CN114980560A

CN114980560A - Production process of base with electronic element

Info

Publication number: CN114980560A
Application number: CN202210703087.3A
Authority: CN
Inventors: 莫凑全
Original assignee: Suzhou Yunzhong Electronic Technology Co ltd
Current assignee: Suzhou Yunzhong Electronic Technology Co ltd
Priority date: 2018-09-25
Filing date: 2018-09-25
Publication date: 2022-08-30
Anticipated expiration: 2038-09-25
Also published as: CN109287074B; CN114980560B; CN109287074A

Abstract

The invention discloses a production process of a base with an electronic element, and relates to the technical field of electronic element assembly. The production process comprises forming a metal circuit; performing injection molding on the position of the metal circuit connected with the electronic element to form a first semi-finished product; welding an electronic component to the first semi-finished product through an SMT (surface mount technology) process to form a second semi-finished product; and performing injection molding on the second semi-finished product to form the base. In the production process, the metal circuit, the electronic element and the plastic part can be integrally formed by two-time injection molding and one-time SMT process without additional assembly steps; in addition, in the step S1, only the metal circuit is molded without manufacturing an FPC, which simplifies the manufacturing process, thereby improving the production efficiency and reducing the production cost.

Description

Production process of base with electronic element

The present application is a divisional application of an invention patent application having an application number of 201811114091.6, which was invented at 2018, 9, 25 and entitled "a process for producing a base having an electronic component".

Technical Field

The invention relates to the technical field of electronic component assembly, in particular to a production process of a base with an electronic component.

Background

At present, a base with a hall element in a voice coil closed-loop motor in a mobile phone camera module comprises the hall element and a plastic shell. The existing base production process mainly includes manufacturing an FPC (Flexible Printed Circuit); before assembling the Hall element on the base, the Hall element needs to be welded on the FPC; after the soldering is completed, the FPC with the hall element needs to be assembled to the plastic housing of the base. In the whole process, the process of manufacturing the FPC exists, so that the process is complex and the production cost is high; in addition, the FPC of the Hall element is assembled with the plastic shell after being welded, so that the assembling process is more, and the working efficiency is reduced.

In view of the above problems, there is a need for a process for manufacturing a base with electronic components, which can solve the problems of complex process, low production efficiency and high production cost in the prior art.

Disclosure of Invention

The invention aims to provide a production process of a base with an electronic element, which aims to solve the problems of complex process, low production efficiency and high production cost in the prior art.

In order to achieve the purpose, the invention adopts the following technical scheme:

a production process of a base with electronic components, which integrates the electronic components on the base in a vertically arranged manner, the production process at least comprising the following steps:

the method comprises the following steps: -a shaped metal circuit (2), said metal circuit (2) comprising a plurality of branches (21) arranged horizontally to be connected to an electronic component;

step two: performing injection molding on positions, where all branches (21) of the metal circuit (2) are connected with the electronic component (1), of a first plastic part (3) to form a first semi-finished product, wherein the first plastic part (3) is horizontally arranged, and the first plastic part (3) connects all branches (21) of the metal circuit (2) into a whole and connects and reinforces the branches (21);

step three: horizontally arranging an electronic element (1) on the first plastic part (3), and welding pins of the electronic element (1) to corresponding branches (21) of a metal circuit (2) so that the branches (21) are connected with the pins of the electronic element (1) in a one-to-one correspondence manner to form a second semi-finished product;

step four: bending the metal circuit (2) in the second semi-finished product, and after bending, simultaneously realizing space conversion between the first plastic part (3) and the electronic element (1) so as to convert the horizontal arrangement into the vertical arrangement;

step five: and carrying out injection molding on the second semi-finished product to form a second plastic part (4), and further forming a base which is formed by integrally molding a metal circuit (2), an electronic element (1) and plastic parts (3 and 4) and is vertically arranged on the electronic element (1).

As a preferable scheme of the production process of the base with the electronic component, the second plastic part (4) is coated on the metal circuit (2), and one end of the branch (21) of the metal circuit (2) far away from the electronic component (1) extends out of the second plastic part (4) to realize connection with an external circuit.

As a preferable proposal of the production process of the base with the electronic component, in the third step, the pins of the electronic component (1) are welded on the corresponding branches (21) of the metal circuit (2) by the surface mounting technology.

As a preferable scheme of the production process of the base with the electronic element, in the second step, an accommodating groove is formed in the first plastic part (3), and the branch (21) of the metal circuit is exposed in the accommodating groove; in the third step, the electronic component (1) is accommodated in the accommodating groove and exposed to the first plastic part (3).

As a preferable scheme of the production process of the base with the electronic element, the base is applied to a motor in a camera module, and the electronic element (1) is a Hall element.

As a preferable scheme of the production process of the base with the electronic component, in the second step, the first plastic part (3) is formed with a plurality of positioning assemblies connected with corresponding branches (21), and each positioning assembly performs at least three position limitation on one end of the corresponding branch (21) connected with the electronic component (1) in different directions.

As a preferable scheme of the production process of the base with the electronic components, each positioning assembly comprises at least three limit blocks (31), and the at least three limit blocks (31) respectively abut against different positions on the corresponding branch (21) to limit the corresponding branch (21) in at least three different directions.

In order to achieve the purpose, the invention also adopts the following technical scheme:

a production process of a base with electronic components, which integrates the electronic components on the base in a vertical arrangement mode, and at least comprises the following steps:

the method comprises the following steps: stamping a strip sheet (5) into a plurality of interconnected metal substrates of predetermined shape, thereby forming a plurality of continuous metal circuits (2), each of said metal circuits (2) comprising a plurality of branches (21) arranged horizontally for connection with electronic components;

step three: horizontally arranging an electronic element (1) on the first plastic part (3), welding pins of the electronic element (1) to corresponding branches (21) of a metal circuit (2) to enable the branches (21) to be connected with the pins of the electronic element (1) in a one-to-one correspondence manner, forming a second semi-finished product, and cutting the metal circuit (2) in the second semi-finished product;

step four: bending the metal circuit (2) in the cut second semi-finished product, and after bending, simultaneously realizing space conversion between the first plastic part (3) and the electronic element (1) and converting the horizontal arrangement into the vertical arrangement;

step five: and carrying out injection molding on the second semi-finished product to form a second plastic part (4), and further forming a metal circuit (2), an electronic element (1) and plastic parts (3 and 4) which are integrally formed, wherein the electronic element (1) is a vertically arranged base which is connected with the bases in a plurality of ways.

As a preferable scheme of the production process of the base with the electronic component, in the third step, the cutting of the metal circuits (2) in the second semi-finished product comprises cutting off connecting parts which are connected with different branches (21) in each metal circuit (2); the production process also comprises the following six steps: the plurality of interconnected bases is cut from the strip of sheet material (5) to form a plurality of individual bases simultaneously.

The invention has the beneficial effects that:

the production process of the base with the electronic element provided by the invention has the advantages that the existing FPC is replaced by the formed metal circuit to be directly connected with the electronic element; the metal circuit, the electronic element and the plastic part are integrally formed by two times of injection molding and one-time welding, so that the assembly process between the electronic element and the plastic part is avoided; and the space conversion of the electronic element from horizontal arrangement to vertical arrangement is skillfully realized by bending the metal circuit in the two-time injection molding process. Therefore, the production process of the base with the electronic element is simplified, and the production efficiency is improved and the production cost is reduced.

Drawings

FIG. 1 is a flow chart illustrating a process for manufacturing a base with electronic components according to an embodiment;

FIG. 2 is a schematic structural diagram of a metal circuit according to an embodiment;

fig. 3 is a schematic structural diagram of a first plastic part and a metal circuit according to an embodiment;

FIG. 4 is an enlarged view of a portion of FIG. 3 at A;

fig. 5 is a schematic structural diagram of a metal circuit provided in the first embodiment after electronic components are soldered thereon;

FIG. 6 is a schematic structural diagram of a base with electronic components according to an embodiment;

FIG. 7 is a flowchart of a process for manufacturing a base with electronic components according to the second embodiment;

FIG. 8 is a schematic structural view of a plurality of interconnected metal substrates provided in example two;

fig. 9 is a schematic structural diagram of a second semi-finished product after the metal circuit is cut according to the second embodiment.

Wherein, 1, an electronic component; 2. a metal circuit; 3. a first plastic part; 4. a second plastic part; 5. a sheet material;

21. a branch circuit; 31. a limiting block; 51. and (7) positioning the holes.

Detailed Description

The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.

Example one

The present embodiment relates to a process for manufacturing a base with an electronic component, as shown in fig. 1, including the following steps:

s11, forming a metal circuit 2, as shown in fig. 2, the metal circuit 2 includes a plurality of branches 21, and the branches 21 are connected to the pins of the electronic component 1 in a one-to-one correspondence manner.

S12, injection molding the first plastic part 3 at the position where the electronic component 1 is connected to the metal circuit 2 to form a first semi-finished product, as shown in fig. 3 and 4.

Specifically, by in-mold injection molding a position of the metal circuit 2 where the electronic component 1 is connected, connection and reinforcement between the respective branches 21 of the metal circuit 2 can be performed by the first plastic member 3 formed at the position. The metal circuit 2 is coated by the first plastic part 3 before the electronic element 1 is connected, so that the situation that the metal circuit 2 cannot be coated by the plastic part through injection molding after being connected with the electronic element 1 is avoided. In addition, the first plastic part 3 at the position can also play a role in supporting the electronic element 1, so that the metal circuit 2 and the electronic element 1 are relatively stable after being connected, and the electronic element 1 is prevented from moving.

The first plastic part 3 is located at a position where the metal circuit 2 is connected with the electronic component 1, and connects all the branches 21 of the metal circuit 2 into a whole. First plastic part 3 includes a plurality of locating component, and a plurality of locating component are connected with a plurality of branch road 21 one-to-one, and every locating component carries out spacing of at least three not equidirectional to the one end that corresponding branch road 21 connects electronic component 1 to can guarantee to carry out the location that stabilizes to the one end that branch road 21 connects electronic component 1. Specifically, each positioning assembly comprises at least three limiting blocks 31, and the different limiting blocks 31 abut against different positions on the corresponding branch 21, so that the corresponding branch 21 can be limited in at least three different directions. The number of the stoppers 31 in each positioning assembly can be specifically selected to be three or more, and can be determined according to the shape of the branch 21.

Because each branch 21 of the metal circuit 2 is connected with the electronic component 1, when the size of the electronic component 1 is small, the distance between the adjacent branches 21 is small, and the limiting blocks 31 corresponding to different branches 21 can be shared or connected into a whole, so that the effect of stably supporting the branches 21 can be enhanced, and the stability of the metal circuit 2 is ensured.

S13, the electronic component 1 is soldered to the first semi-finished product by the SMT process to form a second semi-finished product, as shown in fig. 5. Smt (surface Mount technology) is a surface assembly technology, called surface Mount or surface Mount technology. SMT is a Circuit mounting technique in which a leadless or short-lead surface-mounted component is mounted on the surface of a Printed Circuit Board (PCB) or the surface of another substrate, and is soldered and mounted by a method such as reflow soldering or dip soldering. The electronic component 1 can be soldered to the first semi-finished product by the SMT process, improving soldering efficiency.

S14, injection molding the second plastic part 4 on the second semi-finished product to form a base, as shown in fig. 6.

Specifically, after the second semi-finished product is subjected to in-mold injection molding, an integrally molded base is formed. The cladding of second plastic part 4 is on metal circuit 2, and the one end that electronic component 1 was kept away from to metal circuit 2's branch road 21 stretches out second plastic part 4, and second plastic part 4 can play the guard action to metal circuit 2, and the one end that electronic component 1 was kept away from to metal circuit 2's branch road 21 simultaneously is located the outside at second plastic part 4, realizes being connected with external circuit to make electronic component 1 realize its self function. The shape and structure of the second plastic part 4 can be adaptively selected according to specific use occasions, and are not specifically limited in this embodiment.

In the production process, the metal circuit 2 is used for replacing FPC, FPC manufacturing is not needed, and the production process is simplified; in addition, the process can finish the integral molding of the metal circuit 2, the electronic element 1 and the plastic part only by two times of injection molding and one time of SMT process without additional assembling steps. It can be seen that the production process of the base with the electronic component 1 is simplified, which is beneficial to improving the production efficiency and reducing the production cost.

In this embodiment, the electronic element 1 is a hall element. In other embodiments, the electronic component 1 may be adaptively selected according to actual needs.

Example two

As shown in fig. 7, the flow chart of the manufacturing process of the base with electronic components in this embodiment only describes the differences from the first embodiment in detail, and the same points as the first embodiment are not repeated, and the specific steps are as follows:

s21, the long sheet 5 is punched into a plurality of interconnected metal base materials of a predetermined shape, and wound around a reel.

In the conventional spot-tin soldering process, the electronic component 1 is soldered to the FPC by spot welding. Therefore, each FPC needs to be repeatedly positioned, but the precision of repeated positioning of the FPCs is highly required, and the precision of each positioning cannot be completely guaranteed in the actual production process. Meanwhile, the FPC has form and position tolerance. Based on the above circumstances, the overall defective rate of the base produced by the existing assembly process is high, and the production efficiency is low and the mass production is poor due to welding after positioning one by one.

In step S21, by punching a plurality of metal base materials connected to each other on the long sheet 5, continuous production or mass production can be realized in each subsequent step, which is advantageous in improving the production efficiency. As shown in fig. 8, a plurality of positioning holes 51 are also punched in the long sheet 5 in this step, and in each subsequent process step, the sheet 5 can be positioned by positioning pins penetrating into the positioning holes 51, so that a plurality of metal substrates can be positioned simultaneously, and the problem of low efficiency in repeated positioning one by one is avoided. Wherein, the locating pin sets up on the forming device in corresponding process. In this embodiment, in addition to the metal base material formed by press forming, other methods such as wire cutting can be adopted adaptively, which is within the scope of the present embodiment.

In this embodiment, the long sheet 5 is made of a material such as copper or stainless steel. In other embodiments, the long sheet 5 may be made of other metals or alloys according to specific situations, and may be conductive and soldered to the electronic component 1. The thickness of the strip sheet 5 is in the range of 0.05 to 0.2mm, and may be selected from 0.06mm, 0.08mm, 0.10mm, 0.11mm, 0.13mm, 0.15mm, 0.16mm, 0.18mm and 0.19 mm.

The metal base material is packaged by the reel, and when the metal base material is processed in the next step, the reel can be driven to rotate by the automatic traction device or the feeding device, so that automatic feeding is realized.

And S22, plating an anti-oxidation layer on the surface of the metal base material.

Specifically, the oxidation prevention layer is formed by nickel plating, so that oxidation of the metal circuit 2 is avoided, and the service life of the metal circuit 2 is ensured. In other embodiments, the metal substrate can be protected by plating other antioxidant metals, and the protection is specifically selected according to actual conditions; meanwhile, other surface treatment methods for forming the anti-oxidation layer can be selected.

And S23, plating a soldering assistant layer outside the oxidation resisting layer so as to form a plurality of continuous metal circuits 2, and coiling and packaging.

Specifically, the anti-oxidation layer is plated with gold or tin to form the soldering-assistant layer, and the soldering-assistant layer can be plated with gold or tin, so that a good soldering-assistant effect is achieved. Wherein the welding assistant layer is plated on the welding position to reduce the cost. The solder mask facilitates the soldering process, and improves the soldering quality when the metal circuit 2 and the electronic component 1 are soldered to each other.

The formed metal circuit 2 is packaged by a reel, and when the metal circuit is processed in the next step, the reel can be driven to rotate by an automatic traction device or a feeding device, so that automatic feeding is facilitated.

S24, injection molding the first plastic part 3 at the position of the metal circuit 2 connected with the electronic element 1 to form a first semi-finished product.

Specifically, the injection molding temperature is 250-390 ℃, and can be selected from 260 ℃, 270 ℃, 280 ℃, 290 ℃, 300 ℃, 310 ℃, 320 ℃, 330 ℃, 340 ℃, 350 ℃, 360 ℃, 370 ℃ or 380 ℃. The injection molding time is 5-15s, and can be selected from 6s, 7s, 8s, 9s, 10s, 11s, 12s, 13s or 14 s.

S25, soldering the electronic component 1 to the first semi-finished product by SMT process to form a second semi-finished product.

Specifically, the soldering temperature of the SMT process is 150-.

S26, cutting the metal circuit 2 in the second semi-finished product, and the cut second semi-finished product is as shown in fig. 9.

And S27, bending the metal circuit 2 in the cut second semi-finished product.

Specifically, the position marked with the dotted line in fig. 9 is bent along the dotted line.

And S28, injection molding the second plastic part 4 on the bent second semi-finished product to form a plurality of interconnected bases.

The injection temperature is 250 ℃ and 390 ℃, and the injection temperature can be specifically selected from 260 ℃, 270 ℃, 280 ℃, 290 ℃, 300 ℃, 310 ℃, 320 ℃, 330 ℃, 340 ℃, 350 ℃, 360 ℃, 370 ℃ or 380 ℃. The injection molding time is 5-15s, and can be selected from 6s, 7s, 8s, 9s, 10s, 11s, 12s, 13s or 14 s.

And S29, cutting the plurality of interconnected bases to form a single base so as to conveniently assemble the bases into the corresponding voice coil closed-loop motors one by one.

Specifically, this step includes cutting the strip of strip sheet 5 connecting the plurality of bases, and also includes cutting away the connecting portion of each metal circuit connecting the different branches 21. The guillootine that adopts in this step has decides the material area and many caves divide the cave function, can cut off the base from rectangular sheet 5 to can realize once cutting into a plurality of solitary bases with a plurality of interconnect's base simultaneously, can improve the operating efficiency.

Note that the above is only a preferred embodiment of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A process for producing a base with electronic components, which integrates said electronic components on said base in a vertical arrangement, characterized in that it comprises at least the following steps:

2. The manufacturing process of the base with electronic components according to claim 1, wherein the second plastic part (4) is coated on the metal circuit (2), and one end of the branch (21) of the metal circuit (2) far away from the electronic components (1) extends out of the second plastic part (4) to achieve connection with an external circuit.

3. The process for producing a base with electronic components according to claim 1, characterized in that in step three, the pins of the electronic components (1) are soldered to the corresponding branches (21) of the metal circuit (2) by surface mounting techniques.

4. The process for manufacturing a base with electronic components according to claim 1, wherein in step two, the first plastic part (3) is formed with a receiving groove, and the branch (21) of the metal circuit is exposed to the receiving groove; in the third step, the electronic component (1) is accommodated in the accommodating groove and exposed to the first plastic part (3).

5. The process for producing a base with electronic components according to claim 1, wherein the base is used in a motor in a camera module, and the electronic components (1) are hall elements.

6. The manufacturing process of the base with electronic components as claimed in claim 1, wherein in the second step, the first plastic part (3) is formed with a plurality of positioning components connected to the corresponding branches (21), and each of the positioning components limits the end of the corresponding branch (21) connected to the electronic component (1) in at least three different directions.

7. The process for producing a base with electronic components according to claim 6, characterized in that each positioning assembly comprises at least three stops (31), said at least three stops (31) respectively abutting against different positions on the corresponding branch (21) to perform at least three different directional stops on the corresponding branch (21).

8. A process for producing a base with electronic components, which integrates said electronic components on said base in a vertical arrangement, characterized in that it comprises at least the following steps:

step three: horizontally arranging an electronic element (1) on the first plastic part (3), welding pins of the electronic element (1) to corresponding branches (21) of a metal circuit (2) so that the branches (21) are connected with the pins of the electronic element (1) in a one-to-one correspondence manner, forming a second semi-finished product, and cutting the metal circuit (2) in the second semi-finished product;

step five: and carrying out injection molding on the second semi-finished product to form a second plastic part (4), and further forming a base which is vertically arranged on the base, wherein the base is formed by integrally molding a metal circuit (2), an electronic element (1) and plastic parts (3 and 4), and the base is connected with the electronic element (1).

9. The process for producing a base with electronic components according to claim 8, wherein in step three, the cutting of the metal circuits (2) in the second semi-finished product comprises cutting away the connections in each metal circuit (2) connecting the different branches (21); the production process also comprises the following six steps: the plurality of interconnected bases is cut from the strip of sheet material (5) to form a plurality of individual bases simultaneously.

10. Process for manufacturing a base with electronic components according to claim 8, characterised in that in step three the pins of the electronic component (1) are soldered to the corresponding branches (21) of the metal circuit (2) by means of surface-mounting techniques.