CN117621351A - Manufacturing method of injection molding piece and injection molding piece thereof - Google Patents
Manufacturing method of injection molding piece and injection molding piece thereof Download PDFInfo
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- CN117621351A CN117621351A CN202410095747.3A CN202410095747A CN117621351A CN 117621351 A CN117621351 A CN 117621351A CN 202410095747 A CN202410095747 A CN 202410095747A CN 117621351 A CN117621351 A CN 117621351A
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- 238000001746 injection moulding Methods 0.000 title claims abstract description 214
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 38
- 229910052751 metal Inorganic materials 0.000 claims abstract description 175
- 239000002184 metal Substances 0.000 claims abstract description 138
- 239000011265 semifinished product Substances 0.000 claims abstract description 88
- 239000000463 material Substances 0.000 claims abstract description 87
- 238000005520 cutting process Methods 0.000 claims abstract description 13
- 238000003475 lamination Methods 0.000 claims abstract description 5
- 238000003466 welding Methods 0.000 claims abstract description 4
- 238000002347 injection Methods 0.000 claims description 44
- 239000007924 injection Substances 0.000 claims description 44
- 230000002093 peripheral effect Effects 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 15
- 238000005452 bending Methods 0.000 claims description 6
- 230000009286 beneficial effect Effects 0.000 description 10
- 239000000047 product Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008570 general process Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 238000000465 moulding Methods 0.000 description 1
- 238000012634 optical imaging Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a manufacturing method of an injection molding part and the injection molding part thereof, comprising the following steps of a, providing a first material belt, wherein the first material belt comprises a plurality of first metal elements, and performing first injection molding on the first material belt to form a plurality of first injection molding parts so as to obtain a first semi-finished product; b. providing a second material belt, wherein the second material belt comprises a plurality of second metal elements, the second material belt is arranged on the first material belt in a lamination manner, the second metal elements are positioned at corners of the first semi-finished product to form magnetic attraction elements, and the first semi-finished product and the second material belt are subjected to secondary injection molding to form a plurality of second injection molding parts, so that a second semi-finished product is obtained; c. cutting the second semi-finished product to obtain a plurality of unit semi-finished products, wherein each unit semi-finished product is provided with a first metal element; d. providing an electronic component, welding the electronic component on the unit semi-finished product, and electrically connecting the electronic component with the mounting part of the first metal element to obtain a finished injection molding part.
Description
Technical Field
The invention relates to the field of optical imaging, in particular to a manufacturing method of an injection molding piece and the injection molding piece.
Background
In recent years, intelligent electronic devices have been developed in a rapid manner, and the intelligent electronic devices are increasingly thinned, and camera modules are required to be adapted to the development of the intelligent electronic devices, so that the intelligent electronic devices can be thinned and meet the imaging requirements of the intelligent electronic devices on the camera modules. Therefore, manufacturers of camera modules are dedicated to designing, producing and manufacturing camera modules that meet these requirements. The functions of the camera modules are becoming more and more diversified, including but not limited to Auto Focus (AF), optical anti-shake (Optical Image Stabilization, OIS), iris, continuous zoom, etc. The realization of these functions requires the built-in metal elements of the camera module to supply and control power. The built-in circuit is connected with an external power supply (such as electronic equipment) through a circuit board of the camera module to acquire electric energy, and information transmission can be performed. In order to further save space, there is a technology of embedding a metal element in an injection molding piece of the camera module, which can avoid additionally arranging a corresponding circuit board, and is beneficial to reducing the volume of the camera module.
In the current camera module, injection molding parts, for example: motor mounts, lens mounts, motor carriers, lens carriers, etc., the manufacturing methods thereof generally include injection molding of clad metal elements and surface mounting of electronic components. The general process is to mold a metal material into strips, each strip comprises a plurality of metal elements, then the metal elements are coated by injection molding, then SMT (Surface Mounted Technology, surface mounting technology) is performed on the exposed metal elements, and then the semi-finished product obtained after SMT is cut to obtain the final finished product. Thus, both injection molding and SMT are performed in the form of an entire strip, which results in injection molding efficiency affecting the efficiency of the SMT link. When SMT is performed in the form of a whole tape, the yield of the reflow soldering process of SMT is relatively low, and the efficiency is also affected.
In addition, there is a secondary injection molding process, which is generally performed after SMT. In general, the yield of secondary injection molding is lower than that of primary injection molding, if SMT is performed first and then secondary injection molding is performed, the yield of the SMT link becomes low, the added value of the SMT link is higher, the loss generated by scrapping and reworking of a semi-finished product is higher, and the production cost is higher.
Disclosure of Invention
An object of the present invention is to provide a method for manufacturing injection molded articles, which can improve the productivity and yield.
Another object of the present invention is to provide an injection molded article, which is manufactured by the aforementioned method of manufacturing an injection molded article.
In order to achieve at least one of the above purposes, the invention adopts the following technical scheme: a method of manufacturing an injection molded article comprising the steps of:
a. providing a first material belt, wherein the first material belt comprises a first metal element, and performing primary injection molding on the first material belt to form a plurality of first injection molding parts so as to obtain a first semi-finished product;
b. providing a second material belt, wherein the second material belt comprises a plurality of second metal elements, the second material belt is arranged on the first material belt in a lamination mode, the second metal elements are positioned at corners of the first semi-finished product to form magnetic attraction elements, the second metal elements and the first metal elements are longitudinally arranged at intervals, and the first semi-finished product and the second material belt are subjected to second injection molding to form a plurality of second injection molding parts, so that a second semi-finished product is obtained;
c. Cutting the second semi-finished product to obtain a plurality of unit semi-finished products, so that each unit semi-finished product is provided with the first metal element;
d. providing an electronic component, welding the electronic component on the unit semi-finished product, and electrically connecting the electronic component with the mounting part of the first metal element to obtain a finished injection molding.
Therefore, the magnetic element can be mounted in an embedded mode when the injection molding piece is manufactured, the position accuracy of the magnetic element is improved, and an additional mounting step is omitted. And the second semi-product in the form of the whole strip is cut into single unit semi-finished products before SMT, so that the SMT link can be used for arranging and SMT in the form of the unit semi-finished products, and the whole strip of the second injection molding link does not need to wait for the SMT link after being qualified, thereby improving the production efficiency.
Preferably, in the step a, the first injection molding portion covers at least an inner peripheral portion of the first metal element and avoids the lead portion and the mounting portion of the first metal element when the first injection molding is performed; in the step b, when the second injection molding is performed, the second injection molding part covers the first semi-finished product and the second metal element, and the second injection molding part avoids the end parts of the mounting part and the lead part.
Preferably, in the step b, the second metal element of the second material belt is placed at a limiting part of the first injection molding part, so as to define a position of the second material belt relative to the first semi-finished product in a horizontal direction, wherein four corners of the bottom of the first injection molding part form the limiting part, so that in the finished injection molding part, the magnetic attraction element formed by the second metal element is located below the first metal element. This allows a space to be provided between the second metal element and the first metal element without interfering with each other.
Preferably, the method for manufacturing an injection molded article further includes step e: fixing the first material belt with the first fixing part and the positioning device of the die in the step a; fixing the second material belt through a second fixing part of the second material belt and a positioning device of the die in the step b; the positioning device in the step a and the positioning device in the step b are identical, and each positioning device comprises a first positioning part and a second positioning part which are adjacent to each other, and the first fixing part and the second fixing part are respectively positioned. Therefore, the design of the die configured by the manufacturing method is simpler, the positioning parts are concentrated and positioned at the corners of the die, the shape limitation on the metal element of the material belt is reduced, and the design flexibility of the metal element is improved.
Preferably, the step c specifically includes: and cutting the first connecting part around the first metal element after the second injection molding to separate the first metal element from other parts of the first material belt, and cutting the second connecting part around the second metal element to separate the second metal element from other parts of the second material belt so as to obtain a single semi-finished unit. Therefore, the second semi-finished product can be cut after the second injection molding to obtain a single unit semi-finished product, which is beneficial to improving the production efficiency of the subsequent links.
Preferably, the step a further includes a step a1: and c, cutting part of the first connecting part on the periphery of the first metal element after the first injection molding, so that part of the lead part of the first metal element is conveniently bent and/or the step b is conveniently realized.
Preferably, the step a further includes a step a2: after the first injection molding, bending at least part of the pin parts of the first metal element along a preset position, wherein at least part of the pin parts are vertically arranged and are suitable for being electrically connected with an external circuit of the finished injection molding. And one part of the bent pin part extends vertically, so that the pin part is convenient to fix and electrically connect with a circuit board of the camera module.
Preferably, the method for manufacturing an injection molded article further includes step f1: providing a first mounting channel in the first injection molding part, wherein the first mounting channel is positioned at the bottom of the first injection molding part, and the mounting part is exposed through the first mounting channel. Therefore, the mounting part is positioned at the bottom of the unit semi-finished product, and is convenient to expose for mounting electronic components.
Preferably, the method for manufacturing an injection molded article further includes step f2: and providing a second mounting channel in the second injection molding part, wherein the second mounting channel and the first mounting channel are oppositely arranged, so that the mounting part of the first metal element is exposed to the outside and is suitable for being connected with the electronic component. The mounting part is avoided during injection molding, so that the electronic components are attached to the mounting part during SMT.
In order to achieve at least one of the above purposes, the invention adopts the following technical scheme: an injection molding piece comprises an injection molding part, a metal element and an electronic component, wherein at least part of the metal element is coated in the injection molding part, the electronic component is electrically connected with the metal element, and the injection molding piece is manufactured by the manufacturing method of any one of the injection molding pieces.
The injection molding piece is a motor base, a lens base, a motor carrier or a lens carrier. Therefore, the injection molding piece of the camera module can be conducted with the circuit board of the camera module through the built-in metal element so as to acquire electric energy, and the additionally arranged circuit component with a single path is avoided.
Compared with the prior art, the invention has the beneficial effects that:
(1) The SMT is carried out after the second injection molding, so that the loss of the semi-finished product after the SMT is avoided, the yield of the finished product is improved, and the production cost is reduced;
(2) And after the second injection molding, cutting the second semi-finished product into holes to obtain a unit semi-finished product, wherein the SMT is performed on the unit semi-finished product, so that the efficiency is improved, and the phenomenon of reduced yield in a reflow soldering link when the SMT is performed in the form of a whole material strip is avoided.
Drawings
Fig. 1 is a schematic structural view of a first web according to some embodiments of the present application.
Fig. 2 is a schematic structural view of a first semi-finished product according to some embodiments of the present application.
Fig. 3 is an enlarged schematic view of fig. 2 of the present application at a portion a.
Fig. 4 is an enlarged schematic view of fig. 2 of the present application at a portion B.
Fig. 5 is an enlarged schematic view of the present application at a portion C in fig. 2.
Fig. 6 is a schematic structural view of a second web according to some embodiments of the present application.
Fig. 7 is a schematic structural view of a second tape disposed on a first semi-finished product according to some embodiments of the present application.
Fig. 8 is a schematic illustration of a positioning device mated with a first web and a second web according to some embodiments of the present application.
Fig. 9 is an enlarged schematic view of fig. 8 of the present application at a portion D.
Fig. 10 is a schematic structural view of a second semi-finished product according to some embodiments of the present application.
Fig. 11 is a schematic structural view of a cell blank according to some embodiments of the present application.
Fig. 12 is a schematic structural view of a finished injection molded part according to some embodiments of the present application.
In the figure: 10. a finished injection molding; 11. a first semi-finished product; 12. a second semi-finished product; 13. a unit semi-finished product; 20. a first material belt; 21. a first metal element; 211. an inner peripheral portion; 212. an outer peripheral portion; 213. a lead portion; 2131. a first lead portion; 2132. a second lead part; 214. a mounting part; 214a, a first mounting portion; 214b, a second mounting portion; 215. a conductive portion; 22. a first connection portion; 23. a first base band portion; 24. a first fixing portion; 30. a first injection molding part; 31. a first mounting channel; 311. a hall mounting channel; 312. an IC mounting channel; 32. a limit part; 40. a second material belt; 41. a second metal element; 42. a second connecting portion; 43. a second base band portion; 44. a second fixing portion; 50. a second injection molding part; 51. a second mounting channel; 52. a support arm; 53. a ball groove; 60. an electronic component; 61. a position sensing element; 611. a Hall element; 612. an IC; 70. a positioning device; 71. a first positioning portion; 72. and a second positioning part.
Detailed Description
The present invention will be further described with reference to the following specific embodiments, and it should be noted that, on the premise of no conflict, new embodiments may be formed by any combination of the embodiments or technical features described below.
In the description of the present invention, it should be noted that, for the azimuth words such as terms "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the azimuth and positional relationships are based on the azimuth or positional relationships shown in the drawings, it is merely for convenience of describing the present invention and simplifying the description, and it is not to be construed as limiting the specific scope of protection of the present invention that the device or element referred to must have a specific azimuth configuration and operation.
It should be noted that the terms "first," "second," and the like in the description and in the claims of the present application are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or both elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
The injection molding piece of the camera module comprises, but is not limited to, a lens base, a lens carrier, a motor base, a motor carrier and the like. According to one aspect of the present invention, there is provided a method of manufacturing an injection molded article, as shown in fig. 1 to 12, comprising the following steps.
a. A first strip 20 is provided, the first strip 20 comprising a plurality of first metal elements 21, the first strip 20 being subjected to a first injection moulding to form a plurality of first injection moulded parts 30, obtaining a first semifinished product 11, as shown in fig. 1 to 5.
b. Providing a second material belt 40, wherein the second material belt 40 comprises a plurality of second metal elements 41, arranging the second material belt 40 on the first material belt 20 in a lamination manner, so that the second metal elements 41 are positioned at the corners of the first semi-finished product 11 to form magnetic attraction elements, arranging the second metal elements 41 and the first metal elements 21 at intervals longitudinally, and performing second injection molding on the first semi-finished product 11 and the second material belt 40 to form a plurality of second injection molding parts 50, thereby obtaining a second semi-finished product 12, as shown in fig. 10.
c. The second semifinished product 12 is cut to obtain a plurality of unit semifinished products 13 such that each unit semifinished product 13 has a first metal element 21, as shown in fig. 11.
d. An electronic component 60 is provided, the electronic component 60 is soldered to the unit semifinished product 13, and the electronic component 60 is electrically connected with the mounting portion 214 to obtain a finished injection-molded article 10, as shown in fig. 12.
Specifically, in the step a, the first injection molding portion 30 covers at least the inner peripheral portion 211 of the first metal element 21 and is provided to avoid the lead portion 213 and the mounting portion 214 of the first metal element 21 when the first injection molding is performed; in step b. In step b, during the second injection molding, the second injection molding portion 50 covers the first semi-finished product 11 and the second metal element 41, and the second injection molding portion 50 is away from the end portions of the mounting portion 214 and the lead portion 213. It will be appreciated that in step b, the magnetic element is mounted during the manufacture of the injection molded part in an embedded manner, thereby improving the positional accuracy of the magnetic element and eliminating the need for an additional mounting step. In step d, the electronic component 60 is soldered to the unit blank 13, typically using SMT (Surface Mounted Technology, surface mount technology). It can be understood that the SMT is performed first and then the second injection molding is performed, and the yield of the second injection molding is relatively low, so that the finished semi-finished product of the SMT is lost, but the added value of the finished semi-finished product of the SMT is higher, and the production cost is further increased; in the embodiment, the second injection molding is advanced to the step b, that is, the second injection molding is performed and then the SMT is performed, so that the loss of the semi-finished product after the SMT is reduced, and the production cost is reduced. In addition, SMT is carried out in a whole material belt mode, and the SMT efficiency is limited by the injection molding efficiency; in the embodiment, in the step c, the material belt is cut to form a single semi-finished unit 13, and the semi-finished unit 13 is placed on a tray to perform SMT, which is beneficial to improving SMT efficiency.
As shown in fig. 6, the second tape 40 includes a second metal element 41, a second base band portion 43, and a second connection portion 42, and a plurality of second metal elements 41 are arranged at intervals along the extending direction of the second base band portion 43, and the second metal element 41 is connected to the second base band portion 43 through a plurality of second connection portions 42.
The second tape 40 is provided, the second tape 40 includes a plurality of second metal elements 41, the second tape 40 is laminated with the first tape 20 such that at least portions of the respective first metal elements 21 of the first tape 20 and the respective second metal elements 41 of the second tape 40 are disposed opposite to each other, and then the second injection molding is performed.
Specifically, as shown in fig. 6, the second tape 40 includes a second metal element 41, a second base tape portion 43, and a second connection portion 42, and a plurality of second metal elements 41 are arranged at intervals along the extending direction of the second base tape portion 43, and the second metal element 41 is connected to the second base tape portion 43 through a plurality of second connection portions 42. As shown in fig. 7 to 9, before the second injection molding, the second tape 40 is placed on the first semi-finished product 11, so that the second metal elements 41 on the second tape 40 and the first metal elements 21 on the first tape 20 are placed in a one-to-one correspondence, and further, the second injection molding part 50 is made to cover the second metal elements 41 during the second injection molding. It will be appreciated that the second strip 40 is placed in a stack with the first strip 20, either with the second strip 40 in contact with the first strip 20 or with the second strip 40 and the first strip 20 separated by the first injection section 30.
In one embodiment, the second tape 40 is disposed above the first tape 20 in a manner opposite to the bottom direction of the first injection part 30. The second metal element 41 and the first metal element 21 have a longitudinal spacing therebetween so as to avoid mutual interference. In a subsequent step, a second injection molding is performed, and the second injection molding portion 50 encapsulates the second metal element 41 of the second tape 40, so that the second metal element 41 is embedded into the second injection molding portion 50. Further, the second metal element 41 is disposed at the corner of the first injection molding portion 30, and forms an embedded magnetic element after being coated on the second injection molding portion 50, which is beneficial to improving the position accuracy of the magnetic element, and avoiding the additional installation of the magnetic element when assembling the camera module, thereby being beneficial to improving the production efficiency. Further, the outer end of the second metal element 41 is convexly located outside the finished injection-molded part 10, suitable for welding with the housing.
It will be appreciated that, as shown in fig. 7, the magnetic attraction elements formed by the second metal element 41 are located at four corners of the finished injection molding 10, so as to generate two opposite magnetic attraction restoring forces on the same magnet subsequently mounted above the finished injection molding 10. Further, each second metal element 41 includes two portions intersecting in the extending direction, so as to generate magnetic attraction forces to the magnets on two adjacent sides, respectively.
Further, as shown in fig. 7, in step b, the second metal element 41 of the second tape 40 is placed on the limiting portion 32 of the first injection molding portion 30, so as to define the relative positions of the first tape 20 and the first semi-finished product 11 in the horizontal direction, wherein, in the first injection molding, the four corners of the first injection molding portion 30 form the limiting portion 32, and the limiting portion 32 is located above the first metal element 21, so that, in the second layer of tape, the second metal element 41 is located above the first metal element 21. The limiting portion 32 is implemented as a recess at four corners of the first injection molding portion 30, and its shape is adapted to the shape of the second metal member 41 to perform a limiting function.
Specifically, four corners of the first injection molding portion 30 are provided with limiting portions 32, and the limiting portions 32 are adapted to cooperate with the second material belt 40 to accommodate the second metal element 41. When the second material belt 40 is laid, the second material belt 40 is placed in the limiting part 32, so that the second material belt 40 is placed at a preset position, and the second material belt 40 is prevented from moving relative to the first semi-finished product 11 during moving or secondary injection molding, so that the relative position accuracy of the second material belt 40 and the first semi-finished product 11 is further improved. It will be appreciated that in the first semi-finished product 11 formed by the first injection molding, the limiting portions 32 are formed at four corners of the first injection molding portion 30, and the first metal elements 21 are longitudinally distributed, and the second metal elements 41 are located above the first metal elements 21. In the finished injection molding 10, the second metal element 41 is located below the first metal element 21.
In other examples, the second metal element 41 forms a second layer of circuitry, and the first layer of circuitry formed by the first metal element 21 is longitudinally spaced apart, and the first layer of circuitry and the second layer of circuitry do not interfere with each other and may be electrically connected to different functional elements, respectively.
In some alternative embodiments, the finished injection molding 10 is provided with only the first tape 20, then the first injection molding is performed for the first tape 20, the first injection molding portion 30 is formed to cover the inner peripheral portion 211 of the first metal element 21, and the first injection molding portion 30 is set aside the lead portion 213 and the mounting portion 214 of the first metal element 21, so that in the finished injection molding 10, the mounting portion 214 is fixed and electrically connected with the electronic component 60. The second injection molding is also performed for the first tape 20, the second injection molding portion 50 is formed to cover at least part of the position of the first injection molding portion 30 and the position of the first metal element 21 not covered by the first injection molding portion 30, such as the periphery 212 and the periphery of the lead portion 213, and the second injection molding portion 50 is set aside the mounting portion 214 of the first metal element 21 and the end portions of the lead portion 213, so that in the finished injection molding 10, the mounting portion 214 is fixed and electrically connected with the electronic component 60, while the finished injection molding 10 is electrically connected with the external circuit through the end portions of the lead portion 213.
In other alternative embodiments, the finished injection molding 10 is provided with the first tape 20 and the second tape 40, the first injection molding is performed only for the first tape 20, the first injection molding 30 is formed to cover the inner peripheral portion 211 of the first metal member 21, the second injection molding is performed for the first tape 20 and the second tape 40, the second injection molding 50 is formed to cover at least part of the position of the first injection molding 30, and the positions of the first metal member 21 not covered by the first injection molding 30, such as the outer peripheral portion 212 and the periphery of the lead portion 213, and at least part of the position of the second tape 40, and the second injection molding 50 is formed to avoid the mounting portion 214 of the first metal member 21 and the end portions of the lead portion 213, so that in the finished injection molding 10, the mounting portion 214 is fixed to and electrically connected with the electronic component 60, while the finished injection molding 10 is electrically connected with the external circuit through the end portions of the lead portion 213.
In other alternative embodiments, the finished injection molding 10 is provided with the first tape 20 and the second tape 40, the first injection molding is performed only for the first tape 20, the first injection molding portion 30 is formed to cover the first tape 20, and the first injection molding portion 30 is set aside from the mounting portion 214 of the first metal element 21 and the end portions of the lead portions 213, so that in the finished injection molding 10, the mounting portion 214 is fixed to and electrically connected with the electronic component 60, while the finished injection molding 10 is electrically connected with the external circuit through the end portions of the lead portions 213, the second injection molding is performed only for the second tape 40, and the second injection molding portion 50 is formed to cover at least a part of the second tape 40.
It will be appreciated that the materials used for the first and second injection may or may not be identical, and that the precision of the first and second injection may or may not be identical, to meet the different requirements of the first and second injection sections 30 and 50.
In a specific embodiment, as shown in fig. 11, the finished injection molding 10 is a motor base, the first injection molding is performed on the first material belt 20, the first injection molding portion 30 covers the inner peripheral portion 211 of the first metal element 21, so as to wrap and fix most of the branches of the first metal element 21, and the first injection molding portion 30 avoids the connection portion, the pin portion 213 and other branches located at the outer peripheral portion 212 of the first metal element 21, so as to obtain the first semi-finished product 11, that is, the bottom plate portion of the finished injection molding 10. The second injection molding is performed for the first tape 20 and the second tape 40, the second injection molding portion 50 covers the second metal element 41, the outer peripheral portion 212 and the lead portion 213 of the first metal element 21, and part of the first injection molding portion 30, and the second injection molding portion 50 is set aside from the end portion and the mounting portion 214 of the lead portion 213 to obtain the second semi-finished product 12, that is, the main body portion and the peripheral side portion of the finished injection molding 10. Specifically, four corners of the top surface of the second injection molding part 50 are convexly formed with supporting arms 52 for supporting other components in the camera module; a ball groove 53 is formed on the top surface of the second injection molding part 50 adjacent to the support arm 52 for accommodating balls in the camera module.
Further, at the time of manufacturing, the mounting portion 214 of the first metal element 21 faces upward with facing away from the mold. The first tape 20 is set in the mold with the mounting portion 214 facing upward, and after the first injection, the bottom of the first injection portion 30 faces upward against the mold. When the lead portion 213 is bent, the lead portion 213 is bent upward. The limiting portion 32 formed at the bottom of the first injection molding portion 30 is also directed upward, and is suitable for placing the second material belt 40. After the second injection molding, when the second semi-finished product 12 is cut to obtain the unit semi-finished product 13 and then is subjected to swaying, the bottom of the unit semi-finished product 13 can be directed upwards, and the mounting part 214 at the bottom is exposed for SMT.
This makes it possible to avoid the mounting portion 214 in the injection molding, and the support arms 52 and the ball grooves 53 at the four corners of the first injection molding portion 30 face downward, so that the second material tape 40 is not disturbed in the subsequent lamination and the formation of the second injection molding portion 50. In addition, the mounting portion 214 is oriented opposite to the support arm 52 and the ball groove 53, and the support arm 52 and the ball groove 53 do not affect the mounting of the electronic component 60 in SMT. The bottom of the unit semifinished product 13 where the mounting portion 214 is located does not interfere with the operation of the SMT device.
Further, as shown in fig. 2 and 7, step a further includes step a1: after the first injection molding, the first connecting portion 22 of the periphery of the first metal element 21 is cut, so as to bend a portion of the lead portion 213 of the first metal element 21 and/or to implement the step b. Specifically, the first material strip 20 further includes a first base strip portion 23 and a first connection portion 22, the plurality of first metal elements 21 are arranged at intervals along the extending direction of the first base strip portion 23, and the first metal elements 21 are connected to the first base strip portion 23 through the plurality of first connection portions 22; the first material strip 20 is cut after the first injection molding to remove a portion of the first connecting portion 22, so as to avoid a short circuit after overlapping the first material strip 20 and the second material strip 40. Preferably, a portion of the first connecting portion 22 is left so as to avoid detachment of the first metal member 21 from the first base band portion 23, facilitating the second injection molding in the form of an entire band.
In a specific embodiment, as shown in fig. 2, some first connection portions 22 of the first tape 20 connect the first metal element 21 and the first base tape portion 23, and other first connection portions 22 are located in a middle area of the first metal element 21 to connect different portions of the first metal element 21, so as to enhance the structural strength of the first tape 20 and avoid deformation of the first metal element 21. After the first injection molding, the first injection molding portion 30 wraps the inner peripheral portion 211 of the first metal element 21, so that the structural strength of the first material strip 20 is ensured, and the first connecting portion 22 located in the middle area of the first metal element 21 is cut and removed, as shown in fig. 7, so that the subsequent second injection molding is facilitated.
Further, as shown in fig. 1 and 2, in one embodiment, the first metal element 21 further includes a conductive portion 215 located at the outer peripheral portion 212, and before cutting, one end of the conductive portion 215 is integrally connected to the other portion of the first metal element 21, and the other end of the conductive portion 215 is integrally connected to the first baseband portion 23; the conductive portion 215 is separated from the first base band portion 23 by cutting, which is beneficial to bending the conductive portion 215 later. Further, the conductive portion 215 is located at a top corner of the first metal element 21.
Further, step a further comprises step a2: after the first injection molding, at least part of the lead portions 213 of the first metal element 21 are bent along a predetermined position, and at least part of the lead portions 213 are vertically arranged and adapted to be electrically connected to an external circuit of the finished injection molding 10. Specifically, the inner peripheral portion 211 of the first metal element 21 is disposed horizontally, and at least part of the pins of the first metal element 21 are bent, so that at least part of the pins 213 are disposed vertically, and the arrangement direction of the branches of the first metal element 21 is adjusted, so that the arrangement of the first metal element 21 meets the preset requirement, and is convenient for being electrically connected with the circuit outside the finished injection molding 10 after the finished injection molding 10 is formed.
It should be noted that, when the branch is bent after the first injection molding, the pin portion 213 of the first metal element 21 is not covered by the first injection molding portion 30, so that bending is facilitated, and the inner peripheral portion 211 of the first metal element 21 is further prevented from deformation by fixing the first injection molding portion 30, which is beneficial to improving the yield of the finished injection molded part 10.
It is understood that the number of the pin portions 213 may be one, including a plurality of pins, or may be two or more, including a plurality of pins, respectively. The two or more lead portions 213 may be bent in the same direction as the first metal element 21, or may be bent in opposite directions from the first metal element 21. When the second semi-finished product 12 is cut into the unit semi-finished product 13, the connection portions of the ends of the lead portions 213 are cut away, and the ends of the plurality of leads are separated from each other, and are adapted to be electrically connected, respectively.
In one particular embodiment, the finished injection molding 10 is a motor base, as shown in fig. 1 and 2, with the lead portion 213 including first and second lead portions 2131 and 2132 disposed on opposite sides, and the conductive portion 215 is located on the first metal element 21 adjacent a corner of the first and second lead portions 2131 and 2132. In step a2, the first lead portion 2131 is bent in a direction of a lower side of the motor base to facilitate connection with a PCB circuit located below the motor base, and the conductive portion 215 is bent in a direction of an upper side of the motor base to facilitate connection with other conductive components located above the motor base, for example, the conductive portion 215 is electrically connected with an AF (auto Focus) coil of the motor driving portion through an upper spring sheet to form an AF conductive structure. Further, the conductive portion 215 is formed by bending a plurality of times.
Further, the method for manufacturing the injection molding part further comprises the step e: the first material belt 20 is fixed by the first fixing part 24 and the positioning device 70 of the die in the step a, so that the first material belt 20 is prevented from moving relative to the die in the step a in the process of the first injection molding, and the yield of the first injection molding is improved. The second material belt 40 is fixed by the second fixing part 44 and the positioning device 70 of the die in the step b, so that the second material belt 40 is prevented from moving relative to the die in the step b in the process of secondary injection molding, and the yield of secondary injection molding is improved. Wherein the first fixing portion 24 and the second fixing portion 44 are adjacently disposed, the positioning device 70 in the step a and the positioning device in the step b are the same, and include a first positioning portion 71 and a second positioning portion 72 that are adjacent to each other to respectively position the first fixing portion 24 and the second fixing portion 44.
It will be appreciated that in some embodiments, as shown in fig. 8, the first strip 20 is fixed to the positioning device 70 of the mold in step a during the first injection molding, so as to avoid the first strip 20 moving relative to the mold in step a during the first injection molding; in the second injection molding process, the first material belt 20 and the second material belt 40 need to be fixed with the positioning device 70 of the mold in the step b, so that the first material belt 20 and the second material belt 40 are prevented from moving relative to the mold in the step b in the second injection molding process, and the first material belt 20 is also prevented from moving relative to the second material belt 40. Preferably, when the second tape 40 is disposed on the first semi-finished product 11, the first fixing portion 24 of the first tape 20 and the second fixing portion 44 of the second tape 40 are disposed adjacently, and the first fixing portion 24 and the second fixing portion 44 can be positioned by the same positioning device 70 of the mold in the step b during the second injection molding, which is beneficial to reducing the complexity of the mold in the step b and further reducing the difficulty of mold opening and the cost of mold opening.
In a specific embodiment, as shown in fig. 7 to 9, when the second material strip 40 is disposed at the first semi-finished product 11, the first fixing portion 24 and the second fixing portion 44 are located at four corners of the first injection molding portion 30, and the positioning device 70 is provided with a plurality of protruding first positioning portions 71 and a plurality of protruding second positioning portions 72, where the first fixing portion 24 is adapted to be placed between the oppositely disposed first positioning portions 71, and the second fixing portion 44 is adapted to be placed between the oppositely disposed second positioning portions 72, so that the first material strip 20 and the second material strip 40 are detachably and fixedly connected to the mold in the step b through the first positioning portions 71 and the second positioning portions 72.
Further, the first fixing portions 24 and the second fixing portions 44 are located at or near the corners of each of the first metal members 21 and each of the second metal members 41, respectively, such that there is a certain interval between adjacent first fixing portions 24 and between adjacent second fixing portions 44. Accordingly, the first positioning portion 71 and the second positioning portion 72 of the positioning device 70 are located at or near the corner, so that a certain space is formed between the adjacent first positioning portions 71 and between the adjacent second positioning portions 72. Therefore, the positioning and mounting of the first and second tapes 20 and 40 have less interference with the first and second metal elements 21 and 41, which facilitates the design of the first and second metal elements 21 and 41, such as taking up more space, designing more complex circuit shapes, and the like. Auxiliary materials can be arranged at the rest positions of the first material belt 20 and the second material belt 40 to support the first metal element 21 and the second metal element 41, so that the structure reinforcement effect is achieved.
Further, as shown in fig. 2 to 5, the method for manufacturing an injection molded article further includes step f1: a first mounting channel 31 is provided in the first injection part 30, wherein a mounting part 214 is located at the bottom surface of the first metal element 21, exposed through the first mounting channel 31. Further, the method for manufacturing an injection molded part further includes step f2: providing a second mounting channel 51 in the second injection molding part 50, the second mounting channel 51 and the first mounting channel 31 being disposed opposite to each other such that the mounting part 214 of the first metal element 21 is exposed to the outside, adapted to be connected with the electronic component 60
Specifically, in some embodiments, the mounting portion 214 is formed on the bottom surface of the first metal element 21, and the first injection molding portion 30 needs to avoid the mounting portion 214 when covering the first metal element 21, so that the first mounting channel 31 is provided at the bottom of the first injection molding portion 30, and the first mounting channel 31 is implemented as a hole or a notch penetrating through the first injection molding portion 30. Similarly, the second injection part 50 needs to avoid the mounting part 214 and the first mounting channel 31, and thus a second mounting channel 51 is provided at the bottom of the second injection part 50, the second mounting channel 51 being implemented as a hole or a notch through the second injection part 50. The electronic component 60 is placed in the first mounting channel 31, and is fixed and electrically connected to the mounting portion 214 of the first metal member 21. It will be appreciated that the first mounting channel 31 may be formed during the first injection molding process, or may be formed in the first injection molding portion 30 after the subsequent processing; similarly, the second mounting channel 51 may be formed during the second injection molding, or may be formed in the second injection molding portion 50 after the subsequent processing. In an alternative embodiment, the first mounting channel 31 and the second mounting channel 51 are oriented in the same direction as the bending of the pin portion 213.
In one embodiment, the finished injection molding 10 is a motor base, and a plurality of first mounting channels 31 are formed in the bottom surface of the first injection molding 30. The first mounting channel 31 is adapted to mount an electronic component 60. The electronic component 60 is mounted on the mounting portion 214 by SMT and fixed to the first metal member 21.
The bottom surface of the first metal element 21 forms a mounting portion 214 extending in two directions intersecting. Further, the mounting portions 214 are near the edges of the first injection molded portion 30, and two mounting portions 214 are located on two intersecting edges of the first injection molded portion 30. With a certain spacing between the two mounting portions 214.
As shown in fig. 7 and 12, the electronic component 60 includes a position sensing element 61 adapted to conduct with the first metal element 21 for position sensing. The position sensing element 61 includes a hall element 611 and an IC (integrated circuit ) 612, among others. In one embodiment, the number of hall elements 611 and ICs 612 is two, respectively, and fixedly coupled to the two mounting portions 214, respectively. One hall element 611 and one IC612 are provided on the same side, and the other hall element 611 and the other IC612 are provided on the other side where the extending directions intersect.
The first mounting channel 31 includes a hall mounting channel 311 and an IC mounting channel 312, the hall mounting channel 311 being adapted to receive the hall element 611 for facilitating mounting of the hall element 611 to the mounting portion 214 in step d, the IC mounting channel 312 being adapted to receive the IC612 for facilitating mounting of the IC612 to the mounting portion 214 in step d. The hall mounting channel 311 and the IC mounting channel 312 may be the same, and are adapted to be disposed adjacent to the hall element 611 and the IC612 on the same side. The hall mounting channel 311 and the IC mounting channel 312 may be different and implemented to be disposed at the same side of the first injection part 30.
Specifically, as shown in fig. 7 and 12, with reference to fig. 3 and 5, the first injection-molded part 30 is located at the bottom of the first semi-finished product 11, the second mounting part 214b is formed at one corner of the bottom surface of the first metal element 21, and the hall mounting channel 311 is formed at the bottom of one of the corners of the first injection-molded part 30 to expose the second mounting part 214b for mounting the hall element 611. A first mounting portion 214a is formed on the bottom surface of the first metal member 21 so that two extending directions intersect, and an IC mounting channel 312 is formed on the bottom of the first injection molding portion 30 so that the first mounting portion 214a is exposed for mounting the IC612. Further, the IC mounting channels 312 are located at two intersecting sides of the first injection molding portion 30, so as to detect displacement amounts in two different directions after the hall element 611 and the IC612 are mounted, and perform OIS (Optical image stabilization, optical anti-shake) control in two directions. Further, the electronic components 60 may be mounted to the IC mounting channels 312.
The step c specifically comprises the following steps: after the second injection molding, the first connecting portion 22 of the periphery of the first metal member 21 is cut so that the first metal member 21 is separated from the other portion of the first tape 20, and the second connecting portion 42 of the periphery of the second metal member 41 is cut so that the second metal member 41 is separated from the other portion of the second tape 40, to obtain a single unit semi-finished product 13, as shown in fig. 11.
Specifically, the cutting in the step c is to cut the first connection portion 22 of the first tape 20 and the second connection portion 42 of the second tape 40, so that the first metal element 21 is separated from the first connection portion 22 and the first base tape portion 23 of the first tape 20, so that the second metal element 41 is separated from the second connection portion 42 and the second base tape portion 43 of the second tape 40, and further separate unit semi-finished products 13 are obtained, each unit semi-finished product 13 including the first metal element 21, the first injection molding portion 30, the second metal element 41 and the second injection molding portion 50.
As can be seen from the foregoing, in the embodiment, compared with SMT performed on the whole material strip, the material strip is cut to form the single semi-finished unit 13, and SMT can be performed after the semi-finished unit 13 is arranged, which is beneficial to improving SMT efficiency and improving yield in the reflow soldering process.
Further, the method for manufacturing the injection molding part further comprises the step g: the raw material strip is fed into a forming apparatus, and PIN forming is performed on the raw material strip to obtain the first strip 20 or the second strip 40. It should be noted that, after the PIN molding, the PIN inspection is further performed on the first material belt 20 and the second material belt 40, and the first material belt 20 and the second material belt 40 which do not meet the use requirement are processed, so that the quality of the first material belt 20 and the second material belt 40 is controlled before the injection molding, and the yield of the final injection molding product 10 after the injection molding is improved.
Further, after the step a is completed, the first semi-finished product 11 is detected, and the first semi-finished product 11 which does not meet the use requirement is processed; detecting the second semi-finished product 12 after the step b is finished, and processing the second semi-finished product 12 which does not meet the use requirement; c, detecting the unit semi-finished product 13 after the step c is finished, and processing the unit semi-finished product 13 which does not meet the use requirement; to control the quality of the semi-finished product corresponding to each step and improve the yield of the final injection molded product 10 after injection molding, it is understood that the detection of the final injection molded product 10 is also required after the completion of step d.
Further, the first web 20 is inspected before step a is performed; before step b is carried out, the first semifinished product 11 and the second web 40 are inspected; before step c is carried out, the second semifinished product 12 is inspected; before step d, the unit semi-finished product 13 is detected, so that the quality of the materials and the semi-finished products used in each step can be controlled in advance, and the loss can be reduced.
The injection molding piece comprises an injection molding part, a metal element and an electronic component 60, wherein at least part of the metal element is coated in the injection molding part, the electronic component 60 is electrically connected with the metal element, the injection molding piece is manufactured by any one of the manufacturing methods of the injection molding piece, namely, the injection molding is performed for the second time and then the SMT is performed, so that the loss of a semi-finished product subjected to the SMT is reduced, and the production cost of the injection molding piece is reduced.
Further, the injection molding piece is a plurality of components such as a motor base, a lens base, a motor carrier, a lens carrier and the like. It can be appreciated that the injection molding piece of the camera module, which needs to be internally provided with the metal element, can be manufactured by adopting the scheme according to the design requirement of the camera module.
The foregoing has outlined the basic principles, features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made therein without departing from the spirit and scope of the invention, which is defined by the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (12)
1. A method of manufacturing an injection molded article, comprising the steps of:
a. providing a first material belt, wherein the first material belt comprises a plurality of first metal elements, and performing primary injection molding on the first material belt to form a plurality of first injection molding parts so as to obtain a first semi-finished product;
b. providing a second material belt, wherein the second material belt comprises a plurality of second metal elements, the second material belt is arranged on the first material belt in a lamination mode, the second metal elements are positioned at corners of the first semi-finished product to form magnetic attraction elements, the second metal elements and the first metal elements are longitudinally arranged at intervals, and the first semi-finished product and the second material belt are subjected to second injection molding to form a plurality of second injection molding parts, so that a second semi-finished product is obtained;
c. cutting the second semi-finished product to obtain a plurality of unit semi-finished products, so that each unit semi-finished product is provided with the first metal element;
d. providing an electronic component, welding the electronic component on the unit semi-finished product, and electrically connecting the electronic component with the mounting part of the first metal element to obtain a finished injection molding.
2. The method according to claim 1, wherein in the step a, the first injection molding portion covers at least an inner peripheral portion of the first metal element and avoids the lead portion and the mounting portion of the first metal element at the time of the first injection molding; in the step b, when the second injection molding is performed, the second injection molding part covers the first semi-finished product and the second metal element, and the second injection molding part avoids the end parts of the mounting part and the lead part.
3. The method according to claim 1, wherein in the step b, the second metal element of the second tape is placed at a position of a stopper portion of the first injection molding portion, which positions the second tape horizontally with respect to the first semi-finished product are defined, wherein four corners of a bottom portion of the first injection molding portion form the stopper portion such that the magnetic attraction element formed by the second metal element is located below the first metal element in the finished injection molding.
4. The method of manufacturing an injection molded article according to claim 1, further comprising the step of e: fixing the first material belt with the first fixing part and the positioning device of the die in the step a;
fixing the second material belt through a second fixing part of the second material belt and a positioning device of the die in the step b;
the positioning device in the step a and the positioning device in the step b are identical, and each positioning device comprises a first positioning part and a second positioning part which are adjacent to each other, and the first fixing part and the second fixing part are respectively positioned.
5. The method of manufacturing an injection molded article according to claim 1, wherein the step c specifically comprises: and cutting the first connecting part around the first metal element after the second injection molding to separate the first metal element from other parts of the first material belt, and cutting the second connecting part around the second metal element to separate the second metal element from other parts of the second material belt so as to obtain a single semi-finished unit.
6. The method of manufacturing an injection molded article according to any one of claims 1 to 5, wherein the step a further comprises a step a1: and c, cutting part of the first connecting part on the periphery of the first metal element after the first injection molding, so that part of the lead part of the first metal element is conveniently bent and/or the step b is conveniently realized.
7. The method of manufacturing an injection molded article according to any one of claims 1 to 5, wherein the step a further comprises a step a2: after the first injection molding, bending at least part of the pin parts of the first metal element along a preset position, so that at least part of the pin parts are vertically arranged and are suitable for being electrically connected with an external circuit of the finished injection molding.
8. The method according to any one of claims 1 to 5, wherein in the step a, the first tape is set to a mold with a mounting portion facing upward, wherein the mounting portion is located on a bottom surface of the first metal element.
9. The method of manufacturing an injection molded article according to claim 8, further comprising the step f1: providing a first mounting channel in the first injection molding part, wherein the first mounting channel is positioned at the bottom of the first injection molding part, and the mounting part is exposed through the first mounting channel.
10. The method of manufacturing an injection molded article according to claim 9, further comprising the step f2: and providing a second mounting channel in the second injection molding part, wherein the second mounting channel and the first mounting channel are oppositely arranged, so that the mounting part of the first metal element is exposed to the outside and is suitable for being connected with the electronic component.
11. Injection molded part comprising an injection molded part, a metal element and an electronic component, at least part of the metal element being enclosed in the injection molded part, the electronic component being electrically connected to the metal element, characterized in that the injection molded part is produced by the method for producing an injection molded part according to any one of claims 1 to 10.
12. The injection molded article of claim 11, wherein the injection molded article is a motor mount, or a lens mount, or a motor carrier, or a lens carrier.
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| CN202410095747.3A CN117621351B (en) | 2024-01-23 | 2024-01-23 | Manufacturing method of injection molding piece and injection molding piece thereof |
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