus raising application cost, if be all heater elements installation of heat radiator respectively, then can increase assembly difficulty.Therefore select high heat conductive insulating layer and increase radiator and all difficulty is created to the application of Intelligent Power Module, be unfavorable for Intelligent Power Module popularizing in civilian occasions such as convertible frequency air-conditioners.
Based on above-mentioned consideration, the embodiment of the present invention is by introducing papery radiator, at the back side of papery radiator, heat radiation gauffer is set, form the elements such as insulating barrier, wiring, power component, non-power element in the front of papery radiator, and complete orderly processing, because papery heatsink weight is lighter, to adding, carrier used requirement in man-hour is low, location easily, thus can reduce manufacturing cost, improves process qualification rate; Save operation power component being mounted Inner heat sink, reduce equipment investment expense; In addition, owing to arranging heat radiation gauffer at the back side of papery radiator, area of dissipation greatly increases, under the prerequisite using common insulating barrier, the heat generating components of Intelligent Power Module and application platform thereof is made to obtain good radiating effect, and heat interference seldom, makes Intelligent Power Module stable performance, and then improves the reliability of Intelligent Power Module between each pyrotoxin; In addition, papery radiator is also convenient to transport.
Particularly, reference Fig. 2 (A), Fig. 2 (B) and Fig. 2 (C), Fig. 2 (A) are the rear view of intelligent function module of the present invention preferred embodiment; Fig. 2 (B) is the sectional view of the X-X ' line of Fig. 2 (A); Fig. 2 (C) is the front plan view after embodiment of the present invention intelligent function module removes sealing resin.
As shown in Fig. 2 (A), Fig. 2 (B) and Fig. 2 (C), a kind of Intelligent Power Module 10 that the embodiment of the present invention proposes, the present embodiment for have bridge heap, compressor inversion, Active PFC, blower fan invert function Intelligent Power Module 10 be described, for the application scenario not needing blower fan invert function, removed by blower fan Converting Unit, other parts are identical.
The present embodiment Intelligent Power Module 10 comprises as the papery radiator 17 of carrier, wiring 18, the power component 19 being arranged on described wiring 18 precalculated position and non-power element 14; Wherein:
The one side of described radiator 17 is as front, and another side is as the back side.
Be coated with insulating barrier 21 in the front of radiator 17, described wiring 18 is arranged on the one side away from radiator 17 on described insulating barrier 21.
At the back side of described radiator 17, at least the position of the described power component 19 of correspondence being provided with the gauffer 17A for dispelling the heat, that is, gauffer 17A must being had in the below of power component 19, to reach the thermolysis to power component 19.
Certainly, as a kind of execution mode, in order to the manufacturing process of simplified intelligent power model 10, can all cover gauffer 17A at the back side of papery radiator 17; And in order to save the consumption of gauffer 17A, also only gauffer 17A can be set at the specific part of radiator 17.
Wherein, described radiator 17 and gauffer 17A all can adopt wet type carbon composite functional paper.
Described radiator 17 can be bonding by high temperature glue with described gauffer 17A, or also can both be made into integration.
In addition, for the ease of heat radiation, radiator 17 is also provided with through hole 22, and described through hole 22 runs through described radiator 17 and insulating barrier 21.
This through hole 22 is arranged on the ad-hoc location of radiator 17, particularly, through hole 22 is made to form device and the circuit of pyrotoxin and not form between the device of pyrotoxin and circuit, make heat interference between power component 19 each pyrotoxin little, and most of heat of power component 19 by shedding rapidly non-conducting to non-power element 14, make Intelligent Power Module 10 stable performance, improve the reliability of Intelligent Power Module 10.
In order to prevent through hole 22 mismachining tolerance, between the edge making the edge of wiring 18 and described through hole 22, and, there is between the edge of described insulating barrier 21 and the edge of described through hole 22 setpoint distance (subsequent detailed).
In addition, described Intelligent Power Module 10 also comprises: for connecting described wiring 18, described power component 19 and described non-power element 14 to form the metal wire 15 of related circuit.
At this, the circuit of described power component 19, described non-power element 14, described wiring 18, described metal wire 15 composition, there is bridge heap, compressor inversion and Active PFC function, or there is bridge heap, compressor inversion, Active PFC and blower fan invert function, all heating circuits of the applications such as convertible frequency air-conditioner are concentrated in together and dispels the heat simultaneously; The present embodiment for have bridge heap, compressor inversion, Active PFC, blower fan invert function Intelligent Power Module 10 be described, for the application scenario not needing blower fan invert function, removed by blower fan Converting Unit, other parts are identical.
As shown in Fig. 2 (A) and Fig. 2 (C), circuit unit 1001 realizes bridge heap function, circuit unit 1002 realizes compressor invert function, circuit unit 1003 realizes Active PFC, circuit unit 1004 realizes blower fan invert function.
At this, described bridge heap, the drive part of described compressor inversion, the drive part of described Active PFC, to be isolated by described through hole 22 between the drive part of described blower fan inversion and other control sections.
In addition, described Intelligent Power Module 10 also comprises: be configured in described power model edge, be connected and stretch out as the pin 11 of input and output with described wiring 18.
At this, according to Intelligent Power Module 10 internal circuit layout and peripheral applications needs, described pin 11 can be configured at an edge, two edges, three edges or four edges of Intelligent Power Module 10.
In the present embodiment, described wiring 18, described power component 19 and non-power element 14, metal wire 15, and described pin 11 is encapsulated by sealing resin 12 with the coupling part of wiring 18; Described through hole 22 is filled by described resin 12.
As a kind of execution mode, the position not configuring described gauffer 17A at the back side of described radiator 17 is also encapsulated by resin 12, and the gauffer 17A namely making radiator 17 back side configure exposes from resin 12.
In addition, described wiring 18 can form one or more weld pad 18A at least one edge of insulating barrier 21; If multiple weld pad 18A, then described multiple weld pad 18A aims at arrangement along the edge of described insulating barrier 21; Described pin 11 is fixed by described weld pad 18A, and is connected with described wiring 18.
Below elaborate each inscape of embodiment of the present invention Intelligent Power Module 10:
Wherein, papery radiator 17 is wet type carbon composite functional paper, can become graphite by powder with the Fiber Shape Carbon Material Compound Machining, this wet type carbon composite can tolerate the high temperature of more than 350 DEG C and can be folded into arbitrary shape as required, obtains described heat radiation gauffer 17A.In order to improve corrosion resistance and waterproof, water-proofing treatment can be carried out in surface.
Described papery radiator 17 can be made into integration with described heat radiation gauffer 17A, also can be bonding by high temperature glue with described heat radiation gauffer 17A.
Wherein, the two sides of papery radiator 17 is smooth, and the out-of-shape of the gauffer 17A that dispels the heat; Described papery radiator 17 and heat radiation gauffer 17A also can for adopting the wet type carbon composite of different-thickness, wherein, in order to increase mechanical strength, papery radiator 17 adopts thicker wet type carbon composite, its thickness is preferably 1.5mm ~ 2.5mm, in actual design, thin place thickness can be designed to 1.5mm, thick place thickness can be 2.5mm, in order to reduce costs and increase the density of gauffer 17A, heat radiation gauffer 17A have employed thinner wet type carbon composite, and as a kind of preferred version, thickness can be designed to 0.5mm.
Described insulating barrier 21 can adopt conventional insulating material, and can add the doping such as silicon dioxide, silicon nitride, carborundum to improve thermal conductivity, at this, doping can be spherical or dihedral, by hot pressing mode, is pressed together on the surface of papery radiator 17, i.e. front.
Described wiring 18 is made up of metals such as copper, be formed at the ad-hoc location on insulating barrier 21, according to power needs, the thickness of wiring 18 can be designed to 0.035mm or 0.07mm etc., for general Intelligent Power Module 10, pay the utmost attention to and be designed to 0.07mm, in the present embodiment, adopt the thickness of 0.07mm.In addition, at the edge of described insulating barrier 21, be formed with the weld pad 18A be made up of described wiring 18.At this, multiple weld pad 18A aiming at arrangement is set near described insulating barrier 21, according to function needs, also multiple weld pad 18A aiming at arrangement can be set at multiple adjacent edges of described insulating barrier 21.
Described through hole 22 is between described wiring 18, and there is the distance of more than 1mm with described insulating barrier 21 and wiring 18, described through hole 22 runs through described insulating barrier 21 and described papery radiator 17, after described Intelligent Power Module 10 is encapsulated by sealing resin 12, described through hole 22 is filled completely by sealing resin 12; Described through hole 22 is positioned at the device and circuit that form pyrotoxin, and do not form between the device of pyrotoxin and circuit, because the thermal conductivity of sealing resin 12 is far below the thermal conductivity of papery radiator 17, therefore the heat isolation between can being formed each pyrotoxin, transverse direction between pyrotoxin and non-pyrotoxin is hot isolates, and, the bottom of pyrotoxin, because having gauffer 17A, substantially increases longitudinal heat conduction efficiency of each pyrotoxin thus, and through hole 22 makes Intelligent Power Module 10 reach heat isolation.
In addition, in order to increase hot isolation effect, as the first design, the length of each through hole 22, can be designed as far as possible long; As the second design, in order to improve the hardness of papery radiator 17, the length of through hole 22 can be designed as 5mm ~ 6mm, for the second design, the distance between each through hole 22 can be designed to 0.5 ~ 1mm, in order to improve hot isolation effect, the transverse width of each through hole 22, can be designed to 3mm ~ 3.5mm, in order to reduce the volume of Intelligent Power Module 10, the transverse width of each through hole 22 can be designed to 1mm ~ 2.5mm.
Described power component 19 and non-power element 14 are fixed on circuit wiring 18 being formed regulation.At this, described power component 19 can adopt the elements such as IGBT pipe, high-voltage MOSFET pipe, high pressure FRD pipe, high-voltage diode, and described power component 19 is connected with wiring 18 grade by metal wire 15; Described non-power element 14 adopts active element or the passive components such as electric capacity or resistance such as integrated circuit, transistor or diode, and the active element etc. installed that faces up is connected with wiring 18 by metal wire 15.
Described metal wire 15 can be aluminum steel, gold thread or copper cash, is made between each power component 19 by binding, between each non-power element 14, is set up electrical connection between each wiring 18; In addition, metal wire 15 can also be used for making setting up electrical connection between pin 11 and wiring 18 or power component 19, non-power element 14.For the connection of power component 19, the aluminum steel of 300 μm ~ 400 μm can be adopted, for the electrical connection of non-power element 14, the aluminum steel of 38 μm ~ 125 μm can be adopted, if there is the connection across through hole 22, preferably adopt the aluminum steel of more than 250 μm.
Described pin 11 be fixed on be located at wiring 18 1 edges weld pad 18A on, it has the effect carrying out with outside inputting, exporting.
As a kind of execution mode, what can be designed to Intelligent Power Module 10 arranges many pins 11, the electrical binding agent welding that pin 11 and weld pad 18A are conducted electricity by scolding tin etc.Pin 11 can adopt the metals such as copper to make, and copper surface forms one deck nickeltin layer by chemical plating and plating, and the thickness of alloy-layer is generally 5 μm, and coating can protect copper not to be corroded oxidation, and can improve weldability.
Described sealing resin 12 uses thermosetting resin 12 to be molded by transfer die mode, and injection mould mode also can be used to use thermoplastic resin 12 to be molded.At this, described resin 12 seals all elements on papery radiator 17 surface completely, and namely only sealing has the one side of element, and another side exposes completely.Through hole on papery radiator 17 22 is filled completely by resin 12.
Compared to existing technology, the Intelligent Power Module 10 of the embodiment of the present invention has following beneficial effect:
1, because the back side of Intelligent Power Module 10 of the present invention has heat radiation gauffer 17A, area of dissipation greatly increases, the cooling requirements of insulating barrier 21 without the need to using highly heat-conductive material can meet power component 19.
2, Intelligent Power Module 10 is provided with bridge heap, compressor invert function, or has bridge heap, compressor inversion, blower fan invert function, all heating circuits of the applications such as convertible frequency air-conditioner is concentrated in together and dispels the heat simultaneously.
If 3 heat radiation gauffer 17A are positioned at below power component 19, make most of heat of heater element by shedding rapidly non-conducting to non-power element 14, non-power element 14 is made to always work in low temperature environment, the temperature of non-power element 14 is waftd and is greatly reduced, improve electrical property and the thermal stability of Intelligent Power Module 10, because the back side of described papery radiator 17 is also sealed except the part of configuration gauffer 17A, watertightness and the air-tightness of Intelligent Power Module 10 of the present invention are improved, and improve the long-term reliability in complicated applications environment.
If 4 heat radiation gauffer 17A integrally cover whole Intelligent Power Module 10 back side, simple installation, structure are simple, and can area of dissipation be rolled up, the heat of heater element can be scattered and disappeared fast, and because the back side of Intelligent Power Module 10 is exposed completely, improve the thermal diffusivity of Intelligent Power Module 10.
5, Qiao Dui, compressor inversion drive part, the drive part of Active PFC, isolated by through hole 22 between the drive part of blower fan inversion and other control sections (comprising non-power element 14 etc.), the heat of each heating part is not only made to disturb very low, overwhelming majority heat is scattered and disappeared by gauffer 17A, and make the temperature of control section remain on a low state, avoid Intelligent Power Module 10 hydraulic performance decline caused because control section temperature is waftd.
6, radiator structure is paper material, lightweight, and Intelligent Power Module 10 overall weight is reduced, and is convenient to long-distance transport and workman's assembling; Because Intelligent Power Module 10 of the present invention itself possesses radiator 17, therefore in application process, outside without the need to connecing radiator 17 again, reduce application difficulty and application cost, improve assembling quality.
From the above, Intelligent Power Module 10 of the present invention, reducing costs simultaneously, improves reliability and performance, and can be designed to define compatibility with existing Intelligent Power Module 10 function and pin 11, be convenient to applying of Intelligent Power Module 10.
In addition, one embodiment of the invention also proposes a kind of Intelligent Power Module 10 manufacture method, comprising:
Step S1, forms papery radiator 17, covers insulating barrier 21 in the front of described radiator 17, at insulating barrier 21 circuit forming surface wiring 18 and weld pad 18A, covers gauffer 17A at the back side of described radiator 17;
Particularly, the wet type carbon composite formation papery radiator 17 of preliminary dimension is chosen according to the circuit layout of setting.
In the front of radiator 17, use insulating material and copper material, by the mode of hot pressing, make insulating material be formed at the surface of described radiator 17 and as described insulating barrier 21, make copper material be formed at the surface of described insulating barrier 21 as copper foil layer.
Afterwards, eroded by the ad-hoc location of copper foil layer, remainder forms wiring 18 and weld pad 18A.
Assigned address between described wiring 18 forms through hole 22, and described through hole 22 runs through described insulating barrier 21 and described radiator 17; Described through hole 22 seals in step at resin 12, is filled by described resin 12.
Use wet type carbon composite to form gauffer 17A, be adhered to the back side of described radiator 17 by high temperature resistant glue.
Step S2, at surface-mounted power component 19, the non-power element 14 of described wiring 18, and at the surface-mounted ready-made pin 11 of described weld pad 18A;
Step S3, is connected to form corresponding circuit by metal wire 15 by between described power component 19, non-power element 14 and described wiring 18;
Step S4, is sealed the front of described radiator 17 by sealing resin 12.
Further, can also comprise before step S3:
Step S5, is placed in cleaning machine by the radiator 17 being equipped with each element and cleans.
Further, can also comprise before step S2:
Step S6, makes the pin 11 independently with coating.
Particularly, first, choose Copper base material, Copper base material is passed through to the mode of punching press or etching, make pin 11 in a row, connected by reinforcement between pin 11.
Then, form nickel dam and nickeltin layer successively on described pin 11 surface, obtain the pin 11 being with coating.
Further, also comprise after above-mentioned steps S4:
Step S7, carries out the Trim Molding of described pin 11, and carries out functions of modules test.
Referring to accompanying drawing, the manufacturing process to the present embodiment Intelligent Power Module 10 is described in detail:
As a kind of preferred embodiment, the manufacture method of Intelligent Power Module 10 of the present invention can comprise: the operation forming papery radiator 10 and heat radiation gauffer 17, pressing insulating barrier 21 is formed the operation of wiring 18, weld pad 18A, formation through hole 22; The operation of allocating power element 19, non-power element 14 and pin 11 on wiring 18; The operation of cleaning; The operation of described non-power element 14, power component 19 and described wiring 16 is connected with metal wire 15; Toast and the operation be molded; Shaping operation is carried out to pin 11; Carry out the operation of functional test.Concrete process chart as shown in Figure 9.
The details of each operation is below described.
First operation: with reference to Fig. 3 (A), Fig. 3 (B), Fig. 3 (C), Fig. 3 (D), Fig. 3 (E), Fig. 3 (F), Fig. 3 (G) and Fig. 3 (H).
Fig. 3 (A) is the front view of papery radiator in embodiment of the present invention intelligent function module;
Fig. 3 (B) is the sectional view of the X-X ' line of Fig. 3 (A);
Fig. 3 (C) is the schematic diagram forming insulating barrier and copper foil layer in the front of papery radiator;
Fig. 3 (D) is the schematic diagram forming wiring on the copper foil layer shown in Fig. 3 (C);
Fig. 3 (E) is the sectional view of the X-X ' line of Fig. 3 (D);
Fig. 3 (F) is the schematic diagram forming through hole on the wiring of Fig. 3 (D);
Fig. 3 (G) is the schematic diagram forming heat radiation gauffer;
Fig. 3 (H) is the structural representation at back side gauffer being sticked to papery radiator.
The embodiment of the present invention first operation forms sizeable wet type carbon composite, forms papery radiator 17 based on this wet type carbon composite, and papery radiator 17 is formed the operation of through hole 22 and heat radiation gauffer 17A.
First, with reference to Fig. 3 (A) and the sectional view 3 (B) along the X-X ' line of Fig. 3 (A), the sizeable papery radiator 17 of circuit layout design as required, for general Intelligent Power Module, the size of one piece of Intelligent Power Module can choose 64mm × 30mm, thickness is the wet type carbon composite of 1.5mm, then by the high temperature resistant glue of tolerable temperature more than 300 DEG C, in the same material rectangular that the back side of above-mentioned 64mm × 30mm rectangle papery radiator assembling thickness is 0.5mm, as heat radiation gauffer.
With reference to figure 3 (C), use insulating material and the copper material with dihedral or spherical doping, by while hot pressing mode, the surface (front) making insulating material be formed at described papery radiator 17 is formed at described insulating barrier 21 surface as copper foil layer 18B as described insulating barrier 21, copper material.
At this, in order to improve voltage endurance, the thickness of described insulating barrier 21 can be designed as 110 μm, and in order to improve heat dissipation characteristics, the thickness of described insulating barrier 21 can be designed as 70 μm.At this, in order to improve through-current capability, the thickness of described copper foil layer 18B can be designed to 0.07mm, and in order to reduce costs, the thickness of described copper foil layer 18B can be designed to 0.035mm or 0.0175mm.
With reference to figure 3 (D) and the sectional view 3 (E) along the X-X ' line of Fig. 3 (D), eroded by the ad-hoc location of copper foil layer 18B, remainder is wiring 18 and weld pad 18A.
With reference to figure 3F), by punching press, shearing, turn modes such as wearing, ad-hoc location between described wiring 18 forms through hole 22, described through hole 22 runs through described insulating barrier 21 and described papery radiator 17, after forming through hole 22, can consider that using air pressure gun effects on surface to remain cleans, and also can use supersonic cleaning machine to clean.
With reference to figure 3 (G), the wet type carbon composite that thickness is 0.5mm is used to be formed irregularly shaped, as described heat radiation gauffer 17A.Two sides is carried out as applied the corrosion protection of marine glue, water-proofing treatment.
With reference to figure 3 (H), use the high temperature resistant glue of tolerable temperature more than 300 DEG C, described heat radiation gauffer 17A is sticked to the back side of described papery radiator 17.
Second operation: reference Fig. 4 (A), Fig. 4 (B) and Fig. 4 (C), Fig. 4 (A) are the schematic diagrames making pin in a row in embodiment of the present invention intelligent function module; Fig. 4 (B) is the structural representation of single pin in Fig. 4 (A); Fig. 4 (C) is the single pin schematic diagram with radian.
Second operation of the present invention is the operation of the pin 11 made independently with coating.
Each pin 11 is by Copper base material, by the mode of punching press or etching, makes the row's pin 11 as shown in Fig. 4 (A), and in the present embodiment, pin 11 is connected by reinforcement 11A by 12 independent pin units; As shown in Fig. 4 (B), independent pin units is length C is 25mm, and width K is 1.5mm, and thickness H is the strip of 1mm; Sometimes, for ease of assembling, also wherein certain radian can be suppressed in one end at pin units, as shown in Fig. 4 (C).
Then, form nickel dam by the method for chemical plating at pin surface, specifically comprise:
By nickel salt and inferior sodium phosphate mixed solution, and with the addition of suitable complexing agent, form nickel dam on the copper material surface forming given shape, metallic nickel has very strong passivation ability, the very thin passivating film of one deck can be generated rapidly, the corrosion of air, alkali and some acid can be resisted.Nickel plating crystallization is superfine little, and nickel layer thickness is generally 0.1 μm.
Then by hydrosulphate technique; at room temperature the copper material forming shape and nickel dam is immersed in the plating solution with positive tin ion and is energized; form nickeltin layer on nickel dam surface, alloy-layer general control is at 5 μm, and the formation of alloy-layer greatly improves protectiveness and the solderability of pin.
3rd operation: the end view with reference to figure 5 (A) and Fig. 5 (B), Fig. 5 (A) being the Intelligent Power Module of assembling power component, non-power element and pin in the embodiment of the present invention; Fig. 5 (B) is the vertical view of Fig. 5 (A).
3rd operation of the present invention is in the surface-mounted power component of described wiring 18 19, non-power element 14 and the operation at the surface-mounted pin 11 of described weld pad 18A.
First, by stencil printer, use steel mesh, tin cream application is carried out to the ad-hoc location of the described wiring 18 on described insulating barrier 21 and described weld pad 18A; At this, climbing tin height to improve, the steel mesh of 0.15mm thickness can be used, in order to reduce the risk of power device 19 and non-power element 14 displacement, the steel mesh of 0.12mm thickness can be used.In the present embodiment, the height of the power component 19 of use is 0.07mm, is lighter components and parts, so steel mesh thickness can select the steel mesh of 0.12mm thickness, can also adopt other suitable dimensions in other embodiments, in this no limit.
Then, with reference to end view Fig. 5 (A) and vertical view Fig. 5 (B), carry out the installation of power component 19, non-power element 14 and pin 11, power component 19 and non-power element 14 directly can be placed on the ad-hoc location of described wiring 18, pin 11 then one end is placed on described weld pad 18A, the other end needs carrier 20 to be fixed, and described carrier 20 is made by materials such as synthesis stones.
At this, carrier 20 needs to carry out bottom hollow out process, and described heat radiation gauffer 17A is exposed, and described papery radiator 17 dorsal edge at least not contacted with described carrier 20 by the position of described heat radiation gauffer 17A covering of 1mm plays a supportive role.
Then, be put in described insulating barrier 21 on described carrier 20 by Reflow Soldering, tin cream solidifies, and described non-power element 14 and described pin 11 are fixed.
In said process, as a kind of optimal way, solution temperature can be selected to be the tin cream of 280 DEG C.
It should be noted that, in other embodiments, elargol or silver slurry can also be selected to replace above-mentioned tin cream.
4th operation:
4th operation of the present invention is the operation of cleaning papery radiator 17.
First described papery radiator 17 is put into cleaning machine to clean, the foreign matters such as aluminum steel residual when the scaling powders such as the rosin remained during Reflow Soldering and punching press are cleaned, according to the arrangement density of described non-power element 14 at described wiring 18, clean by spray ultrasonic or both combine forms carry out.
During cleaning, described pin 11 is clamped by mechanical arm, described papery radiator 17 is placed in rinse bath, and will note not allowing mechanical arm touch described papery radiator 17, because described papery radiator 17 enbrittles and easily deformation, if mechanical arm clamps described papery radiator 17, the vibrations produced when cleaning, easily cause described papery radiator 17 to burst apart.
5th operation: reference Fig. 6 (A) and Fig. 6 (B), Fig. 6 (A) are in the embodiment of the present invention the 5th operation, are made power component, non-power element by metal wire, are formed the end view of connection between radiator and wiring; Fig. 6 (B) is the vertical view of Fig. 6 (A).
5th operation of the present invention is by metal wire (also can become binding line), makes described power component 19, non-power element 14, forms the operation of connection between radiator 13 and described wiring 18.
According to through-current capability needs, select the aluminum steel of suitable diameter as metal wire, for the integrated circuit for signal controlling, also can consider to use gold thread as metal wire.In the present embodiment, whole selection aluminum steel, in general, uses the aluminum steel of 350 μm ~ 400 μm surely to the nation of described power component 19, the nation of described non-power element 14 is used surely to the aluminum steel of 38 μm ~ 200 μm, the nation of described radiator 13 is used surely to the aluminum steel of 350 μm ~ 400 μm.
Goods after this operation completes can with reference to end view Fig. 6 (A) and vertical view Fig. 6 (B).
Wherein make power component 19, non-power element 14 by metal wire, be connected between radiator 13 with wiring 18, form corresponding circuit.
As shown in Fig. 6 (B), described circuit unit 1001 realizes described bridge heap function, described circuit unit 1002 realizes described compressor invert function, described circuit unit 1003 realizes described Active PFC function, described circuit unit 1004 realizes described blower fan invert function.
6th operation: with reference to Fig. 7
6th operation of the present invention is the operation being sealed described papery radiator 17 by sealing resin 12.Fig. 7 represents the profile using mould 50 to be sealed the operation of described papery radiator 17 by sealing resin 12.
Particularly, first, toast described papery radiator 17 in oxygen-free environment, baking time should not be less than 2 hours, baking temperature and selection 125 DEG C.
Afterwards, between the patrix 44 papery radiator 17 configuring pin 11 being transported to mould and counterdie 45.By making the specific part of pin 11 contact with fixture 46, carrying out the location of papery radiator 17, making papery radiator 17 not cover the marginal portion of gauffer 17A equal with the top of counterdie 45.
During matched moulds, in the die cavity being formed at mould inside, place described papery radiator 17, then inject sealing resin 12 by cast gate 53.The method carrying out sealing can adopt and use the transfer die of thermosetting resin to be molded or to use the injection mould of thermosetting resin to be molded.And after cast gate 53 injects sealing resin 12, the gas of mold cavity is discharged into outside by exhaust outlet 54.
At this, described through hole 22 is filled completely by described resin 12.
At this, the back side of described papery radiator 17 is close on counterdie 45, in order to strengthen laminating, also thimble can be increased at patrix, but still have a small amount of sealing resin 12 and enter between the back side of papery radiator 17 and counterdie 45, therefore, after demoulding, need to carry out laser-induced thermal etching or grinding, the a small amount of sealing resin 12 remaining in described papery radiator 17 back side is removed, the back side of described papery radiator 17 is exposed from described sealing resin 12, and the back side of described papery radiator 17 is sealed by sealing resin 12 with upper part.
7th operation: reference Fig. 8, Fig. 8 are in the embodiment of the present invention the 7th operation, the schematic diagram of pin Trim Molding.
The present invention the 7th operation is the operation of carrying out described pin 11 Trim Molding and carrying out functions of modules test, and Intelligent Power Module completes as goods through operation thus.
In front operation and transfer die mold assembly step, other parts except pin 11 are all sealed by resin 12.The length that this operation uses according to pin and shape needs, such as, the position of dotted line 51 in fig. 8 can cut off external pin 11, sometimes also can be bent into definite shape, be convenient to follow-up assembling.
Then Intelligent Power Module 10 is put into testing equipment, carry out conventional electric parameters testing, generally comprise the test events such as dielectric voltage withstand, quiescent dissipation, delay time, test passes person is finished product.
Utilize above-mentioned operation, namely complete Fig. 2 (A), Fig. 2 (B) and the Intelligent Power Module 10 shown in Fig. 2 (C).
Embodiment of the present invention Intelligent Power Module and manufacture method thereof, the papery radiator of carrier is introduced as in Intelligent Power Module, and heat radiation gauffer is set at the back side of papery radiator, area of dissipation greatly increases, and insulating barrier can meet power component cooling requirements without the need to using highly heat-conductive material; And most of heat of power component by shedding rapidly, non-conducting, to non-power element, makes non-power element always work in low temperature environment, the temperature of non-power element is waftd and is greatly reduced, and improves electrical property and the thermal stability of Intelligent Power Module; The papery radiator that the present invention adopts weight lighter, to adding, carrier used requirement in man-hour is low, and location easily, reduces manufacturing cost, improves process qualification rate; Save operation power component being mounted Inner heat sink, reduce equipment investment expense.
Above are only the preferred embodiments of the present invention; not thereby the scope of the claims of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.

Claims (20)

1. an Intelligent Power Module, comprise wiring, be arranged on power component and the non-power element in described wiring precalculated position, it is characterized in that, also comprise: as the papery radiator of carrier, the one side of described radiator is coated with insulating barrier as front, and described wiring is arranged on the one side away from radiator on described insulating barrier; The another side of described radiator, as the back side, is at least provided with the gauffer for dispelling the heat in the position of the described power component of correspondence.
2. Intelligent Power Module according to claim 1, is characterized in that, described gauffer covers the whole back side of described radiator.
3. Intelligent Power Module according to claim 1 and 2, is characterized in that, described radiator is also provided with through hole, and described through hole runs through described radiator and insulating barrier; Between the edge of described wiring and the edge of described through hole, and, between the edge of described insulating barrier and the edge of described through hole, there is setpoint distance.
4. Intelligent Power Module according to claim 3, is characterized in that, also comprises: for connecting described wiring, described power component and described non-power element to form the metal wire of related circuit.
5. Intelligent Power Module according to claim 4, is characterized in that, also comprises being configured in described power model edge, being connected and stretching out as the pin of input and output with described wiring.
6. Intelligent Power Module according to claim 5, is characterized in that, described wiring, described power component and non-power element, metal wire, and the coupling part of described pin and wiring is by resin-encapsulated; Described resin is by described filling through hole.
7. Intelligent Power Module according to claim 5, is characterized in that, described wiring forms one or more weld pad at least one edge of described insulating barrier; Described multiple weld pad aims at arrangement along the edge of described insulating barrier; Described pin is fixed by described weld pad, and is connected with described wiring.
8. Intelligent Power Module according to claim 1, is characterized in that, the back side of described radiator does not configure the position of described gauffer by resin-encapsulated.
9. Intelligent Power Module according to claim 1 and 2, is characterized in that, described radiator and gauffer are wet type carbon composite functional paper.
10. Intelligent Power Module according to claim 9, is characterized in that, described radiator is bonding with described gauffer or be made into integration.
11. Intelligent Power Module according to claim 9, is characterized in that, the thickness of described radiator is 1.5mm ~ 2.5mm; The thickness of described radiator is greater than the thickness of described gauffer.
12. Intelligent Power Module according to claim 4, it is characterized in that, the circuit of described power component, described non-power element, described wiring, described metal wire composition, there is bridge heap, compressor inversion and Active PFC function, or there is bridge heap, compressor inversion, Active PFC and blower fan invert function.
13. 1 kinds of Intelligent Power Module manufacture methods, is characterized in that, comprise the following steps:
Form papery radiator, cover insulating barrier in the front of described radiator, form wiring and weld pad at surface of insulating layer, cover gauffer at the back side of described radiator;
At surface-mounted power component, the non-power element of described wiring, and at the surface-mounted ready-made pin of described weld pad;
Corresponding circuit is connected to form by between described power component, non-power element and described wiring by metal wire;
By sealing resin, the front of described radiator is sealed.
14. methods according to claim 13, is characterized in that, are describedly also comprised before being connected to form the step of corresponding circuit between described power component, non-power element and described wiring by metal wire:
The radiator being equipped with each element is placed in cleaning machine clean.
15. methods according to claim 13, is characterized in that, the described surface-mounted power component at wiring, non-power element, and also comprise before the step of the surface-mounted ready-made pin of described weld pad:
Make the pin independently with coating; Specifically comprise:
Choose Copper base material, Copper base material is passed through to the mode of punching press or etching, make pin in a row, connected by reinforcement between pin;
Form nickel dam and nickeltin layer successively at described pin surface, obtain the pin being with coating.
16. methods according to claim 15, is characterized in that, also comprise after the described step sealed in the front of described radiator by sealing resin:
Carry out the Trim Molding of described pin, and carry out functions of modules test.
17. methods according to claim 15, is characterized in that, also comprise after the described step sealed in the front of described radiator by sealing resin:
By sealing resin, the back side of described radiator is not covered the position seals of gauffer.
18. methods according to any one of claim 13-17, it is characterized in that, described formation papery radiator, cover insulating barrier in the front of described radiator, form wiring and weld pad at surface of insulating layer, the step covering gauffer at the back side of described radiator comprises:
The wet type carbon composite choosing preliminary dimension according to the circuit layout of setting forms papery radiator;
In the front of radiator, use insulating material and copper material, by the mode of hot pressing, make insulating material be formed at the surface of described radiator and as described insulating barrier, make copper material be formed at the surface of described insulating barrier as copper foil layer;
Eroded by the ad-hoc location of described copper foil layer, remainder forms wiring and weld pad;
Use wet type carbon composite to form gauffer, be adhered to the back side of described radiator by high temperature resistant glue.
19. methods according to claim 18, is characterized in that, described use wet type carbon composite forms gauffer, also comprises before being adhered to the step at the back side of described radiator by high temperature resistant glue:
Assigned address between described wiring forms through hole, and described through hole runs through described insulating barrier and described radiator; Described through hole in resin-sealing step, by described resin filling.
20. methods according to claim 19, is characterized in that, the described surface-mounted power component at wiring, non-power element, and comprise in the step of the surface-mounted ready-made pin of described weld pad:
By tin cream or elargol, described power component, non-power element and pin are fixed.
CN201510130308.2A 2015-03-23 2015-03-23 SPM and its manufacture method Expired - Fee Related CN104767396B (en)

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Application Number Priority Date Filing Date Title
CN201510130308.2A CN104767396B (en) 2015-03-23 2015-03-23 SPM and its manufacture method
PCT/CN2016/077143 WO2016150391A1 (en) 2015-03-23 2016-03-23 Smart power module and manufacturing method therefor
JP2018500841A JP6500162B2 (en) 2015-03-23 2016-03-23 Intelligent power module and manufacturing method thereof
US15/559,834 US10615155B2 (en) 2015-03-23 2016-03-23 Intelligent power module and manufacturing method thereof

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CN104767396B CN104767396B (en) 2017-11-14

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