CN112737272A - Base welded with electronic element, production process thereof and voice coil motor - Google Patents
Base welded with electronic element, production process thereof and voice coil motor Download PDFInfo
- Publication number
- CN112737272A CN112737272A CN202011489802.5A CN202011489802A CN112737272A CN 112737272 A CN112737272 A CN 112737272A CN 202011489802 A CN202011489802 A CN 202011489802A CN 112737272 A CN112737272 A CN 112737272A
- Authority
- CN
- China
- Prior art keywords
- metal circuit
- soldered
- base
- insulating
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
- H02K41/035—DC motors; Unipolar motors
- H02K41/0352—Unipolar motors
- H02K41/0354—Lorentz force motors, e.g. voice coil motors
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/0094—Structural association with other electrical or electronic devices
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K15/00—Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
Abstract
The invention provides a base welded with electronic elements, comprising: at least two electronic components; each metal circuit is connected with at least one electronic element and comprises a plurality of branches, a welding part is formed at one inner end of each branch, and the welding parts of the branches are correspondingly connected with the pins of the electronic element one by one; at least two insulating blocks, at least two metal circuits are correspondingly coated and molded, each insulating block is coated and molded on the outer periphery of the position where the corresponding metal circuit is connected with the electronic element, and all branches of the metal circuit are positioned by each insulating block to form a metal circuit module; the insulating body is coated and molded on at least partial outer sides of the at least two metal circuit modules so as to position and package the at least two metal circuit modules.
Description
Technical Field
The present invention relates to a base welded with electronic components, a production process thereof, and a voice coil motor, and more particularly, to a base for use in the field of electronic devices, a production process thereof, and a voice coil motor.
Background
The camera module is an important component of electronic equipment with a camera shooting function, such as a mobile phone, a tablet personal computer and the like. The camera module generally includes a Printed Circuit Board (PCB), an image sensor, a supporting base, a voice coil motor, and a lens. Image sensor and supporting seat all set up on printed circuit board, and the voice coil motor sets up on the supporting seat, all is provided with the through-hole on voice coil motor and the supporting seat, and the camera lens is connected with the voice coil motor to just to setting up through-hole and image sensor. The supporting seat is adhered with an optical filter for shielding the through hole. The supporting seat increases the height of the camera module, and is not beneficial to development of electronic equipment such as mobile phones towards lightness and thinness.
In view of the above, chinese patent application CN110177429A discloses a component with an electronic component, which is a supporting seat formed by one-step injection molding, and a metal circuit is directly embedded in the supporting seat, so that no additional printed circuit board is required to be disposed. However, the support seat is formed by performing one-step injection molding on the metal circuit, and the support seat is affected by the high temperature of the reflow oven in the subsequent Surface Mount Technology (SMT) process of soldering the electronic component to the metal circuit of the support seat, which causes the problem of dimensional variation of the plastic part of the support seat.
As another example, chinese utility model patent CN209928190U discloses a driving mechanism with a three-dimensional circuit, where the driving mechanism includes a base B (including a body B1 and a retaining wall B2) and a three-dimensional circuit E (including a first section E1, a second section E2 and a third section E3), the three-dimensional circuit E is embedded in the base B and electrically connected to a position sensing component, specifically, a part of the three-dimensional circuit E (a second section E2, a third section E3) is embedded in the retaining wall B2 by an insert molding technique, and another part of the three-dimensional circuit E (a first section E1) is embedded in the body B1 by an insert molding technique. In this patent, through two injection moulding technique shaping base B, form certain contained angle between barricade B2 and the body B1, barricade B2 combines through a face only with body B1, and not only the combination between the two is unreliable, can only form the actuating mechanism that has a three-dimensional circuit E moreover once, and the shaping is inefficient.
Therefore, it is necessary to provide a new base to which electronic components are soldered, a manufacturing process thereof, and a voice coil motor.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a novel base welded with electronic components, a production process thereof and a voice coil motor, so as to overcome the defects of the prior art.
The technical scheme adopted by the invention for solving the problems in the prior art is as follows:
a submount to which an electronic component is soldered, comprising:
at least two electronic components;
each metal circuit is connected with at least one electronic element and comprises a plurality of branches, a welding part is formed at one inner end of each branch, and the welding parts of the branches are connected with the pins of the electronic element in a one-to-one correspondence manner;
at least two insulating blocks, wherein the at least two insulating blocks correspondingly overmould the at least two metal circuits, each insulating block is overmoulded on the outer periphery of a position where the corresponding metal circuit is connected with the electronic element, and each insulating block positions all branches of the metal circuit to form a metal circuit module;
the insulating body is coated and molded on at least partial outer sides of the at least two metal circuit modules so as to position and package the at least two metal circuit modules.
Preferably, the insulating body is overmolded on all outer edges of at least two of the metal circuit modules to position and encapsulate the at least two metal circuit modules.
Preferably, the metal circuit module is formed by integral injection molding.
Preferably, the insulation body is formed by integral injection molding and covers at least two of the metal circuit modules.
Preferably, the base includes three metal circuit module, is first metal circuit module, second metal circuit module, third metal circuit module respectively, insulator includes the main part and is located first edge portion, second edge portion and the third edge portion of main part periphery, first metal circuit module inlays to be located first edge portion, second metal circuit module inlays to be located the second edge portion, third metal circuit module inlays to be located third edge portion.
Preferably, the base further includes a fourth metal circuit module, the insulating body further includes a fourth edge portion located on the periphery of the main body portion, and the fourth metal circuit module is embedded in the fourth edge portion.
Preferably, the metal circuit modules are arranged on the edge parts corresponding to the metal circuit modules respectively and deviated from the centers of the edge parts.
Preferably, the insulation blocks include base portions, an upper surface of the base portion of each insulation block is coplanar with an upper surface of the main body portion of the insulation body, and a lower surface of the base portion of each insulation block is coplanar with a lower surface of the main body portion of the insulation body.
Preferably, the insulating block is provided with an accommodating groove formed by sinking downwards from the upper surface of the insulating block, the plurality of branches of the metal circuit are provided with welding parts, and the welding parts are exposed in the accommodating groove and arranged.
Preferably, a plurality of bumps formed by protruding upwards from the bottom wall of the accommodating groove are arranged in the accommodating groove, and the welding part is exposed on the upper surface of the bump.
Preferably, the material of the insulating block is different from the material of the insulating body, and the heat resistance of the material of the insulating block is greater than that of the material of the insulating body.
Preferably, the insulation block is made of PPS plastic material.
Preferably, the insulation body is made of LCP plastic materials.
Preferably, a hollow area is formed in the middle of the main body part, and the optical filter is fixed in the hollow area of the main body part.
A production process of a base with electronic components soldered thereon, for producing the base with electronic components soldered thereon according to any one of the above, comprising the steps of:
s11, forming at least two metal circuits, wherein the two metal circuits are integrally connected through a first square frame type material belt;
s12, performing in-mold injection molding on the at least two metal circuits to respectively coat the multiple branches of the two metal circuits and expose the welding parts of the multiple branches, and forming at least two metal circuit modules after the injection molding is completed, wherein each metal circuit module comprises an insulating block and the metal circuit embedded in the insulating block;
s13, correspondingly welding the at least two electronic components to the at least two metal circuit modules to form the metal circuit modules with the electronic components;
s14, performing in-mold injection molding on at least two metal circuit modules with electronic components, wherein an insulation body formed by injection molding covers the at least two metal circuit modules welded with the electronic components;
and S15, cutting the first square frame type material belt to form the base welded with the electronic element.
Preferably, in step S15, the at least two electronic components are respectively soldered to the corresponding metal circuit modules by an SMT process.
Preferably, between the step S13 and the step S14, a step S16 is further included: and cutting a second square material belt connected between the at least two metal circuit modules, wherein the outer sides of the at least two metal circuit modules are connected with the first square material belt.
Preferably, the material of the insulating block is different from the material of the insulating body, and the heat resistance of the material of the insulating block is greater than that of the material of the insulating body.
Preferably, the insulation block is made of PPS plastic material.
Preferably, the insulation body is made of LCP plastic materials.
A voice coil motor is connected with a lens and used for driving the lens to move so as to achieve automatic focusing, and the voice coil motor comprises a base welded with electronic elements according to any one of the above items.
The invention has the beneficial effects that: the base welded with the electronic component is formed through the secondary injection molding process, the plastic materials adopted in the two injection molding processes are different, the PPS plastic material is adopted for the four insulating blocks formed in the first injection molding process, the LCP plastic material is adopted for the insulating body formed in the second injection molding process, and the four insulating blocks formed after the PPS plastic material is subjected to injection molding are better in high temperature resistance and structural strength, so that the four insulating blocks are prevented from being deformed due to high temperature in an SMT (surface mounting technology) process, the LCP plastic material is better in molding performance, the size of the insulating body formed after injection molding is more stable, and the integral manufacturing performance and reliability of the base are improved; in addition, the base comprises four metal circuit modules, each metal circuit module is welded with a corresponding electronic element, a metal circuit in each metal circuit module forms an independent line, and the metal circuit and the corresponding electronic element are welded to have independent functions.
Drawings
The above objects, technical solutions and advantages of the present invention can be achieved by the following drawings:
FIG. 1 is a schematic structural view of a base to which electronic components are soldered according to the present invention;
FIG. 2 is a schematic view of the base of FIG. 1 with electronic components soldered thereto from another perspective;
FIG. 3 is a schematic view of the base shown in FIG. 1 (with electronic components removed);
fig. 4 is an exploded perspective view of the base of fig. 1 with electronic components soldered thereto;
FIG. 5 is a schematic diagram of the four metal circuits of FIG. 3;
FIG. 6 is a schematic structural diagram of four metal circuit modules formed by performing injection molding on the four metal circuits shown in FIG. 5;
fig. 7 is a schematic structural diagram of the first metal circuit module shown in fig. 6, and the structures of the second metal circuit module, the third metal circuit module and the fourth metal circuit module are the same as the structure of the first metal circuit module;
fig. 8 is a flow chart of a process for producing the submount with electronic components soldered thereto shown in fig. 2;
FIG. 9 is a schematic structural diagram of four metal circuits in the present invention, wherein a first square material strip is connected to the periphery of the four metal circuits, and a second square material strip is connected to the center of the four metal circuits;
fig. 10 is a schematic structural diagram of the four metal circuits in fig. 9 after the second square material tape is cut off after the four metal circuits are formed by injection molding to form four metal circuit modules.
Detailed Description
The invention is described in further detail below with reference to the accompanying drawings of embodiments.
As shown in fig. 1 to 7, the present invention provides a base 100 to which electronic components are soldered, wherein the base 100 is substantially square. The base 100 comprises an insulating body 50 and a first metal circuit module 10 embedded in the insulating body 50, a second metal circuit module 20, a third metal circuit module 30 and a fourth metal circuit module 40, wherein a first electronic element 60 is welded on the first metal circuit module 10, a second electronic element 70 is welded on the second metal circuit module 20, a third electronic element 80 is welded on the third metal circuit module 30, a fourth electronic element 90 is welded on the fourth metal circuit module 40, the first metal circuit module 10 comprises a first insulating block 11 and a first metal circuit 12 embedded in the first insulating block 11, the second metal circuit module 20 comprises a second insulating block 21 and a second metal circuit 22 embedded in the second insulating block 21, the third metal circuit module 30 comprises a third insulating block 31 and a third metal circuit 32 embedded in the third insulating block 31, the fourth metal circuit module 40 comprises a fourth insulating block 41 and a fourth metal circuit 42 embedded in the fourth insulating block 41 . Each metal circuit comprises a plurality of branches, the branches are provided with welding parts, and the welding parts of the branches are welded with a plurality of welding pins of the electronic component in a one-to-one correspondence mode.
The insulation body 50 includes a main body 55, and a first edge 51, a second edge 52, a third edge 53 and a fourth edge 54 located around the main body 55, the first metal circuit module 10 is embedded in the first edge 51, the second metal circuit module 20 is embedded in the second edge 52, the third metal circuit module 30 is embedded in the third edge 53, the fourth metal circuit module 40 is embedded in the fourth edge 54, the first metal circuit module 10, the second metal circuit module 20, the third metal circuit module 30 and the fourth metal circuit module 40 are disposed on the respective corresponding edges and offset from the center of the edges, so as to optimize the space layout inside the voice coil motor, to avoid most of the edge distribution space as possible, to allow more vertical component layouts, to increase the density of the space layout inside the voice coil motor, specifically, the first metal circuit module 10 is disposed at one end of the first edge 51 close to the second edge 52, the second metal circuit module 20 is disposed at one end of the second edge 52 close to the third edge 53, the third metal circuit module 30 is disposed at one end of the third edge 53 close to the fourth edge 54, and the fourth metal circuit module 40 is disposed at one end of the fourth edge 54 close to the first edge 51. The main body 55 has a hollow area 56 in the middle, and a filter (not shown) is embedded in the hollow area 56 of the main body 55.
Specifically, the first metal circuit module 10, the second metal circuit module 20, the third metal circuit module 30 and the fourth metal circuit module 40 are all formed by integral injection molding. The first metal circuit 12 has a plurality of first soldering portions 120 exposed out of the Surface of the first insulating block 11, and the first electronic component 60 has a plurality of first soldering pins (not shown), and the plurality of first soldering pins are soldered to the plurality of first soldering portions 120 in a one-to-one correspondence by Surface Mount Technology (SMT). The second metal circuit 22 has a plurality of second soldering portions 220 exposed out of the Surface of the second insulating block 21, and the second electronic component 70 has a plurality of second soldering pins (not shown), and the plurality of second soldering pins are soldered to the plurality of one-to-one corresponding second soldering portions 220 by Surface Mount Technology (SMT). The third metal circuit 32 has a plurality of third soldering portions 320 exposed out of the Surface of the third insulating block 31, and the third electronic component 80 has a plurality of third soldering pins (not shown), and the plurality of third soldering pins are soldered to the plurality of one-to-one corresponding third soldering portions 320 by Surface Mount Technology (SMT). The fourth metal circuit 42 has a plurality of fourth soldering portions 420 exposed out of the Surface of the fourth insulating block 41, and the fourth electronic component 90 has a plurality of fourth soldering pins (not shown), and the plurality of fourth soldering pins are soldered to the plurality of one-to-one corresponding fourth soldering portions 420 by Surface Mount Technology (SMT). In this embodiment, the first insulating block 11, the second insulating block 21, the third insulating block 31, and the fourth insulating block 41 are all made of PPS plastic material, so that the four insulating blocks have higher structural strength and better high temperature resistance, and the problem of size and shape variation caused by high temperature when the four insulating blocks pass through the reflow furnace in the SMT manufacturing process can be avoided.
The insulating body 50 is also formed by injection molding, and the insulating body 50 covers the four metal circuit modules with electronic components soldered thereon to form the base 100 with electronic components. The insulating body 50 is overmolded on all outer edges of each metal circuit module to position and encapsulate each metal circuit module, that is, the insulating body 50 is overmolded on all outer edges of the four metal circuit modules (10, 20, 30, 40) to position and encapsulate the four metal circuit modules (10, 20, 30, 40), so that the overall strength of the base 100 is increased. In this embodiment, the insulator 50 is made of LCP plastic material which is more favorable to injection molding and has a stable size, and the LCP plastic material has better formability, so that the overall manufacturing performance and reliability of the base 100 are improved.
In this embodiment, before the injection molding of the first insulating block 11, the second insulating block 21, the third insulating block 31, and the fourth insulating block 41, the first metal circuit 12, the second metal circuit 22, the third metal circuit 32, and the fourth metal circuit 42 are arranged on four edges of a square, the first metal circuit 12, the second metal circuit 22, the third metal circuit 32, and the fourth metal circuit 42 are all connected to the first square material tape 200 and the second square material tape 300 at the same time, the first square material tape 200 is disposed on the periphery of the square, the second square material tape 300 is disposed in the middle of the square, in this embodiment, the second square material tape 300 may be in various shapes such as a hexagon, an octagon, and the like, and in other embodiments, the second square material tape 300 may also be disposed in a circular shape. The first metal circuit 12 has six first welding portions (121, 122, 123, 124, 125, 126) exposed out of the surface of the first insulating block 11, three first welding portions (121, 122, 123, 124, 125, 126) of the six first welding portions (121, 122, 123) are arranged near the outer edge of the square, the other three first welding portions (124, 125, 126) are arranged near the center of the square, the three first welding portions (121, 122, 123) arranged near the outer edge of the square are connected to the first square-shaped material tape 200 through branches, one first welding portion 124 arranged near the center of the square is connected to the first square-shaped material tape 200 through a branch, and the other two first welding portions (125, 126) arranged near the center of the square are simultaneously connected to the first square-shaped material tape 200 and the second square-shaped material tape 300 through branches. The second metal circuit 22 has six second welding portions (221, 222, 223, 224, 225, 226) exposed out of the surface of the second insulating block 21, three second welding portions (221, 222, 223, 224, 225, 226) of the six second welding portions (221, 222, 223) are arranged near the outer edge of the square, the other three second welding portions (224, 225, 226) are arranged near the center of the square, the three second welding portions (221, 222, 223) arranged near the outer edge of the square are connected to the first square-shaped material tape 200 through branches, one second welding portion 224 arranged near the center of the square is connected to the first square-shaped material tape 200 through a branch, and the other two second welding portions (225, 226) arranged near the center of the square are connected to the first square-shaped material tape 200 and the second square-shaped material tape 300 through branches. The third metal circuit 32 has six third welding portions (321, 322, 323, 324, 325, 326) exposed out of the surface of the third insulating block 31, three third welding portions (321, 322, 323, 324, 325, 326) of the six third welding portions (321, 322, 323, 324, 325, 326) are arranged near the outer edge of the square, the other three third welding portions (324, 325, 326) are arranged near the center of the square, the three third welding portions (321, 322, 323) arranged near the outer edge of the square are connected to the first square-shaped material tape 200 through branches, one of the third welding portions 324 arranged near the center of the square is connected to the first square-shaped material tape 200 through branches, and the other two third welding portions (325, 326) arranged near the center of the square are connected to the first square-shaped material tape 200 and the second square-shaped material tape 300 through branches. The fourth metal circuit 42 has six fourth welding portions (421, 422, 423, 424, 425, 426) exposed out of the surface of the fourth insulating block 41, three fourth welding portions (421, 422, 423, 424, 425, 426) of the six fourth welding portions (421, 422, 423) are arranged near the outer edge of the square, the other three fourth welding portions (424, 425, 426) are arranged near the center of the square, the three fourth welding portions (421, 422, 423) arranged near the outer edge of the square are connected to the first square-shaped material strip 200 through branches, one fourth welding portion 424 arranged near the center of the square is connected to the first square-shaped material strip 200 through a branch, and the other two fourth welding portions (425, 426) arranged near the center of the square are connected to the first square-shaped material strip 200 and the second square-shaped material strip 300 through branches.
The first insulating block 11 has a first base 111, two first additional portions 112 protruding from an upper surface of the first base 111, and a first protruding portion 113 protruding from a lower surface of the first base 111, the second insulating block 21 has a second base 211, two second additional portions 212 protruding from an upper surface of the second base 211, and a second protruding portion 213 protruding from a lower surface of the second base 211, the third insulating block 31 has a third base 311, two third additional portions 312 protruding from an upper surface of the third base 311, and a third protruding portion 313 protruding from a lower surface of the third base 311, and the fourth insulating block 41 has a fourth base 411, two fourth additional portions 412 protruding from an upper surface of the fourth base 411, and a fourth protruding portion 413 protruding from a lower surface of the fourth base 411. In the present invention, the upper surface of the main body 55 of the insulation body 50 is coplanar with the upper surface of the first base 111 of the first insulation block 11, the upper surface of the second base 211 of the second insulation block 21, the upper surface of the third base 311 of the third insulation block 31, and the upper surface of the fourth base 411 of the fourth insulation block 41, and the lower surface of the main body 55 of the insulation body 50 is coplanar with the lower surface of the first base 111 of the first insulation block 11, the lower surface of the second base 211 of the second insulation block 21, the lower surface of the third base 311 of the third insulation block 31, and the lower surface of the fourth base 411 of the fourth insulation block 41, the insulation body 50 is wrapped around the four insulation blocks by injection molding, and the upper surfaces of the bases of the four insulation blocks are coplanar with the upper surface of the main body 55 of the insulation body 50, and the lower surfaces of the bases of the four insulation blocks are coplanar with the lower surface of the main body 55 of the insulation body 50, so that the insulating body 50 and the four insulating blocks have better bonding strength, and in order to ensure that the upper surfaces of the insulators formed by injection molding twice are kept coplanar in the molding process, a jig for keeping coplanarity needs to be specially introduced.
Fig. 7 shows a schematic structural diagram of the first metal circuit module 10, and the structures of the second metal circuit module 20, the third metal circuit module 30 and the fourth metal circuit module 40 are the same as the structure of the first metal circuit module 10. Specifically, the first insulating block 11 is provided with a first receiving groove 114 formed by recessing downward from the upper surface of the first base 111, and the first receiving groove 114 is used for positioning and partially receiving the first electronic component 60. The first receiving groove 114 is provided with a plurality of first bumps 115 protruding upwards from the bottom wall thereof, the plurality of first soldering portions 120 of the first metal circuit 12 are respectively exposed on the upper surfaces of the plurality of first bumps 115, so as to facilitate the soldering with the electronic component by adopting the SMT soldering method, and one first soldering portion 120 is exposed on the upper surface of each first bump 115. A first U-shaped groove 116 is formed around each first protrusion 115, and two first U-shaped grooves 116 corresponding to two adjacent first protrusions 115 are communicated with each other, that is, a plurality of first U-shaped grooves 116 corresponding to a plurality of first protrusions 115 are communicated to form a channel. In the process of injection molding the first insulating block 11, the first metal circuit 12 is positioned by the positioning insert, injection molding is performed in the mold, after injection molding is completed, the positioning insert is drawn out, the position where the positioning insert is originally located is a first U-shaped groove 116, the positioning insert surrounds the three side faces of the first welding part 120 when the first metal circuit 12 is positioned, the size positioning precision of the metal circuit in the injection molding process can be greatly improved, and accurate welding of the welding part of the metal circuit and the welding pin of the electronic element is further ensured. When the first soldering pin of the first electronic component 60 is soldered to the first soldering portion 120 in the first receiving groove 114 by solder, the first U-shaped groove 116 can receive the excessive solder that overflows after the first soldering pin and the first soldering portion 120 are mutually attached and extruded, so as to solve the problems of connection soldering, short circuit and the like that are easily generated by soldering when the positions of the plurality of first soldering portions 120 are relatively close in the SMT process. In the best embodiment of the invention, the U-shaped groove can precisely position three sides of the welding part, but in other embodiments, single-sided or double-sided positioning can be considered, specifically, parallel spaced rectangular grooves arranged perpendicular to each welding part or parallel spaced rectangular grooves arranged parallel to each welding part can be adopted, and the positioning surface is not limited to plane positioning contact, and can also be designed into other contact limit forms such as multi-point positioning or line positioning. Two adjacent welding parts share a groove on the adjacent side surface, so that the material design of the positioning jig can be saved. Compared with the prior art that a plurality of integrally embedded or split embedded positioning blocks need to be inserted or formed in advance, the positioning fixture can be removed by removing the fixture after forming only by presetting the groove for positioning in the forming process, and the positioning fixture can be repeatedly used for positioning for multiple times, so that the forming efficiency in the manufacturing process can be realized, and the forming and manufacturing cost in the process can be saved.
The second insulating block 21 is provided with a second receiving groove 214 formed by recessing downward from the upper surface of the second base portion 211, and the second receiving groove 214 is used for positioning and partially receiving the second electronic component 70. A plurality of second bumps 215 protruding upward from the bottom wall of the second receiving groove 214 are disposed in the second receiving groove 214, a plurality of second soldering portions 220 of the second metal circuit 22 are respectively exposed on the upper surfaces of the plurality of second bumps 215, so as to facilitate the soldering with the electronic component by adopting the SMT soldering method, and one second soldering portion 220 is exposed on the upper surface of each second bump 215. A second U-shaped groove 216 is formed around each second protrusion 215, and two second U-shaped grooves 216 corresponding to two adjacent second protrusions 215 are communicated with each other, that is, a plurality of second U-shaped grooves 216 corresponding to a plurality of second protrusions 215 are communicated to form a channel. The formation and function of the second U-shaped groove 216 are the same as the first U-shaped groove 116, and are not described herein again.
The third insulating block 31 is provided with a third receiving groove 314 formed by recessing downward from the upper surface of the third base 311, and the third receiving groove 314 is used for positioning and partially receiving the third electronic component 80. The third receiving groove 314 is provided with a plurality of third bumps 315 protruding upward from the bottom wall thereof, the plurality of third soldering portions 320 of the third metal circuit 32 are respectively exposed on the upper surfaces of the plurality of third bumps 315, so as to be soldered to the electronic component by adopting an SMT soldering method, and one third soldering portion 320 is exposed on the upper surface of each third bump 315. A third U-shaped groove 316 is formed around each third bump 315, and two third U-shaped grooves 316 corresponding to two adjacent third bumps 315 are communicated with each other, that is, a plurality of third U-shaped grooves 316 corresponding to a plurality of third bumps 315 are communicated to form a channel. The formation and function of the third U-shaped groove 316 are the same as those of the first U-shaped groove 116, and are not described herein again.
The fourth insulating block 41 is provided with a fourth receiving groove 414 formed by recessing downward from the upper surface of the fourth base 411, and the fourth receiving groove 414 is used for positioning and partially receiving the fourth electronic component 90. A plurality of fourth bumps 415 protruding upward from the bottom wall of the fourth receiving cavity 414 are disposed in the fourth receiving cavity 414, a plurality of fourth soldering portions 420 of the fourth metal circuit 42 are respectively exposed on the upper surfaces of the plurality of fourth bumps 415, so as to facilitate the soldering with the electronic component by using the SMT soldering method, and one fourth soldering portion 420 is exposed on the upper surface of each fourth bump 415. A fourth U-shaped groove 416 is formed around each fourth bump 415, and two fourth U-shaped grooves 416 corresponding to two adjacent fourth bumps 415 are communicated with each other, that is, a plurality of fourth U-shaped grooves 416 corresponding to a plurality of fourth bumps 415 are communicated to form a channel. The formation and function of the fourth U-shaped groove 416 are the same as those of the first U-shaped groove 116, and are not described herein again.
Referring to fig. 8 to 10, the present invention provides a process for manufacturing a base 100 soldered with electronic components, comprising the following steps: .
S11, stamping a single material tape at a time to form a first metal circuit 12, a second metal circuit 22, a third metal circuit 32 and a fourth metal circuit 42, specifically, stamping and combining the sheets to form the first metal circuit 12, the second metal circuit 22, the third metal circuit 32 and the fourth metal circuit 42 by stamping and bending the welding portion, wherein the peripheries of the first metal circuit 12, the second metal circuit 22, the third metal circuit 32 and the fourth metal circuit 42 are connected with a large first square material tape 200, and the middles of the first metal circuit 12, the second metal circuit 22, the third metal circuit 32 and the fourth metal circuit 42 are connected with a small second square material tape 300;
s12, performing in-mold injection molding on the first metal circuit 12, the second metal circuit 22, the third metal circuit 32 and the fourth metal circuit 42 to form a first metal circuit module 10, a second metal circuit module 20, a third metal circuit module 30 and a fourth metal circuit module 40, wherein the periphery of the four metal circuit modules is connected with a first square material belt 200, the middle of the four metal circuit modules is connected with a second square material belt 300, specifically, a first insulating block 11, a second insulating block 21, a third insulating block 31 and a fourth insulating block 41 are formed by injection molding, the first metal circuit 12 is embedded in the first insulating block 11, the second metal circuit 22 is embedded in the second insulating block 21, the third metal circuit 32 is embedded in the third insulating block 31, the fourth metal circuit 42 is embedded in the fourth insulating block 41, the first insulating block 11 has a first accommodating groove 114 formed by sinking downwards from the upper surface thereof, the second insulating block 21 has a second receiving groove 214 recessed downward from the upper surface thereof, the third insulating block 31 has a third receiving groove 314 recessed downward from the upper surface thereof, the fourth insulating block 41 has a fourth receiving groove 414 recessed downward from the upper surface thereof, the first receiving groove 114 has a plurality of first bumps 115 therein, the plurality of first soldering portions 120 of the first metal circuit 12 are exposed on the upper surfaces of the plurality of first bumps 115, the second receiving groove 214 has a plurality of second bumps 215 therein, the plurality of second soldering portions 220 of the second metal circuit 22 are exposed on the upper surfaces of the plurality of second bumps 215, the plurality of third bumps 315 are disposed in the third receiving groove 314, the plurality of third soldering portions 320 of the third metal circuit 32 are exposed on the upper surfaces of the plurality of third bumps 315, the fourth receiving groove 414 has a plurality of fourth bumps 415 therein, and the plurality of fourth soldering portions 420 of the fourth metal circuit 42 are exposed on the upper surfaces of the plurality of fourth bumps 415, respectively;
s13, soldering the first solder feet of the first electronic component 60 to the first solder parts 120 on the top surfaces of the first bumps 115 in the first housing groove 114 by SMT, soldering the second solder feet of the second electronic component 70 to the second solder parts 220 on the top surfaces of the second bumps 215 in the second housing groove 214 by SMT, soldering the third solder feet of the third electronic component 80 to the third solder parts 320 on the top surfaces of the third bumps 315 in the third housing groove 314 by SMT, and soldering the fourth solder feet of the fourth electronic component 90 to the fourth solder parts 420 on the top surfaces of the fourth bumps 415 in the fourth housing groove 414 by SMT;
s14, cutting the second square frame-shaped material strap 300 connected between the first metal circuit module 10, the second metal circuit module 20, the third metal circuit module 30 and the fourth metal circuit module 40 to cut off the loop formed by the first metal circuit 12, the second metal circuit 22, the third metal circuit 32 and the fourth metal circuit 42, so that the four metal circuits form independent circuits respectively;
s15, performing in-mold injection molding on the first metal circuit module 10 welded with the first electronic component 60, the second metal circuit module 20 welded with the second electronic component 70, the third metal circuit module 30 welded with the third electronic component 80, and the fourth metal circuit module 40 welded with the fourth electronic component 90, wherein the insulation body 50 formed by injection molding is wrapped around the four metal circuit modules to form a semi-finished product with the periphery connected with the first square-shaped material strip 200, and at this time, the first metal circuit module 10, the second metal circuit module 20, the third metal circuit module 30, and the fourth metal circuit module 40 are integrally embedded in the insulation body 50 relative to the cut-off metal circuit section of the second square-shaped material strip 300;
s16, cutting the first square tape 200 connected to the periphery of the semi-finished product to form the base 100 with electronic components.
The present invention provides a camera module (not shown) comprising a lens (not shown) and a voice coil motor (not shown) connected to each other, wherein the voice coil motor is used for driving the lens to move so as to achieve auto-focusing, and the voice coil motor comprises the above-mentioned base 100 welded with electronic components.
The base 100 welded with the electronic component is formed through a secondary injection molding process, the plastic materials adopted in the two injection molding processes are different, the four insulating blocks (11, 21, 31 and 41) formed in the first injection molding process are made of PPS plastic materials, the insulating body 50 formed in the second injection molding process is made of LCP plastic materials, the four insulating blocks formed by injection molding of the PPS plastic materials are better in high temperature resistance and structural strength, so that the four insulating blocks are prevented from being deformed due to the influence of high temperature in an SMT process, the LCP plastic materials are better in molding performance, the size of the insulating body 50 formed after injection molding is more stable, and the overall manufacturing performance and reliability of the base 100 are improved; in addition, the base 100 includes four metal circuit modules (10, 20, 30, 40), each of which is soldered with a corresponding electronic component, and the metal circuits in each of the metal circuit modules form an independent circuit, and the metal circuits are soldered with the corresponding electronic components to have independent functions.
The embedding technology or the over-Molding technology mentioned in the present invention refers to a technology combining manner of integral Molding, for example, the metal circuit and the insulating block can adopt embedding (IM) or Molding Interconnection Device (MID) to achieve the embedding or over-Molding combining manner.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express the embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (20)
1. A soldered base with electronic components, comprising:
at least two electronic components;
each metal circuit is connected with at least one electronic element and comprises a plurality of branches, a welding part is formed at one inner end of each branch, and the welding parts of the branches are connected with the pins of the electronic element in a one-to-one correspondence manner;
at least two insulating blocks, wherein the at least two insulating blocks correspondingly overmould the at least two metal circuits, each insulating block is overmoulded on the outer periphery of a position where the corresponding metal circuit is connected with the electronic element, and each insulating block positions all branches of the metal circuit to form a metal circuit module;
the insulating body is coated and molded on at least partial outer sides of the at least two metal circuit modules so as to position and package the at least two metal circuit modules.
2. The soldered electronic component package of claim 1, wherein the insulative body is overmolded onto all outer edges of at least two of the metal circuit modules to positionally encapsulate at least two of the metal circuit modules.
3. The soldered electronic component package of claim 1, wherein the metal circuit module is formed by injection molding.
4. The soldered electronic component socket as claimed in claim 1, wherein the insulating body is formed by injection molding and covers at least two of the metal circuit modules.
5. The soldered substrate of claim 1, wherein the substrate comprises three metal circuit modules, namely a first metal circuit module, a second metal circuit module and a third metal circuit module, the insulating body comprises a main body and a first edge portion, a second edge portion and a third edge portion, the first metal circuit module is embedded in the first edge portion, the second metal circuit module is embedded in the second edge portion, and the third metal circuit module is embedded in the third edge portion.
6. The soldered package of claim 5, wherein the package further comprises a fourth metal circuit module, the housing further comprises a fourth edge portion disposed at the periphery of the main body, and the fourth metal circuit module is embedded in the fourth edge portion.
7. The soldered electronic component base of claim 5, wherein the metal circuit modules are disposed off-center of the edge portions on the respective edge portions.
8. The soldered submount of claim 5, wherein the dielectric blocks comprise bases, an upper surface of the base of each dielectric block being coplanar with an upper surface of the main body portion of the dielectric body, and a lower surface of the base of each dielectric block being coplanar with a lower surface of the main body portion of the dielectric body.
9. The soldered electronic component package as claimed in claim 1, wherein the insulating block is provided with a receiving groove formed by being recessed downward from an upper surface thereof, and the plurality of branches of the metal circuit are provided with soldering portions arranged to be exposed in the receiving groove.
10. The soldered base of claim 9, wherein the receiving groove has a plurality of bumps protruding upward from a bottom wall thereof, and the solder portion is exposed on an upper surface of the bumps.
11. The soldered base of claim 1, wherein the insulating block is made of a material different from the insulating body and has a higher heat resistance than the insulating body.
12. The soldered electronic component of claim 11, wherein the insulating block is made of PPS plastic.
13. The soldered electronic component carrier as claimed in claim 11, wherein the insulating body is made of LCP plastic material.
14. The soldered package of claim 5, wherein the main body has a hollow area in the middle, and the filter is fixed in the hollow area of the main body.
15. A process for producing a base with soldered electronic components, for producing a base with soldered electronic components according to any one of claims 1 to 14, comprising the steps of:
s11, forming at least two metal circuits, wherein the two metal circuits are integrally connected through a first square frame type material belt;
s12, performing in-mold injection molding on the at least two metal circuits to respectively coat the multiple branches of the two metal circuits and expose the welding parts of the multiple branches, and forming at least two metal circuit modules after the injection molding is completed, wherein each metal circuit module comprises an insulating block and the metal circuit embedded in the insulating block;
s13, correspondingly welding the at least two electronic components to the at least two metal circuit modules to form the metal circuit modules with the electronic components;
s14, performing in-mold injection molding on at least two metal circuit modules with electronic components, wherein an insulation body formed by injection molding covers the at least two metal circuit modules welded with the electronic components;
and S15, cutting the first square frame type material belt to form the base welded with the electronic element.
16. The process for manufacturing a soldered pad with electronic components as claimed in claim 15, wherein in step S15, the at least two electronic components are soldered to the corresponding metal circuit modules by SMT.
17. The process for producing a soldered mount of electronic components as claimed in claim 15, further comprising step S16 between the step S13 and the step S14: and cutting a second square material belt connected between the at least two metal circuit modules, wherein the outer sides of the at least two metal circuit modules are connected with the first square material belt.
18. The process for manufacturing a soldered base according to claim 15, wherein the insulating block is made of a material different from that of the insulating body and has a higher heat resistance than that of the insulating body.
19. The process for manufacturing a soldered package of electronic components as claimed in claim 18, wherein the insulating block is made of PPS plastic and the insulating body is made of LCP plastic.
20. A voice coil motor connected to a lens, the voice coil motor being used for driving the lens to move for automatic focusing, the voice coil motor comprising a base having electronic components soldered thereon according to any one of claims 1 to 14.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011489802.5A CN112737272B (en) | 2020-12-16 | 2020-12-16 | Base welded with electronic element, production process thereof and voice coil motor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011489802.5A CN112737272B (en) | 2020-12-16 | 2020-12-16 | Base welded with electronic element, production process thereof and voice coil motor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112737272A true CN112737272A (en) | 2021-04-30 |
| CN112737272B CN112737272B (en) | 2022-05-17 |
Family
ID=75602467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011489802.5A Active CN112737272B (en) | 2020-12-16 | 2020-12-16 | Base welded with electronic element, production process thereof and voice coil motor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112737272B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113783341A (en) * | 2021-09-18 | 2021-12-10 | 苏州昀冢电子科技股份有限公司 | Voice coil motor base and manufacturing method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1170110A1 (en) * | 2000-07-07 | 2002-01-09 | Pollmann Austria OHG | Method for fabricating a plastic coated conductive structure of an electrical circuit unit as well as an electrical circuit unit comprising a plastic coated conductive structure |
| CN107277314A (en) * | 2016-04-08 | 2017-10-20 | 台湾东电化股份有限公司 | Camera module |
| TW201803099A (en) * | 2016-03-12 | 2018-01-16 | 寧波舜宇光電信息有限公司 | Camera Module and Array Camera Module with Circuit Board Unit and Photosensitive Unit and Manufacturing Method Thereof |
| CN109287074A (en) * | 2018-09-25 | 2019-01-29 | 苏州昀冢电子科技有限公司 | A kind of production technology of the pedestal with electronic component |
| CN110177429A (en) * | 2019-06-18 | 2019-08-27 | 苏州昀冢电子科技有限公司 | A kind of component and its production technology and camera module with electronic component |
| CN210780975U (en) * | 2019-09-04 | 2020-06-16 | 昆山丘钛微电子科技有限公司 | Camera module and electronic equipment |
-
2020
- 2020-12-16 CN CN202011489802.5A patent/CN112737272B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1170110A1 (en) * | 2000-07-07 | 2002-01-09 | Pollmann Austria OHG | Method for fabricating a plastic coated conductive structure of an electrical circuit unit as well as an electrical circuit unit comprising a plastic coated conductive structure |
| TW201803099A (en) * | 2016-03-12 | 2018-01-16 | 寧波舜宇光電信息有限公司 | Camera Module and Array Camera Module with Circuit Board Unit and Photosensitive Unit and Manufacturing Method Thereof |
| CN107277314A (en) * | 2016-04-08 | 2017-10-20 | 台湾东电化股份有限公司 | Camera module |
| CN109287074A (en) * | 2018-09-25 | 2019-01-29 | 苏州昀冢电子科技有限公司 | A kind of production technology of the pedestal with electronic component |
| CN110177429A (en) * | 2019-06-18 | 2019-08-27 | 苏州昀冢电子科技有限公司 | A kind of component and its production technology and camera module with electronic component |
| CN210780975U (en) * | 2019-09-04 | 2020-06-16 | 昆山丘钛微电子科技有限公司 | Camera module and electronic equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113783341A (en) * | 2021-09-18 | 2021-12-10 | 苏州昀冢电子科技股份有限公司 | Voice coil motor base and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112737272B (en) | 2022-05-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9882316B2 (en) | Electrcial connector and manufacturing method of the same | |
| US6593840B2 (en) | Electronic packaging device with insertable leads and method of manufacturing | |
| KR100586124B1 (en) | Circuit board of protective circuit for storage battery, protective circuit for storage battery, and storage battery pack | |
| US20100170706A1 (en) | Electronic module and method for manufacturing an electronic module | |
| JP3146452B2 (en) | Surface mount type LED element and method of manufacturing the same | |
| US20060284287A1 (en) | Two-pole smt miniature housing for semiconductor components and method for the manufacture thereof | |
| JPH11307820A (en) | Surface mount led and its manufacture | |
| EP2312917A1 (en) | Apparatus and method for vertically-structured passive components | |
| US9585260B2 (en) | Electronic component module and manufacturing method thereof | |
| US11217955B1 (en) | Method for manufacturing electrical connector | |
| EP1429389A1 (en) | Compact circuit module having high mounting accuracy and method of manufacturing the same | |
| CN101682133A (en) | Connector for interconnecting surface-mount devices and circuit substrates | |
| EP2587558B1 (en) | Semiconductor device package assembly and method of manufacturing a semiconductor device | |
| CN112737272B (en) | Base welded with electronic element, production process thereof and voice coil motor | |
| CN112702841B (en) | Base welded with electronic element and voice coil motor thereof | |
| US7586529B2 (en) | Solid-state imaging device | |
| CN213717815U (en) | Base welded with at least two electronic elements and voice coil motor thereof | |
| CN213783113U (en) | Base welded with electronic element and voice coil motor thereof | |
| CN115955035A (en) | Motor base, motor and manufacturing method thereof | |
| US20150138420A1 (en) | Liquid crystal cell connection to lens mount of camera module | |
| EP2061289A1 (en) | Interconnection of embedded passive components and substrates | |
| CN216625432U (en) | Motor base | |
| JP6029221B2 (en) | Semiconductor device package assembly, semiconductor device assembly, and semiconductor device manufacturing method | |
| US20230412060A1 (en) | Base with integrated coils and the motor with the same | |
| CN113381565B (en) | Base assembly and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |