CN104112719B - Hybrid integrated circuit module and manufacturing method thereof - Google Patents

Abstract

A hybrid integrated circuit module and its manufacturing method, the manufacturing method comprising: making a substrate, a heat sink, and a glass fiber board with through holes at preset positions, and covering one surface of the substrate with an insulating layer; The glass fiber board and the radiator are arranged on the surface of the insulating layer; the circuit wiring layer is arranged on the surface of the glass fiber board; power elements and non-power elements are respectively arranged on the radiator and corresponding positions of the circuit wiring layer; Metal wires are connected between the circuit wiring layer, the heat sink, the power element, and the non-power element. Improve the contact reliability of the bonding point, shorten the length of the bonding line and reduce the height difference of the bonding line can effectively reduce the probability of line punching during molding, so that the manufacturing pass rate and long-term reliability of the intelligent power module are improved. promote.

Description

Hybrid integrated circuit module and manufacturing method thereof

technical field

The invention belongs to the field of electronic device manufacturing technology, and in particular relates to a hybrid integrated circuit module and a manufacturing method thereof.

Background technique

Intelligent Power Module (IPM) is a power drive product that combines power electronics and integrated circuit technology. IPM integrates power switching devices and high-voltage drive circuits, and has built-in fault detection circuits such as overvoltage, overcurrent and overheating. On the one hand, the IPM receives the control signal from the MCU to drive the subsequent circuits to work, and on the other hand, sends the system status detection signal back to the MCU. Compared with the traditional discrete solution, IPM wins more and more markets with its advantages of high integration and high reliability. It is especially suitable for frequency converters and various inverter power supplies for driving motors. An ideal power electronic device for electric traction, servo drive, and frequency conversion home appliances.

The configuration of a conventional smart power module 100 will be described with reference to FIG. 1 . Fig. 1(A) is a top view of the smart power module 100, and Fig. 1(B) is a cross-sectional view along line X-X' of Fig. 1(A).

The intelligent power module 100 has the following structure, which includes: a circuit aluminum substrate 106; the circuit wiring 108 formed on the insulating layer 107 on the surface of the aluminum substrate 106; non-power element 104; heat sink 103 fixed on the circuit wiring 108; power element 109 fixed on the heat sink 103; connecting non-power element 104, the power element 109 and the circuit wiring 108 Metal wires 105; pins 101 connected to the circuit wiring 108; at least one side of the aluminum substrate 106 is sealed by a sealing resin 102. In order to improve the sealing performance, the aluminum substrate 106 will be completely sealed. In order to improve heat dissipation, the aluminum substrate 106 will be sealed. The aluminum substrate 106 is sealed with the rear surface exposed to the outside.

The intelligent power module 100 generally works in harsh working conditions, such as an outdoor unit of an inverter air conditioner, and the working environment temperature can reach 50°C in summer, while the power element 109, such as an IGBT (Insulated Gate Bipolar pole type transistor), etc., a large amount of heat will be generated during the working process, and the temperature of the power element 109 can reach above 120°C. ), plus the thickness of the power element 109 itself (generally 0.07 mm to 0.2 mm), therefore, the height difference between the upper surface of the power element 109 and the upper surface of the circuit wiring 108 generally reaches 2 mm, and the height difference The larger the distance, the greater the distance required to form a connection through the metal wire 105: the bond head needs a certain arc in the air, and in order to prevent the metal wire 105 from touching other elements, the vertical height difference H and the two fixed points The relationship between the horizontal distance L is roughly:

3H+N<L<5H+N (Formula 1)

Here, N is related to the bonding wire used and the bonding head of the bonding wire equipment. For general power components, 300-450 μm aluminum wire and its corresponding bonding head will be used for the bonding operation. At this time, the value of N The value should not be lower than 3mm, so it is necessary to make L>1.4H+3mm to ensure that the pass rate of the bonding wire meets the needs of mass production, such as: when H is 1mm, L needs to reach 6mm, and when H is 2mm, L needs to reach 9mm.

For a current smart power module, it has 6 power components, and each power component needs to keep a distance of more than 10.2mm from its corresponding wiring, which undoubtedly greatly increases the area of the smart power module and improves the manufacturing of the smart power module. Higher requirements have been put forward for the design of the subsequent electric control board, etc.; and the height difference H between the two bonded points is too high, which will increase the drop of the bonded line, and it is easy to cause line punching, Defects such as off-line. If off-line occurs, it can be detected during the test of the test equipment; and if the line is flushed, because the bonding line is still connected to the bonding point, it will be difficult to detect it through the test equipment. The bonding wire will eventually fall off, resulting in a greatly reduced service life of the intelligent power module. Because the power element is a key component of the intelligent power module, it is used to drive the follow-up compressor, motor, etc., and the off-line and out-of-control of the power element will cause the follow-up compressor or motor to run out of control, and in severe cases, the equipment will burn out;

Finally, because the height difference H is large, the requirements for the bonding process are high, and the control of the bonding pressure and ultrasonic energy is very strict. To produce the intelligent power module of the current design scheme, it is often necessary to purchase expensive bonding equipment. Undoubtedly, the manufacturing cost of the current smart power module is further increased.

Contents of the invention

The present invention aims to solve the deficiencies of the prior art, and provides a hybrid integrated circuit module that uses conductive substances to electrically connect the circuit wiring layer and the substrate, and solves the problem that the excessive height difference between the power element and the circuit wiring will cause the bonding line to be flushed , off-line and cause the problem of low product yield and reliability.

The present invention is achieved like this, a kind of hybrid integrated circuit module, comprises:

a substrate with one surface covered with an insulating layer;

A glass fiber board disposed on the surface of the insulating layer, wherein the glass fiber board is provided with a through hole at a predetermined position;

A heat sink that passes through the through hole and is exposed on the surface of the glass fiber board is provided on the surface of the insulating layer opposite to the through hole;

A circuit wiring layer formed on the surface of the fiberglass board;

The power element arranged on the heat sink and the non-power element arranged at the corresponding position of the circuit wiring layer;

Metal wires for connecting the circuit wiring layer, the heat sink, the power element and the non-power element.

The beneficial effects of the above-mentioned hybrid integrated circuit module are: since the heat sink is installed in the through hole of the glass fiber board, and the height of the heat sink is only slightly higher than the height of the glass fiber board, the heat sink and the power components assembled on the heat sink The height is slightly higher than that of the circuit wiring on the glass fiber board, so the distance between the radiator and the circuit wiring layer, the power element and the circuit wiring can be very small, which greatly reduces the area of the intelligent power module and reduces the raw materials of the intelligent power module Reduce the cost, improve the contact reliability of the bonding point, shorten the length of the bonding line and reduce the height difference of the bonding line can effectively reduce the probability of line punching during molding, so that the manufacturing pass rate and long-term reliability of the intelligent power module Sex is enhanced.

Another object of the present invention is to provide a method for manufacturing a hybrid integrated circuit module, comprising the following steps:

The process of making the substrate, heat sink, and glass fiber board with through-holes opened at preset positions, and covering one surface of the substrate with an insulating layer;

The process of arranging the glass fiber board and the heat sink on the surface of the insulating layer so that the heat sink passes through the through hole and is exposed on the surface of the glass fiber board;

The process of laying a circuit wiring layer on the surface of the fiberglass board;

The process of arranging power components and non-power components on the heat sink and corresponding positions of the circuit wiring layer respectively;

A step of connecting metal wires between the circuit wiring layer, the heat sink, the power element, and the non-power element.

Another object of the present invention is to provide a method for manufacturing a hybrid integrated circuit module, comprising the following steps:

The process of making the substrate;

The process of making a glass fiber board with a through hole at a preset position, and laying a circuit wiring layer on the surface of the glass fiber board;

The process of making a radiator and arranging power components on the radiator;

a process of arranging non-power components at corresponding positions of the circuit wiring layer;

Applying an insulating layer on the substrate, and arranging the glass fiber plate and the heat sink on the surface of the insulating layer, so that the heat sink passes through the through hole and is exposed on the surface of the glass fiber plate ;

A step of connecting metal wires between the circuit wiring layer, the heat sink, the power element, and the non-power element.

The beneficial effect of the manufacturing method of the above-mentioned hybrid integrated circuit module is that, on the premise of not increasing the production process, the difficulty of bonding wires is reduced by reducing the height difference of bonding points, and the process design requirements can be met without purchasing expensive bonding wire equipment, reducing the The manufacturing cost of the intelligent power module improves the production efficiency of the intelligent power module.

Description of drawings

FIG. 1(A) is a schematic top view of an existing intelligent power module;

Fig. 1 (B) is the X-X ' line sectional view of Fig. 1 (A);

Fig. 2 (A) is the top view of the hybrid integrated circuit module provided by the embodiment of the present invention;

Fig. 2 (B) is the sectional view along X-X ' line in Fig. 2 (A);

Fig. 2 (C) is the plane sectional view of Fig. 2 (A);

3(A) and 3(B) are the steps of setting the substrate in the manufacturing method provided by the embodiment of the present invention;

Fig. 4 (A), 4 (B) is the operation that glass fiber plate is set in the manufacturing method that the embodiment of the present invention provides;

Fig. 5 (A), 5 (B) is the process of laying circuit wiring on the surface of the glass fiber board in the manufacturing method provided by the embodiment of the present invention;

Fig. 6 is the process of setting a radiator in the manufacturing method provided by the embodiment of the present invention;

7(A) and 7(B) are the steps of setting power components on the radiator in the manufacturing method provided by the embodiment of the present invention;

8(A), 8(B) are the steps of setting pins in the manufacturing method provided by the embodiment of the present invention;

9(A) and 9(B) are the steps of setting non-power components and pins on the circuit wiring in the manufacturing method provided by the embodiment of the present invention;

10(A) and 10(B) are the steps of disposing an insulating layer on the substrate and disposing a heat sink on the insulating layer in the manufacturing method provided by the embodiment of the present invention;

11(A) and 11(B) are the steps of welding metal wires in the manufacturing method provided by the embodiment of the present invention;

Fig. 12 is the sealing process in the manufacturing method provided by the embodiment of the invention.

detailed description

In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

2 (A), 2 (B), 2 (C), as a hybrid integrated circuit module 10 in an embodiment, it includes a substrate 16, an insulating layer 17, a glass fiber board 21 (glass fiber board), heat dissipation device 13 , circuit wiring layer 18 , power element 19 , non-power element 14 and metal wire 15 .

One of the surfaces of the substrate 16 is covered with an insulating layer 17; a glass fiber board 21 is arranged on the surface of the insulating layer 17, wherein the glass fiber board 21 is provided with a through hole 22 at a predetermined position; the radiator 13 is arranged on the insulating layer 17 opposite The surface position of the through hole 22, and the radiator 13 passes through the through hole 12 and is exposed on the surface of the fiberglass board 21; the circuit wiring layer 18 is formed on the surface of the fiberglass board 21; the power element 19 is arranged on the radiator 13 The non-power components 14 are arranged at the corresponding positions of the circuit wiring layer 18; the metal wires 15 are used to connect the circuit wiring layer 18, the radiator 13, the power components 19 and the non-power components 14.

Further, in one embodiment, the hybrid integrated circuit module 10 also includes pins 11, the circuit wiring layer 18 includes pin pads 18A near the surface edge of the substrate 16, the pins 11 are connected to the pin pads 18A and automatically The base plate 16 extends outward.

Further, in one embodiment, the hybrid integrated circuit module 10 further includes a sealing layer 12, and the sealing layer covers all surfaces of the substrate 16 except the surface area opposite to the insulating layer 17, that is, except that shown in FIG. 2(B). all surfaces except the bottom surface shown.

In this embodiment, the substrate 16 is a rectangular plate made of aluminum such as 1100 material. In order to improve the corrosion resistance of the plate, the surface is sometimes anodized. In order to save manufacturing costs, in some applications that do not require high corrosion resistance, only the surface of the aluminum material can be brushed. The thickness of the substrate 16 can be Choose 1.5mm.

The insulating layer 17 can be made of red glue, which is refrigerated during storage, and it will form a semi-molten state after being restored at room temperature for several hours. It has certain fluidity and can be applied on the solid surface to form a thin layer. It has certain adhesion and can be used for stacking and placing solids The position is fixed and solidified after high temperature. In order to improve heat dissipation, red gum varieties filled with high concentration of alumina and other fillers can be used to improve thermal conductivity.

The glass fiber plate 21 is cut from a glass fiber plate, and the size is consistent with the substrate 16. A certain number of through holes 22 are opened at a specific position of the rectangular glass fiber plate 21. In this embodiment, 6 through holes are opened. The size of the through hole 22 can be designed as 7mm×5mm. In addition, in this embodiment, the four corners of the fiberglass board 21 are designed to be at right angles; in addition, because the fiberglass board 21 is generally brittle, the four corners can also be designed as rounded corners.

The circuit wiring layer 18 is made of metal such as copper, and is formed at a specific position on the fiberglass board 21. According to power requirements, it can be designed to have a thickness of 0.035 mm or 0.07 mm. For general hybrid integrated circuit modules 10, it is preferred to design it as 0.07mm. In addition, on the edge of the glass fiber board 21, the lead pad 18A which consists of the circuit wiring layer 18 is formed. Here, a plurality of aligned lead pads 18A are provided near one side of the fiberglass board 21 . According to functional requirements, a plurality of aligned lead pads 18A may also be provided near multiple sides of the fiberglass board 21 .

The heat sink 13 is made of copper. In order to improve the connection effect with the power element 19, the surface can be plated with silver, and the thickness of the silver can be 4-6 μm. The size of the radiator 13 is determined according to the size of the power element 19 and the required heat capacity. In this embodiment, it is designed to have an area of 6mm×4mm and a height of 1.1mm. Here, the horizontal cross-sectional area of the radiator 13 needs to be slightly smaller than that of the through hole 22 , and the vertical height of the radiator 13 in the direction of the substrate 16 needs to be slightly higher than the vertical height of the glass fiber plate 21 in the direction of the substrate 16 . For example, the vertical height difference between the surface of the heat sink 13 provided with the power element 19 and the surface of the circuit wiring layer 18 is 0.03 ± 0.01mm, and the vertical height difference between the surface of the power element 19 opposite to the heat sink 13 and the surface of the circuit wiring layer 18 0.1±0.02mm.

The non-power element 14 is fixed on the circuit wiring 18 to form a predetermined circuit. The non-power element 14 is an active element such as an integrated circuit, a transistor, or a diode, or a passive element such as a capacitor or a resistor. Here, the face-up mounted active elements and the like are connected to the circuit wiring layer 18 through the metal wire 15 .

The power element 19 is fixed on the heat sink 13 . The power element 19 is an IGBT tube, a high voltage MOSFET. (Metal-Oxide-Semiconductor Field Effect Transistor, Metal-Oxide-Semiconductor Field Effect Transistor) tube, a high voltage FRD (Fast Recovery Diode, fast recovery diode) tube and other components. Here, the heat sink 13 and the power element 19 are connected to the circuit wiring 18 and the like through the metal wire 15 .

The metal wires 15 can be aluminum wires, gold wires or copper wires, and are used to establish electrical connections between power elements 19, non-power elements 14, and circuit wiring layers 18 through bonding. An electrical connection relationship is established between the pin 11 and the circuit wiring layer 18 or the power element 19 and the non-power element 14 . When the metal wire is an aluminum wire, the diameter range of the metal wire connected between the circuit wiring layer 18 and the radiator 13 and the power element 19 is: 350 μm to 400 μm; the metal wire connected between the circuit wiring layer 18 and the non-power element 14 The diameter of 15 ranges from 38 μm to 200 μm.

The pin 11 is fixed on a pin pad 18A provided on one edge of the substrate 16 , and has a function of inputting and outputting with the outside. Here, it is designed that a plurality of pins 11 are provided on one side, and the pins 11 and the lead pads 18A are soldered with a conductive electrical adhesive such as solder. Pin 11 is generally made of copper and other metals. The copper surface forms a layer of nickel-tin alloy layer through electroless plating and electroplating. The thickness of the alloy layer is generally 5 μm. The plating layer can protect copper from corrosion and oxidation and improve solderability.

The sealing layer 12 may be molded using a thermosetting resin by transfer molding or may be molded using a thermoplastic resin by injection molding. Here, the sealing layer 12 completely seals all elements on the upper surface of the substrate 16 , and for the hybrid integrated circuit module 10 that requires high compactness, generally the entire substrate 16 is also sealed. In this embodiment, in order to improve the heat dissipation of the intelligent power module, the back surface of the circuit substrate 16 is exposed.

3 to 12, the manufacturing method of the hybrid integrated circuit module in an embodiment includes:

Making the substrate 16, the radiator 13 and the glass fiber plate 21 with the through hole 22 at the preset position, and covering the process of insulating layer 17 on one of the surfaces of the substrate 16; The glass fiber board 21 and the heat sink 13, the process of making the heat sink 13 pass through the through hole 22 and expose the surface of the glass fiber board 21; the process of laying a circuit wiring layer 18 on the surface of the glass fiber board 21; The process of arranging the power element 19 and the non-power element 14 on the heat sink 13 and the corresponding position of the circuit wiring layer 18 respectively; A step of connecting the metal wires 15 between the non-power elements 14 .

The manufacturing method of the hybrid integrated circuit module in another embodiment includes: the process of manufacturing the substrate 16; manufacturing a glass fiber board 21 with a through hole 22 at a preset position and laying a circuit wiring layer 18 on the surface of the glass fiber board 21 The process of making radiator 13 and disposing power element 19 on said radiator 13; the process of arranging non-power element 14 at the corresponding position of said circuit wiring layer 18; applying an insulating layer on said substrate 16 17, and the glass fiber plate 21 and the heat sink 13 are arranged on the surface of the insulating layer 17, and the heat sink 13 is exposed to the surface of the glass fiber plate 21 through the through hole 22; A step of connecting the metal wire 15 between the circuit wiring layer 18 , the heat sink 13 , the power element 19 , and the non-power element 14 .

It should be noted that the processes in the above two manufacturing methods of the hybrid integrated circuit module do not have to be executed in the order in which they are arranged, but each process can be exchanged or executed synchronously according to the actual situation. For example, the manufacturing processes of the substrate 16, the glass fiber board 21, and the radiator 13 can be performed in an exchanged order or synchronously, and so on for other processes.

Further, in one embodiment, the circuit wiring layer 18 includes the pin pad 18A near the surface edge of the substrate 16, after the process of laying the circuit wiring layer 18 on the surface of the glass fiber board 21 It also includes: the process of setting pins 11 , connecting the pins 11 to the pin pads 18A and extending outward from the substrate 16 .

Further, in one embodiment, after the process of connecting the metal wire 15 between the circuit wiring layer 18, the heat sink 13, the power element 19 and the non-power element 14, it further includes: connecting the A process of sealing all surfaces of the substrate 16 except the surface opposite to the insulating layer 17 .

Further, in one embodiment, after the step of arranging the non-power components 14 at the corresponding positions of the circuit wiring layer 18 , a step of cleaning the fiberglass board 21 is also included.

In a more detailed embodiment, each process of the manufacturing method of the hybrid integrated circuit module is described in detail as follows:

Referring to FIG. 3 , it is a process of forming a substrate 16 on the process of forming an aluminum substrate with a suitable size in one embodiment.

First, with reference to Fig. 3(A) and the cross-sectional view 3(B) along the XX' line of Fig. 3(A), a substrate 16 of appropriate size according to the design of the required hybrid integrated circuit module 10, for general hybrid integration For the circuit module, the size of the substrate 16 can be selected as 64mm×30mm, the thickness is 1.5mm, and anti-corrosion treatment such as anodic oxidation is performed on both sides.

Here, the formation of the substrate 16 with a suitable size is formed by directly processing the aluminum material of 1m×1m×1.5mm. The knife is cut at right angles to the aluminum plane; it can also be formed by stamping.

With reference to Fig. 4 (A), 4 (B), 5 (A) and 5 (B), offer the glass fiber board 21 that has through hole 22 for making preset position in an embodiment and on described glass fiber board 21 The process of laying the circuit wiring layer 18 on the surface.

At first with reference to Fig. 4 (A) and Fig. 4 (A) the sectional view Fig. 4 (B) of the XX' section of Fig. 4 (A), according to the hybrid integrated circuit module 10 design size suitable glass fiber board 21, can make and substrate 16 has the same size, that is, 64mm×30mm, and may also be slightly smaller than the area of the substrate 16 .

Then, form through holes 22 by means of milling cutter, stamping, etc. at specific positions. In this embodiment, 6 right-angled through holes 22 are formed, and the size of the through holes is 7mm×5mm. Other numbers can also be formed as required. , the size of the through hole 22, the through hole 22 can also be made into rounded corners. Here, the thickness of the glass fiber board 21 is generally 1 mm.

Finally, referring to FIG. 5(A) and FIG. 5(A) XX' cross-section sectional view FIG. 5(B), the surface of the fiberglass board 21 is pasted with copper foil as a conductive pattern. Then the copper foil produced in this process is etched to partially remove the copper foil to form a circuit wiring layer 18, and a special circuit wiring layer 18 is formed on at least one edge of the glass fiber board 16 as a lead pad 18A. Here, the copper foil is generally selected to be 2 oz, and the height of the formed circuit wiring layer 18 and lead pad 18A is about 0.07mm.

Here, the formation of the glass fiber plate 21 with a suitable size can be formed by directly punching a glass fiber plate of 1m×1m×1mm, etc., or by first forming a V-groove on a glass fiber plate of 1m×1m×1mm, and then formed by shearing.

Referring to Fig. 6, Fig. 7 (A) and 7 (B), it is the process of making radiator 13 in one embodiment, and disposing power element 19 on described radiator 13;

Referring to Fig. 6, each heat sink 13 is made of a copper substrate by stamping or etching to make a cuboid as shown in Fig. 6. In this embodiment, the area of the heat sink 13 is designed as L*W =6mm * 4mm, also can be designed to smaller size than through hole 22 as required, the height H of radiator 13 is designed to be 1.1mm, also can be designed as required than glass fiber plate 21 thickness slightly bigger size. In order to improve the wettability of the subsequent soldering process, the silver layer will be formed by chemical plating; according to the surface condition of the copper layer, it can be degreased, deoxidized, and chemically illuminated before silver plating. Radiator 13.

Referring to Fig. 7(A) and Fig. 7(A), the cross-sectional view of the XX' section Fig. 7(B), at first, heat the radiator 13, and drop on the surface of the radiator 13 by dissolving the high-temperature solder wire, Therefore, high-temperature solder wire with a melting temperature of about 310°C can be selected. Then, place the power element 19 on the solder wire that is dissolved and spread on the surface of the heat sink 13 , flatten, cool, and after the high-temperature solder wire is solidified, the power element 19 is fixed on the surface of the heat sink 13 . In this embodiment, the height of the power element 19 used is 0.07 mm.

The second process: Referring to FIG. 8(A) and FIG. 8(B), it is a process of making an independent pin 11 with plating in one embodiment.

Each pin 11 is made of a copper base material by stamping or etching to form a row of pins 11 as shown in FIG. 8(A). In this embodiment, the pin 11 is connected by 12 individual pin 11 units through stiffeners. As shown in Figure 8(B), the individual pins 11 are strips with a length L1 of 25 mm, a width W1 of 1.5 mm, and a thickness H1 of 1 mm; sometimes, for ease of assembly, one end of the pin 11 is also pressed out a certain arc;

Then the nickel layer is formed by electroless plating: through the mixed solution of nickel salt and sodium hypophosphite, and adding an appropriate complexing agent, a nickel layer is formed on the surface of the copper material that has formed a specific shape, and the metal nickel has a strong Passivation ability, can quickly form an extremely thin passivation film, which can resist the corrosion of atmosphere, alkali and some acids. The crystals of nickel plating are very small, and the thickness of nickel layer is generally 0.1μm;

Then, through the acid sulfate process, the copper material with the formed shape and nickel layer is immersed in the plating solution with positive tin ions at room temperature, and a nickel-tin alloy layer is formed on the surface of the nickel layer. The alloy layer is generally controlled at 5 μm. The formation of the alloy layer greatly improves protection and solderability.

Referring to FIGS. 9(A) and 9(B), it shows the process of mounting the non-power element 14 on the surface of the circuit wiring layer 18 and mounting the pin 11 on the surface of the pin pad 18A in one embodiment.

First, use a stencil to apply solder paste to the specific position of the circuit wiring layer 18 on the fiberglass board 21 and the pin pad 18A through a solder paste printing machine; A steel mesh with a thickness of mm, in order to reduce the risk of displacement of the non-power components 14, a steel mesh with a thickness of 0.12 mm can be used.

Then, with reference to side view Fig. 9 (A) and plan view Fig. 9 (B), carry out the installation of non-power element 14 and pin 11, non-power element 14 can be directly placed on the specific position of circuit wiring layer 18, and pin 11 Then one end should be placed on the pin pad 18A, and the other end needs to be fixed by a carrier 20, which is made of materials such as synthetic stone. Then, the glass fiber board 21 placed on the carrier 20 undergoes reflow soldering, the solder paste is solidified, and the non-power components 14 and pins 11 are fixed. Here, solder paste with a melting temperature of 280°C can be selected.

In a preferred embodiment, the manufacturing method of the hybrid integrated circuit module further includes a process of cleaning the fiberglass board 21 .

Put the glass fiber board 21 into a cleaning machine for cleaning, and clean the residual flux such as rosin during reflow soldering and the foreign matter such as aluminum wire remaining during stamping. According to the arrangement density of the non-power components 14 in the circuit wiring layer 18, Cleaning can be done by spraying or ultrasound or a combination of both. When cleaning, clamp the pin 11 by the mechanical arm, place the fiberglass plate 21 in the cleaning tank, and be careful not to let the mechanical arm touch the fiberglass plate 21, because the fiberglass plate 21 is brittle, if the mechanical arm The glass fiber board 21 is clamped, and the vibration generated during cleaning may easily cause the glass fiber board 21 to break.

Referring to the side view sectional view 10 (A) and the top sectional view 9 (B), in an embodiment, an insulating layer 17 is applied on the substrate 16, and the fiberglass plate 21 and the fiberglass plate 21 are arranged on the surface of the insulating layer 17. The heat sink 13 is a process of making the heat sink 13 pass through the through hole 22 and be exposed on the surface of the glass fiber board 21 .

First, evenly spread a layer of non-conductive red glue on the surface of the substrate 16 to form the insulating layer 17 as the insulating glue. Then, place the cleaned glass fiber board 21 that has been assembled with non-power components 14 after the above process on the surface of the red glue, and then place the heat sink 13 that has assembled the power components 19 on the red plastic through the through hole 22. glue surface. Here, because the fiberglass board 21 has been configured with the pins 11 , it is generally placed in a carrier 23 that can support the pins 11 . Finally, put the carrier 23 into the oven and add it to cure the red glue. Here, red glue with a curing temperature of about 170°C can be selected, and the smear height of the red glue can be 0.05mm.

After this process, the radiator 13 is 0.03±0.01mm higher than the circuit wiring layer 18, and the power element 19 is 0.1±0.02mm higher than the circuit wiring layer 18.

Referring to the side view sectional view 11(A) and the top view sectional view 11(B), in one embodiment, in the circuit wiring layer 18, the heat sink 13, the power element 19 and the non-power element 14 The process of connecting the metal lines 15 between them.

According to the requirement of the flow capacity, an aluminum wire with an appropriate diameter is selected as the bonding wire (metal wire 15 ). For integrated circuits used for signal control, gold wires may also be considered as the bonding wire. In this embodiment, all aluminum wires are selected. In general, aluminum wires of 350 μm to 400 μm are used for bonding to the power element 19, aluminum wires of 38 μm to 200 μm are used for bonding to the non-power element 14, and aluminum wires of 350 μm to 400 μm are used for bonding to the heat sink 13. aluminum wire.

Because the height difference between the radiator 13 and the power element 19 and the circuit wiring layer 18 is very small, it can be ignored compared with N in (Formula 1), and the distance between the radiator 13 and the power element 19 and the circuit wiring layer 18 is determined by N, That is 3mm (mm). Because the height difference of the bond wire is small and the distance of the bond wire is short, the work of this process can be completed by using a general domestic aluminum wire bond machine.

Referring to sectional view 12, in a preferred embodiment, the manufacturing method of the hybrid integrated circuit module further includes a step of sealing all surfaces of the substrate except the surface opposite to the insulating layer.

The substrate 16 is baked in an oxygen-free environment, the baking time should not be less than 2 hours, and the baking temperature should be 125°C. The substrate 16 on which the pins 11 are arranged is transferred to the molds 44 and 45 . Positioning of the substrate 16 is performed by bringing a specific portion of the pin 11 into contact with the fixture 46 . When closing the mold, the substrate 16 is placed in the cavities formed inside the molds 44 and 45 , and then the sealing resin is injected through the gate 53 . A method of performing sealing may employ transfer molding using a thermosetting resin or injection molding using a thermosetting resin. Also, the gas corresponding to the inside of the sealing resin cavity injected from the gate 53 is discharged to the outside through the exhaust port 54 .

Here, the back of the substrate 16 is in close contact with the lower mold 45 , but a small amount of the sealing resin still enters between the back of the substrate 16 and the lower mold 45 . Therefore, after demoulding, it is necessary to perform laser etching or grinding to remove a small amount of sealing resin remaining on the back of the substrate 16, so that the back of the substrate 16 is exposed from the sealing resin, and the parts other than the back of the substrate 16 are sealed by the sealing resin.

In a preferred embodiment, the manufacturing method of the hybrid integrated circuit module further includes the steps of trimming and forming the pins 11 and performing a module function test, and the above-mentioned hybrid integrated circuit module 10 is completed as a product through this process.

The parts other than the lead 11 are resin-sealed in the preceding process, that is, the transfer molding process. In this process, a part of the external pin 11 is cut off according to the length and shape required, and sometimes it is bent into a certain shape to facilitate subsequent assembly. Then put the hybrid integrated circuit module 10 into the test equipment, and conduct conventional electrical parameter tests, generally including test items such as insulation withstand voltage, static power consumption, and delay time, and those that pass the test are finished products.

Through the above steps, the smart power module 10 shown in FIG. 2 is completed.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the protection of the present invention. within range.

Claims (14)

1. A hybrid integrated circuit module, characterized in that, comprising: a substrate with one surface covered with an insulating layer; A glass fiber board disposed on the surface of the insulating layer, wherein the glass fiber board is provided with a through hole at a predetermined position; A heat sink that passes through the through hole and is exposed on the surface of the glass fiber board is provided on the surface of the insulating layer opposite to the through hole; A circuit wiring layer formed on the surface of the fiberglass board; The power element arranged on the heat sink and the non-power element arranged at the corresponding position of the circuit wiring layer; Metal wires for connecting the circuit wiring layer, the heat sink, the power element and the non-power element. 2. The hybrid integrated circuit module according to claim 1, further comprising pins, said circuit wiring layer comprising pin pads close to the surface edge of said substrate, said pins being connected to said pins The foot pads are connected to and extend outward from the substrate. 3. The hybrid integrated circuit module according to claim 1 or 2, further comprising a sealing layer, the sealing layer covering all surfaces of the substrate except the surface area opposite to the insulating layer . 4. The hybrid integrated circuit module according to claim 1 or 2, wherein the power element is an IGBT tube, a high voltage MOSFET tube or a high voltage FRD tube. 5. The hybrid integrated circuit module according to claim 1 or 2, wherein the vertical height difference between the surface of the radiator provided with the power element and the surface of the circuit wiring layer is 0.03±0.01mm, The vertical height difference between the surface of the power element opposite to the radiator and the surface of the circuit wiring layer is 0.1±0.02mm. 6. The hybrid integrated circuit module according to claim 1 or 2, characterized in that the diameter of the metal wire connecting the circuit wiring layer with the heat sink and the power element ranges from 350 μm to 400 μm ; The diameter range of the metal wire connected between the circuit wiring layer and the non-power element is: 38 μm-200 μm. 7. A method of manufacturing a hybrid integrated circuit module, characterized in that it comprises: The process of making the substrate, heat sink, and glass fiber board with through-holes opened at preset positions, and covering one surface of the substrate with an insulating layer; The process of arranging the glass fiber board and the heat sink on the surface of the insulating layer so that the heat sink passes through the through hole and is exposed on the surface of the glass fiber board; The process of laying a circuit wiring layer on the surface of the fiberglass board; The process of arranging power components and non-power components on the heat sink and corresponding positions of the circuit wiring layer respectively; A step of connecting metal wires between the circuit wiring layer, the heat sink, the power element, and the non-power element. 8. The manufacturing method of a hybrid integrated circuit module as claimed in claim 7, wherein the circuit wiring layer includes pin pads near the surface edge of the substrate, and on the surface of the glass fiber board After the step of arranging the circuit wiring layer, it further includes: a step of arranging pins, connecting the pins to the pads of the pins and extending outward from the substrate. 9. The manufacturing method of a hybrid integrated circuit module as claimed in claim 7 or 8, wherein a metal wire is connected between the circuit wiring layer, the heat sink, the power element, and the non-power element After the process, the process further includes: a process of sealing all surfaces of the substrate except the surface area opposite to the insulating layer. 10. The method for manufacturing a hybrid integrated circuit module according to claim 7 or 8, further comprising: cleaning the fiberglass board after the process of arranging non-power components at the corresponding positions of the circuit wiring layer process. 11. A method for manufacturing a hybrid integrated circuit module, comprising: The process of making the substrate; The process of making a glass fiber board with a through hole at a preset position, and laying a circuit wiring layer on the surface of the glass fiber board; The process of making a radiator and arranging power components on the radiator; a process of arranging non-power components at corresponding positions of the circuit wiring layer; Applying an insulating layer on the substrate, and arranging the glass fiber board and the radiator on the surface of the insulating layer, so that the radiator passes through the through hole and is exposed on the surface of the glass fiber board ; A step of connecting metal wires between the circuit wiring layer, the heat sink, the power element, and the non-power element. 12. The manufacturing method of a hybrid integrated circuit module as claimed in claim 11, wherein the circuit wiring layer includes pin pads close to the surface edge of the substrate, on the surface of the glass fiber board After the step of arranging the circuit wiring layer, it further includes: a step of arranging pins, connecting the pins to the pads of the pins and extending outward from the substrate. 13. The manufacturing method of a hybrid integrated circuit module as claimed in claim 11 or 12, wherein a metal wire is connected between the circuit wiring layer, the heat sink, the power element, and the non-power element After the process, the process further includes: a process of sealing all surfaces of the substrate except the surface opposite to the insulating layer. 14. The method for manufacturing a hybrid integrated circuit module according to claim 11 or 12, further comprising: cleaning the fiberglass board after the process of arranging non-power components at the corresponding positions of the circuit wiring layer process.