CN114980560B - Production process of base with electronic element - Google Patents
Production process of base with electronic element Download PDFInfo
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- CN114980560B CN114980560B CN202210703087.3A CN202210703087A CN114980560B CN 114980560 B CN114980560 B CN 114980560B CN 202210703087 A CN202210703087 A CN 202210703087A CN 114980560 B CN114980560 B CN 114980560B
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- plastic part
- metal circuit
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- electronic
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application discloses a production process of a base with an electronic element, and relates to the technical field of electronic element assembly. The production process comprises forming a metal circuit; injection molding is carried out on the position, connected with the electronic element, of the metal circuit to form a first semi-finished product; soldering an electronic component to the first semi-finished product through an SMT process to form a second semi-finished product; and carrying out injection molding on the second semi-finished product to form the base. In the production process, the metal circuit, the electronic element and the plastic part can be integrally formed through two injection molding processes and one SMT process, and no additional assembly step is needed; in addition, in the step S1, only the metal circuit is formed, the FPC is not required to be manufactured, and the manufacturing process is simplified, so that the production efficiency is improved, and the production cost is reduced.
Description
The application relates to a division application of an application patent application with the application number 201811114091.6, wherein the application name of the application is 2018, 9, 25, and the application number of the application is 201811114091.6.
Technical Field
The present disclosure relates to electronic component assembly, and particularly to a process for manufacturing a base with an electronic component.
Background
At present, a base with a Hall element in a voice coil closed-loop motor in a mobile phone camera module comprises the Hall element and a plastic shell. The existing process for producing the base mainly comprises the steps of manufacturing FPC (Flexible Printed Circuit, flexible printed circuit board); before the hall element is assembled to the base, the hall element needs to be soldered to the FPC; after the soldering is completed, it is also necessary to mount the FPC with the hall element to the plastic housing of the base. In the whole process, the FPC is manufactured, so that the process is complex and the production cost is high; in addition, the FPC of the Hall element is assembled with the plastic shell after being welded, so that the assembling process is more, and the working efficiency is reduced.
Based on the above problems, there is a need for a process for manufacturing a substrate with an electronic component, which can solve the problems of complex process, low production efficiency and high production cost in the prior art.
Disclosure of Invention
The application aims to provide a production process of a base with an electronic element, which aims to solve the problems of complex process, low production efficiency and high production cost in the prior art.
To achieve the purpose, the application adopts the following technical scheme:
a process for producing a base with electronic components, which process integrates the electronic components on the base in a vertical arrangement, the process comprising at least the following steps:
step one: -forming a metallic circuit (2), said metallic circuit (2) comprising a plurality of branches (21) arranged horizontally for connection with electronic components;
step two: injection molding a first plastic part (3) is carried out on the positions, connected with the electronic element (1), of all the branches (21) of the metal circuit (2) to form a first semi-finished product, the first plastic part (3) is horizontally arranged, and the first plastic part (3) connects all the branches (21) of the metal circuit (2) into a whole and connects and reinforces all the branches (21);
step three: horizontally arranging the electronic component (1) on the first plastic part (3), and welding pins of the electronic component (1) to corresponding branches (21) of the metal circuit (2) so that the branches (21) are in one-to-one correspondence with the pins of the electronic component (1) to form a second semi-finished product;
step four: bending the metal circuit (2) in the second semi-finished product, and after bending, simultaneously realizing space conversion between the first plastic part (3) and the electronic element (1) so as to convert the horizontal arrangement into the vertical arrangement;
step five: and carrying out injection molding on the second semi-finished product to form a second plastic part (4), so as to form a base which is formed by integrally molding the metal circuit (2), the electronic element (1) and the plastic parts (3 and 4) and is vertically arranged on the electronic element (1).
As a preferable scheme of the production process of the base with the electronic element, the second plastic part (4) is coated on the metal circuit (2), and one end of the branch (21) of the metal circuit (2) far away from the electronic element (1) extends out of the second plastic part (4) to realize connection with an external circuit.
As a preferred solution of the above-mentioned production process of the base with electronic components, in step three, the pins of the electronic components (1) are soldered to the corresponding branches (21) of the metal circuit (2) by means of surface-mounting techniques.
As a preferable mode of the production process of the base with electronic components, in the second step, the first plastic part (3) is molded with a containing groove, and the branch (21) of the metal circuit is exposed to the containing groove; in the third step, the electronic component (1) is accommodated in the accommodating groove and is exposed to the first plastic part (3).
As a preferred scheme of the production process of the base with the electronic component, the base is applied to a motor in a camera module, and the electronic component (1) is a hall element.
In the second step, the first plastic part (3) is formed with a plurality of positioning assemblies connected with the corresponding branches (21), and each positioning assembly limits one end of the corresponding branch (21) connected with the electronic component (1) in at least three different directions.
As a preferred solution of the above-mentioned production process of the base with electronic components, each positioning assembly comprises at least three limiting blocks (31), the at least three limiting blocks (31) respectively abut against different positions on the corresponding branch (21) to limit the corresponding branch (21) in at least three different directions.
To achieve the purpose, the application also adopts the following technical scheme:
a process for producing a base with electronic components, which process integrates the electronic components on the base in a vertical arrangement, the process comprising at least the following steps:
step one: stamping a strip (5) of material into a plurality of interconnected metal substrates of predetermined shape, thereby forming a plurality of continuous metal circuits (2), each of said metal circuits (2) comprising a plurality of branches (21) arranged horizontally for connection to electronic components;
step two: injection molding a first plastic part (3) is carried out on the positions, connected with the electronic element (1), of all the branches (21) of the metal circuit (2) to form a first semi-finished product, the first plastic part (3) is horizontally arranged, and the first plastic part (3) connects all the branches (21) of the metal circuit (2) into a whole and connects and reinforces all the branches (21);
step three: horizontally arranging the electronic component (1) on the first plastic part (3), welding pins of the electronic component (1) to corresponding branches (21) of the metal circuit (2) so that the branches (21) are in one-to-one correspondence with the pins of the electronic component (1), forming a second semi-finished product, and cutting the metal circuit (2) in the second semi-finished product;
step four: bending the metal circuit (2) in the cut second semi-finished product, and after bending, simultaneously realizing space conversion between the first plastic part (3) and the electronic element (1) and converting the horizontal arrangement into the vertical arrangement;
step five: and carrying out injection molding on the second semi-finished product to form a second plastic part (4), so as to form a base which is formed by integrally molding the metal circuit (2), the electronic element (1) and the plastic parts (3 and 4) and is vertically arranged by the electronic element (1), wherein a plurality of bases are connected with each other.
As a preferable mode of the above-mentioned production process of the base having electronic components, in the third step, cutting the metal circuits (2) in the second semi-finished product includes cutting out the connection portion of each metal circuit (2) connecting different branches (21); the production process further comprises the step six of: a plurality of interconnected bases are cut from an elongated sheet (5) to simultaneously form a plurality of individual bases.
As a preferred solution of the above-mentioned production process of the base with electronic components, in step three, the pins of the electronic components (1) are soldered to the corresponding branches (21) of the metal circuit (2) by means of surface-mounting techniques.
The application has the beneficial effects that:
according to the production process of the base with the electronic element, the existing FPC is replaced by a molded metal circuit to be directly connected with the electronic element; the integrated forming of the metal circuit, the electronic element and the plastic part is completed through the two injection molding and one welding process, so that the assembly process of the electronic element and the plastic part is avoided; and space conversion of the electronic element from horizontal arrangement to vertical arrangement is skillfully realized by bending the metal circuit in the two injection molding processes. Therefore, the production process of the base with the electronic element is simplified, which is beneficial to improving the production efficiency and reducing the production cost.
Drawings
FIG. 1 is a flow chart of a process for producing a base with electronic components according to an embodiment;
FIG. 2 is a schematic diagram of a metal circuit according to a first embodiment;
FIG. 3 is a schematic diagram of a first plastic part and a metal circuit according to a first embodiment;
FIG. 4 is an enlarged view of a portion of FIG. 3 at A;
fig. 5 is a schematic structural diagram of a metal circuit provided in the first embodiment after an electronic component is soldered on the metal circuit;
fig. 6 is a schematic structural diagram of a base with electronic components according to the first embodiment;
fig. 7 is a flowchart of a production process of a base with electronic components provided in the second embodiment;
FIG. 8 is a schematic structural diagram of a plurality of interconnected metal substrates according to a second embodiment;
fig. 9 is a schematic structural diagram of a second semi-finished product after cutting a metal circuit according to the second embodiment.
1, an electronic element; 2. a metal circuit; 3. a first plastic part; 4. the second plastic piece; 5. a sheet;
21. a branch; 31. a limiting block; 51. and positioning holes.
Detailed Description
The technical scheme of the application is further described below by the specific embodiments with reference to the accompanying drawings.
Example 1
The present embodiment relates to a process for producing a base having an electronic component, as shown in fig. 1, including the steps of:
s11, forming a metal circuit 2, wherein the metal circuit 2 comprises a plurality of branches 21, and the branches 21 are connected with pins of the electronic element 1 in a one-to-one correspondence manner, as shown in FIG. 2.
S12, injection molding a first plastic part 3 at the position of connecting the electronic element 1 on the metal circuit 2 to form a first semi-finished product, as shown in fig. 3 and 4.
Specifically, by in-mold injection molding the position of the metal circuit 2 where the electronic component 1 is connected, the connection and reinforcement between the respective branches 21 of the metal circuit 2 can be made by the first plastic member 3 formed at the position. The metal circuit 2 is covered by the first plastic part 3 before the electronic element 1 is connected, so that the situation that the metal circuit 2 cannot be covered by the plastic part through injection molding after the electronic element 1 is connected with the metal circuit is avoided. In addition, the first plastic part 3 at the position can also play a role in supporting the electronic element 1, so that the metal circuit 2 and the electronic element 1 are relatively stable after being connected, and the electronic element 1 is prevented from moving.
The first plastic part 3 is located at the connection position of the metal circuit 2 and the electronic component 1, and connects all the branches 21 of the metal circuit 2 into a whole. The first plastic part 3 comprises a plurality of positioning components, the positioning components are connected with the branches 21 in a one-to-one correspondence manner, and each positioning component limits the end, connected with the electronic element 1, of the corresponding branch 21 in at least three different directions, so that the end, connected with the electronic element 1, of the branch 21 can be stably positioned. Specifically, each positioning assembly includes at least three limiting blocks 31, and different limiting blocks 31 are abutted against different positions on the corresponding branch 21, so that the corresponding branch 21 can be limited in at least three different directions. The number of the limiting blocks 31 in each positioning assembly may be specifically selected to be three or more, and may be determined according to the shape of the branch 21.
Because each branch 21 of the metal circuit 2 is connected with the electronic component 1, when the size of the electronic component 1 is smaller, the distance between the adjacent branches 21 is smaller, and the limiting blocks 31 corresponding to different branches 21 can be shared or connected into a whole, so that the effect of stably supporting the branches 21 can be enhanced, and the stability of the metal circuit 2 is ensured.
S13, welding the electronic component 1 on the first semi-finished product through an SMT process to form a second semi-finished product, as shown in FIG. 5. SMT (Surface Mount Technology) is a surface mount technology, known as surface mount or surface mount technology. SMT is a circuit attachment technique for mounting leadless or short-lead surface-mount components on the surface of a printed circuit board (Printed Circuit Board, PCB) or other substrate, and soldering the components by reflow or dip soldering. The electronic component 1 can be soldered to the first semi-finished product by the SMT process, improving soldering efficiency.
S14, injection molding the second plastic part 4 on the second semi-finished product to form a base, as shown in FIG. 6.
Specifically, after the second semi-finished product is subjected to in-mold injection molding, an integrally molded base is formed. The second plastic part 4 is coated on the metal circuit 2, one end, far away from the electronic element 1, of the branch 21 of the metal circuit 2 extends out of the second plastic part 4, the second plastic part 4 can protect the metal circuit 2, and meanwhile, one end, far away from the electronic element 1, of the branch 21 of the metal circuit 2 is located outside the second plastic part 4, so that connection with an external circuit is achieved, and the electronic element 1 achieves the function of the electronic element. The shape and structure of the second plastic part 4 may be adaptively selected according to the specific application, which is not particularly limited in this embodiment.
In the production process, the FPC is replaced by the metal circuit 2, so that the FPC is not required to be manufactured, and the production process is simplified; in addition, the process can complete the integral molding of the metal circuit 2, the electronic element 1 and the plastic part by only two injection molding processes and one SMT process, and no additional assembly step is needed. It is thus seen that the production process of the base with electronic component 1 is simplified, which is advantageous in improving production efficiency and reducing production cost.
In this embodiment, the electronic component 1 is a hall element. In other embodiments, the electronic component 1 may be adaptively selected according to actual needs.
Example two
As shown in fig. 7, a flowchart of a production process of a base with an electronic component in this embodiment is only described herein in detail, and the differences from the first embodiment are not repeated, and specific steps are as follows:
s21, stamping the long sheet 5 into a plurality of interconnected metal substrates with preset shapes, and carrying out reel packaging.
At the time of soldering, the electronic component 1 is soldered to the FPC by spot welding, which is conventional at present. Therefore, repeated positioning is required for each FPC, but the repeated positioning precision of the FPC has higher requirements, and in the actual production process, the repeated positioning precision of each time cannot be completely ensured. At the same time, the FPC itself has form and position tolerances. Based on the above situation, the whole defective rate of the base produced by the existing assembly process is high, and the production efficiency is low and the mass productivity is poor due to welding after positioning one by one.
In this step S21, by pressing a plurality of metal substrates connected to each other on the long sheet 5, continuous production or mass production can be achieved in the subsequent respective steps, which is advantageous in improving production efficiency. As shown in fig. 8, in this step, a plurality of positioning holes 51 are also punched and formed in the long sheet 5, and in each subsequent process step, the sheet 5 can be positioned by positioning pins penetrating into the positioning holes 51, so that a plurality of metal substrates can be positioned simultaneously, and the problem of low positioning efficiency is avoided. Wherein the locating pin is arranged on the forming device in the corresponding procedure. In this embodiment, the metal base material is formed by press forming, and other wire cutting methods can be adopted adaptively, which are within the scope of the present embodiment.
In this embodiment, the long sheet 5 is made of copper, stainless steel, or the like. In other embodiments, the strip 5 may be made of other metals or alloys according to the specific situation, so as to be conductive and soldered to the electronic component 1. The thickness of the long sheet 5 is in the range of 0.05 to 0.2mm, and specifically may be selected from 0.06mm, 0.08mm, 0.10mm, 0.11mm, 0.13mm, 0.15mm, 0.16mm, 0.18mm or 0.19mm.
The metal substrate is coiled and packed, and when the metal substrate is processed in the following step, the coil can be driven to rotate through the automatic traction device or the feeding device, so that the automatic feeding is realized.
S22, plating an antioxidation layer on the surface of the metal substrate.
Specifically, the oxidation-resistant layer is formed by nickel plating, so that the oxidation of the metal circuit 2 is avoided, and the service life of the metal circuit 2 is ensured. In other embodiments, protection of the metal substrate can be achieved by plating other antioxidant metals, and the actual situation is selected; other surface treatment methods for forming the antioxidation layer can be selected.
S23, plating a soldering-assisting layer outside the oxidation-resisting layer, so that a plurality of continuous metal circuits 2 are formed, and reel packaging is carried out.
Specifically, the soldering-assisting layer is formed by plating gold or tin outside the oxidation-resisting layer, and the soldering-assisting layer can be plated with gold or tin, so that a good soldering-assisting effect is realized. Wherein the welding assisting layer is plated on the welding position to reduce the cost. The soldering-assist layer contributes to the progress of the soldering process, and can improve soldering quality when the metal circuit 2 and the electronic component 1 are soldered to each other.
The reel of the formed metal circuit 2 is packaged, and when the metal circuit is processed in the next step, the reel can be driven to rotate by an automatic traction device or a feeding device, so that the metal circuit is beneficial to realizing automatic feeding.
S24, injection molding the first plastic part 3 at the position of the metal circuit 2, which is connected with the electronic element 1, to form a first semi-finished product.
Specifically, the injection molding is carried out at a temperature of 250-390℃and may be 260℃270℃280℃290℃300℃310℃320℃330℃340℃350, 360℃370℃or 380 ℃. The injection molding time is 5-15s, and can be specifically selected from 6s, 7s, 8s, 9s, 10s, 11s, 12s, 13s or 14s.
S25, welding the electronic component 1 on the first semi-finished product through an SMT process to form a second semi-finished product.
Specifically, the SMT process has a soldering temperature of 150-350deg.C, specifically 160 deg.C, 170 deg.C, 180 deg.C, 190 deg.C, 200 deg.C, 210 deg.C, 220 deg.C, 230 deg.C, 240 deg.C, 250 deg.C, 260 deg.C, 270 deg.C, 280 deg.C, 290 deg.C, 300 deg.C, 310 deg.C, 320 deg.C, 330 deg.C, 340 deg.C or 350 deg.C.
S26, cutting the metal circuit 2 in the second semi-finished product, wherein the cut second semi-finished product is shown in fig. 9.
And S27, bending the metal circuit 2 in the cut second semi-finished product.
Specifically, the position marked with a broken line in fig. 9 is bent along the broken line.
And S28, injection molding the second plastic part 4 on the bent second semi-finished product to form a plurality of interconnected bases.
The injection molding temperature is 250-390 deg.C, and is selected from 260 deg.C, 270 deg.C, 280 deg.C, 290 deg.C, 300 deg.C, 310 deg.C, 320 deg.C, 330 deg.C, 340 deg.C, 350 deg.C, 360 deg.C, 370 deg.C or 380 deg.C. The injection molding time is 5-15s, and can be specifically selected from 6s, 7s, 8s, 9s, 10s, 11s, 12s, 13s or 14s.
S29, cutting the plurality of interconnected bases to form a single base, so that the bases can be conveniently assembled into the corresponding voice coil closed-loop motors one by one.
Specifically, this step includes cutting the strip of material of the strip 5 connecting the plurality of bases, and cutting the connection portion of each metal circuit connecting the different branches 21. The cutting machine adopted in the step has the functions of cutting the material belt and dividing the holes by multiple holes, namely, the base can be cut off from the strip sheet 5, a plurality of mutually connected bases can be cut into a plurality of single bases at the same time, and the operation efficiency can be improved.
Note that the above is only a preferred embodiment of the present application. It will be understood by those skilled in the art that the present application is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the application. Therefore, while the application has been described in connection with the above embodiments, the application is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the application, which is set forth in the following claims.
Claims (10)
1. A production process of a base with electronic components, which integrates the electronic components on the base in a vertical arrangement, characterized in that it comprises at least the following steps:
step one: -forming a metallic circuit (2), said metallic circuit (2) comprising a plurality of branches (21) arranged horizontally for connection with electronic components;
step two: injection molding a first plastic part (3) at the position where all the branches (21) of the metal circuit (2) are connected with the electronic component (1) to form a first semi-finished product, wherein the first plastic part (3) is horizontally arranged and covers the position where all the branches (21) of the metal circuit (2) are connected with the electronic component (1), and the first plastic part (3) connects all the branches (21) of the metal circuit (2) into a whole and connects and reinforces all the branches (21);
step three: horizontally arranging an electronic component (1) on the first plastic part (3), and welding pins of the electronic component (1) to corresponding branches (21) of a metal circuit (2) through a surface mounting technology so that the branches (21) are in one-to-one correspondence with the pins of the electronic component (1) to form a second semi-finished product, wherein the first plastic part (3) supports the electronic component (1) upwards;
step four: bending the metal circuit (2) in the second semi-finished product, and after bending, simultaneously realizing space conversion between the first plastic part (3) and the electronic element (1) so as to convert the horizontal arrangement into the vertical arrangement;
step five: and carrying out injection molding on the second semi-finished product to form a second plastic part (4), so as to form a base which is formed by integrally molding the metal circuit (2), the electronic element (1) and the first plastic part (3) and the second plastic part (4) and is vertically arranged on the electronic element (1).
2. The process for producing the base with the electronic component according to claim 1, wherein the second plastic part (4) is coated on the metal circuit (2), and one end of the branch (21) of the metal circuit (2) far away from the electronic component (1) extends out of the second plastic part (4) to realize connection with an external circuit.
3. The process for producing a base with electronic components according to claim 1, characterized in that in step five, the electronic components (1) are simultaneously exposed to the first plastic part (3) and to the second plastic part (4).
4. A process for producing a base with electronic components according to claim 3, characterized in that in step two, the first plastic part (3) is shaped with a containing groove, to which the branch (21) of the metal circuit is exposed; in the third step, the electronic component (1) is accommodated in the accommodating groove and is exposed to the first plastic part (3).
5. The process for producing a base with electronic components according to claim 1, characterized in that the base is applied in a motor in a camera module, the electronic components (1) being hall elements.
6. The process for manufacturing the base with electronic components according to claim 1, wherein in the second step, the first plastic member (3) is formed with a plurality of positioning assemblies connected with the corresponding branches (21), and each positioning assembly limits the end, connected with the electronic component (1), of the corresponding branch (21) in at least three different directions.
7. The process for producing a base with electronic components according to claim 6, characterized in that each positioning assembly comprises at least three stop blocks (31), said at least three stop blocks (31) respectively abutting against different positions on the respective branch (21) to stop the respective branch (21) in at least three different directions.
8. A production process of a base with electronic components, which integrates the electronic components on the base in a vertical arrangement, characterized in that it comprises at least the following steps:
step one: stamping a strip (5) of material into a plurality of interconnected metal substrates of predetermined shape, thereby forming a plurality of continuous metal circuits (2), each of said metal circuits (2) comprising a plurality of branches (21) arranged horizontally for connection to electronic components;
step two: injection molding a first plastic part (3) at the position where all the branches (21) of the metal circuit (2) are connected with the electronic component (1) to form a first semi-finished product, wherein the first plastic part (3) is horizontally arranged and covers the position where all the branches (21) of the metal circuit (2) are connected with the electronic component (1), and the first plastic part (3) connects all the branches (21) of the metal circuit (2) into a whole and connects and reinforces all the branches (21);
step three: horizontally arranging an electronic element (1) on the first plastic part (3), welding pins of the electronic element (1) to corresponding branches (21) of a metal circuit (2) through a surface mounting technology so that the branches (21) are connected with the pins of the electronic element (1) in a one-to-one correspondence manner to form a second semi-finished product, cutting the metal circuit (2) in the second semi-finished product, and upwards supporting the electronic element (1) by the first plastic part (3);
step four: bending the metal circuit (2) in the cut second semi-finished product, and after bending, simultaneously realizing space conversion between the first plastic part (3) and the electronic element (1) and converting the horizontal arrangement into the vertical arrangement;
step five: injection molding is carried out on the second semi-finished product to form a second plastic part (4), so that a metal circuit (2), an electronic element (1), a first plastic part (3) and a second plastic part (4) are integrally formed, and the electronic element (1) is a vertically arranged base, and a plurality of bases are connected with each other.
9. The process for producing a base with electronic components according to claim 8, characterized in that in step three, cutting the metal circuits (2) in the second semifinished product comprises cutting out the connection portion of each metal circuit (2) connecting the different branches (21); the production process further comprises the step six of: a plurality of interconnected bases are cut from an elongated sheet (5) to simultaneously form a plurality of individual bases.
10. The process for producing a base with electronic components according to claim 8, characterized in that in step five, the electronic components (1) are simultaneously exposed to the first plastic part (3) and the second plastic part (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210703087.3A CN114980560B (en) | 2018-09-25 | 2018-09-25 | Production process of base with electronic element |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811114091.6A CN109287074B (en) | 2018-09-25 | 2018-09-25 | Production process of base with electronic element |
| CN202210703087.3A CN114980560B (en) | 2018-09-25 | 2018-09-25 | Production process of base with electronic element |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811114091.6A Division CN109287074B (en) | 2018-09-25 | 2018-09-25 | Production process of base with electronic element |
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| Publication Number | Publication Date |
|---|---|
| CN114980560A CN114980560A (en) | 2022-08-30 |
| CN114980560B true CN114980560B (en) | 2023-08-29 |
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| CN201811114091.6A Active CN109287074B (en) | 2018-09-25 | 2018-09-25 | Production process of base with electronic element |
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| CN110177429A (en) * | 2019-06-18 | 2019-08-27 | 苏州昀冢电子科技有限公司 | A kind of component and its production technology and camera module with electronic component |
| CN112702841B (en) * | 2020-12-16 | 2022-01-14 | 苏州昀冢电子科技股份有限公司 | Base welded with electronic element and voice coil motor thereof |
| CN112737272B (en) * | 2020-12-16 | 2022-05-17 | 苏州昀冢电子科技股份有限公司 | Base welded with electronic element, production process thereof and voice coil motor |
| CN112702842B (en) * | 2020-12-16 | 2022-04-29 | 苏州昀冢电子科技股份有限公司 | Base with metal circuit, voice coil motor and manufacturing method |
| CN117621351A (en) * | 2024-01-23 | 2024-03-01 | 宁波舜宇光电信息有限公司 | Manufacturing method of injection molding piece and injection molding piece thereof |
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| US6319448B1 (en) * | 1998-05-18 | 2001-11-20 | Remy Kirchdoerffer | Process for the production of an apparatus or instrument by overmolding and apparatus or instrument thus obtained |
| EP1170110A1 (en) * | 2000-07-07 | 2002-01-09 | Pollmann Austria OHG | Method for fabricating a plastic coated conductive structure of an electrical circuit unit as well as an electrical circuit unit comprising a plastic coated conductive structure |
| EP1357774A1 (en) * | 2002-04-26 | 2003-10-29 | Pollmann Austria OHG | Method for fabricating a plastic coated conductive structure of an electrical circuit unit as well as an electrical circuit unit comprising a plastic coated conductive structure |
| CN103474859A (en) * | 2013-09-02 | 2013-12-25 | 信源电子制品(昆山)有限公司 | Terminal manufacturing method as well as manufacturing method of terminals and cores of electronic parts and components |
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| JP3996904B2 (en) * | 2004-01-27 | 2007-10-24 | 松下電器産業株式会社 | Surface mount base for electronic devices |
| JP2009025377A (en) * | 2007-07-17 | 2009-02-05 | Konica Minolta Opto Inc | Drive unit and manufacture method for drive unit |
| DE102014008853B4 (en) * | 2014-06-14 | 2016-05-04 | Audi Ag | Plastic-coated conductor track structure and method for producing the plastic-coated conductor track structure |
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| US6319448B1 (en) * | 1998-05-18 | 2001-11-20 | Remy Kirchdoerffer | Process for the production of an apparatus or instrument by overmolding and apparatus or instrument thus obtained |
| EP1170110A1 (en) * | 2000-07-07 | 2002-01-09 | Pollmann Austria OHG | Method for fabricating a plastic coated conductive structure of an electrical circuit unit as well as an electrical circuit unit comprising a plastic coated conductive structure |
| EP1357774A1 (en) * | 2002-04-26 | 2003-10-29 | Pollmann Austria OHG | Method for fabricating a plastic coated conductive structure of an electrical circuit unit as well as an electrical circuit unit comprising a plastic coated conductive structure |
| CN103474859A (en) * | 2013-09-02 | 2013-12-25 | 信源电子制品(昆山)有限公司 | Terminal manufacturing method as well as manufacturing method of terminals and cores of electronic parts and components |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109287074A (en) | 2019-01-29 |
| CN114980560A (en) | 2022-08-30 |
| CN109287074B (en) | 2023-03-24 |
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