CN101868121B - Circuit board and method for forming connection part thereof - Google Patents
Circuit board and method for forming connection part thereof Download PDFInfo
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- CN101868121B CN101868121B CN2010102125709A CN201010212570A CN101868121B CN 101868121 B CN101868121 B CN 101868121B CN 2010102125709 A CN2010102125709 A CN 2010102125709A CN 201010212570 A CN201010212570 A CN 201010212570A CN 101868121 B CN101868121 B CN 101868121B
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Abstract
The invention discloses a circuit board and a method for forming a connection part thereof. The circuit board comprises a connection part provided with metal sheets. The method for forming the connection part comprises the following steps of: coating metal paste on the metal sheet in a screen printing manner to form a plurality of paste-shaped points on the metal sheet; and then curing the plurality of paste-shaped points to form a plurality of metal points, wherein the inoxidizability of the plurality of metal points is superior to that of the metal sheet. Thus, the circuit board can electrically contact external electric elements through the metal points with better inoxidizability without the oxidizing the metal sheet. In addition, the controllable planeness of the contact plane can be obtained by arranging a plurality of metal points on the metal sheet, and the problem that the metal sheet is coated with other materials to destroy the planeness of the contact plane is avoided.
Description
Technical field
The present invention is about the manufacturing process of a kind of circuit board and connecting portion thereof, and is particularly a kind of about be formed at circuit board and the manufacturing process on its contact contact with a plurality of metal dots.
Background technology
Along with environmental consciousness is general gradually, all towards green doctrine development, electronic product is no exception for various life correlated products.Along with the progress of electronics technology, most of electronic product all comprises circuit board, is carrying many electronic components on it, in order to reach electronic control function.Under the requirement of environmental protection standard, it is lead-free that these elements all are asked to.With the circuit board is example; It comprises Copper Foil; With develop, etched mode forms required circuit layout, wherein comprise to be used for the contact electrical connection section (for example golden finger) that the welded gasket and being used for of welding electronic part (for example initiatively or passive device) is connected with exterior electrical components.In circuit board process, on welded gasket, be coated with earlier tin cream, so that (when Surface Mount Technique, SMT) tin stove, the electronic component that is provided with on it can be by welding firmly, and this moment, welded gasket was promptly accomplished its purpose in crossing surface mount technology.Yet aforementioned contact electrical connection section, for example inserts in the slot of connector for the usefulness of electrical connection in the future because of its purposes need keep exposed for a long time.But this exposed requirement also causes the result of contact electrical connection section oxidation, has a strong impact on the effect of follow-up electrical connection.
In view of this; At present circuit board is imposed antioxidation method coating organic protective film (OrganicSolderability Preservatives is arranged; OSP), change tin method (Immersion Tin), change golden method (Electroless Ni/Au), zinc-plated, gold-plated, spray tin method (Hot Air Solder Level, HASL) etc.The antioxidation coating timeliness that OSP produces is limited, and other processing procedures then are to increase extra processing procedure and also increased many costs.
Summary of the invention
Therefore, one of the object of the invention is to provide a kind of circuit board, and circuit board includes connecting portion, is used for reaching with the way of contact with exterior electrical components being electrically connected.It is provided with the preferable metal dots of a plurality of non-oxidizabilitys this connecting portion, with the contact function of the sheet metal that replaces this connecting portion.
For reaching above-mentioned purpose, the present invention provides a kind of circuit board, and circuit board comprises connecting portion.This connecting portion has sheet metal, and a plurality of metal dots are positioned on this sheet metal, and wherein the non-oxidizability of these a plurality of metal dots is superior to the non-oxidizability of this sheet metal, for example is used for the soldering alloy of leadless process.By this, the preferable metal dots of these a plurality of non-oxidizabilitys replaces the function that the original relatively poor sheet metal of non-oxidizability electrically contacts as formula, so that more reliable electrical contact to be provided.In addition; In same contact area; Providing with original sheet metal with these a plurality of metal dots is provided suitable contact plane, can avoid the rough phenomenon that on this sheet metal, possibly cause with single metal coated and produces the phenomenon of loose contact, and can effectively control the height of these a plurality of metal dots; Be its formed new contact plane, so that the contact of the exterior electrical components that electrically contacts with it still can keep Elastic Contact.
Further, each metal dots is a mound shape projection.
Further, the basal cross section of each metal dots is circle or rectangle.
Further, this circuit board has a plurality of pads, and these a plurality of pads are used for welding electronic part, and the material of these a plurality of pads is identical with the material of these a plurality of metal dots.
Further, the diameter of each metal dots is between 0.5 to 1.0mm.
Further, these a plurality of metal dots are formed with metal alloy.
Further, this metal alloy is SAC alloy, sn-ag alloy, tin silver bismuth indium alloy or red brass.
Further, these a plurality of metal dots are distributed on this sheet metal with the planar array mode.
Another object of the present invention is to provide a kind of manufacturing process of connecting portion of circuit board, promptly, especially form these a plurality of metal dots on this sheet metal in order to form the aforementioned circuit plate.
Manufacturing process of the present invention comprises: circuit board is provided, and this circuit board comprises connecting portion, and this connecting portion has sheet metal; On this sheet metal, use forming a plurality of paste points on this sheet metal with the mode coating metal paste of screen painting; And solidify these a plurality of paste points to form a plurality of metal dots, wherein the non-oxidizability of these a plurality of metal dots is superior to this sheet metal.By this, this manufacturing process can be integrated in the program of coating tin cream in the SMT processing procedure, and single treatment is accomplished, the process variation of avoiding secondary operations to bring, on foot expensive source.
Further, be coated with this metal paste on this sheet metal, use these a plurality of paste points of formation on this sheet metal, comprise the following step: the shield with plurality of through holes is provided; This shield is placed on this circuit board, so that this plurality of through holes is positioned on this sheet metal; On this sheet metal, use these a plurality of paste points of formation via this this metal paste of plurality of through holes coating on this sheet metal; And remove this shield.
Further, this shield has specific thicknesses, and the diameter of each paste point equals this specific thicknesses.
Further, each through hole has circular cross-section or square-section.
Further, solidify these a plurality of paste points, comprise the following step: heat these a plurality of paste points and form this a plurality of metal dots to solidify to form these a plurality of metal dots.
Further, each paste point is formed the diameter that has between 0.5 to 1.0mm.
Further, this metal paste comprises metal alloy powders and scaling powder.
Further, this metal alloy powders is SAC alloy powder, sn-ag alloy powder, tin silver bismuth indium alloy powder or red brass powder.
Further, this circuit board has a plurality of welded gaskets, and these a plurality of welded gaskets are used for welding electronic part, and this manufacturing process is coated with this metal paste on this sheet metal and these a plurality of welded gaskets simultaneously with this screen painting mode.
Further; If the material of other pads is identical on the material of this metal dots and this circuit board; For example use lead-free tin cream, then this metal paste (being tin cream) can be coated on welded gasket and this sheet metal in a step simultaneously; And behind follow-up SMT stove excessively, form this pad and this metal dots.Because this metal dots system directly utilizes the existing SMT processing procedure of circuit board process to come to form in the lump; Therefore circuit board of the present invention need not extra processing procedure and can make; And extra spent usefulness (comprise the shield hole position processing charges that is coated with usefulness and form the required tin cream cost of metal dots) is extremely small with respect to whole processing procedure cost, the effective oxidation resistant benefit that but can bring.
With respect to prior art, the present invention is directed to circuit board with the connecting portion that is used to electrically contact, a kind of method of a plurality of metal dots on the sheet metal of this connecting portion that form proposed, use the function that this sheet metal of replacement electrically contacts.The present invention utilizes the non-oxidizability of this metal dots to be superior to the characteristic of the non-oxidizability of this sheet metal, so that this circuit board can provide the better interface that electrically contacts.Therefore, the invention solves the easy oxidation of Copper Foil in the prior art and the problem of the electrical connection pattern that is unfavorable for repeatedly electrically contacting.In addition, the manufacturing process that the present invention proposes can be incorporated general SMT processing procedure into, and can use general scolder, makes that the processing procedure cost of this manufacturing process is very cheap, even can ignore.
Can graphicly further be understood by following detailed Description Of The Invention and appended about advantage of the present invention and spirit.
Description of drawings
Fig. 1 is according to the wherein stereogram of the circuit board of a preferred embodiment of the present invention;
Fig. 2 is circuit board partial enlarged drawing in the circle A in Fig. 1;
Fig. 3 is the enlarged side view of connecting portion among Fig. 2;
Fig. 4 is the partial enlarged drawing of the circuit board of rectangle for the basal cross section of its metal dots;
Fig. 5 is the partial enlarged drawing of its metal dots with the circuit board of single row configuration arrangement;
Fig. 6 is the stereogram according to the circuit board of another preferred embodiment of the present invention;
Fig. 7 is the end view of circuit board among Fig. 6;
Fig. 8 is according to the wherein flow chart of the manufacturing process of the connecting portion of the circuit board of a preferred embodiment of the present invention;
Fig. 9 is the vertical view of uncompleted circuit board;
Figure 10 be according among Fig. 8 of an embodiment wherein with the flow chart of screen painting;
Figure 11 places the sketch map on the circuit board for shield.
Embodiment
See also Fig. 1 and Fig. 2, Fig. 1 is the stereogram according to the circuit board 1 of a wherein preferred embodiment of the present invention, and Fig. 2 is circuit board 1 partial enlarged drawing in the circle A in Fig. 1.Circuit board 1 comprises multilayer plate body 12 and a plurality of electronic component 14.Plate body 12 has circuit layout (not being illustrated among the figure), and electronic component 14 is welded on the plate body 12 according to this circuit layout.Plate body 12 comprises connecting portion 16, is used for reaching electrical connection with the external connected electronic element with the mode that contacts.Connecting portion 16 has sheet metal 162, and it is provided with a plurality of metal dots 164 (only indicating one of which), and wherein the non-oxidizability of metal dots 164 is superior to the non-oxidizability of sheet metal 162.In present embodiment, sheet metal 162 can be the part of the Copper Foil in the multilayer plate body 12, and metal dots 164 is a mound shape projection, and its basal cross section can be circle, and these a plurality of metal dots 164 are distributed on the sheet metal 162 with the planar array mode equably; But the present invention is not as limit.
Please and consult Fig. 3, it is the enlarged side view of connecting portion 16 among Fig. 2, and wherein for ease of explanation, sheet metal 162, metal dots 164 are to illustrate with exaggerative with respect to connecting portion 16 integral thickness.The convention practice is on sheet metal 162, to form diaphragm (OSP) or other metal levels; Intactly to cover sheet metal 162; Use the contact-making surface that obtains protection sheet metal 162 or with new, replace the effect of former contact-making surface than the contact-making surface of tool non-oxidizability, and reach the purpose that exterior electrical components good electrical contact interface is provided.The present invention is distributed on the sheet metal 162 with a plurality of metal dots 164; The top end of each metal dots 164 forms a new contact-making surface (being represented by dotted lines in figure); It increases the whole height 166 of sheet metal 162, and wherein the whole height 166 of sheet metal 162 should be looked the size of metal dots 164 and decide.
In present embodiment, the adhesive force that metal dots 164 and sheet metal are 162 is good, presents the contact angle of acute angle, and metal dots 164 presents mound shape structure.Even if it is different slightly that each metal dots 164 and the adhesive force of 162 of sheet metals have, because of in practical application, the cumulative volume of each metal dots 164 is almost equal, and the ratio of the difference in height of metal dots 164 is also little.And in present embodiment, the diameter of metal dots 164 (or particle diameter) (particle size) is indulged the ratio that aforementioned difference in height is arranged between 0.5 to 1.0mm, and its essence difference in height will be more micro-little.Therefore, the present invention utilizes a plurality of small new contact-making surfaces that metal dots constituted, and its plane fluctuation can be ignored (being that flatness is quite little), and can directly be regarded as smooth plane.What remark additionally is that in present embodiment, the height of metal dots 164 is about 1/2nd of its diameter, promptly between 0.25 to 0.5mm.If connecting portion 16 is to reach electrical connection to insert in the slot, then the thickness of aforementioned increase still in general slot permissible range, comprises accommodation space size and shell fragment regime of elastic deformation.In other words, though plate 1 increases the whole thickness of a little connecting portion 16 in a circuit according to the invention, the operation that reality is inserted does not have materially affect, and circuit board 1 can also be possessed the good contact characteristics of connecting portion 16.Aforementioned diameter or setting highly to metal dots 164 are decided by product specification, and the present invention is not exceeded with aforementioned range.
See also Fig. 4, it is the partial enlarged drawing of the circuit board 1 of rectangle for the basal cross section of its metal dots 164.Though previous embodiment is that circle is an example with the basal cross section of metal dots 164, the present invention is not as limit, and the basal cross section of being used as metal dots 164 with rectangle also can obtain identical effect; Certainly, other shapes also can, for example triangle or other polygons etc.In addition, no matter be the metal dots 164 that shows among Fig. 2 or Fig. 4, all arrange, but the present invention for example has different distribution densities all can not as limit with annular arrangement or according to design requirement with planar array.Again, though aforementioned be explanation basis with the planar alignment, the present invention is not still as limit.See also Fig. 5, it is the partial enlarged drawing of its metal dots 164 with the circuit board 1 of single row configuration arrangement.The metal dots 164 that Fig. 5 shows is to arrange with single structure, and it is applicable to the interface of less pin column pitch (pitch) usually.Because of the width of its single contact (sheet metal 162) is rather narrow, so arrange sufficient with single metal dots 164.
Supplementary notes is again, though previous embodiment is an example with the golden finger of interface card, the present invention is not as limit.See also Fig. 6 and Fig. 7, Fig. 6 is the stereogram according to the circuit board 3 of another preferred embodiment of the present invention, wherein is represented by dotted lines connecting portion 16 positions; Fig. 7 is the end view of circuit board 3 among Fig. 6, and wherein dotted line is represented the shell of ccontaining circuit board 3, and exterior electrical components 5 is passed shell to electrically contact with connecting portion 16.In present embodiment, the zone of connecting portion 16 for only providing the plane to electrically contact, it also comprises sheet metal 162 and is formed at a plurality of metal dots 164 on the sheet metal 162.The related description that previous embodiment can be directly consulted in the explanation of sheet metal 162 and metal dots 164 repeats no more.Connecting portion 16 and exterior electrical components 5 no longer see through the mode of inserting slot and reach the purpose that is electrically connected, but reach the purpose that elasticity electrically contacts with the mode of shell fragment compressing (or directly with the compressing of elasticity forward) merely.In practical application, exterior electrical components 5 and connecting portion 16 can also other electric connectors as the media that is electrically connected, do not exceed with person shown in the 7th figure.
Compared to prior art; The higher metal dots 164 of circuit board 1 utilization non-oxidizability replaces the relatively poor sheet metal of antioxygen property 162; And replace the contact-making surface that former cause sheet metal 162 is provided by the new contact-making surface that a plurality of metal dots 164 form, effectively solve the problem that causes poor electric contact because of sheet metal 162 oxidations.Again; Employed scolder material was identical when the material of metal dots 164 was able to 14 welding of other electronic components; For example metal dots 164 is all used solder commonly used with pad 144 (seeing also Fig. 1), for example SAC alloy, sn-ag alloy, tin silver bismuth indium alloy, red brass or the good metal alloy of other solderabilities.By this, the processing procedure that forms metal dots 164 can be incorporated the surface mount technology of circuit board 1 into (Surface Mount Technique SMT) implements in the processing procedure, need not extra processing procedure expense, the detailed as back literary composition of its processing procedure.Generally speaking; Plate 1 can be made with extremely cheap means in a circuit according to the invention; And solve the contact problem of oxidation effectively; And in the prior art, need secondary operations (fabrication process in addition) and extra process expense (medicament coating, plating, immersion plating) etc., increase production the risk that article cost and product are made on foot.
See also Fig. 8 and Fig. 9, the 8th figure is that Fig. 9 is the vertical view of uncompleted circuit board 2 according to the wherein flow chart of the manufacturing process of the connecting portion of the circuit board of a preferred embodiment of the present invention.At first, this manufacturing process provides this circuit board 2, shown in step S100.Circuit board 2 is as shown in Figure 9.This circuit board 2 belongs to uncompleted circuit board with respect to the circuit board 1 of Fig. 1; Its multilayer plate body 12 comprises connecting portion 16 and other are provided with the part of electronic component 14; Connecting portion 16 has sheet metal 162; Plate body 12 other parts then have a plurality of welded gaskets 142, supply the usefulness of later welded electronic component 14.In present embodiment, sheet metal 162 and welded gasket 142 are the exposed part of Copper Foil in the multilayer plate body 12 of circuit board 2, and the circuit part that other Copper Foils form is then in addition with the protective layer covering protection.
Then; Shown in step S120; This manufacturing process with the mode coating metal paste of screen painting on sheet metal 162 and welded gasket 142, use form a plurality of paste points on the sheet metal 162 and the metal paste that forms evenly coating on welded gasket 142.What remark additionally is; Because of present embodiment is to execute in the lump as example with the circuit board 2 and the SMT processing procedure of other electronic components 14; Considering cost and processing procedure convenience; This metal paste is used to form the solder of metal dots 164 and welding electronic part 14 simultaneously, so this metal paste directly adopts habitual tin cream, it comprises metal alloy powders and scaling powder; Wherein this metal alloy powders is SAC alloy powder, sn-ag alloy powder, tin silver bismuth indium alloy powder, red brass powder or the good metal alloy powders of other solderabilities, but the present invention is not as limit.Certainly, coat on the sheet metal 162 with coat welded gasket 142 on metal paste also can be different, look closely product specification and decide.
See also Figure 10 and Figure 11, Figure 10 be according among Fig. 8 of an embodiment wherein with the flow chart of screen painting, Figure 11 places the sketch map on the circuit board 2 for shield 4.In present embodiment, abovementioned steps S120 can further be decomposed into provides the shield 4 with plurality of through holes 42, shown in step S122; Then, this shield is placed on the circuit board 2, so that this plurality of through holes 42 is positioned on sheet metal 162 and the welded gasket 142, shown in step S124 accordingly; Follow again, be coated with these metal paste on sheet metal 162 and welded gasket 142, use forming a plurality of paste points in reaching the even metal paste that is coated with of formation on the sheet metal 162 on welded gasket 142, shown in step S126 via through hole 42; At last, remove shield 4, shown in step S128.
In present embodiment, the through hole 42 of corresponding sheet metal 162 has circular cross-section, can be coated with columned paste point by this on sheet metal 162, and behind follow-up curing schedule, can form the mound shape projection with circular base cross section, and is promptly as shown in Figure 2.If when the through hole 42 of corresponding sheet metal 162 has the square-section, the paste point of coating the column on the sheet metal 162 by this can form the mound shape projection with rectangular base cross section behind follow-up curing schedule, promptly as shown in Figure 4.If desire forms the metal dots 164 (can consult Fig. 2) of its diameter between 0.5 to 1.0mm; Then each paste point can be formed the diameter that has between 0.5 to 1.0mm, or more bigger again, and this contains volatile materials because of this metal paste; After the curing, volume can dwindle.But in practical application, the diameter of the paste point that is coated with among the present invention does not exceed with above-mentioned.
In addition; Because when the diameter of the paste point of coating much larger than it highly the time; After treating the fusing of paste point; Because of motlten metal liquid cohesive force, surface tension and with the effects such as adhesive force of 162 of sheet metals, this motlten metal liquid can't be evenly distributed on the originally shared zone of paste point, but is distributed in several fragmentations, irregular and distinct area.To be cooled, solidify after, that original single paste point promptly forms is that several (also be accompanied by highly and differ), shapes not of uniform size differ, metal mound shape thing independently.Therefore, in practical application, shield 4 is made with steel plate usually, when the diameter of the paste point that is coated with approximately equates with the thickness of shield 4, can obtain preferable metal dots 164 forming effects.
Supplementary notes be, in present embodiment, because of employing only with a kind of metal paste, so can be once, side by side metal paste is coated on sheet metal 162 and the welded gasket 142; If adopt two kinds of metal paste to coat respectively on sheet metal 162 and the welded gasket 142, still can carry out suitable separation design by control coating operation or with shield 4, with once, side by side with two kinds of metal paste with coating respectively.Certainly, gradation is coated with single kind or two kinds of metal paste also can.In addition, the composition of this metal dots is not limit metal alloy, and single metal (can comprise small amount of impurities) also can.In like manner, the metal dust that this metal paste is contained does not also exceed with metal alloy, repeats no more.
Please get back to Fig. 8.After being coated with this metal paste, this manufacturing process then is positioned over the electronic component 14 that need are welded on the circuit board 2 on the corresponding welded gasket that is coated with this metal paste 142, shown in step S140.Shown in step S160; At last; This manufacturing process solidifies these a plurality of paste points of coating on the sheet metal 162 to form a plurality of metal dots 164; Simultaneously, the metal paste of coating on the welded gasket 142 also solidify to form pad 144 (being illustrated among Fig. 1 with hachure), and welding electronic part 14 is on circuit board 2.So far, circuit board 1 is promptly accomplished, and is as shown in Figure 1.In practical application, this metal paste is the mode with heating, so that scaling powder volatilization and make the metal alloy powders fusion in this metal paste, cooling curing is shaped again.Because of the SMT processing procedure of present embodiment and electronic component 14 is implemented in the lump, so aforementioned heating, shaping etc. are all carried out in the SMT stove; But the present invention also can with other mode of heatings not as limit.
What remark additionally is that aforementioned manufacturing process mainly based on incorporating existing SMT processing procedure into, to simplify processing procedure, describe, but the present invention is not as limit.Usually the welding of electronic component 14 only need be implemented once, so to the first heavy solderability of the requirement of pad 144; Relative; Metal dots 164 reaches the purpose that good electrical contact can be provided repeatedly because of need; So the requirement head to it focuses on the surface oxidation-resistant ability; This has been one of solution prior art problem, promptly is superior to the metal of sheet metal 162 with non-oxidizability, comes substituted metal thin slice 162 (Copper Foil) to be prone to the problem of oxidation.Therefore, if special demands are arranged, the material of metal dots 164 can be different with the material of pad 144 certainly, needless to say give unnecessary details.Again, this moment, whether both processing procedures need merge embodiment, still needed and considered the required enforcement environment of these two kinds of unlike materials (for example temperature, atmosphere etc.), were not limited to aforementioned embodiments.
With respect to prior art, the present invention is directed to circuit board with the connecting portion that is used to electrically contact, a kind of method of a plurality of metal dots on the sheet metal of this connecting portion that form proposed, use the function that this sheet metal of replacement electrically contacts.The present invention utilizes the non-oxidizability of this metal dots to be superior to the characteristic of the non-oxidizability of this sheet metal, so that this circuit board can provide the better interface that electrically contacts.Therefore, the invention solves the easy oxidation of Copper Foil in the prior art and the problem of the electrical connection pattern that is unfavorable for repeatedly electrically contacting.In addition, the manufacturing process that the present invention proposes can be incorporated general SMT processing procedure into, and can use general scolder, makes that the processing procedure cost of this manufacturing process is very cheap, even can ignore.
In addition; The present invention utilizes a plurality of metal dots; Each metal dots size is much smaller than the whole contact area of sheet metal, that is the diameter of utilization control metal dots, as the means of the shaped profile of controlling each metal dots; Reaching the purpose of control metal dots height, and the flatness of the contact plane of guaranteeing to be made up of metal dots can be in permissible range.Therefore, even if the present invention utilizes independently metal dots of a plurality of structures, still can keep the depth of parallelism of the new former contact plane that contact plane and sheet metal provided.If will be controlled in the permissible range, circuit board of the present invention is as good as in the use with circuit board with the prior art manufacturing because of the integral thickness that forms the connecting portion that metal dots increases.
The above is merely preferred embodiment of the present invention, and all equalizations of being done according to claim scope of the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (14)
1. circuit board is characterized in that this circuit board includes:
Connecting portion, this connecting portion has sheet metal, and a plurality of metal dots are positioned on this sheet metal, and wherein the non-oxidizability of these a plurality of metal dots is superior to the non-oxidizability of this sheet metal, and the material of these a plurality of metal dots is a solder.
2. circuit board as claimed in claim 1 is characterized in that each this metal dots is a mound shape projection.
3. circuit board as claimed in claim 1, the basal cross section that it is characterized in that each this metal dots is circle or rectangle.
4. circuit board as claimed in claim 1 is characterized in that this circuit board has a plurality of pads, and these a plurality of pads are used for welding electronic part, and the material of these a plurality of pads is identical with the material of these a plurality of metal dots.
5. circuit board as claimed in claim 1, the particle diameter that it is characterized in that each this metal dots is between 0.5 to 1.0mm.
6. circuit board as claimed in claim 1 is characterized in that these a plurality of metal dots are distributed on this sheet metal with the planar array mode.
7. the manufacturing process of the connecting portion of a circuit board is characterized in that this manufacturing process comprises the following step:
Circuit board is provided, and this circuit board comprises connecting portion, and this connecting portion has sheet metal;
On this sheet metal, use forming a plurality of paste points on this sheet metal with the mode coating metal paste of screen painting; And
Solidify these a plurality of paste points to form a plurality of metal dots, wherein the non-oxidizability of these a plurality of metal dots is superior to the non-oxidizability of this sheet metal.
8. manufacturing process as claimed in claim 7 is characterized in that being coated with this metal paste on this sheet metal, uses these a plurality of paste points of formation on this sheet metal, comprises the following step:
Shield with plurality of through holes is provided;
This shield is placed on this circuit board, so that this plurality of through holes is positioned on this sheet metal;
On this sheet metal, use these a plurality of paste points of formation via this this metal paste of plurality of through holes coating on this sheet metal; And
Remove this shield.
9. manufacturing process as claimed in claim 8 is characterized in that this shield has specific thicknesses, and the particle diameter of each this paste point equals this specific thicknesses.
10. manufacturing process as claimed in claim 8 is characterized in that each this through hole has circular cross-section or square-section.
11. manufacturing process as claimed in claim 7 is characterized in that solidifying these a plurality of paste points to form these a plurality of metal dots, comprises the following step:
Heat these a plurality of paste points and form this a plurality of metal dots to solidify.
12. manufacturing process as claimed in claim 7 is characterized in that each this paste point is formed the particle diameter that has between 0.5 to 1.0mm.
13. manufacturing process as claimed in claim 7 is characterized in that this metal paste comprises metal alloy powders and scaling powder.
14. manufacturing process as claimed in claim 7; It is characterized in that this circuit board has a plurality of welded gaskets; These a plurality of welded gaskets are used for welding electronic part, and this manufacturing process is coated with this metal paste on this sheet metal and these a plurality of welded gaskets simultaneously with this screen painting mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102125709A CN101868121B (en) | 2010-06-06 | 2010-06-06 | Circuit board and method for forming connection part thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102125709A CN101868121B (en) | 2010-06-06 | 2010-06-06 | Circuit board and method for forming connection part thereof |
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| CN101868121A CN101868121A (en) | 2010-10-20 |
| CN101868121B true CN101868121B (en) | 2012-04-11 |
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| CN102917552A (en) * | 2011-08-05 | 2013-02-06 | 西门子公司 | Welding accessory coating method, welding pad and printed circuit board |
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| JP4875871B2 (en) * | 2005-09-09 | 2012-02-15 | 昭和電工株式会社 | Method for attaching solder powder to electronic circuit board and electronic wiring board with solder |
| CN2927605Y (en) * | 2006-04-08 | 2007-07-25 | 技嘉科技股份有限公司 | Circuit board and its radiating metal surface arrangement shape |
| CN201752159U (en) * | 2010-06-06 | 2011-02-23 | 苏州达方电子有限公司 | Circuit board |
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