CN2899049Y - Chip resistance structure by seamless laser welding process - Google Patents

Abstract

The utility model is a chip resistance structure by seamless laser welding process, the utility model uses the laser welding machine to seamless weld the required alloy board selected according to different resistance value and a copper board; after the prearranged shape is formed by die punching, the resistance value are detected and adjusted; and the shape is being cut to adjust delicately by laser; because the utility model combines the copper board on the alloy board with the laser welding combination structure, the precision of the resistance value during production can be accurately commanded, and after the module is whole damped the resistance repairing can be actualized, and the prearranged resistance scope can be achieved.

Description

The chip-resistance structure of laser seamless welding

Technical field

The utility model relates to a kind of chip-resistance structure of laser seamless welding, be meant especially with laser alloy sheets and copper coin are done no seam welding, resistance value must be controlled at a stable scope, and impose resistance value fine setting technology, so that the precision of each resistance is adjusted in the required scope.

Background technology

Known its manufacture process of SMD LED surface-mount device LED chip resister mainly is electroplate with the copper metal on alloy sheets, so that alloy sheets is combined with copper coin, through the stamping moulding, repair resistance, mould the fat layer, the electro-coppering end utmost point, to form required resistor.When but general chip resister is attached to alloy sheets at the enforcement plating mode with the copper metal-plated, because the copper metal thickness in the plating additive process is wayward, this just causes resistance to become unstability, when the probe of surveying usefulness when contacting with resistive element, because its resistance value rate of change is not easy to adjust resistance value greatly and very, because the resistance adjustment is difficult for, so the resistive element ratio height that is eliminated, therefore relative manufacturing cost often remains high.

Summary of the invention

In order to overcome deficiency of the prior art, a kind of a kind of a large amount of production and stay-in-grade chip-shaped resistor that be suitable for that provide is provided the purpose of this utility model.To replace the problem of resistance value instability in traditional manufacturing structure and precision difference.

The technical solution adopted in the utility model is: a kind of chip-resistance structure of laser seamless welding,

Alloy sheets is a strip, and the seamless respectively solder bond in these alloy sheets both sides has copper coin.

Description of drawings

Fig. 1 is hard board stereoscopic figure of the present utility model;

Fig. 2 is that the utility model is the stereoscopic figure that copper coin is welded on the hard board both sides;

Fig. 3 is the stereogram of the utility model stamping moulding;

Fig. 4 is the utility model is adjusted resistance with laser cutting stereoscopic figure;

Fig. 5 is that the utility model is at the two-sided coated protection glue-line of alloy sheets;

Fig. 6 the utility model has weld layer in the plating of copper coin two end electrodes.

Description of reference numerals: 1 alloy sheets; 2 copper coins; 3 laser welding; 4 laser cutting; 5 resins protect mould; 6 electrode tips; A-resistance alloys body.

Embodiment

See also Figure 1 and Figure 2, the chip-resistance structure of laser seamless welding of the present utility model mainly is to select required alloy sheets material according to required resistance, wherein this alloy sheets 1 is for being ribbon, the copper coin of selecting for use according to resistance value 2 (or copper alloy) is for forming the both sides of electrode tip in alloy sheets 1 desire with laser welding, with graphic is example, be directly to give being welded on alloy sheets 1 both sides, because being welded on alloy sheets 1 with laser welding 3 copper coins 2 serves as to form a kind of no seam welding, therefore copper coin 2 and alloy sheets 1 to combine precision certain again, very simple on the welding processing, the sheet metal of two different materials in conjunction with the time, with the predetermined almost nil difference of resistance that is provided with.

See also Fig. 3 again to shown in Figure 4, when alloy sheets 1 in conjunction with after having the copper coin 2 of high-termal conductivity, can advance and once implement the whole piece punch die, it according to former default resistance and go out its shape, and is cut in the alloy sheets 1 of a side wherein, so that measure resistance.Because when implementing punch die, can produce a little error, therefore the resistive element of can the laser special machine each alloy sheets 1 part being sentenced punch die is done laser cutting 4 to reach the effect of fine setting finishing resistance, and can improve its accuracy value in 1% through each resistance after the finishing, so its defective products is superseded relative very low.

With shown in Figure 5; above-mentioned resistive element is after process punch die, adjustment resistance; promptly be coated on the two-sided place of resistance alloys body (in graphic, protecting mould 5 parts) of alloy sheets 1 with the fat of moulding of realizing coating with epoxy resin; protect mould 5 with the protective resistance body and reach insulation effect as moulding fat; but for keep and circuit substrate between the electrical equipment conducting, the copper coin 2 that weld at alloy sheets 1 two ends must partly expose.

Continuous see also shown in Figure 6; when resistive element through after moulding the fat resin and protecting the protection of mould; can carry out the punch die of single body to it; the resistance punching out of whole piece is become individual unit; be that at last protruding being exposed at mould the copper coin that fat protects mould 5 two ends and carry out barrel plating electrode tip 6; with nickel (Ni), tin (Sn), cover the copper coin surface according to termination electrode 6 platings, can improve the not good situation of copper metallic tin by nickel (Ni), tin (Sn).

The chip-resistance structure of laser seamless welding of the present utility model is to adopt with easy solder bond structure, can reach the simplification fabrication schedule, has also guaranteed the accuracy of the resistance of chip-resistance simultaneously; The chip-resistance structure of laser seamless welding therefore provided by the utility model, it not only is the novel initiative of inventor, and really can be reached the practical value and the effect of expection by its structure, compared to the plating form of commonly using product, the utility model is to have bigger advantage and progressive effect.

In sum, only be preferred embodiment of the present utility model, when can not with the scope implemented of qualification the present invention.Promptly the equalization of being done according to the utility model claim generally changes and modifies, and all should still belong in the scope that patent of the present invention contains.

Claims (1)

1. the chip-resistance structure of laser seamless welding is characterized in that:

Alloy sheets is a strip, and the seamless respectively solder bond in these alloy sheets both sides has copper coin.

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