TW200742513A - Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board - Google Patents

Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board

Info

Publication number
TW200742513A
TW200742513A TW095133327A TW95133327A TW200742513A TW 200742513 A TW200742513 A TW 200742513A TW 095133327 A TW095133327 A TW 095133327A TW 95133327 A TW95133327 A TW 95133327A TW 200742513 A TW200742513 A TW 200742513A
Authority
TW
Taiwan
Prior art keywords
solder powder
circuit board
electronic circuit
attachment
metallic surface
Prior art date
Application number
TW095133327A
Other languages
Chinese (zh)
Other versions
TWI316835B (en
Inventor
Takashi Shoji
Takekazu Sakai
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Publication of TW200742513A publication Critical patent/TW200742513A/en
Application granted granted Critical
Publication of TWI316835B publication Critical patent/TWI316835B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/082—Flux dispensers; Apparatus for applying flux
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0485—Tacky flux, e.g. for adhering components during mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness to the metallic surface to form a tacky part, and supplying the tacky part with a solder powder slurry suspended in a liquid, thereby inducing attachment of the solder powder. A method for the production of a soldered electronic circuit board, includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness to the metallic surface to form a tacky part; supplying the tacky part with a solder powder slurry suspended in a liquid, thereby inducing attachment of the solder powder, and thermally fusing the attached solder powder, thereby forming a circuit. A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness to the metallic surface to form a tacky part, supplying the tacky part with a solder powder slurry suspended in a liquid, thereby inducing attachment of the solder powder and, on the occurrence of a part devoid of attachment of solder powder in the consequently formed electronic circuit board, supplying the part with a solder powder slurry, thereby inducing attachment of solder powder thereto.
TW095133327A 2005-09-09 2006-09-08 Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board TWI316835B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005261835A JP4875871B2 (en) 2005-09-09 2005-09-09 Method for attaching solder powder to electronic circuit board and electronic wiring board with solder

Publications (2)

Publication Number Publication Date
TW200742513A true TW200742513A (en) 2007-11-01
TWI316835B TWI316835B (en) 2009-11-01

Family

ID=37935036

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095133327A TWI316835B (en) 2005-09-09 2006-09-08 Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board

Country Status (4)

Country Link
JP (1) JP4875871B2 (en)
KR (1) KR101062706B1 (en)
CN (1) CN101283632B (en)
TW (1) TWI316835B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4576270B2 (en) 2005-03-29 2010-11-04 昭和電工株式会社 Method for manufacturing solder circuit board
WO2007007865A1 (en) 2005-07-11 2007-01-18 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board
JP2008306029A (en) * 2007-06-08 2008-12-18 Smk Corp Reflow soldering method for printed circuit board using conductive paint
CN101868121B (en) * 2010-06-06 2012-04-11 苏州达方电子有限公司 Circuit board and method for forming connection part thereof
JPWO2021132689A1 (en) * 2019-12-27 2021-07-01

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0548258A (en) * 1991-08-20 1993-02-26 Murata Mfg Co Ltd Soldering method for electronic component
JP2592757B2 (en) * 1992-10-30 1997-03-19 昭和電工株式会社 Solder circuit board and method for forming the same
CN1080616C (en) * 1995-06-20 2002-03-13 松下电器产业株式会社 Solder and soldered electronic component and electronic circuit board
JP2933065B2 (en) * 1997-06-18 1999-08-09 日本電気株式会社 Arrangement method of small metal balls
JPH11240612A (en) * 1998-02-26 1999-09-07 Nichiden Mach Ltd Minute ball alignment method and device

Also Published As

Publication number Publication date
TWI316835B (en) 2009-11-01
CN101283632B (en) 2010-05-19
JP2007073869A (en) 2007-03-22
JP4875871B2 (en) 2012-02-15
KR20080043371A (en) 2008-05-16
CN101283632A (en) 2008-10-08
KR101062706B1 (en) 2011-09-06

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees