CN206952317U - Wave soldering carrier - Google Patents
Wave soldering carrier Download PDFInfo
- Publication number
- CN206952317U CN206952317U CN201720630514.4U CN201720630514U CN206952317U CN 206952317 U CN206952317 U CN 206952317U CN 201720630514 U CN201720630514 U CN 201720630514U CN 206952317 U CN206952317 U CN 206952317U
- Authority
- CN
- China
- Prior art keywords
- deckle board
- surface mount
- mount elements
- motherboard
- supporting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
The utility model is wave soldering carrier; motherboard is carried using it to be subjected to; the special construction set on carrier can effective protecting to component, it is realized local welding during welding, so as to reach effect non-interference between surface mount elements and plug-in element.Deckle board is annular frame like structure, is provided with supporting plate in the middle part of deckle board, supporting plate is provided with the groove corresponding with the electronic component on motherboard, and groove is enclosed construction；The position corresponding with surface mount elements is provided with projection, the raised interior gap slot for being provided with a side opening on the inside of deckle board.Overall structure is relatively easy; but surface mount elements can be but effectively protected by the gap slot of setting during actual use; motherboard is set selectively to be protected to surface mount elements during by wave-soldering; the subsequent job of artificial repair welding is eliminated, while can also ensure welding quality.
Description
Technical field
The auxiliary equipment being subjected to using wave-soldering is the utility model is related to, specifically wave soldering carrier.
Background technology
Wave-soldering refers to the solder of fusing（Terne metal）, through electrodynamic pump or electromagnetic pump jet flow into design requirement
It solder wave, can also be formed by injecting nitrogen to solder pot, make to be pre-loaded with the printed board of component by solder wave,
Realize room machine and the solder of electrical connection of component welding end or pin and printed board pad.
In tin cream processing procedure, when the solder joint between surface mount elements and plug-in element is less than 1mm, the quality of welding cannot protect
Card, the measure that prior art is taken are generally manual repair welding, so taken time and effort, and the potential risk to come off also be present.
The content of the invention
The utility model is wave soldering carrier, and carrying motherboard using it is subjected to, the special knot set on carrier
Structure can effective protecting to component, it is realized local welding during welding, so as to reach paster member
Non-interference effect between part and plug-in element.
The utility model realizes that above-mentioned purpose uses following technical scheme：
Wave soldering carrier, it includes deckle board and the supporting plate being located in deckle board.
Described deckle board is annular frame like structure, is provided with supporting plate in the middle part of deckle board, described supporting plate is provided with and motherboard
On the corresponding groove of electronic component, described groove is enclosed construction；It is corresponding with surface mount elements on the inside of deckle board
Position is provided with projection, and the gap slot of a side opening is provided with described projection.
The utility model is had the advantages that using above-mentioned technical proposal：
Overall structure is relatively easy, but but can be by the gap slot of setting to paster member during actual use
Part is effectively protected, and motherboard is selectively protected to surface mount elements during by wave-soldering, is saved
The subsequent job of artificial repair welding, while can also ensure welding quality.
Brief description of the drawings
Fig. 1 is schematic diagram of the present utility model.
Embodiment
The utility model is described in further detail below in conjunction with the accompanying drawings.
Wave soldering carrier as shown in Figure 1, it includes deckle board 1 and the supporting plate 2 being located in deckle board.
Described deckle board 1 is annular frame like structure, and the middle part of deckle board 1 is provided with supporting plate 2, described supporting plate 2 provided with
The corresponding groove 3 of electronic component on motherboard, described groove 3 is enclosed construction；The inner side of deckle board 1 and surface mount elements phase
Corresponding position is provided with projection 4, and the gap slot 5 of a side opening is provided with described projection 4.
During actual use, with the corresponding groove of position setting that motherboard is corresponding on carrier, surface mount elements are with inserting
The nearer position of part element distances sets raised and gap slot, surface mount elements is selectively protected, carrier is with motherboard
During by wave-soldering, raised and gap slot effectively can be obstructed and protected.
Claims (1)
1. wave soldering carrier, it includes deckle board and the supporting plate being located in deckle board, it is characterised in that：Described deckle board is annular
Frame like structure, is provided with supporting plate in the middle part of deckle board, and described supporting plate is provided with corresponding with the electronic component on motherboard recessed
Groove, described groove are enclosed construction；The position corresponding with surface mount elements is provided with raised on the inside of deckle board, in described projection
Gap slot provided with a side opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720630514.4U CN206952317U (en) | 2017-06-02 | 2017-06-02 | Wave soldering carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720630514.4U CN206952317U (en) | 2017-06-02 | 2017-06-02 | Wave soldering carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206952317U true CN206952317U (en) | 2018-02-02 |
Family
ID=61378432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720630514.4U Expired - Fee Related CN206952317U (en) | 2017-06-02 | 2017-06-02 | Wave soldering carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206952317U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111482670A (en) * | 2020-05-27 | 2020-08-04 | 东莞市点精电子有限公司 | Electronic component soldering method |
-
2017
- 2017-06-02 CN CN201720630514.4U patent/CN206952317U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111482670A (en) * | 2020-05-27 | 2020-08-04 | 东莞市点精电子有限公司 | Electronic component soldering method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180202 Termination date: 20210602 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |