CN114624844A - Lens driving device, base thereof and manufacturing method of base - Google Patents

Abstract

The invention discloses a lens driving device, a base thereof and a manufacturing method of the base. The manufacturing method of the base comprises the following steps: the metal frame is of a rectangular sheet structure and comprises a metal frame body and a chip mounting portion, and the chip mounting portion is electrically connected with the metal frame body. And carrying out primary injection molding around the periphery of the chip mounting part to form a protective shell, and obtaining a semi-finished product. And performing secondary injection molding around the metal frame body to obtain a base finished product. The base is manufactured by a two-time injection molding method, and the first injection molding only surrounds the periphery of the chip mounting part, so that the injection molding precision of the chip welding part can be ensured, the dislocation phenomenon of the metal frame in the welding process is prevented, and the cold joint phenomenon in the process of welding the chip to the chip mounting part is avoided.

Description

Lens driving device, base thereof and manufacturing method of base

Technical Field

The invention relates to the field of optical drive, in particular to a lens drive device, a base and a base manufacturing method.

Background

With the development of technology, many electronic devices (such as smart phones or digital cameras) have a function of taking pictures or recording videos. The electronic devices are more and more commonly used, and the development is directed to a design of convenience and lightness and thinness to provide more choices for users.

In order to make the electronic device lighter and thinner, a part of the chip and the circuit are disposed inside the base. In the prior art, a metal frame is generally directly molded into a base structure in an injection mode, a chip mounting part is reserved, then the method cannot guarantee the precision of the reserved chip mounting part, a cold joint phenomenon is possible to occur due to movement or dislocation of the metal frame in the chip welding process, and the chip can be accurately welded to the chip mounting part only by guaranteeing the injection molding precision of the chip mounting part due to the fact that the size of the chip is small, so that a qualified base is prepared.

Disclosure of Invention

An object of the present invention is to provide a lens driving apparatus, a base and a method for manufacturing the base, which solve the above-mentioned problems in the prior art.

In order to solve the above-mentioned problems, according to an aspect of the present invention, there is provided a method of manufacturing a mount for a lens driving apparatus, comprising the steps of:

providing a metal frame, wherein the metal frame comprises a metal frame body and a chip mounting part, and the chip mounting part is electrically connected with the metal frame body; performing primary injection molding around the periphery of the chip mounting part to form a protective shell to obtain a semi-finished product;

and performing second injection molding around the metal frame body.

In one embodiment, the metal frame includes at least two sets of metal strips, at least one set of the metal strips electrically connecting at least one of the chip mounting portions.

In one embodiment, the metal frame includes two sets of metal strips, each set of metal strips electrically connecting at least one of the chip mounting portions.

In one embodiment, the two sets of metal strips are arranged end to end and form a rectangular frame, and preferably, the two sets of metal strips are identical in structure.

In one embodiment, each of the metal strips includes a plurality of metal strips, at least two of the metal strips being broken in between and forming the chip mounting portion at the broken position.

In one embodiment, before the first injection molding, one end of at least one part of the metal strips, which is far away from the chip mounting part, is bent for 2 to 5 times, and forms a preset angle relative to a plane formed by other parts of the metal strips except the bent end parts.

In one embodiment, the predetermined angle is in the range of 70 ° to 90 °, preferably 80 ° to 90 °, more preferably 85 ° to 90 °.

In one embodiment, after the second injection molding, the method further comprises the steps of: and soldering a chip to the chip mounting portion.

In one embodiment, before the first injection molding of the metal frame, the method further comprises the steps of: and soldering a chip to the chip mounting portion.

The present invention also relates to a base of a lens driving apparatus, comprising:

the frame comprises a frame body and a protective shell, wherein the outer periphery of the frame is rectangular, the inner periphery of the frame forms a circular hollow structure, the two ends of the protective shell are connected to the two ends of the frame body, the protective shell is formed by first injection molding, and the frame body is formed by second injection molding;

a metal frame; the metal frame is embedded in the frame and comprises a metal frame body and a chip mounting part, the metal frame body is electrically connected with the chip mounting part, the metal frame body is embedded in the frame body, and the chip mounting part is exposed in the protective shell;

a chip, the chip install in the protective housing and with the chip installation department electricity is connected.

In one embodiment, the metal frame is further provided with a circuit board connection end exposed to the inner periphery of the bezel.

In one embodiment, the metal frame further has suspension wire connection ends exposed to four corners of the bezel.

The present invention also relates to a lens driving device including:

a housing;

the base and the shell are matched to form an accommodating space;

the circuit board is internally provided with a coil which is electrically connected with the metal frame;

the lens driving device comprises a frame, a base and a lens driving device, wherein the frame is provided with a central hole, an internal circuit is embedded in the frame, and the frame is also provided with a magnet, wherein the magnet is used for matching with the coil of the base so as to drive the frame to move along the direction vertical to the optical axis of the lens driving device;

the carrier is movably arranged in the central hole of the frame, and a coil is arranged on the carrier;

an upper spring plate connecting the frame and the top of the carrier and elastically connecting the frame with the carrier, the upper spring plate electrically connecting the internal circuit of the frame;

a lower spring plate which connects the frame and the bottom of the carrier and electrically connects the internal circuit and the coil on the carrier, and elastically connects the frame and the carrier;

one end of the suspension wire is connected with the metal frame of the base, and the other end of the suspension wire is connected with the upper reed.

The base is manufactured by a two-time injection molding method, and the first injection molding only surrounds the periphery of the chip mounting part, so that the injection molding precision of the chip welding part can be ensured, the dislocation phenomenon of the metal frame in the welding process is prevented, and the cold joint phenomenon in the process of welding the chip to the chip mounting part is avoided.

Drawings

Fig. 1 is an exploded perspective view of a lens driving apparatus according to an embodiment of the present invention.

Fig. 2 is a schematic view of a metal frame of one embodiment of the present invention.

Fig. 3 is another angle schematic view of the metal frame of the embodiment shown in fig. 2.

Fig. 4 is a schematic view of the metal frame of the embodiment of fig. 2 injection molded to form a base.

Fig. 5 is another angle view of the base of the embodiment of fig. 4.

Fig. 6 is a schematic view of a metal frame according to another embodiment of the present invention.

Fig. 7 is a schematic view of the metal frame of the embodiment of fig. 6 after injection molding to form a base.

Reference numerals are as follows: 1. a base; 11. a metal frame; 111. a metal frame body; 112. a chip mounting portion; 113. A metal strip; 114. a circuit board connecting end; 115. a suspension wire connecting end; 12. a frame; 121. a frame body; 122. a protective shell; 123. a hollow structure; 13. a chip; 14. a circuit board; 2. a frame; 21. a magnet; 3. a reed is arranged; 4. a lower reed; 5. a carrier; 6. suspension of silk; 7. a housing; 100. a lens driving device.

Detailed Description

The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the objects, features and advantages of the invention can be more clearly understood. It should be understood that the embodiments shown in the drawings are not intended to limit the scope of the present invention, but are merely intended to illustrate the spirit of the technical solution of the present invention.

In the following description, for the purposes of illustrating various disclosed embodiments, certain specific details are set forth in order to provide a thorough understanding of the various disclosed embodiments. One skilled in the relevant art will recognize, however, that the embodiments may be practiced without one or more of the specific details. In other instances, well-known devices, structures and techniques associated with this application may not be shown or described in detail to avoid unnecessarily obscuring the description of the embodiments.

Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

In the following description, for the purposes of clearly illustrating the structure and operation of the present invention, directional terms will be used, but terms such as "front", "rear", "left", "right", "outer", "inner", "outer", "inward", "upper", "lower", etc. should be construed as words of convenience and should not be construed as limiting terms.

Fig. 1 is an exploded perspective view of a lens driving mechanism according to an embodiment of the present invention, and in an embodiment, the lens driving mechanism 100 includes a housing 7, a base 1, a carrier 5, a frame 2, an upper spring 3, a lower spring 4, and a magnet 21. The housing 7 cooperates with the base 1 to form a chamber to accommodate the carrier 5, the frame 2, the upper spring 3, the lower spring 4, and the magnet 21. It should be noted that the chamber herein may be an open space or a closed space, and may have a regular shape or an irregular shape, which is not limited herein. The carrier 5 is used for mounting a lens and is wound with a coil, the frame 2 is provided with a central hole, the carrier 5 is arranged in the central hole, and the magnet 21 is arranged in the frame 2 and is matched with the coil on the carrier 5 to drive the carrier 5 to move along the optical axis direction, so that the optical zooming function is realized.

The lower spring 4 movably connects the lower surface of the frame 2 and the carrier 5, and the upper spring 3 movably connects the upper surface of the frame 2 and the carrier 5, thereby being used for the returning operation of the carrier 5 after the carrier 5 moves relative to the frame 2.

Fig. 2, fig. 3 or fig. 4 are schematic views of the base 1 of the lens driving apparatus 100 according to an embodiment of the present invention. The base 1 of the lens driving device 100 includes a frame 12, a metal frame 11 and a chip 13, wherein the frame 12 is used for supporting the metal frame 11 and the chip 13, and the metal frame 11 is used as an embedded circuit of the frame 2 and can be used for transmitting current or welding the chip 13. Specifically, the periphery of the frame 12 is rectangular, the inside is a circular hollow structure 123, the frame 12 includes a frame body 121 and a protective shell 122, two ends of the protective shell 122 are connected to two ends of the frame body 121, and the frame 12 is formed together with the frame body 121. The protective case 122 is formed by the first injection molding, and the frame body 121 is formed by the second injection molding. The metal frame 11 is embedded in the frame 12, the metal frame 11 includes a metal frame body 111 and a chip mounting portion 112, the metal frame body 111 is electrically connected to the chip mounting portion 112, the metal frame body 111 is embedded in the frame body 121, and the chip mounting portion 112 is exposed in the protective shell 122. The chip 13 is mounted in the protective case 122 and electrically connected to the chip mounting portion 112. The metal strip 113 and the chip 13 are disposed inside the base 1, so that the occupied space of the external circuit board 14 can be reduced, and the lens driving device 100 is lighter and thinner.

Optionally, the metal frame 11 is further provided with a circuit board connection end 114, and the circuit board connection end 114 is exposed to the inner periphery of the frame 12. In the embodiment of fig. 2 and 6, the circuit board connection terminals 114 are four in number and are all disposed on the inner periphery of the base 1.

Further, the base 1 is further provided with a circuit board 14, the circuit board 14 is electrically connected to the circuit board connection end 114 on the base 1, the circuit board 14 is preferably a flexible circuit board, the flexible circuit board covers one side of the frame 12, and two sets of coils are further arranged inside the flexible circuit board and can be matched with the two sets of magnets 21 on the frame 2 to drive the lens to move along the X axis or the Y axis.

Further, the metal frame 11 further has suspension wire connection ends 115, the suspension wire connection ends 115 are exposed at four corners of the frame 12, the suspension wire connection ends 115 are used for connecting the suspension wires 6, the upper connection end of the metal frame 11 in the base 1 can be connected with external current, and the current flows into the coil on the carrier 5 through the suspension wires 6, the upper spring leaf 3 and the lower spring leaf 4, so that the coil and another group of magnets 21 on the frame 2 cooperate to drive the carrier 5 to move along the optical axis direction.

In addition, it should be noted that the structure of the metal frame 11 and the frame 2 in the embodiments of fig. 2 to 5 and fig. 6 to 7 are slightly different, and the implementation of the present invention is not affected.

Specifically, a circuit board 14 is further arranged on the base 1, a coil is arranged in the circuit board 14, the coil is electrically connected with the metal frame 11, and the base 1 and the shell 7 are matched to form an accommodating space. The frame 2 is provided with a central hole, an internal circuit is embedded in the frame 2, and the frame 2 is further provided with a plurality of groups of magnets 21, wherein the magnets 21 are used for matching with two groups of coils of the base 1 so as to drive the frame 2 to drive the carrier 5 to move along the direction perpendicular to the optical axis of the lens driving device, namely along the X axis or the Y axis. Go up the top that reed 3 connects frame 2 and carrier 5, go up reed 3 and include the multiunit elastic wire, and go up reed 3's one end and connect carrier 5, the internal circuit in frame 2 and the frame 2 is connected to the other end, go up the yellow piece can be with frame 2 and carrier 5 elastic connection, can also input the electric current in the base 1 to the internal circuit, the coil on reed 4 and the carrier 5 down flows in through the internal circuit again. The lower spring 4 is attached to the bottom of the frame 2 and the carrier 5. The lower reed 4 also comprises a plurality of groups of elastic wires, one end of the lower reed 4 is connected with the carrier 5 and placed in the abdomen, and the other end is connected with the bottom end of the frame 2 and the internal circuit of the frame 2. The lower spring 4 is also connected to the coil on the carrier 5, and a current of an internal circuit of the frame 2 can flow into the coil on the carrier 5 through the lower spring 4, and the lower spring 4 elastically connects the frame 2 and the carrier 5.

The carrier 5 is installed in the central hole of the frame 2, a coil is arranged on the carrier 5, and the coil on the carrier is electrically connected with the lower spring 4 and matched with the magnet 21 of the frame 2 to drive the carrier 5 to drive the lens to move along the optical axis direction. One end of the suspension wire 6 is connected with the metal frame 11 of the base 1, the other end is connected with the upper reed 3, and the connecting end of the base 1 can flow into the coil on the carrier 5 through the suspension wire 6, the upper reed 3, the internal circuit of the frame 2 and the lower reed 4. In addition, the metal frame 11 in the base 1 is also electrically connected with the coil in the circuit board 14, and the coil of the circuit board 14 is matched with the magnet 21 in the frame 2 to drive the carrier 5 to move along the X axis or the Y axis.

Alternatively, the circuit board 14 is connected to the circuit board connection terminal 114 of the metal frame 11 in the base 1 through the circuit board connection terminal 114, and then current is input to the coil in the circuit board 14.

Alternatively, there are four suspension wires 6 respectively connected to the suspension wire connection terminals 115 at four angles of the base 1, and the four suspension wires 6 are respectively connected to four portions of the upper spring 3 and electrically connected to the internal circuit of the frame 2 through the upper spring 3.

It is to be noted that in both embodiments of fig. 2 and 6, the metal frame 11 is of a rectangular plate-like structure. It should be understood that the shape of the metal frame 11 is not limited to the shape of fig. 2 and 6, and may be designed in other shapes such as a diamond shape or a hexagonal shape.

Optionally, the metal frame body 111 includes at least two sets of metal strips 113, and at least one set of metal strips 113 is electrically connected to at least one chip mounting portion 112. It is understood that the metal strips 113 may also be provided in a plurality of groups, such as 2, 3, 4 or more groups. Each set of metal bars 113 may be electrically connected to one chip mounting portion 112, or may be connected to a plurality of chip mounting portions 112. In the embodiment of fig. 2 and 3, there are two chip mounting portions 112, and two sensors may be respectively mounted on the two chip mounting portions 112, and the two sensors respectively cooperate with the magnets 21 of the frame 2 to detect displacements of the carrier 5 along the X-axis and the Y-axis, which are two mutually perpendicular directions perpendicular to the optical axis direction. It is to be understood that the chip mounting portions 112 may be provided in three, four, five or more, as necessary, without limiting the number and positions of the chip mounting portions 112.

Optionally, the metal frame 11 is a rectangular frame 2 and includes two sets of metal strips 113, each set of metal strips 113 is electrically connected to at least one chip mounting portion 112, in the embodiment of fig. 2 and 6, each set of metal strips 113 is electrically connected to one chip mounting portion 112, and two sets of metal strips 113 are respectively electrically connected to two chip mounting portions 112.

Optionally, two groups of metal strips 113 are arranged end to end in an insulated manner and form a rectangular frame, each group of metal strips 113 includes a plurality of metal strips 113, and two adjacent metal strips 113 are arranged in an insulated manner. In the embodiment of fig. 2 and 3, each group of metal strips 113 includes six metal strips, and one end of each metal strip 113 is located on the chip mounting portion 112, wherein one ends of the two metal strips 113 away from the chip mounting portion 112 are circuit board connection ends 114, and the circuit board connection ends 114 are located inside the metal frame 11. The other four are divided into two groups and located on both sides of the metal frame 11 adjacent thereto, and the end of one group of metal strips 113 extends to the side opposite to the other group of metal strips 113. In another embodiment, as shown in fig. 6, each group of the metal strips 113 has six metal strips, wherein the ends of two metal strips 113 are also circuit board connection ends 114, the circuit board connection ends 114 are also located at positions close to the inner circumference of the metal frame 11, the middle of two metal strips 113 is broken and a chip mounting portion 112 is formed at the broken position, and two ends of another pair of metal strips 113 are respectively located at two adjacent corners of the metal frame 11 for connecting the suspension wires 6. The skilled person can also set the metal frame 11 in other shapes as necessary, without limiting the shape of the metal frame 11 and the circuit arrangement. Furthermore, a plurality of metal strips 113 may be provided to be cut off at the same position to form the chip mounting portion 112, without limiting the number of connections between the metal strips 113 and the chip mounting portion 112.

Preferably, the two sets of metal strips 113 are identical in structure. In the embodiment of fig. 2 and 3, the two sets of metal strips 113 are identical in structure and are symmetrically disposed with respect to the center of the metal frame 11. In the embodiment of fig. 6, the two sets of metal strips 113 have the same structure, and the two sets of metal strips 113 are also symmetrically disposed. The two groups of metal strips 113 have consistent structures and are convenient to process and produce.

In the present application, when the base 1 is manufactured, the manufacturing method thereof includes the steps of: a metal frame 11 is provided, the metal frame 11 includes a metal frame body 111 and a chip mounting portion 112, and the chip mounting portion 112 is electrically connected to the metal frame body 111. A first injection molding is performed around the periphery of the chip mounting portion 112 and the protective case 122 is formed, resulting in a semi-finished product. A second injection is performed around the metal holder body 111. The base 1 is manufactured by a two-time injection molding method, and the first injection molding only surrounds the periphery of the chip mounting part 112, so that the injection molding precision of the welding part of the chip 13 can be ensured, the dislocation phenomenon of the metal frame 11 in the welding process can be prevented, and the false welding phenomenon in the process of welding the chip 13 to the chip mounting part 112 can be avoided.

Optionally, before the first injection molding, one end of the partial metal strip 113 away from the chip mounting portion 112 is bent 2-5 times, and is at a predetermined angle with respect to a plane formed by other portions of the partial metal strip except the bent portion. In the embodiment of fig. 2 and 3, the ends of the two pairs of metal strips 113 away from the chip mounting portion 112 are connecting ends, which are located at two opposite sides of the metal frame 11 and bent at a predetermined angle relative to the chip mounting portion 112. In the embodiment of fig. 6, both ends of the two pairs of metal strips 113 away from the chip mounting portion 112, one end of one pair of metal strips 113 away from the circuit board 14 mounting portion, and one end of the other pair of metal strips 113 away from the suspension wire connecting end 115 are connecting ends, all bent at a predetermined angle, and the connecting ends of the two sets of metal strips 113 are located at opposite sides.

Optionally, the connection end is bent to be substantially perpendicular to the chip mounting portion 112, and the bending angle of the connection end is selectable in a range of 70 ° to 90 °, preferably in a range of 80 ° to 90 °, and more preferably in a range of 85 ° to 90 °.

Alternatively, the chip 13 is also soldered to the chip mounting portion 112 before the first injection molding. Preferably, the chip 13 may be soldered to the chip mounting portion 112 after the second injection molding. As another preferable scheme, after the protective shell 122 is formed by injection molding for the first time, the chip 13 may be welded to the chip mounting portion 112, because the protective shell 122 is already formed at this time, and the precision of the protective shell 122 is high, so that the chip 13 is conveniently positioned and welded, and the welding efficiency may be improved.

It should be noted that in the embodiment of fig. 2 and 3, the protective casing 122 is shaped as a rectangular frame, and it should be understood that in other embodiments, the protective casing 122 may also be shaped as other shapes, such as a polygonal frame or a circular frame, without limiting the shape of the protective casing 122. The chip 13 may be a sensor for sensing the position of the carrier 5, or may be a capacitor, and the type of the chip 13 is not limited.

It should be noted that, in the embodiment shown in fig. 7, three magnets 21 are disposed on the frame 2, two sets of coils are disposed in the circuit board 14, one set of coils is disposed on the carrier 5, two magnets 21 of the three magnets 21 in the frame 2 respectively correspond to the two sets of coils in the circuit board 14 to drive the carrier 5 to move along the X-axis and the Y-axis directions, and the other magnet 21 is used for matching with the one set of coils on the carrier 5 to drive the carrier 5 to move along the optical axis direction. It should be understood that in another embodiment, the frame 2 may be provided with four or more magnets 21, and may also cooperate with the circuit board 14 and the plurality of sets of coils of the carrier 5 and drive the carrier 5 to move along the X-axis, Y-axis or optical axis direction.

The base 1 of the present invention is formed by two injection molding processes, so that the accuracy of the chip mounting portion 112 can be ensured, a part of the chip 13 can be allowed to be mounted in the base 1, the use of the circuit board 14 is reduced, the lens driving device 100 can be made thinner and lighter, and market demands can be met.

While the preferred embodiments of the present invention have been illustrated and described in detail, it should be understood that various changes and modifications of the invention can be effected therein by those skilled in the art after reading the above teachings of the invention. Such equivalents are intended to fall within the scope of the claims appended hereto.

Claims (13)

1. A method of manufacturing a mount for a lens driving apparatus, comprising the steps of:

providing a metal frame, wherein the metal frame comprises a metal frame body and a chip mounting part, and the chip mounting part is electrically connected with the metal frame body;

performing primary injection molding around the periphery of the chip mounting part to form a protective shell to obtain a semi-finished product;

and performing second injection molding around the metal frame body.

2. The method of manufacturing a submount of claim 1, wherein the metal frame comprises at least two sets of metal strips, at least one set of the metal strips electrically connecting at least one of the chip mounting sections.

3. The method of manufacturing a submount of claim 2, wherein the metal frame comprises two sets of metal strips, each set of metal strips electrically connecting at least one of the chip mounting sections.

4. A method of manufacturing a base as claimed in claim 3, wherein two sets of said metal strips are arranged end to end and form a rectangular frame, preferably said two sets of said metal strips are identical in structure.

5. The method of manufacturing a submount of claim 2, wherein each set of the metal strips comprises a plurality of metal strips, at least two of the plurality of metal strips being broken in between and forming the chip mounting portion at the broken position.

6. The method of manufacturing a submount according to claim 2, wherein, before the first injection molding, one end of at least a part of the metal strips which is away from the chip mounting portion is bent 2 to 5 times and is at a predetermined angle with respect to a plane formed by other parts of the plurality of metal strips except the bent end portions.

7. A method of manufacturing a base as claimed in claim 6, wherein the predetermined angle is in the range 70 ° to 90 °, preferably 80 ° to 90 °, more preferably 85 ° to 90 °.

8. The method for manufacturing a base plate of claim 1, wherein after the second injection molding, the method further comprises the steps of: and soldering a chip to the chip mounting portion.

9. The method for manufacturing a base according to claim 1, wherein before the first injection molding of the metal frame, the method further comprises the steps of: and soldering a chip to the chip mounting portion.

10. A base of a lens driving apparatus, comprising:

the frame comprises a frame body and a protective shell, wherein the outer periphery of the frame is rectangular, the inner periphery of the frame forms a circular hollow structure, the two ends of the protective shell are connected to the two ends of the frame body, the protective shell is formed by first injection molding, and the frame body is formed by second injection molding;

a metal frame; the metal frame is embedded in the frame and comprises a metal frame body and a chip mounting part, the metal frame body is electrically connected with the chip mounting part, the metal frame body is embedded in the frame body, and the chip mounting part is exposed in the protective shell;

a chip, the chip install in the protective housing and with the chip installation department electricity is connected.

11. The mount for lens driving apparatuses according to claim 10, wherein the metal frame is further provided with a circuit board connection end exposed to an inner periphery of the rim.

12. The mount for a lens driving apparatus according to claim 10, wherein the metal frame further has suspension wire connection ends exposed to four corners of the rim.

13. A lens driving apparatus, comprising:

a housing;

the base of any of claims 10-12, said base and housing cooperating to form a receiving space;

the circuit board is internally provided with a coil which is electrically connected with the metal frame;

the lens driving device comprises a frame, a base and a lens driving device, wherein the frame is provided with a central hole, an internal circuit is embedded in the frame, and the frame is also provided with a magnet, wherein the magnet is used for matching with the coil of the base so as to drive the frame to move along the direction vertical to the optical axis of the lens driving device;

the carrier can be movably arranged in the central hole of the frame, and a coil is arranged on the carrier;

an upper spring plate connecting the frame and the top of the carrier and elastically connecting the frame with the carrier, the upper spring plate electrically connecting the internal circuit of the frame;

a lower spring plate which connects the frame and the bottom of the carrier and electrically connects the internal circuit and the coil on the carrier, and elastically connects the frame and the carrier;

one end of the suspension wire is connected with the metal frame of the base, and the other end of the suspension wire is connected with the upper reed.

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