CN104795378A - Intelligent power module and manufacturing method thereof - Google Patents

Intelligent power module and manufacturing method thereof Download PDF

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Publication number
CN104795378A
CN104795378A CN201510129259.0A CN201510129259A CN104795378A CN 104795378 A CN104795378 A CN 104795378A CN 201510129259 A CN201510129259 A CN 201510129259A CN 104795378 A CN104795378 A CN 104795378A
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CN
China
Prior art keywords
aluminium base
wiring
power module
pin
intelligent power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201510129259.0A
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Chinese (zh)
Other versions
CN104795378B (en
Inventor
魏调兴
冯宇翔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Midea Group Co Ltd
GD Midea Air Conditioning Equipment Co Ltd
Original Assignee
Midea Group Co Ltd
Guangdong Midea Refrigeration Equipment Co Ltd
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Publication date
Application filed by Midea Group Co Ltd, Guangdong Midea Refrigeration Equipment Co Ltd filed Critical Midea Group Co Ltd
Priority to CN201510129259.0A priority Critical patent/CN104795378B/en
Publication of CN104795378A publication Critical patent/CN104795378A/en
Application granted granted Critical
Publication of CN104795378B publication Critical patent/CN104795378B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses an intelligent power module and a manufacturing method thereof. The intelligent power module comprises a circuit, power elements, non-power elements and an aluminum substrate serving as a carrier, and the power elements and the non-power elements are arranged at preset positions of the circuit. One surface of the aluminum substrate serves as a front surface covered with an insulating layer, and the circuit is arranged on one surface, away from the aluminum substrate, of the insulating layer; the other surface of the aluminum substrate serves as a back surface provided with paper radiating fins, and a heat insulation structure for partition of the power elements and the non-power elements is arranged on the aluminum substrate. The intelligent power module has the advantages of effectiveness in heat radiation and heat insulation and guarantee of electric insulation.

Description

Intelligent Power Module and manufacture method thereof
Technical field
The present invention relates to Intelligent Power Module technical field, particularly relate to a kind of Intelligent Power Module and the manufacture method thereof with heat insulation structural and insulating radiation device.
Background technology
Intelligent Power Module, i.e. IPM (Intelligent Power Module) are a kind of power drive devices power electronics and integrated circuit technique combined.Owing to having the advantage such as high integration, high reliability, Intelligent Power Module wins increasing market, being particularly suitable for the frequency converter of drive motors and various inverter, is frequency control, metallurgical machinery, electric traction, servo-drive, power electronic device that frequency-conversion domestic electric appliances is conventional.
The structure of existing Intelligent Power Module is as shown in Fig. 1 (A), Fig. 1 (B) and Fig. 1 (C).Fig. 1 (A) is the vertical view of existing Intelligent Power Module 100, Fig. 1 (B) is X-X ' the line profile of Fig. 1 (A), Fig. 1 (C) is the schematic diagram after Fig. 1 (A) removes resin, and Fig. 1 (D) is the schematic diagram that described Intelligent Power Module is arranged on aluminium radiator.
As shown in Fig. 1 (A), Fig. 1 (B) and Fig. 1 (C), existing Intelligent Power Module 100 has following structure, and it comprises: aluminium base 103; Be located at the described wiring 105 that the insulating barrier 104 on described circuit substrate 103 surface is formed; Be covered in the solder mask 106 of described insulating barrier 104 and described wiring 105 ad-hoc location; Power component 109 on described wiring 105 and non-power element 108 is fixed on by tin cream 107; Connect the metal wire 110 of described non-power element 108, described power component 109 and described wiring 105; The pin 101 be connected with described wiring 105; At least one side of described aluminium base 103 is sealed by sealing resin 102, in order to improve sealing and insulating properties, aluminium base 103 all can be sealed, and in order to improve thermal diffusivity, seals under the back side of described aluminium base 103 can be made to be exposed to outside state.
Because described Intelligent Power Module 100 is generally operational in hot environment, and described power component 109 operationally can send a large amount of heat, cause the junction temperature of described power device 109 very high, although described aluminium base 103 has thermolysis, but because the existence of described insulating barrier 104, cause the overall thermal resistance of described Intelligent Power Module 100 higher.
Intelligent Power Module long-term work at high temperature, seriously can reduce useful life, and the stability of performance can be affected, in extreme circumstances, can cause Intelligent Power Module in the course of the work because of the overheated and out of control blast of internal components, cause casualties and property loss.
Summary of the invention
Main purpose of the present invention is to provide a kind of Intelligent Power Module and the manufacture method thereof with the guarantee of good radiating effect, effect of heat insulation and electric insulation.
In order to achieve the above object, the present invention proposes a kind of Intelligent Power Module, comprise wiring, be arranged on power component and the non-power element in described wiring precalculated position, and as the aluminium base of carrier, the one side of described aluminium base is coated with insulating barrier as front, and described wiring is arranged on the one side away from described aluminium base on described insulating barrier; The another side of described aluminium base, as the back side, is provided with papery radiating fin, described aluminium base is provided with the heat insulation structural for separating described power component and described non-power element.
Preferably, described heat insulation structural is the through hole formed at described aluminium base ad-hoc location.
Preferably, described radiating fin is at least 5mm apart from the distance at each edge of described aluminium base.
Preferably, this Intelligent Power Module also comprises for connecting described wiring, described power component and described non-power element to form the metal wire of related circuit.
Preferably, this Intelligent Power Module also comprises and is configured in described power model edge, is connected and stretches out as the pin of input and output with described wiring.
Preferably, described wiring, described power component and non-power element, metal wire, and the coupling part of described pin and wiring is by resin-encapsulated.
Preferably, described pin is fixed on the precalculated position of described wiring.
Preferably, described radiating fin is wet type carbon composite functional paper; The thickness of described radiating fin is 0.5mm ~ 1.5mm.
The invention allows for a kind of manufacture method of Intelligent Power Module, comprise the following steps:
Form the aluminium base with heat insulation structural, cover insulating barrier in the front of described aluminium base, form wiring at surface of insulating layer, cover ready-made radiating fin at the back side of described aluminium base;
At surface-mounted power component, the non-power element of described wiring, and assemble ready-made pin in the precalculated position of described wiring;
Corresponding circuit is connected to form by between described power component, non-power element and described wiring by metal wire;
By sealing resin, the front of described aluminium base is sealed.
Preferably, describedly also to be comprised before being connected to form the step of corresponding circuit between described power component, non-power element and described wiring by metal wire:
The aluminium base being equipped with each element is placed in cleaning machine clean.
Preferably, the described surface-mounted power component at wiring, non-power element, and also comprise before the step of assembling ready-made pin in the precalculated position of described wiring:
Make the pin independently with coating; Specifically comprise: choose Copper base material, Copper base material is passed through to the mode of punching press or etching, make independently pin; Form nickel dam and nickeltin layer successively at described pin surface, obtain the pin being with coating;
Preferably, also comprise after the described step front of described aluminium base sealed by sealing resin: the Trim Molding carrying out described pin, and carry out functions of modules test.
Preferably, described formation has the aluminium base of heat insulation structural, covers insulating barrier in the front of described aluminium base, and form wiring at surface of insulating layer, the step covering ready-made radiating fin at the back side of described aluminium base comprises:
The aluminium base of preliminary dimension is chosen according to the circuit layout of setting;
In the front of aluminium base, use insulating material and copper material, by the mode of hot pressing, make insulating material be formed at described aluminium base surface and as described insulating barrier, make copper material be formed at the surface of described insulating barrier as copper foil layer;
Eroded by the ad-hoc location of described copper foil layer, remainder forms wiring;
Heat insulation structural is formed at the ad-hoc location processing through hole of aluminium base;
Use wet type carbon composite to form radiating fin, be adhered to the back side of described aluminium base by high temperature resistant glue.
The described surface-mounted power component at wiring, non-power element, and the step of assembling ready-made pin in the precalculated position of described wiring comprises:
By tin cream or elargol, described power component, non-power element and pin are fixed.
The Intelligent Power Module that the present invention proposes and manufacture method thereof, papery radiating fin is introduced in Intelligent Power Module, substantially increase area of dissipation, insulating barrier can meet described power component cooling requirements without the need to using highly heat-conductive material, in application process, outside without the need to connecing radiator again, reduce application difficulty and application cost, improve assembling quality; Between power component and non-power element, there is heat insulation structural, effectively can stop the rising of non-power element junction temperature; And the present invention's radiating fin used is high-heat-conductance insulating paper material, with sealing resin compact siro spinning technology, good electric insulation guarantee is formed to the wiring of power model internal circuit, power component and non-power element; Radiator structure is paper material, lightweight, and Intelligent Power Module overall weight reduces, and is convenient to long-distance transport and workman's assembling; Intelligent Power Module provided by the invention has good radiating effect, effect of heat insulation and electric insulation guarantee.
Accompanying drawing explanation
Fig. 1 (A) is the vertical view of existing Intelligent Power Module;
Fig. 1 (B) is X-X ' the line profile of Fig. 1 (A);
Fig. 1 (C) is the schematic diagram after Fig. 1 (A) removes resin;
Fig. 1 (D) is the schematic diagram that existing Intelligent Power Module is arranged on aluminium radiator;
Fig. 2 (A) is the vertical view of embodiment of the present invention Intelligent Power Module preferred embodiment;
Fig. 2 (B) is the sectional view of the X-X ' line of Fig. 2 (A);
Fig. 2 (C) is the schematic diagram after Fig. 2 (A) removes resin;
Fig. 2 (D) is the upward view of embodiment of the present invention Intelligent Power Module preferred embodiment;
Fig. 3 (A) is the front view of aluminium base in the embodiment of the present invention first operation;
Fig. 3 (B) is the sectional view of the X-X ' line of Fig. 3 (A);
Fig. 3 (C) is the schematic diagram forming insulating barrier and copper foil layer in the front of aluminium base;
Fig. 3 (D) is the schematic diagram forming wiring on the copper foil layer shown in Fig. 3 (C);
Fig. 3 (E) is the sectional view of the X-X ' line of Fig. 3 (D);
Fig. 3 (F) is the schematic diagram forming radiating fin;
Fig. 3 (G) is the schematic diagram covering ready-made radiating fin in the embodiment of the present invention first operation at the back side of described aluminium base;
Fig. 4 (A) is the schematic diagram making pin in a row in the embodiment of the present invention second operation;
Fig. 4 (B) is the structural representation of single pin in Fig. 4 (A);
Fig. 4 (C) is the single pin schematic diagram with radian;
Fig. 5 (A) is in the embodiment of the present invention the 3rd operation, the end view of the Intelligent Power Module of assembling power component, non-power element and pin;
Fig. 5 (B) is the vertical view of Fig. 5 (A);
Fig. 6 (A) is in the embodiment of the present invention the 5th operation, is made power component by metal wire, is formed the end view of connection between non-power element and wiring;
Fig. 6 (B) is the vertical view of Fig. 6 (A);
Fig. 7 (A) is in the embodiment of the present invention the 6th operation, the end view of the mould of use;
Fig. 7 (B) is in the embodiment of the present invention the 6th operation, uses mould by the profile of sealing resin sealed aluminum substrate;
Fig. 8 is in the embodiment of the present invention the 7th operation, the schematic diagram of pin Trim Molding;
Fig. 9 is the manufacture method flow chart of the Intelligent Power Module of the embodiment of the present invention.
In order to make technical scheme of the present invention clearly, understand, be described in further detail below in conjunction with accompanying drawing.
Embodiment
Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
As previously mentioned, existing Intelligent Power Module due to radiating effect not good, long-term work at high temperature, serious can reduce its useful life, and can affect the stability of intelligent object performance.
The present invention considers, in specific application scenarios such as convertible frequency air-conditioners, although high heat conductive insulating layer and increase radiator can solve the heat dissipation problem of Intelligent Power Module, but, high heat conductive insulating layer is selected to dispel the heat, cost is very high on the one hand, another aspect mix and cause Intelligent Power Module hardness very large a large amount of because high heat conductive insulating layer employs, thus adds the manufacture difficulty of Intelligent Power Module; If increase radiator in Intelligent Power Module inside, by power component attachment on a heat sink, can the cost of raw material be increased on the one hand, too increase the technology difficulty of Intelligent Power Module on the other hand; If increase radiator in Intelligent Power Module outside, cause to I haven't seen you for ages following 2 unfavorable: on the one hand add assembly difficulty and overall weight; If aluminium base all seals on the other hand, although the sealing of improve and insulating properties, but the overall thermal resistance of described Intelligent Power Module can increase further, if the back side of aluminium base seals under being exposed to outside state, although raising thermal diffusivity, aluminium base and aluminium radiator all can not provide electric insulation guarantee.These have all manufactured difficulty to the application of Intelligent Power Module, are unfavorable for that the market of Intelligent Power Module is popularized.
Based on above-mentioned consideration, the embodiment of the present invention is by introducing papery radiating fin at the back side of aluminium base, the elements such as insulating barrier, wiring, power component, non-power element are formed in the front of aluminium base, and completing orderly processing, area of dissipation greatly increases, and insulating barrier can meet described power component cooling requirements without the need to using highly heat-conductive material, in application process, outside without the need to connecing radiator again, reduce application difficulty and application cost, assembling quality is provided; Between power component and non-power element, there is heat insulation structural, effectively can stop the rising of non-power element junction temperature; And, the present invention's radiating fin used is high-heat-conductance insulating paper material, with sealing resin compact siro spinning technology, good electric insulation guarantee is formed to the wiring of power model internal circuit, power component and non-power element, make Intelligent Power Module stable performance, and then improve the reliability of Intelligent Power Module.
Particularly, shown in Fig. 2 (A), Fig. 2 (B), Fig. 2 (C) and Fig. 2 (D), a kind of Intelligent Power Module 200 that the embodiment of the present invention proposes, the present embodiment for have bridge heap, compressor inversion, Active PFC, blower fan invert function Intelligent Power Module 200 be described, for the application scenario not needing blower fan invert function, removed by blower fan Converting Unit, other parts are identical.
The present embodiment Intelligent Power Module 200 comprises as the aluminium base 203 of carrier, wiring 205, the power component 209 being arranged on described wiring 205 precalculated position and non-power element 208; Wherein:
Described aluminium base is provided with the heat insulation structural 212 for separating described power component 209 and described non-power element 208.
The one side of described aluminium base 203 is as front, and another side is as the back side.
Be coated with insulating barrier 204 in the front of aluminium base 203, described wiring 205 is arranged on the one side away from aluminium base 203 on described insulating barrier 204.
At the back side of described aluminium base 203, be provided with papery radiating fin 203A.
At this, described heat radiation radiating fin 203A can not cover the back side of described aluminium base 203 completely, needs the smooth position of flowing out at least 5mm at the edge at the back side of described aluminium base 203.
Wherein, radiating fin 203A can adopt wet type carbon composite functional paper.
Described aluminium base 203 can be bonding by high temperature glue with described radiating fin 203A.
In the present embodiment, described wiring 205, described power component 209 and non-power element 208, metal wire 210, and described pin 201 is encapsulated by sealing resin 202 with the coupling part of wiring 205, only has pin 201 part to expose.
(subsequent detailed).
In addition, described Intelligent Power Module 200 also comprises: for connecting described wiring 205, described power component 209 and described non-power element 208 to form the metal wire 210 of related circuit.
At this, the circuit of described power component 209, described non-power element 208, described wiring 205, described metal wire 210 composition, there is bridge heap, compressor inversion and Active PFC function, or there is bridge heap, compressor inversion, Active PFC and blower fan invert function, all heating circuits of the applications such as convertible frequency air-conditioner are concentrated in together and dispels the heat simultaneously; The present embodiment for have bridge heap, compressor inversion, Active PFC, blower fan invert function Intelligent Power Module 200 be described, for the application scenario not needing blower fan invert function, removed by blower fan Converting Unit, other parts are identical.
In addition, described Intelligent Power Module 200 also comprises: be configured in described power model edge, be connected and stretch out as the pin 201 of input and output with described wiring 205.
At this, according to Intelligent Power Module 200 internal circuit layout and peripheral applications needs, described pin 201 can be configured at an edge, two edges, three edges or four edges of Intelligent Power Module 200.
Below elaborate each inscape of embodiment of the present invention Intelligent Power Module 200:
Wherein, papery radiating fin 203A is wet type carbon composite functional paper, can become graphite by powder with the Fiber Shape Carbon Material Compound Machining, this wet type carbon composite can tolerate the high temperature of more than 350 DEG C and can be folded into arbitrary shape as required, obtains described heat radiation radiating fin 203A.In order to improve corrosion resistance and waterproof, water-proofing treatment can be carried out in surface.
Wherein, the two sides of aluminium base 203 is smooth, and the out-of-shape of the radiating fin 203A that dispels the heat; In order to increase mechanical strength, described papery radiating fin 203A have employed thicker wet type carbon composite, and thickness can be designed to 1.5mm, in order to reduce costs and increase the density of gauffer, described radiating fin 203A have employed thinner wet type carbon composite, and thickness can be designed to 0.5mm.At this, described aluminium base 203 there is the back side that described radiating fin 203A and smooth one side thereof be called described aluminium base 203, opposite face is called the surface of described aluminium base 203.At this, described wrinkled portion can not cover the back side of described aluminium base 203 completely, needs the smooth position reserving at least 5mm at the edge of the backside heat fin 203A of described aluminium base 203.
Described insulating barrier 204 can add the doping such as silicon dioxide, silicon nitride, carborundum to improve thermal conductivity, and at this, doping can be spherical or dihedral, by hot pressing mode, is pressed together on the surface of described aluminium base 203, i.e. front.
Described wiring 205 is made up of metals such as copper, is formed at the ad-hoc location on described insulating barrier 204, according to power needs, the thickness of 0.035mm or 0.07mm etc. can be designed to, for general Intelligent Power Module, pay the utmost attention to and be designed to 0.07mm, in the present embodiment, adopt the thickness of 0.07mm.Described solder mask (being commonly called as green oil) 206 is a kind of protective layers, be coated in wiring 205 do not need weld circuit and insulating barrier 204 on.
Described power component 209 and non-power element 208 are fixed on the circuit described wiring 205 being formed regulation.At this, described power component 209 adopts the elements such as IGBT pipe, high-voltage MOSFET pipe, high pressure FRD pipe, and described power component 209 is connected with wiring 205 grade by metal wire 210; Described non-power element 208 adopts active element or the passive components such as electric capacity or resistance such as integrated circuit, transistor or diode, and the active element etc. installed that faces up is connected with wiring 205 by metal wire 210.
Aluminium base 203 is provided with hot heat insulation structural 212 of isolating is carried out to described power component 209 and described non-power element 208.Described heat insulation structural 212 is the circle with specific configuration or square through hole that are formed on the ad-hoc location of aluminium base 203 by the method for chemical corrosion or machining.
Described metal wire 210 can be aluminum steel, gold thread or copper cash, surely making between each power component 209 by nation, between each non-power element 208, between each wiring 205, set up electrical connection, sometimes also setting up electrical connection for making between described pin 201 and described wiring 205 or described power component 209, non-power element 208.
Described pin 201 is fixed on the ad-hoc location be located on described wiring 205, and it has the effect such as carrying out with outside inputting, exporting.At this, be designed to be provided with many pins 201, pin 201 and wiring 205 are by the electrical binding agent welding of the conductions such as scolding tin.Described pin 201 generally adopts the metals such as copper to make, and copper surface forms one deck nickeltin layer by chemical plating and plating, and the thickness of alloy-layer is generally 5 μm, and coating can protect copper not to be corroded oxidation, and can improve weldability.
Described resin 202 uses the molded injection mould mode that also can use of thermosetting resin to use thermoplastic resin to be molded by transfer die mode.At this, described resin 202 seals all elements on described aluminium base 203 upper surface completely.
Compared to existing technology, the Intelligent Power Module 200 of the embodiment of the present invention has following beneficial effect:
1, because the back side of Intelligent Power Module 200 of the present invention has heat radiation radiating fin 203A, area of dissipation greatly increases, the cooling requirements of insulating barrier 204 without the need to using highly heat-conductive material can meet power component 209.
2, Intelligent Power Module 200 is provided with bridge heap, compressor invert function, or has bridge heap, compressor inversion, blower fan invert function, all heating circuits of the applications such as convertible frequency air-conditioner is concentrated in together and dispels the heat simultaneously.
3, the present invention's radiating fin used is high-heat-conductance insulating paper material, with sealing resin compact siro spinning technology, forms good electric insulation guarantee to the wiring of power model internal circuit, power component and non-power element.
4, between power component and non-power element, there is heat insulation structural, effectively can stop the rising of non-power element junction temperature.
5, radiator structure is paper material, lightweight, and Intelligent Power Module 200 overall weight is reduced, and is convenient to long-distance transport and workman's assembling; Because Intelligent Power Module of the present invention itself possesses radiating fin, so in application process, outside without the need to connecing radiator again, reduce application difficulty and application cost, assembling quality is provided.
From the above, Intelligent Power Module 200 of the present invention, reducing costs simultaneously, possesses good radiating effect and effect of heat insulation, improves its reliability.And can be designed to define compatibility with existing Intelligent Power Module 200 function and pin 201, be convenient to applying of Intelligent Power Module 200.
In addition, one embodiment of the invention also proposes a kind of Intelligent Power Module 200 manufacture method, comprising:
Step S1, forms the aluminium base 203 with heat insulation structural 212, covers insulating barrier 204 in the front of described aluminium base 203, in insulating barrier 204 circuit forming surface wiring 205, covers ready-made radiating fin 203A at the back side of described aluminium base 203;
Particularly, the aluminium base 203 of preliminary dimension is chosen according to the circuit layout of setting.
The through hole with specific configuration formed on the ad-hoc location of aluminium base 203 by the method for chemical corrosion or machining forms heat insulation structural 212, through hole is in the present embodiment square through hole, also can be set to the circular through hole waiting other shapes in other real-time example.
In the front of aluminium base 203, use insulating material and copper material, by the mode of hot pressing, make insulating material be formed at the surface of described aluminium base 203 and as described insulating barrier 204, make copper material be formed at the surface of described insulating barrier 204 as copper foil layer.
Then, eroded by the ad-hoc location of copper foil layer, remainder forms wiring 205.
Step S2, at surface-mounted power component 209, the non-power element 208 of described wiring 205, and assembles ready-made pin 201 in the precalculated position of described wiring 205;
Step S3, is connected to form corresponding circuit by metal wire 210 by between described power component 209, non-power element 208 and described wiring 205;
Step S4, is sealed the front of described aluminium base 203 by sealing resin 202.
Further, can also comprise before step S3:
Step S5, is placed in cleaning machine by the aluminium base 203 being equipped with each element and cleans.
Further, can also comprise before step S2:
Step S6, makes the pin 201 independently with coating.
Particularly, first, choose Copper base material, Copper base material is passed through to the mode of punching press or etching, make multiple independent pin 201.
Then, form nickel dam and nickeltin layer successively on described pin 201 surface, obtain the pin 201 being with coating.
Further, also comprise after above-mentioned steps S5:
Step S7, carries out the Trim Molding of described pin 201, and carries out functions of modules test.
Referring to accompanying drawing, the manufacturing process to the present embodiment Intelligent Power Module 200 is described in detail:
As a kind of preferred embodiment, the manufacture method of Intelligent Power Module 200 of the present invention can comprise: form the aluminium base 203 with heat insulation structural 212, the operation of dispelling the heat radiating fin 203A, pin 201, pressing insulating barrier 204 is formed the operation of wiring 205, solder mask 206; The operation of allocating power element 209, non-power element 208 and pin 201 on wiring 205; The operation of cleaning; The operation of described non-power element 208, power component 209 and described wiring 205 is connected with metal wire 210; Use resin 202 to inject mould and be molded the operation that above-mentioned key element seals by mode; Carry out the operation of functional test.Concrete process chart as shown in Figure 9.
The details of each operation below illustrated.
First operation: with reference to Fig. 3 (A), Fig. 3 (B), Fig. 3 (C), Fig. 3 (D), Fig. 3 (E), Fig. 3 (F) and Fig. 3 (G).
Fig. 3 (A) is the front view of aluminium base in the embodiment of the present invention first operation;
Fig. 3 (B) is the sectional view of the X-X ' line of Fig. 3 (A);
Fig. 3 (C) is the schematic diagram forming insulating barrier and copper foil layer in the front of aluminium base;
Fig. 3 (D) is the schematic diagram forming wiring on the copper foil layer shown in Fig. 3 (C);
Fig. 3 (E) is the sectional view of the X-X ' line of Fig. 3 (D);
Fig. 3 (F) is the schematic diagram forming radiating fin;
Fig. 3 (G) is the schematic diagram covering ready-made radiating fin in the embodiment of the present invention first operation at the back side of described aluminium base.
First operation of the embodiment of the present invention be formed sizeablely at ad-hoc location, there is heat insulation structural 212, the back side has wet type carbon composite and forms the operation that papery radiating fin 203A and front have the aluminium base 203 of wiring 205.
First, with reference to Fig. 3 (A) and the sectional view 3 (B) of X-X ' line prolonging Fig. 3 (A), the sizeable aluminium base 203 of circuit layout design as required, for general Intelligent Power Module, the size of one piece can choose 64mm × 30mm, thickness is 1.5mm, carries out as anodised corrosion protection process two sides.
With reference to figure 3 (C), use insulating material and the copper material with dihedral or spherical doping, by while hot pressing mode, make insulating material be formed at the surface of described aluminium base 203 and be formed at described insulating barrier 204 surface as copper foil layer 205A as described insulating barrier 204, copper material.At this, in order to improve voltage endurance, the thickness of described insulating barrier 204 can be designed as 110 μm, and in order to improve heat dissipation characteristics, the thickness of described insulating barrier 204 can be designed as 70 μm.At this, in order to improve through-current capability, the thickness of described copper foil layer 205A can be designed to 0.07mm, and in order to reduce costs, the thickness of described copper foil layer 205A can be designed to 0.035mm or 0.0175mm.
With reference to figure 3 (D) and the sectional view 3 (E) of X-X ' line prolonging Fig. 3 (D), eroded by the ad-hoc location of copper foil layer 205A, remainder is wiring 205.Being diffused into prevent the solder of follow-up welding sequence the position that wiring 205 does not need welding, not needing at insulating barrier 204 and wiring 205 circuit of welding applies solder mask 206.In order to isolate carrying out heat between power component 209 and non-power element 208, the method for machine drilling is adopted to form heat insulation structural 212 at the ad-hoc location processing through hole of aluminium base 203.
With reference to figure 3 (F), the wet type carbon composite that thickness is 0.5mm is used to be formed irregularly shaped, as described radiating fin 203A.Two sides is carried out as applied the corrosion protection of marine glue, water-proofing treatment.
With reference to figure 3 (G), use the high temperature resistant glue of tolerable temperature more than 300 DEG C, described radiating fin 203A is sticked to the back side of described aluminium base 203, at this, the wrinkled portion of described radiating fin 203A can not cover the back side of described aluminium base 203 completely, needs at the edge at the back side of described aluminium base 203 the smooth position reserving at least 5mm.
Second operation: with reference to Fig. 4 (A), Fig. 4 (B) and Fig. 4 (C).
Fig. 4 (A) is the schematic diagram making pin in a row in the embodiment of the present invention second operation; Fig. 4 (B) is the structural representation of single pin in Fig. 4 (A); Fig. 4 (C) is the single pin schematic diagram with radian.
Second operation of the present invention is the operation of the pin 201 made independently with coating.
Each pin 201 is by Copper base material, and by the mode of punching press or etching, make the row's pin 201 as shown in Fig. 4 (A), in the present embodiment, pin 201 is connected by reinforcement 201A by independent pin units; As shown in Fig. 4 (B), independent pin units is length C is 25mm, and width K is 1.5mm, and thickness H is the strip of 1mm; Sometimes, for ease of assembling, also wherein certain radian is suppressed in one end at pin units, as shown in Fig. 4 (B);
Then nickel dam is formed by the method for chemical plating: by nickel salt and inferior sodium phosphate mixed solution, and with the addition of suitable complexing agent, nickel dam is formed on the copper material surface forming given shape, metallic nickel has very strong passivation ability, the very thin passivating film of one deck can be generated rapidly, the corrosion of air, alkali and some acid can be resisted.Nickel plating crystallization is superfine little, and nickel layer thickness is generally 0.1 μm;
Then by hydrosulphate technique; at room temperature the copper material forming shape and nickel dam is immersed in the plating solution with positive tin ion and is energized; form nickeltin layer on nickel dam surface, alloy-layer general control is at 5 μm, and the formation of alloy-layer greatly improves protectiveness and solderability.
3rd operation: with reference to Fig. 5 (A) and 5 (B).
Fig. 5 (A) is in the embodiment of the present invention the 3rd operation, the end view of the Intelligent Power Module of assembling power component, non-power element and pin; Fig. 5 (B) is the vertical view of Fig. 5 (A).
3rd operation of the present invention is the operation at the surface-mounted power component 209 of described wiring 205, non-power element 208 and pin 201.
First, by stencil printer, use steel mesh, tin cream application is carried out to the ad-hoc location of the described wiring 205 on described insulating barrier 204; At this, climbing tin height to improve, the steel mesh of 0.15mm thickness can be used, in order to reduce the risk of described power device 209 and non-power element 208 displacement, the steel mesh of 0.12mm thickness can be used.In the present embodiment, the height of the described power component 209 of use is 0.07mm, is the lightest components and parts, so steel mesh thickness selects the steel mesh of 0.12mm thickness.
Then, with reference to end view Fig. 5 (A) and vertical view Fig. 5 (B), carry out the installation of described power component 209, non-power element 208 and pin 201, described power component 209 and described non-power element 208 directly can be placed on the ad-hoc location of described wiring 205, pin 201 then one end will be placed on described wiring 205 ad-hoc location, the other end needs carrier 211 to be fixed, and described carrier 211 is made by materials such as synthesis stones.At this, described carrier 211 needs to carry out bottom hollow out process, and described radiating fin 203A is exposed.
Then, be put in described above-mentioned element on described carrier 211 by Reflow Soldering, tin cream solidifies, and described power component 209, non-power element 208 and described pin 201 are fixed.
In said process, as a kind of optimal way, solution temperature can be selected to be the tin cream of 280 DEG C.
It should be noted that, in other embodiments, elargol or silver slurry can also be selected to replace above-mentioned tin cream.
4th operation:
4th operation of the present invention is the operation that the aluminium base of above-mentioned element has been installed in cleaning.
First described aluminium base is put into cleaning machine to clean, the foreign matters such as aluminum steel residual when the scaling powders such as the rosin remained during Reflow Soldering and punching press are cleaned, according to the arrangement density of described non-power element 208 at described wiring 205, clean by spray ultrasonic or both combine forms carry out.
5th operation: with reference to Fig. 6 (A) and Fig. 6 (B).
Fig. 6 (A) is in the embodiment of the present invention the 5th operation, is made power component, non-power element by metal wire, is formed the end view of connection between aluminium base and wiring, and Fig. 6 (B) is the vertical view of Fig. 6 (A).
5th operation of the present invention is by nation's alignment, makes described power component 209, forms the operation of electrical connection between non-power element 208 and described wiring 205.
According to through-current capability needs, select the aluminum steel of suitable diameter as nation's alignment, for the integrated circuit for signal controlling, also can consider to use gold thread as nation's alignment.In the present embodiment, all select aluminum steel, in general, the nation of described power component 209 is used surely to the aluminum steel of 350 μm ~ 400 μm, the nation of described non-power element 208 is used surely to the aluminum steel of 38 μm ~ 200 μm.
Goods after this operation completes are referring to end view Fig. 6 (A) and vertical view Fig. 6 (B).
6th operation: with reference to Fig. 7 (A) and Fig. 7 (B).
Fig. 7 (A) is in the embodiment of the present invention the 6th operation, the end view of the mould of use, and Fig. 7 (B) is in the embodiment of the present invention the 6th operation, uses mould by the profile of sealing resin sealed aluminum substrate.
6th operation seals by sealing resin 202 half-finished operation that described aluminium base 203 and the above-mentioned element installed form thereon.
The described semi-finished product configuring pin 201 are transported to mould 213.By making the specific part of pin 201 contact with holddown groove 214, position.
During matched moulds, in the die cavity being formed at mould 213 inside, place described semi-finished product, then inject sealing resin 202 by cast gate 215.The method carrying out sealing can adopt and use the transfer die of thermoplastic resin to be molded or to use the injection mould of thermosetting resin to be molded.At this, the smooth edge privileged site of described papery radiating fin 203A is close on counterdie, in order to strengthen laminating, also can increase thimble at patrix.
7th operation: with reference to Fig. 8
Fig. 8 is in the embodiment of the present invention the 7th operation, the schematic diagram of pin Trim Molding;
The present invention the 7th operation is the operation of carrying out described pin 11 Trim Molding and carrying out functions of modules test, and Intelligent Power Module completes as goods through operation thus.
In front operation and transfer die sealing process, other parts except described pin 201 are all sealed by described resin 202.External pin 201, according to the length used and shape needs, such as, cuts off in the position of dotted line 216, sometimes also can be bent into definite shape, be convenient to follow-up assembling by this operation.
Then module is put into testing equipment, carry out conventional electric parameters testing, generally comprise the test events such as dielectric voltage withstand, quiescent dissipation, delay time, test passes person is finished product.
Utilize above-mentioned operation, complete the Intelligent Power Module 200 shown in Fig. 2.
The Intelligent Power Module that the present invention proposes and manufacture method thereof, papery radiating fin is introduced in Intelligent Power Module, substantially increase area of dissipation, insulating barrier can meet described power component cooling requirements without the need to using highly heat-conductive material, in application process, outside without the need to connecing radiator again, reduce application difficulty and application cost, improve assembling quality; Between power component and non-power element, there is heat insulation structural, effectively can stop the rising of non-power element junction temperature; And the present invention's radiating fin used is high-heat-conductance insulating paper material, with sealing resin compact siro spinning technology, good electric insulation guarantee is formed to the wiring of power model internal circuit, power component and non-power element; Radiator structure is paper material, lightweight, and Intelligent Power Module overall weight reduces, and is convenient to long-distance transport and workman's assembling; Intelligent Power Module provided by the invention has good radiating effect, effect of heat insulation and electric insulation guarantee.
Above are only the preferred embodiments of the present invention; not thereby the scope of the claims of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.

Claims (13)

1. an Intelligent Power Module, comprise wiring, be arranged on power component and the non-power element in described wiring precalculated position, it is characterized in that, also comprise: as the aluminium base of carrier, the one side of described aluminium base is coated with insulating barrier as front, described wiring is arranged on the one side away from described aluminium base on described insulating barrier, the another side of described aluminium base is as the back side, being provided with papery radiating fin, described aluminium base being provided with the heat insulation structural for separating described power component and described non-power element.
2. Intelligent Power Module according to claim 1, is characterized in that, described heat insulation structural is the through hole formed at described aluminium base ad-hoc location.
3. Intelligent Power Module according to claim 1 and 2, is characterized in that, described radiating fin is at least 5mm apart from the distance at each edge of described aluminium base.
4. Intelligent Power Module according to claim 3, is characterized in that, also comprises for connecting described wiring, described power component and described non-power element to form the metal wire of related circuit.
5. Intelligent Power Module according to claim 4, is characterized in that, also comprises being configured in described power model edge, being connected and stretching out as the pin of input and output with described wiring.
6. Intelligent Power Module according to claim 5, is characterized in that, described wiring, described power component and non-power element, metal wire, and the coupling part of described pin and wiring is by resin-encapsulated.
7. Intelligent Power Module according to claim 1, is characterized in that, described radiating fin is wet type carbon composite functional paper; The thickness of described radiating fin is 0.5mm ~ 1.5mm.
8. an Intelligent Power Module manufacture method, is characterized in that, comprises the following steps:
Form the aluminium base with heat insulation structural, cover insulating barrier in the front of described aluminium base, form wiring at surface of insulating layer, cover ready-made radiating fin at the back side of described aluminium base;
At surface-mounted power component, the non-power element of described wiring, and assemble ready-made pin in the precalculated position of described wiring;
Corresponding circuit is connected to form by between described power component, non-power element and described wiring by metal wire;
By sealing resin, the front of described aluminium base is sealed.
9. Intelligent Power Module manufacture method according to claim 8, is characterized in that, is describedly also comprised before being connected to form the step of corresponding circuit between described power component, non-power element and described wiring by metal wire:
The aluminium base being equipped with each element is placed in cleaning machine clean.
10. Intelligent Power Module manufacture method according to claim 8, it is characterized in that, the described surface-mounted power component at wiring, non-power element, and also comprise before the step of assembling ready-made pin in the precalculated position of described wiring:
Make the pin independently with coating; Specifically comprise:
Choose Copper base material, Copper base material is passed through to the mode of punching press or etching, make independently pin;
Form nickel dam and nickeltin layer successively at described pin surface, obtain the pin being with coating.
11. Intelligent Power Module manufacture methods according to claim 10, is characterized in that, also comprise after the described step sealed in the front of described aluminium base by sealing resin:
Carry out the Trim Molding of described pin, and carry out functions of modules test.
12. Intelligent Power Module manufacture methods according to Claim 8 according to any one of-10, it is characterized in that, described formation has the aluminium base of heat insulation structural, insulating barrier is covered in the front of described aluminium base, form wiring at surface of insulating layer, the step covering ready-made radiating fin at the back side of described aluminium base comprises:
The aluminium base of preliminary dimension is chosen according to the circuit layout of setting;
In the front of aluminium base, use insulating material and copper material, by the mode of hot pressing, make insulating material be formed at described aluminium base surface and as described insulating barrier, make copper material be formed at the surface of described insulating barrier as copper foil layer;
Eroded by the ad-hoc location of described copper foil layer, remainder forms wiring;
Heat insulation structural is formed at the ad-hoc location processing through hole of aluminium base;
Use wet type carbon composite to form radiating fin, be adhered to the back side of described aluminium base by high temperature resistant glue.
13. Intelligent Power Module manufacture methods according to claim 12, it is characterized in that, the described surface-mounted power component at wiring, non-power element, and the step of assembling ready-made pin in the precalculated position of described wiring comprises:
By tin cream or elargol, described power component, non-power element and pin are fixed.
CN201510129259.0A 2015-03-23 2015-03-23 Intelligent power module and its manufacture method Expired - Fee Related CN104795378B (en)

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CN106684002A (en) * 2016-11-28 2017-05-17 广东美的制冷设备有限公司 Intelligent power module and preparation method therefor, and power electronic equipment
CN109411429A (en) * 2018-10-31 2019-03-01 广东美的制冷设备有限公司 Intelligent power module and preparation method, electric appliance
CN109411430A (en) * 2018-10-31 2019-03-01 广东美的制冷设备有限公司 Intelligent power module and preparation method, electric appliance
CN114115081A (en) * 2021-12-31 2022-03-01 北京中航智科技有限公司 High-power-density servo driver

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CN102263197A (en) * 2011-07-22 2011-11-30 江苏物联网研究发展中心 Novel miniature thermoelectric generator and manufacturing method
CN102484103A (en) * 2009-08-31 2012-05-30 阿波制纸株式会社 Paper sheet radiator
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CN102484103A (en) * 2009-08-31 2012-05-30 阿波制纸株式会社 Paper sheet radiator
CN101963295A (en) * 2010-07-07 2011-02-02 杨东佐 LED (Light Emitting Diode) integrated structure, manufacturing method, lamp, display screen, backlight device, projecting device and injection mould of forming plastic part
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CN106684002A (en) * 2016-11-28 2017-05-17 广东美的制冷设备有限公司 Intelligent power module and preparation method therefor, and power electronic equipment
CN109411429A (en) * 2018-10-31 2019-03-01 广东美的制冷设备有限公司 Intelligent power module and preparation method, electric appliance
CN109411430A (en) * 2018-10-31 2019-03-01 广东美的制冷设备有限公司 Intelligent power module and preparation method, electric appliance
CN114115081A (en) * 2021-12-31 2022-03-01 北京中航智科技有限公司 High-power-density servo driver
CN114115081B (en) * 2021-12-31 2024-04-05 北京中航智科技有限公司 High-power density servo driver

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