WO2010095256A1 - Metal plate low resistance chip resistor, and production method for the same - Google Patents

Metal plate low resistance chip resistor, and production method for the same Download PDF

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Publication number
WO2010095256A1
WO2010095256A1 PCT/JP2009/053149 JP2009053149W WO2010095256A1 WO 2010095256 A1 WO2010095256 A1 WO 2010095256A1 JP 2009053149 W JP2009053149 W JP 2009053149W WO 2010095256 A1 WO2010095256 A1 WO 2010095256A1
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WO
WIPO (PCT)
Prior art keywords
plate
chip
resistance
metal
resistance value
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Application number
PCT/JP2009/053149
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French (fr)
Japanese (ja)
Inventor
立樹 平野
Original Assignee
釜屋電機株式会社
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Publication date
Application filed by 釜屋電機株式会社 filed Critical 釜屋電機株式会社
Priority to CN200980157340.2A priority Critical patent/CN102326215B/en
Priority to KR1020117017188A priority patent/KR101267876B1/en
Priority to PCT/JP2009/053149 priority patent/WO2010095256A1/en
Publication of WO2010095256A1 publication Critical patent/WO2010095256A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H01C17/245—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by mechanical means, e.g. sand blasting, cutting, ultrasonic treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C3/00—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/001—Mass resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors

Definitions

  • the present invention relates to a metal plate low-resistance chip resistor and a method for realizing the resistance value relatively high and with high accuracy.
  • a copper plate as an electrode and a resistance metal plate formed by etching or punching with a die are spot-welded.
  • the metal plate low resistance chip resistor is energized, there is a problem that reliability is lowered due to generation of hot spots on the resistance metal plate.
  • the base of the electrode portion and the resistance portion uses the same resistance metal plate, and a slit having a very narrow width is formed in the resistance portion to provide resistance.
  • a method for increasing the value is described.
  • a protective film is applied to the resistance portion, and the electrode portion is formed by bonding a copper plate by a clad method or the like.
  • a very narrow slit is formed in the resistance portion to increase the resistance value, when a current is passed through the chip resistor, a hot spot is generated in the resistance metal plate, and reliability is increased.
  • the copper plate is joined by the clad method, the electrode part is also difficult to manufacture at a low cost.
  • the present invention has been proposed in view of the current situation as described above, and an object of the present invention is to provide a highly reliable and low-profile metal plate with a specific resistance value in the range of about 15 to 50 m ⁇ . It is to provide a resistor chip resistor.
  • Another object of the present invention is that a metal plate low resistance chip resistor having a specific resistance value in the range of about 15 to 50 m ⁇ can be manufactured with high accuracy and high yield by a relatively simple and continuous process. It is to provide a manufacturing method.
  • the protective film is A metal plate low resistance chip resistor that covers the surface of the metal resistance plate and fills both sides of the resistance value fixing portion and has the same width as both ends.
  • a step of forming a plurality of holes arranged in a line at predetermined intervals in the belt-shaped metal resistor plate, and a protective film formation for closing the plurality of holes by forming a protective film in the central long side direction of the belt-shaped metal resistor plate A step of forming an electrode film with a predetermined width on the side of the hole, and forming a region having no electrode film on both sides of the hole in the region from both sides of the metal resistor plate to the hole; And a chip-shaped cutting step of forming a chip-shaped metal resistance plate by cutting the metal resistance plate in the short-side direction at the portion where the hole is provided, and the chip-shaped cutting step has a desired resistance value.
  • a method of manufacturing a metal plate low resistance chip resistor characterized in that a cutting width of a band-shaped metal resistor plate is determined so that a chip metal resistor plate is obtained.
  • the protective film is formed by providing a sheet-like or belt-like organic resin material on both surfaces of the metal resistance plate and welding them while applying pressure. Or the manufacturing method of the metal plate low resistance chip resistor as described in said (4).
  • the chip-shaped cutting step includes a step of cutting a strip-shaped metal resistor plate in a short side direction at a portion where the hole is provided to form a chip-shaped metal resistor plate, and a resistance of the chip-shaped metal resistor plate A measurement step for measuring the value, and calculation using the measurement value to calculate the cutting width of the strip-shaped metal resistance plate in the next cutting step so that a chip-shaped metal resistance plate having a desired resistance value is obtained.
  • the chip-shaped cutting step includes a step of cutting a strip-shaped metal resistor plate in a short side direction at a portion where the hole is provided to form a chip-shaped metal resistor plate, and a resistance of the chip-shaped metal resistor plate
  • a measurement process for measuring the value, and calculation using the measurement value so that a chip-shaped metal resistance plate having a desired resistance value is obtained in the short side direction of the strip-shaped metal resistance plate in the next cutting process Cutting the band-shaped metal resistor plate twice in the short side direction with the cutting width calculated in the previous calculation step, and calculating the two chip-shaped metal resistor plates
  • Each of the resistance values is measured to calculate an average value, which is calculated using the average value, so that a chip-shaped metal resistance plate having a desired resistance value is obtained.
  • the cutting width of (3) is calculated.
  • a step of forming a plurality of through grooves linearly at a predetermined interval on a metal resistor plate of a predetermined size, and a predetermined interval between the through grooves In the method for manufacturing a metal plate low resistance chip resistor of (3), a step of forming a plurality of through grooves linearly at a predetermined interval on a metal resistor plate of a predetermined size, and a predetermined interval between the through grooves.
  • the step of forming a plurality of holes arranged in a row can be performed simultaneously.
  • a plurality of through grooves and a plurality of holes can be simultaneously formed in the metal resistance plate by an etching method or a punching method using a mold, and can also be sequentially formed as different steps.
  • a resistance value fixing portion having a narrow width is provided at a predetermined position of the metal resistor plate, so that the resistance value is roughly increased, and electrode films are formed on both ends of the metal resistor plate.
  • the width of both ends is slightly adjusted to finely adjust the resistance value, and the resistance value is adjusted to a predetermined range with high accuracy, for example, It is possible to set a specific resistance value in the range of about 15 to 50 m ⁇ .
  • the resistance value fixing part of the metal resistor plate is slightly narrower than both end parts, but the resistance value fixing part is formed with a length larger than the width, and the resistance value fixing part is the same as both end parts. It has a thickness and is not provided with holes, grooves or slits unlike conventional metal plate low resistance chip resistors, so it can prevent hot spots and has high reliability. A sufficient physical strength can be secured.
  • metal plate low resistance chip resistor manufacturing method of the present invention either one of a predetermined size metal resistor plate or a strip-shaped metal resistor plate is used, and a plurality of holes are formed at predetermined intervals from these metal resistor plates.
  • a strip-shaped metal resistor plate provided with a protective film and an electrode film is manufactured as an intermediate processed product, and the strip-shaped intermediate processed product is cut in the short side direction at a position where a hole is present to form a chip-shaped resistor.
  • a metal plate low resistance chip resistor having a desired resistance value can be manufactured by appropriately adjusting the cutting width.
  • the hole provided in the metal resistance plate becomes a notch portion in the metal resistance plate of (1) above when the strip-shaped intermediate processed product is cut into a chip-shaped metal resistance plate, and the width is thereby reduced. A narrow resistance value fixing portion is formed, and the resistance value is roughly increased. And when the part without a hole of a strip-shaped intermediate processed product is cut, it becomes both ends of the metal resistance plate of the above (1), and the width of this both ends is the cutting width of the strip-shaped intermediate processed product. Therefore, in particular, the resistance value of the low resistance chip resistor of the metal plate is finely adjusted to a predetermined range by the region without the electrode film at both ends. In this way, the resistance value of the metal plate low resistance chip resistor is relatively high, for example, it can be set to a specific resistance value in the range of about 15 to 50 m ⁇ to a target resistance value with high accuracy. Become.
  • a strip-shaped metal resistor plate having a plurality of holes formed at predetermined intervals and provided with a protective film and an electrode film is manufactured as an intermediate processed product.
  • the intermediate processed product is cut in the short side direction with a predetermined cutting width (initial setting value) corresponding to one chip resistor at the position where the hole exists, and a chip-shaped metal resistor plate (chip-shaped processed product) is obtained.
  • a chip-shaped metal resistor plate chip-shaped processed product
  • the strip-shaped intermediate processed product is cut once or twice in the short side direction at the calculated cutting width and at the position where the hole is present to form a chip-shaped processed product, and the resistance value of the chip-shaped processed product is measured.
  • the cutting width for the next cutting step is calculated using the measured one resistance value or the average value of the two resistance values.
  • the chip-shaped processed product is manufactured by repeating the cutting process, the resistance value measuring process, and the cutting width calculating process in the same manner, and the metal plate low resistance chip resistor is manufactured from the chip-shaped processed product whose resistance value is within an allowable range. Is to be manufactured.
  • the resistance value of the low resistance chip resistor of the metal plate is finely adjusted to a predetermined range by the region without the electrode film at both ends.
  • the cutting width in the short side direction for the strip-shaped intermediate workpiece is always corrected according to the resistance value of one or two chip-shaped workpieces formed in the previous step.
  • the resistance value of the chip-like processed product is within an allowable range with extremely high accuracy, and the yield of the metal plate low-resistance chip resistors manufactured from the chip-like processed product is extremely high.
  • a highly accurate low resistance metal plate low resistance chip resistor can be manufactured by a relatively simple and continuous process.
  • (A) is a top view of the metal plate low resistance chip resistor of the present invention
  • (b) is a cross-sectional view taken along the line BB
  • (c) is a cross-sectional view taken along the line CC.
  • (d) is a plan view of a metal resistor plate constituting a metal plate low resistance chip resistor. It is a top view of the strip
  • (A) is a plan view of a metal resistor plate 20A of a predetermined size
  • (b) is a plan view of a strip-shaped metal resistor plate 20B.
  • FIG. 5 is a cross-sectional view of a step that follows the manufacturing step of FIG. 4. It is a figure for demonstrating the theoretical formula which calculates the cutting width of a strip
  • FIG. 1A is a top view of a metal plate low resistance chip resistor 10 of the present invention
  • FIG. 1B is a cross-sectional view taken along the line BB
  • FIG. It is sectional drawing cut
  • FIG.1 (d) is a top view of the metal resistance board 11 which comprises the metal plate low resistance chip resistor 10.
  • the metal plate low resistance chip resistor 10 has an electrode film 12 formed on both sides of a metal resistor plate 11 made of an alloy, and a protective film 13 formed between the electrode films 12 on both ends.
  • the metal resistance plate 11 is formed in a rectangular shape including a side 11a and an end 11b, with the center of both sides 11a being cut out.
  • a region 11e having a narrower width than both end portions 11d, that is, a resistance value fixing portion 11e is formed at the center by the notch portion 11c.
  • the resistance value fixing portion 11e has a length L larger than the width W.
  • the metal resistance plate 11 can be formed of, for example, an alloy containing iron, chromium and aluminum, or an alloy containing nickel and chromium.
  • the electrode film 12 is formed on the front and back surfaces and the end surface with a predetermined width from the end side 11b of the metal resistor plate 11, and a region 11f without the electrode film 12 is provided on the side close to the notch portion 11c in both end portions 11d.
  • the region 11f without the electrode film 12 at both end portions 11d functions as a resistance value adjusting unit 11f, as will be described later.
  • the electrode film 12 can be formed by stacking a Cu film, a Ni film, and a Sn film.
  • the protective film 13 includes a protective film lower layer 13a and a protective film upper layer 13b.
  • the protective film lower layer 13a is melted by pressing a resin sheet having a photosensitive group on the front and back surfaces of the metal resistor plate 11. Thereafter, the film is formed by removing from the region where the electrode film 12 is formed by means of photofabrication that covers a predetermined portion with a photomask, and exposes and develops.
  • the protective film lower layer 13a fills the cutout portion 11c of the metal resistor plate 11, and the outer shape of the metal plate low resistance chip resistor 10 is substantially rectangular as shown in FIG.
  • the protective film upper layer 13b is formed, for example, by applying an epoxy resin paste from above the protective film lower layer 13a by screen printing and curing it.
  • FIG. 2 is a top view of the strip-shaped intermediate workpiece 20 in the manufacturing process of the metal plate low resistance chip resistor 10 of the present invention.
  • a plurality of rectangular holes 21 are formed at predetermined intervals in the strip-shaped metal resistor plate 11, electrode films 12 are formed in the long-side direction on both sides of the strip-shaped metal resistor plate 11, and the long sides at the front and back center portions
  • a protective film 13 is formed in the direction.
  • the belt-shaped intermediate processed product 20 is cut at a position where the hole 21 is present in the short side direction with a predetermined cutting width W n as indicated by the alternate long and short dash line 22, and the chip-shaped processed product A n is formed, and the chip-shaped processed product An is further subjected to a few steps for commercialization, and the metal plate low resistance chip resistor 10 as a finished product is formed.
  • the strip-shaped intermediate workpiece 20 is cut at a position where the hole 21 is present, in this cutting step, the width and length of the resistance value fixing portion 11e in the metal plate low resistance chip resistor 10 of FIG.
  • the width of the resistance value adjusting unit 11f is increased or decreased depending on the cutting width W n, thereby the resistance value of the metal plate low resistance chip resistor 10 is increased or decreased by fine adjustment.
  • the cutting width W n are those as the width of the resistance value adjusting unit 11f, if broadly the cutting width W n, the resistance value can be slightly reduced, conversely, the cutting width W n If it is narrowed, the resistance value can be slightly increased.
  • the metal plate low resistance chip resistor 10 can set the width and length of the resistance value fixing portion 11e by adjusting the size and interval of the holes 21 provided in the metal resistance plate 11 in the manufacturing process. Thus, a rough increase in the resistance value of the metal plate low resistance chip resistor 10 can be achieved. As described above, in the metal plate low resistance chip resistor 10, the resistance value is roughly increased by the resistance value fixing portion 11e, and the resistance value is finely adjusted by the width of the resistance value adjusting portion 11f.
  • a plurality of through grooves 22 are formed on a metal resistor plate 20A having a predetermined size as shown in FIG. 3A by an etching method or a die punching method.
  • a plurality of rectangular holes 21 are formed between the through grooves 22 so as to be arranged in a line at a predetermined interval.
  • the metal resistor plate 20A has a rectangular planar shape.
  • the planar shape and dimensions can be selected as appropriate, and a strip-shaped metal resistor as shown in FIG. A plate 20B may be used.
  • the plurality of rectangular holes 21 are formed so as to be aligned in a line at a predetermined interval.
  • FIG. 4A to 4C are an enlarged plan view and a cross-sectional view of FIG. 3A, and the metal resistance plate 20A in which the hole 21 and the through groove 22 are formed in this way is shown in FIG.
  • the hole 21 becomes the notch portion 11c, and the region between the hole 21 and the hole 21 becomes the resistance value fixing portion 11e, Between the hole 21 and the through groove 22 are both end portions 11d.
  • the resin sheet having the photosensitive group is pressure-bonded and melted on both the front and back surfaces of the metal resistance plate 20A in which the hole 21 and the through-groove 22 are formed. Bonded to the surface of 20A.
  • the protective film lower layer 13a is formed.
  • the protective film lower layer 13a fills the hole 21 of the metal resistance plate 20A and covers the region of the resistance value adjusting portion 11f provided at a predetermined width on both sides of the hole 21.
  • an epoxy resin paste is applied from above the protective film lower layer 13a by screen printing, and dried and cured, the protective film upper layer 13b is formed as shown in FIG.
  • the electrode film 12 is formed by laminating a Cu film, a Ni film, and a Sn film on both sides of the through groove 22 in a region where the protective film lower layer 13a and the protective film upper layer 13b are not yet formed.
  • the electrode film 12 is formed on the front and back surfaces and the end face with a predetermined width from the through groove 22 of the metal resistance plate 20A, and the electrode film 12 is not provided on the side where the hole 21 is present in both end portions 11d of the metal resistance plate 20A. Is covered with the protective film lower layer 13a and the protective film upper layer 13b as described above, and the region without the electrode film 12 becomes the resistance value adjusting portion 11f.
  • a plurality of rectangular holes 21 are formed in a line at a predetermined interval, and the strip-shaped metal resistor plate 20B is formed.
  • a protective film lower layer 13a made of a resin sheet is formed in the central long side direction, the plurality of holes 21 are closed, areas on both sides of the holes 21 are covered to a predetermined width, and resistance value adjusting portions 11f are formed in areas on both sides of the holes 21. Secure. Then, after the protective film upper layer 13b is provided on the protective film lower layer 13a to form the protective film 13, the Cu film, Ni film and Sn film are laminated on the side where the protective film 13 is not formed. If the film 12 is formed, a strip-like intermediate processed product 20 similar to the above can be formed.
  • the resistance unit includes a resistance value fixing unit a and resistance value adjusting units b and b ′, and the total resistance value (R) is the resistance value (Ra) of the resistance value fixing unit a.
  • the resistance value (Rb) of the resistance value adjusting unit b and the resistance value (Rb ′) of the resistance value adjusting unit b ′ are the resistance value (Ra) of the resistance value fixing unit a.
  • ⁇ is the volume resistivity
  • t is the thickness of the metal resistance plate
  • w 2 corresponds to the cutting width W n of FIG.
  • An initial value is input to a metal plate low resistance chip resistor manufacturing apparatus (not shown).
  • the initial value include an allowable minimum value of the cutting width, an allowable maximum value of the cutting width, a frequency of resistance value measurement, a frequency of changing the cutting width, a target resistance value, and the number of times of cutting for one strip-shaped intermediate workpiece. be able to.
  • the first cutting width W 1 is obtained from the average value (W min + W max ) / 2 of the allowable minimum value W min and the allowable maximum value W max .
  • the intermediate workpiece 20 is cut with the cutting width W 1 to form a chip-like workpiece A 1 , the resistance value R 1 is measured, and the resistance value R 1 and the target resistance value R are calculated. From the deviation, the second cutting width W 2 is calculated by the theoretical formula (1).
  • the resistance value measurement frequency is 1 and the cutting width change frequency is 1, the second and subsequent chip-shaped processed products An are formed by cutting the strip-shaped intermediate processed product 20 into the cutting width.
  • the strip in the same cutting width W n The intermediate workpiece 20 is cut to form chip-like workpieces An and An + 1 .
  • the resistance values R n and R n + 1 of the chip-like processed products A n and A n + 1 are measured one by one , the average value of these resistance values R n and R n + 1 is calculated, From the deviation from the target resistance value R, the cutting width W n + 2 is calculated by the theoretical formula (1).
  • the two chip-like processed products A n + 2 and A n + 3 that are subsequently formed after the chip-like processed products An and An + 1 are cut from the strip-shaped intermediate processed product 20 with the same cutting width W n + 2. To do. The above process is repeated every time two chip-shaped workpieces are formed, and is performed up to the number of cuttings input as an initial value. Chip-like workpieces A n obtained as described above is, through some steps for commercialization, the metal plate low resistance chip resistor 10 as a finished product.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

Provided is a metal plate low resistance chip resistor which has a resistance value of about 15 to 50 mΩ, high reliability, and a lower back. Also provided is a production method that can produce the metal plate low resistance chip resistor with a high degree of accuracy and at a high yield using a relatively simple process. A metal plate low resistance chip resistor (10) includes a metal resistance plate (11), electrode films (12) formed on both ends of the metal resistance plate, and a protective film (13) formed between the electrode films. Both sides (11a) of the rectangular metal resistance plate are cut off at predetermined positions to form the shape of the metal resistance plate. On both edge sections (11d) of the metal resistance plate, the electrode films (12) are formed near one edge side and the other edge side, respectively. An area where there is no electrode film on the metal resistance plate is provided as a resistance section. In the resistance section, there is a portion both sides of which remains without being cut off, and the portion serves as a resistance value adjustment section (11f). There is a portion both sides of which are cut off, and the portion serves as a resistance value fixed section (11e). The surface of the metal resistance plate is covered with the protective film. The protective film extends over both sides of the resistance value fixed section. Therefore, the width of the protective layer is the same as that of both edge sections.

Description

金属板低抵抗チップ抵抗器及びその製造方法Metal plate low resistance chip resistor and manufacturing method thereof
　本発明は、金属板低抵抗チップ抵抗器、及びその抵抗値を比較的高く且つ高精度に実現する方法に関する。 The present invention relates to a metal plate low-resistance chip resistor and a method for realizing the resistance value relatively high and with high accuracy.
　合金からなる板状の金属抵抗体の両端に電極膜が形成された低抵抗のチップ抵抗器が従来から使用されている。このような金属板低抵抗チップ抵抗器のなかでは、比較的高めの抵抗値である１５～５０ｍΩを高精度で実現したいという要望がある。 Conventionally, low-resistance chip resistors in which electrode films are formed on both ends of a plate-shaped metal resistor made of an alloy have been used. Among such metal plate low resistance chip resistors, there is a demand for realizing a relatively high resistance value of 15 to 50 mΩ with high accuracy.
　金属板低抵抗チップ抵抗器の製造方法としては、例えば、特許文献１に記載されたように、電極としての銅板と、エッチング法または金型による打ち抜きにより形づくられた抵抗金属板とをスポット溶接法により接合し、トランスファーモールドによりパッケージする方法がある。しかしながら、抵抗金属板と、電極としての銅板とをスポット溶接することや、トランスファーモールドによりパッケージすることにより、低背化と製造コストの低減を図ることが困難になる。また、この金属板低抵抗チップ抵抗器が通電されたときには、抵抗金属板にホットスポットが発生することで信頼性が低下するという課題もある。 As a method for manufacturing a metal plate low resistance chip resistor, for example, as described in Patent Document 1, a copper plate as an electrode and a resistance metal plate formed by etching or punching with a die are spot-welded. There is a method of bonding by a package and packaging by transfer molding. However, it is difficult to reduce the height and reduce the manufacturing cost by spot welding a resistance metal plate and a copper plate as an electrode or packaging by transfer molding. Further, when the metal plate low resistance chip resistor is energized, there is a problem that reliability is lowered due to generation of hot spots on the resistance metal plate.
　上述のものとは異なる製造方法として、例えば、特許文献２には、電極部と抵抗部のベースは同一の抵抗金属板を使用し、幅が非常に狭いスリットを抵抗部に刻設して抵抗値を高くする方法が記載されている。そして、抵抗部に保護膜を塗布し、電極部は銅板をクラッド法等により接合して形成するといった方法がある。しかしながら、抵抗部に幅が非常に狭いスリットを刻設して抵抗値を高くした場合にも、チップ抵抗器に電流が通されたときに、抵抗金属板にホットスポットが発生し、信頼性が低下するという欠点があり、さらに、電極部は銅板がクラッド法により接合されるため、やはり、安価に製造することが困難になってしまう。 As a manufacturing method different from the above, for example, in Patent Document 2, the base of the electrode portion and the resistance portion uses the same resistance metal plate, and a slit having a very narrow width is formed in the resistance portion to provide resistance. A method for increasing the value is described. There is a method in which a protective film is applied to the resistance portion, and the electrode portion is formed by bonding a copper plate by a clad method or the like. However, even when a very narrow slit is formed in the resistance portion to increase the resistance value, when a current is passed through the chip resistor, a hot spot is generated in the resistance metal plate, and reliability is increased. Furthermore, since the copper plate is joined by the clad method, the electrode part is also difficult to manufacture at a low cost.
　さらに、金属板低抵抗チップ抵抗器の別の製造方法として、特許文献３に記載されたように、抵抗金属板に多種の形状の穴をあけて抵抗値を上げ、さらにその寸法を変えることにより抵抗値を調節し、電極部にはんだ濡れ性を保証するため、銅及びスズめっき膜を形成し、穴が隠れて自立性を保つことができるようにパッケージングを行うものがある。（参照）この製造方法では、抵抗値は上がるが、パッケージングを行うことにより部品の高さが高くなってしまう。現在、部品の低背化に対する要望が多く存在するが、そのような顧客の要求に対応できず、しかも、抵抗値の調節のプロセスが煩雑になってしまうという問点がある。
特許第３８４６９８７号公報 特開２００６－１９６６９号公報 特開平１１－３８０４号公報 Furthermore, as another method of manufacturing a metal plate low resistance chip resistor, as described in Patent Document 3, various resistance holes are formed in the resistance metal plate to increase the resistance value, and the dimensions are changed. In order to adjust the resistance value and ensure solder wettability on the electrode part, there is a type in which a copper and tin plating film is formed and packaging is performed so that the hole is hidden and the self-supporting property can be maintained. (Reference) In this manufacturing method, the resistance value is increased, but the height of the component is increased by packaging. Currently, there are many demands for reducing the height of parts, but there is a problem that the process of adjusting the resistance value becomes complicated because it cannot respond to such a customer's request.
Japanese Patent No. 3846987 JP 2006-19669 A Japanese Patent Laid-Open No. 11-3804
　本発明は、以上のような現状を鑑みて提案されたものであり、その目的は、１５～５０ｍΩ程度の範囲の特定の抵抗値で高い信頼性を有し、低背化された金属板低抵抗チップ抵抗器を提供することである。 The present invention has been proposed in view of the current situation as described above, and an object of the present invention is to provide a highly reliable and low-profile metal plate with a specific resistance value in the range of about 15 to 50 mΩ. It is to provide a resistor chip resistor.
　また本発明の別の目的は、比較的簡易で連続的な工程により、１５～５０ｍΩ程度の範囲の特定の抵抗値を有する金属板低抵抗チップ抵抗器を高精度、且つ高い歩留まりで製造可能にする製造方法を提供することである。 Another object of the present invention is that a metal plate low resistance chip resistor having a specific resistance value in the range of about 15 to 50 mΩ can be manufactured with high accuracy and high yield by a relatively simple and continuous process. It is to provide a manufacturing method.
　本発明では、以下に記載する（１）乃至（７）の手段により上記課題が解決される。 In the present invention, the above problems are solved by means (1) to (7) described below.
　（１）金属抵抗板と、当該金属抵抗板の両端にそれぞれ形成された電極膜と、金属抵抗板を覆うため両電極膜間に形成された保護膜とを備え、前記金属抵抗板は長方形の両側辺の所定位置が切欠かれた形状に形成され、前記金属抵抗板の両端部には、端辺側に所定幅で前記電極膜がそれぞれ形成され、前記金属抵抗板における電極膜の無い領域が抵抗部として設けられ、当該抵抗部のうち両側が切欠かれていない箇所が抵抗値調整部とされ、当該抵抗部のうち両側が切欠かれた箇所が抵抗値固定部とされ、前記保護膜は、前記金属抵抗板の表面を覆うと共に、前記抵抗値固定部の両側方を満たして両端部と同じ幅に形成されたものである金属板低抵抗チップ抵抗器。 (1) A metal resistor plate, electrode films formed on both ends of the metal resistor plate, and a protective film formed between the electrode films to cover the metal resistor plate, the metal resistor plate having a rectangular shape A predetermined position on both sides is formed in a cut-out shape, and the electrode films are formed on both ends of the metal resistor plate with a predetermined width on the end sides, respectively, and there are no electrode film regions on the metal resistor plate. Provided as a resistance part, the part where both sides of the resistance part are not cut out is a resistance value adjusting part, the part where both sides are cut out of the resistance part is a resistance value fixing part, the protective film is A metal plate low resistance chip resistor that covers the surface of the metal resistance plate and fills both sides of the resistance value fixing portion and has the same width as both ends.
　（２）前記抵抗値固定部は長さが幅よりも大きく形成されたものである前記（１）に記載の金属板低抵抗チップ抵抗器。 (2) The metal plate low resistance chip resistor according to (1), wherein the resistance value fixing portion is formed to have a length larger than a width.
　（３）所定サイズの金属抵抗板に複数の貫通溝を直線状に所定間隔で形成する工程と、貫通溝間に所定間隔で一列に並ぶ複数の穴を形成する工程と、前記貫通溝の両側の所定幅を除いた領域を保護膜で被覆して前記複数の穴を塞ぐ保護膜形成工程と、前記金属抵抗板の貫通溝から前記穴までの領域において、穴の両側に電極膜の無い領域を設けると共に、貫通溝の在る側の所定幅に電極膜を形成する電極膜形成工程と、前記保護膜形成工程及び前記電極膜形成工程の後に、前記貫通溝に沿って金属抵抗板を切断して帯状の金属抵抗板を形成する帯状切断工程と、帯状の金属抵抗板を前記穴が設けられた部分で短辺方向に切断してチップ状金属抵抗板を形成するチップ状切断工程とを備え、当該チップ状切断工程では、所望の抵抗値を備えたチップ状金属抵抗板が得られるように、帯状の金属抵抗板の切断幅が決定されることを特徴とする金属板低抵抗チップ抵抗器の製造方法。 (3) a step of linearly forming a plurality of through grooves on a metal resistor plate of a predetermined size, a step of forming a plurality of holes arranged in a line at predetermined intervals between the through grooves, and both sides of the through grooves A protective film forming step of covering the plurality of holes by covering the region excluding the predetermined width with a protective film, and a region having no electrode film on both sides of the hole in the region from the through groove to the hole of the metal resistor plate And an electrode film forming step of forming an electrode film in a predetermined width on the side where the through groove is present, and the metal resistance plate is cut along the through groove after the protective film forming step and the electrode film forming step. A strip-shaped cutting step of forming a strip-shaped metal resistor plate, and a chip-shaped cutting step of cutting the strip-shaped metal resistor plate in the short side direction at the portion where the hole is provided to form a chip-shaped metal resistor plate Equipped with the desired resistance value in the chip-shaped cutting step Tsu As looped metal resistor plate is obtained, the metal plate low resistance chip resistor manufacturing method, wherein a cutting width of the strip of metal resistor plate is determined.
　（４）帯状の金属抵抗板に所定間隔で一列に並ぶ複数の穴を形成する工程と、帯状の金属抵抗板の中央長辺方向に保護膜を形成して前記複数の穴を塞ぐ保護膜形成工程と、前記金属抵抗板の両側辺から前記穴までの領域において、穴の両側に電極膜の無い領域を設けると共に、側辺側に所定幅に電極膜を形成する電極膜形成工程と、帯状の金属抵抗板を前記穴が設けられた部分で短辺方向に切断してチップ状金属抵抗板を形成するチップ状切断工程とを備え、当該チップ状切断工程では、所望の抵抗値を備えたチップ状金属抵抗板が得られるように、帯状の金属抵抗板の切断幅が決定されることを特徴とする金属板低抵抗チップ抵抗器の製造方法。 (4) A step of forming a plurality of holes arranged in a line at predetermined intervals in the belt-shaped metal resistor plate, and a protective film formation for closing the plurality of holes by forming a protective film in the central long side direction of the belt-shaped metal resistor plate A step of forming an electrode film with a predetermined width on the side of the hole, and forming a region having no electrode film on both sides of the hole in the region from both sides of the metal resistor plate to the hole; And a chip-shaped cutting step of forming a chip-shaped metal resistance plate by cutting the metal resistance plate in the short-side direction at the portion where the hole is provided, and the chip-shaped cutting step has a desired resistance value. A method of manufacturing a metal plate low resistance chip resistor, characterized in that a cutting width of a band-shaped metal resistor plate is determined so that a chip metal resistor plate is obtained.
　（５）前記保護膜形成工程において、シート状又は帯状の有機系樹脂材料を金属抵抗板の両面に設け、圧力をかけながら溶着させることにより保護膜を形成することを特徴とする前記（３）又は前記（４）に記載の金属板低抵抗チップ抵抗器の製造方法。 (5) In the protective film forming step, the protective film is formed by providing a sheet-like or belt-like organic resin material on both surfaces of the metal resistance plate and welding them while applying pressure. Or the manufacturing method of the metal plate low resistance chip resistor as described in said (4).
　（６）前記チップ状切断工程は、帯状の金属抵抗板を前記穴が設けられた部分で短辺方向に切断してチップ状金属抵抗板を形成する工程と、当該チップ状金属抵抗板の抵抗値を測定する測定工程と、前記測定値を用いて演算し、所望の抵抗値を備えたチップ状金属抵抗板が得られるように、次の切断工程における帯状の金属抵抗板の切断幅を算出する演算工程とを含み、前の演算工程において算出した切断幅で帯状の金属抵抗板を短辺方向に切断し、これにより形成された一個のチップ状金属抵抗板の抵抗値を測定し、測定した抵抗値を用いて演算し、所望の抵抗値を備えたチップ状金属抵抗板が得られるように、次の切断工程における帯状の金属抵抗板の切断幅を算出することを特徴とする前記（３）又は前記（４）に記載の金属板低抵抗チップ抵抗器の製造方法。 (6) The chip-shaped cutting step includes a step of cutting a strip-shaped metal resistor plate in a short side direction at a portion where the hole is provided to form a chip-shaped metal resistor plate, and a resistance of the chip-shaped metal resistor plate A measurement step for measuring the value, and calculation using the measurement value to calculate the cutting width of the strip-shaped metal resistance plate in the next cutting step so that a chip-shaped metal resistance plate having a desired resistance value is obtained. Cutting the strip-shaped metal resistor plate in the short side direction with the cutting width calculated in the previous calculation step, and measuring the resistance value of one chip-shaped metal resistor plate formed thereby The cutting width of the strip-shaped metal resistor plate in the next cutting step is calculated so that a chip-shaped metal resistor plate having a desired resistance value is obtained by calculating using the resistance value ( 3) or low resistance of metal plate according to (4) Method of manufacturing a chip resistor.
　（７）前記チップ状切断工程は、帯状の金属抵抗板を前記穴が設けられた部分で短辺方向に切断してチップ状金属抵抗板を形成する工程と、当該チップ状金属抵抗板の抵抗値を測定する測定工程と、前記測定値を用いて演算し、所望の抵抗値を備えたチップ状金属抵抗板が得られるように、次の切断工程における帯状の金属抵抗板の短辺方向の切断幅を算出する演算工程とを含み、前の演算工程により算出した切断幅で帯状の金属抵抗板を短辺方向に二回切断し、これにより形成された二個のチップ状金属抵抗板の抵抗値をそれぞれ測定して平均値を算出し、前記平均値を用いて演算し、所望の抵抗値を備えたチップ状金属抵抗板が得られるように、次の切断工程における帯状の金属抵抗板の切断幅を算出することを特徴とする前記（３）又は前記（４）に記載の金属板低抵抗チップ抵抗器の製造方法。 (7) The chip-shaped cutting step includes a step of cutting a strip-shaped metal resistor plate in a short side direction at a portion where the hole is provided to form a chip-shaped metal resistor plate, and a resistance of the chip-shaped metal resistor plate A measurement process for measuring the value, and calculation using the measurement value so that a chip-shaped metal resistance plate having a desired resistance value is obtained in the short side direction of the strip-shaped metal resistance plate in the next cutting process Cutting the band-shaped metal resistor plate twice in the short side direction with the cutting width calculated in the previous calculation step, and calculating the two chip-shaped metal resistor plates Each of the resistance values is measured to calculate an average value, which is calculated using the average value, so that a chip-shaped metal resistance plate having a desired resistance value is obtained. The cutting width of (3) is calculated. Method for producing a metal plate low resistance chip resistor according to (4).
　なお、前記（３）の金属板低抵抗チップ抵抗器の製造方法では、所定サイズの金属抵抗板に複数の貫通溝を直線状に所定間隔で形成する工程と、各貫通溝間に所定間隔で一列に並ぶ複数の穴を形成する工程とは、同時に行うことも可能である。例えば、エッチング法又は金型による打ち抜き法により、複数の貫通溝と複数の穴とを金属抵抗板に同時に形成することが可能であり、また異なる工程として順次形成することも可能である。 In the method for manufacturing a metal plate low resistance chip resistor of (3), a step of forming a plurality of through grooves linearly at a predetermined interval on a metal resistor plate of a predetermined size, and a predetermined interval between the through grooves. The step of forming a plurality of holes arranged in a row can be performed simultaneously. For example, a plurality of through grooves and a plurality of holes can be simultaneously formed in the metal resistance plate by an etching method or a punching method using a mold, and can also be sequentially formed as different steps.
　本発明の金属板低抵抗チップ抵抗器では、金属抵抗板の所定位置に幅が狭い抵抗値固定部が設けられることにより抵抗値の大まかな上昇が図られ、金属抵抗板の両端部に電極膜の無い領域が設けられ、金属板低抵抗チップ抵抗器の製造時に、この両端部の幅が僅かに調整されることにより抵抗値の微調整がなされ、抵抗値を高い精度で所定の範囲、例えば、１５～５０ｍΩ程度の範囲の特定の抵抗値に設定することが可能になる。また金属抵抗板の抵抗値固定部は両端部に比べると若干幅が狭くなるが、抵抗値固定部は長さが幅よりも大きく形成されたものであり、抵抗値固定部は両端部と同じ厚さであり、従来の金属板低抵抗チップ抵抗器のように、孔、溝又はスリットが設けられるものではないため、ホットスポットの発生を防止することができて高い信頼性を有し、また物理的にも十分な強度が確保できる。 In the metal plate low resistance chip resistor of the present invention, a resistance value fixing portion having a narrow width is provided at a predetermined position of the metal resistor plate, so that the resistance value is roughly increased, and electrode films are formed on both ends of the metal resistor plate. When the metal plate low resistance chip resistor is manufactured, the width of both ends is slightly adjusted to finely adjust the resistance value, and the resistance value is adjusted to a predetermined range with high accuracy, for example, It is possible to set a specific resistance value in the range of about 15 to 50 mΩ. In addition, the resistance value fixing part of the metal resistor plate is slightly narrower than both end parts, but the resistance value fixing part is formed with a length larger than the width, and the resistance value fixing part is the same as both end parts. It has a thickness and is not provided with holes, grooves or slits unlike conventional metal plate low resistance chip resistors, so it can prevent hot spots and has high reliability. A sufficient physical strength can be secured.
　本発明の金属板低抵抗チップ抵抗器の製造方法では、所定サイズの金属抵抗板または帯状の金属抵抗板の何れか一方が使用され、これら金属抵抗板から、複数の穴が所定間隔で形成され、且つ保護膜及び電極膜が設けられた帯状の金属抵抗板が中間加工品として製造され、この帯状の中間加工品を穴の在る位置で短辺方向に切断してチップ状の抵抗器を形成するものであり、この切断幅を適宜調整することにより、所望の抵抗値を備えた金属板低抵抗チップ抵抗器を製造することができる。
　つまり、金属抵抗板に設けられた穴は、帯状の中間加工品が切断されてチップ状金属抵抗板になったときに、前記（１）の金属抵抗板における切欠き部分になり、これにより幅が狭い抵抗値固定部が形成され、抵抗値の大まかな上昇が図られる。そして、帯状の中間加工品の穴のない部分は、切断されたときに、前記（１）の金属抵抗板における両端部となり、この両端部の幅は、すなわち帯状の中間加工品の切断幅であるため、特に、両端部の電極膜の無い領域により、金属板低抵抗チップ抵抗器の抵抗値は所定範囲へと微調整される。このようにして、金属板低抵抗チップ抵抗器の抵抗値としては比較的高い、例えば、１５～５０ｍΩ程度の範囲の特定の抵抗値に、高い精度で目標の抵抗値に設定することが可能になる。 In the metal plate low resistance chip resistor manufacturing method of the present invention, either one of a predetermined size metal resistor plate or a strip-shaped metal resistor plate is used, and a plurality of holes are formed at predetermined intervals from these metal resistor plates. In addition, a strip-shaped metal resistor plate provided with a protective film and an electrode film is manufactured as an intermediate processed product, and the strip-shaped intermediate processed product is cut in the short side direction at a position where a hole is present to form a chip-shaped resistor. A metal plate low resistance chip resistor having a desired resistance value can be manufactured by appropriately adjusting the cutting width.
That is, the hole provided in the metal resistance plate becomes a notch portion in the metal resistance plate of (1) above when the strip-shaped intermediate processed product is cut into a chip-shaped metal resistance plate, and the width is thereby reduced. A narrow resistance value fixing portion is formed, and the resistance value is roughly increased. And when the part without a hole of a strip-shaped intermediate processed product is cut, it becomes both ends of the metal resistance plate of the above (1), and the width of this both ends is the cutting width of the strip-shaped intermediate processed product. Therefore, in particular, the resistance value of the low resistance chip resistor of the metal plate is finely adjusted to a predetermined range by the region without the electrode film at both ends. In this way, the resistance value of the metal plate low resistance chip resistor is relatively high, for example, it can be set to a specific resistance value in the range of about 15 to 50 mΩ to a target resistance value with high accuracy. Become.
　本発明の金属板低抵抗チップ抵抗器の製造方法では、複数の穴が所定間隔で形成され、且つ保護膜及び電極膜が設けられた帯状の金属抵抗板が中間加工品として製造され、この帯状の中間加工品を、穴の在る位置、且つ一個のチップ抵抗器に相当する所定の切断幅（初期設定値）で短辺方向に切断してチップ状金属抵抗板（チップ状加工品）を形成し、このチップ状加工品の抵抗値を測定し、この測定値を用いて演算し、所望の抵抗値を備えたチップ状加工品が得られるように、次の切断工程における帯状中間加工品の短辺方向の切断幅を算出する。
　次に、算出された切断幅、且つ穴の在る位置で帯状中間加工品を短辺方向に１回又は２回切断してチップ状加工品を形成し、チップ状加工品の抵抗値を測定し、この測定した１つの抵抗値、又は２つの抵抗値の平均値を用いて、次の切断工程のための切断幅を算出する。これ以降、切断工程、抵抗値の測定工程及び切断幅の算出工程を同様に繰り返すことによりチップ状加工品を製造し、抵抗値が許容範囲内のチップ状加工品から金属板低抵抗チップ抵抗器を製造するものである。
　したがって、金属抵抗板に設けられた穴は、切断されてチップ状金属抵抗板になったときに、両側辺の切欠き部分になり、これにより幅が狭い抵抗値固定部が形成され、抵抗値の大まかな上昇が図られる。そして、帯状の中間加工品の穴のない部分は、切断されたときに、前記（１）の金属抵抗板における両端部となり、この両端部の幅は、すなわち帯状の中間加工品の切断幅であるため、特に、両端部の電極膜の無い領域により、金属板低抵抗チップ抵抗器の抵抗値は所定範囲へと微調整される。
　つまり、本発明では帯状の中間加工品に対する短辺方向の切断幅は、常に、一つ前の工程で形成された一つ又は二つのチップ状加工品の抵抗値に応じて補正されるので、チップ状加工品の抵抗値は極めて高い精度で許容範囲内に収まり、チップ状加工品から製造される金属板低抵抗チップ抵抗器の歩留まりも極めて高いものになる。本発明では、比較的簡易で連続的な工程により、高精度な低抵抗の金属板低抵抗チップ抵抗器を製造することができる。 In the method of manufacturing a metal plate low resistance chip resistor of the present invention, a strip-shaped metal resistor plate having a plurality of holes formed at predetermined intervals and provided with a protective film and an electrode film is manufactured as an intermediate processed product. The intermediate processed product is cut in the short side direction with a predetermined cutting width (initial setting value) corresponding to one chip resistor at the position where the hole exists, and a chip-shaped metal resistor plate (chip-shaped processed product) is obtained. Form and measure the resistance value of this chip-like processed product, and calculate using this measured value, so that a chip-like processed product having a desired resistance value is obtained, and a strip-like intermediate processed product in the next cutting step The cutting width in the short side direction is calculated.
Next, the strip-shaped intermediate processed product is cut once or twice in the short side direction at the calculated cutting width and at the position where the hole is present to form a chip-shaped processed product, and the resistance value of the chip-shaped processed product is measured. Then, the cutting width for the next cutting step is calculated using the measured one resistance value or the average value of the two resistance values. Thereafter, the chip-shaped processed product is manufactured by repeating the cutting process, the resistance value measuring process, and the cutting width calculating process in the same manner, and the metal plate low resistance chip resistor is manufactured from the chip-shaped processed product whose resistance value is within an allowable range. Is to be manufactured.
Therefore, when the hole provided in the metal resistor plate is cut into a chip-shaped metal resistor plate, it becomes a notch portion on both sides, thereby forming a resistance value fixing portion with a narrow width, and a resistance value A rough rise of And when the part of the strip-shaped intermediate work product without a hole is cut, it becomes both end portions of the metal resistance plate of (1), and the width of both end portions is the cut width of the strip-shaped intermediate work product. Therefore, in particular, the resistance value of the low resistance chip resistor of the metal plate is finely adjusted to a predetermined range by the region without the electrode film at both ends.
That is, in the present invention, the cutting width in the short side direction for the strip-shaped intermediate workpiece is always corrected according to the resistance value of one or two chip-shaped workpieces formed in the previous step. The resistance value of the chip-like processed product is within an allowable range with extremely high accuracy, and the yield of the metal plate low-resistance chip resistors manufactured from the chip-like processed product is extremely high. In the present invention, a highly accurate low resistance metal plate low resistance chip resistor can be manufactured by a relatively simple and continuous process.
（ａ）は本発明の金属板低抵抗チップ抵抗器の上面図、（ｂ）はＢ－Ｂ線に沿って切断した断面図、（ｃ）はＣ－Ｃ線に沿って切断した断面図であり、（ｄ）は金属板低抵抗チップ抵抗器を構成する金属抵抗板の平面図である。(A) is a top view of the metal plate low resistance chip resistor of the present invention, (b) is a cross-sectional view taken along the line BB, (c) is a cross-sectional view taken along the line CC. And (d) is a plan view of a metal resistor plate constituting a metal plate low resistance chip resistor. 本発明の金属板低抵抗チップ抵抗器の製造過程における帯状の中間加工品の上面図である。It is a top view of the strip | belt-shaped intermediate workpiece in the manufacture process of the metal plate low resistance chip resistor of this invention. （ａ）は所定サイズの金属抵抗板２０Ａの平面図であり、（ｂ）は帯状の金属抵抗板２０Ｂの平面図である。(A) is a plan view of a metal resistor plate 20A of a predetermined size, and (b) is a plan view of a strip-shaped metal resistor plate 20B. （ａ）～（ｆ）は、本発明の金属板低抵抗チップ抵抗器の製造過程における平面図又は断面図である。(A)-(f) is the top view or sectional drawing in the manufacturing process of the metal plate low resistance chip resistor of this invention. 図４の製造過程に続く工程の断面図である。FIG. 5 is a cross-sectional view of a step that follows the manufacturing step of FIG. 4. 帯状中間加工品の切断幅を算出する理論式を説明するための図である。It is a figure for demonstrating the theoretical formula which calculates the cutting width of a strip | belt-shaped intermediate workpiece.
符号の説明Explanation of symbols
　１０　金属板低抵抗チップ抵抗器
　１１　金属抵抗板
　１１ａ　側辺
　１１ｂ　端辺
　１１ｃ　切欠部
　１１ｄ　両端部
　１１ｅ　抵抗値固定部
　１１ｆ　抵抗値調整部
　１２　電極膜
　１３　保護膜
　１３ａ　保護膜下層
　１３ｂ　保護膜上層
　２０　帯状の中間加工品
　２０Ａ　所定サイズの金属抵抗板金属抵抗板
　２０Ｂ　帯状の金属抵抗板
　２１　矩形の穴
　２２　貫通溝
　Ａn　ｎ回目の切断により形成されたチップ状加工品
　Ｒn　Ａnの抵抗値
　Ｗn　ｎ回目の切断幅 DESCRIPTION OF SYMBOLS 10 Metal plate low resistance chip resistor 11 Metal resistance board 11a Side 11b End 11c Notch part 11d Both ends 11e Resistance value fixing | fixed part 11f Resistance value adjustment part 12 Electrode film 13 Protective film 13a Protective film lower layer 13b Protective film upper layer 20 Band shape resistance W n of the intermediate workpiece 20A predetermined size of metal resistor plate metal resistor plate 20B strip metal resistor plate 21 rectangular hole 22 through grooves a n n-th chip-like workpieces formed by cutting R n a n nth cutting width
　以下、図面を参照して本発明の実施の形態について説明するが、本発明はこれに限定されるものではない。 Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto.
　図１（ａ）は本発明の金属板低抵抗チップ抵抗器１０の上面図、図１（ｂ）はＢ－Ｂ線に沿って切断した断面図であり、図１（ｃ）はＣ－Ｃ線に沿って切断した断面図であり、図１（ｄ）は金属板低抵抗チップ抵抗器１０を構成する金属抵抗板１１の平面図である。金属板低抵抗チップ抵抗器１０は、合金からなる金属抵抗板１１の両端の表裏に電極膜１２が形成され、両端の電極膜１２間に保護膜１３が形成されたものである。 FIG. 1A is a top view of a metal plate low resistance chip resistor 10 of the present invention, FIG. 1B is a cross-sectional view taken along the line BB, and FIG. It is sectional drawing cut | disconnected along the line, FIG.1 (d) is a top view of the metal resistance board 11 which comprises the metal plate low resistance chip resistor 10. FIG. The metal plate low resistance chip resistor 10 has an electrode film 12 formed on both sides of a metal resistor plate 11 made of an alloy, and a protective film 13 formed between the electrode films 12 on both ends.
　ここで、前記金属抵抗板１１は、図１（ｄ）に示したように、側辺１１ａと端辺１１ｂとからなる長方形において、両側辺１１aのほぼ中央が切欠かれた形状に形成され、この切欠部１１ｃによりほぼ中央には両端部１１ｄよりも幅が狭い領域１１ｅ、すなわち抵抗値固定部１１ｅが形成される。この抵抗値固定部１１ｅは幅Ｗよりも長さＬが大きいものとされる。なお、金属抵抗板１１は、例えば、鉄、クロム及びアルミニウムを含む合金、又はニッケル及びクロムを含む合金により形成可能である。 Here, as shown in FIG. 1 (d), the metal resistance plate 11 is formed in a rectangular shape including a side 11a and an end 11b, with the center of both sides 11a being cut out. A region 11e having a narrower width than both end portions 11d, that is, a resistance value fixing portion 11e is formed at the center by the notch portion 11c. The resistance value fixing portion 11e has a length L larger than the width W. The metal resistance plate 11 can be formed of, for example, an alloy containing iron, chromium and aluminum, or an alloy containing nickel and chromium.
　前記電極膜１２は、金属抵抗板１１の端辺１１ｂから所定幅で表裏面及び端面に形成され、両端部１１ｄにおける切欠部１１ｃに近い側に電極膜１２の無い領域１１ｆが設けられる。この両端部１１ｄの電極膜１２の無い領域１１ｆは、後述するように、抵抗値調整部１１ｆとして機能する。なお、電極膜１２としてはＣｕ膜、Ｎｉ膜及びＳｎ膜を積層して形成することが可能である。 The electrode film 12 is formed on the front and back surfaces and the end surface with a predetermined width from the end side 11b of the metal resistor plate 11, and a region 11f without the electrode film 12 is provided on the side close to the notch portion 11c in both end portions 11d. The region 11f without the electrode film 12 at both end portions 11d functions as a resistance value adjusting unit 11f, as will be described later. The electrode film 12 can be formed by stacking a Cu film, a Ni film, and a Sn film.
　前記保護膜１３は、保護膜下層１３ａと保護膜上層１３ｂとから構成され、この保護膜下層１３ａは、例えば、感光基を有する樹脂製シートを金属抵抗板１１の表裏面に圧着して溶融した後に、フォトマスクにより所定部を被覆して露光、現像するフォトファブリケーションの手段により、電極膜１２が形成される領域から除去することにより形成される。保護膜下層１３ａは金属抵抗板１１の切欠部１１ｃを満たし、図１（ａ）に示したように金属板低抵抗チップ抵抗器１０の外形をほぼ矩形とする。また保護膜上層１３ｂは、例えば、保護膜下層１３ａの上からスクリーン印刷法によりエポキシ樹脂ペーストを塗布し、これを硬化することにより形成される。 The protective film 13 includes a protective film lower layer 13a and a protective film upper layer 13b. For example, the protective film lower layer 13a is melted by pressing a resin sheet having a photosensitive group on the front and back surfaces of the metal resistor plate 11. Thereafter, the film is formed by removing from the region where the electrode film 12 is formed by means of photofabrication that covers a predetermined portion with a photomask, and exposes and develops. The protective film lower layer 13a fills the cutout portion 11c of the metal resistor plate 11, and the outer shape of the metal plate low resistance chip resistor 10 is substantially rectangular as shown in FIG. The protective film upper layer 13b is formed, for example, by applying an epoxy resin paste from above the protective film lower layer 13a by screen printing and curing it.
　図２は、本発明の金属板低抵抗チップ抵抗器１０の製造過程における帯状の中間加工品２０の上面図である。帯状の金属抵抗板１１には、所定間隔で複数の矩形の穴２１が形成されており、帯状の金属抵抗板１１の両側の長辺方向に電極膜１２が形成され、表裏中央部の長辺方向に保護膜１３が形成されている。
　本発明の製造方法では、この帯状の中間加工品２０を一点鎖線２２で示したように穴２１の在る位置で短辺方向に所定の切断幅Ｗnで切断し、チップ状の加工品Ａnを形成するものであり、チップ状の加工品Ａnに更に製品化のための僅かな工程が施され、完成品としての金属板低抵抗チップ抵抗器１０が形成される。
　このように、帯状の中間加工品２０は穴２１の在る位置で切断されるため、この切断工程では、図１の金属板低抵抗チップ抵抗器１０における抵抗値固定部１１ｅの幅や長さは変わらず、切断幅Ｗnに応じて抵抗値調整部１１ｆの幅のみが増減し、これにより金属板低抵抗チップ抵抗器１０の抵抗値が増減し微調整される。つまり、切断幅Ｗnはそのまま抵抗値調整部１１ｆの幅となるものであり、この切断幅Ｗnを広くすれば、抵抗値を僅かに低下させることができ、逆に、切断幅Ｗnを狭くすれば、抵抗値を僅かに上昇させることができる。
　一方、金属板低抵抗チップ抵抗器１０は、その製造工程において、金属抵抗板１１に設ける穴２１の大きさや間隔を調整すれば、抵抗値固定部１１ｅの幅や長さを設定することが可能であり、これにより、金属板低抵抗チップ抵抗器１０の大まかな抵抗値の上昇が図られるものである。
　以上のように、金属板低抵抗チップ抵抗器１０は、抵抗値固定部１１ｅにより大まかな抵抗値の上昇が図られ、抵抗値調整部１１ｆの幅により抵抗値の微調整が図られる。 FIG. 2 is a top view of the strip-shaped intermediate workpiece 20 in the manufacturing process of the metal plate low resistance chip resistor 10 of the present invention. A plurality of rectangular holes 21 are formed at predetermined intervals in the strip-shaped metal resistor plate 11, electrode films 12 are formed in the long-side direction on both sides of the strip-shaped metal resistor plate 11, and the long sides at the front and back center portions A protective film 13 is formed in the direction.
In the manufacturing method of the present invention, the belt-shaped intermediate processed product 20 is cut at a position where the hole 21 is present in the short side direction with a predetermined cutting width W n as indicated by the alternate long and short dash line 22, and the chip-shaped processed product A n is formed, and the chip-shaped processed product An is further subjected to a few steps for commercialization, and the metal plate low resistance chip resistor 10 as a finished product is formed.
Thus, since the strip-shaped intermediate workpiece 20 is cut at a position where the hole 21 is present, in this cutting step, the width and length of the resistance value fixing portion 11e in the metal plate low resistance chip resistor 10 of FIG. unchanged, only the width of the resistance value adjusting unit 11f is increased or decreased depending on the cutting width W n, thereby the resistance value of the metal plate low resistance chip resistor 10 is increased or decreased by fine adjustment. That is, the cutting width W n are those as the width of the resistance value adjusting unit 11f, if broadly the cutting width W n, the resistance value can be slightly reduced, conversely, the cutting width W n If it is narrowed, the resistance value can be slightly increased.
On the other hand, the metal plate low resistance chip resistor 10 can set the width and length of the resistance value fixing portion 11e by adjusting the size and interval of the holes 21 provided in the metal resistance plate 11 in the manufacturing process. Thus, a rough increase in the resistance value of the metal plate low resistance chip resistor 10 can be achieved.
As described above, in the metal plate low resistance chip resistor 10, the resistance value is roughly increased by the resistance value fixing portion 11e, and the resistance value is finely adjusted by the width of the resistance value adjusting portion 11f.
　次に、本発明の金属板低抵抗チップ抵抗器１０の製造方法について説明する。
　本発明の金属板低抵抗チップ抵抗器の製造方法では、図３（ａ）に示したような所定サイズの金属抵抗板２０Ａに、エッチング法又は金型による打ち抜き法により、複数の貫通溝２２を所定間隔で直線状に形成し、同時に、これらの貫通溝２２の間に長方形の複数の穴２１を所定間隔で一列に並ぶように形成する。なお、図３（ａ）では金属抵抗板２０Ａとして長方形の平面形状のものを示したが、この平面形状や寸法は適宜選択可能であり、図３（ｂ）に示したような帯状の金属抵抗板２０Ｂを使用しても良い。帯状の金属抵抗板２０Ｂにおいても、長方形の複数の穴２１は所定間隔で一列に並ぶように形成する。 Next, the manufacturing method of the metal plate low resistance chip resistor 10 of this invention is demonstrated.
In the method of manufacturing a metal plate low resistance chip resistor of the present invention, a plurality of through grooves 22 are formed on a metal resistor plate 20A having a predetermined size as shown in FIG. 3A by an etching method or a die punching method. At the same time, a plurality of rectangular holes 21 are formed between the through grooves 22 so as to be arranged in a line at a predetermined interval. In FIG. 3A, the metal resistor plate 20A has a rectangular planar shape. However, the planar shape and dimensions can be selected as appropriate, and a strip-shaped metal resistor as shown in FIG. A plate 20B may be used. Also in the strip-shaped metal resistance plate 20B, the plurality of rectangular holes 21 are formed so as to be aligned in a line at a predetermined interval.
　図４（ａ）～（ｃ）は、図３（ａ）を拡大した平面図及び断面図であり、このように穴２１と貫通溝２２とが形成された金属抵抗板２０Ａは、図１（ｄ）に示したような一個の金属板低抵抗チップ抵抗器１０に形成されたとき、穴２１が切欠部１１ｃになり、穴２１と穴２１の間の領域が抵抗値固定部１１ｅになり、穴２１と貫通溝２２との間が両端部１１ｄになる。このように穴２１と貫通溝２２とが形成された金属抵抗板２０Ａの表裏両面の全域に感光基を有する樹脂製シートを圧着して溶融することにより、これが穴２１に満たされ、金属抵抗板２０Ａの表面に接着される。この樹脂製シートを、フォトマスクにより所定部を被覆して露光、現像するフォトファブリケーション等の手段により、貫通溝２２の両側の所定幅、すなわち、電極膜１２が形成される領域から除去すれば、図４（ｄ）～（ｆ）に示したように、保護膜下層１３ａが形成される。この保護膜下層１３ａは金属抵抗板２０Ａの穴２１を埋めて、穴２１の両側の所定幅に設けられる抵抗値調整部１１ｆの領域を被覆する。
　さらに、保護膜下層１３ａの上からスクリーン印刷法によりエポキシ樹脂ペーストを塗布し、これを乾燥させて硬化させれば、図５（ａ）に示したように保護膜上層１３ｂが形成される。 4A to 4C are an enlarged plan view and a cross-sectional view of FIG. 3A, and the metal resistance plate 20A in which the hole 21 and the through groove 22 are formed in this way is shown in FIG. When formed in one metal plate low resistance chip resistor 10 as shown in d), the hole 21 becomes the notch portion 11c, and the region between the hole 21 and the hole 21 becomes the resistance value fixing portion 11e, Between the hole 21 and the through groove 22 are both end portions 11d. In this way, the resin sheet having the photosensitive group is pressure-bonded and melted on both the front and back surfaces of the metal resistance plate 20A in which the hole 21 and the through-groove 22 are formed. Bonded to the surface of 20A. If this resin sheet is removed from the predetermined width on both sides of the through groove 22, that is, the region where the electrode film 12 is formed, by means of photofabrication or the like that covers and exposes and develops a predetermined portion with a photomask. As shown in FIGS. 4D to 4F, the protective film lower layer 13a is formed. The protective film lower layer 13a fills the hole 21 of the metal resistance plate 20A and covers the region of the resistance value adjusting portion 11f provided at a predetermined width on both sides of the hole 21.
Furthermore, when an epoxy resin paste is applied from above the protective film lower layer 13a by screen printing, and dried and cured, the protective film upper layer 13b is formed as shown in FIG.
　次に、貫通溝２２の両側において、未だ保護膜下層１３ａ及び保護膜上層１３ｂが形成されていない領域に、Ｃｕ膜、Ｎｉ膜及びＳｎ膜を積層することにより電極膜１２を形成する。電極膜１２は、金属抵抗板２０Ａの貫通溝２２から所定幅で表裏面及び端面に形成され、金属抵抗板２０Ａの両端部１１ｄにおける穴２１のある側には電極膜１２が設けられず、ここが前述のように保護膜下層１３ａ及び保護膜上層１３ｂで覆われ、この電極膜１２の無い領域が抵抗値調整部１１ｆとなる。
　金属抵抗板２０Ａに電極膜１２を形成した後に、貫通溝２２に沿って切断すると、図２に示したような帯状の中間加工品２０が形成される。 Next, the electrode film 12 is formed by laminating a Cu film, a Ni film, and a Sn film on both sides of the through groove 22 in a region where the protective film lower layer 13a and the protective film upper layer 13b are not yet formed. The electrode film 12 is formed on the front and back surfaces and the end face with a predetermined width from the through groove 22 of the metal resistance plate 20A, and the electrode film 12 is not provided on the side where the hole 21 is present in both end portions 11d of the metal resistance plate 20A. Is covered with the protective film lower layer 13a and the protective film upper layer 13b as described above, and the region without the electrode film 12 becomes the resistance value adjusting portion 11f.
When the electrode film 12 is formed on the metal resistance plate 20A and then cut along the through groove 22, a strip-shaped intermediate processed product 20 as shown in FIG. 2 is formed.
　なお、図３（ｂ）に示したような帯状の金属抵抗板２０Ｂを使用した場合にも、長方形の複数の穴２１を所定間隔で一列に並ぶように形成し、帯状の金属抵抗板２０Ｂの中央長辺方向に樹脂製シートからなる保護膜下層１３ａを形成し、複数の穴２１を塞ぐと共に穴２１の両側の領域を所定幅まで被覆し、穴２１の両側の領域に抵抗値調整部１１ｆを確保する。そして、保護膜下層１３ａの上に保護膜上層１３ｂを設けて保護膜１３を形成した後に、保護膜１３の形成されていない側辺側に、Ｃｕ膜、Ｎｉ膜及びＳｎ膜を積層して電極膜１２を形成すれば、上述と同様の帯状の中間加工品２０を形成することができる。 Even when the strip-shaped metal resistor plate 20B as shown in FIG. 3B is used, a plurality of rectangular holes 21 are formed in a line at a predetermined interval, and the strip-shaped metal resistor plate 20B is formed. A protective film lower layer 13a made of a resin sheet is formed in the central long side direction, the plurality of holes 21 are closed, areas on both sides of the holes 21 are covered to a predetermined width, and resistance value adjusting portions 11f are formed in areas on both sides of the holes 21. Secure. Then, after the protective film upper layer 13b is provided on the protective film lower layer 13a to form the protective film 13, the Cu film, Ni film and Sn film are laminated on the side where the protective film 13 is not formed. If the film 12 is formed, a strip-like intermediate processed product 20 similar to the above can be formed.
　次に、帯状の中間加工品２０の切断幅Ｗnを算出する方法について説明する。
　図２の帯状の中間加工品２０を短辺方向に所定の切断幅Ｗnで切断し、チップ状の加工品Ａnを形成した場合、その抵抗値は、次の理論式（１）により計算することができる。
Ｒ＝Ｒａ＋Ｒｂ＋Ｒｂ’
　＝ρ×｛Ｌ1／（ｗ1ｔ）｝＋ρ×｛Ｌ2／（ｗ2ｔ）｝＋ρ×｛Ｌ2’／（ｗ2ｔ）｝
　＝ρ／ｔ×｛Ｌ1／ｗ1＋Ｌ2／ｗ2＋Ｌ2’／ｗ2｝・・・・・・・・・・・・・式（１）
　ここで、抵抗部は、図６に示したように抵抗値固定部ａと抵抗値調整部ｂかつｂ’からなり、全抵抗値（Ｒ）は、抵抗値固定部ａの抵抗値（Ｒａ）と、抵抗値調整部ｂの抵抗値（Ｒｂ）と、抵抗値調整部ｂ’の抵抗値（Ｒｂ’）との和として表わされる。
　ρは体積抵抗率、ｔは金属抵抗板の厚さ、ｗ2は図２の切断幅Ｗnに相当する。 Next, a method for calculating the cutting width W n of the strip-shaped intermediate workpiece 20 will be described.
A strip of an intermediate workpiece 20 in Figure 2 is cut with a predetermined cutting width W n in the short side direction, when forming a chip-shaped workpiece A n, the resistance value, calculated by the following theoretical formula (1) can do.
R = Ra + Rb + Rb ′
= Ρ × {L 1 / (w 1 t)} + ρ × {L 2 / (w 2 t)} + ρ × {L 2 '/ (w 2 t)}
= Ρ / t × {L 1 / w 1 + L 2 / w 2 + L 2 ′ / w 2 } ........................... (1)
Here, as shown in FIG. 6, the resistance unit includes a resistance value fixing unit a and resistance value adjusting units b and b ′, and the total resistance value (R) is the resistance value (Ra) of the resistance value fixing unit a. And the resistance value (Rb) of the resistance value adjusting unit b and the resistance value (Rb ′) of the resistance value adjusting unit b ′.
ρ is the volume resistivity, t is the thickness of the metal resistance plate, and w 2 corresponds to the cutting width W n of FIG.
　次に、帯状の中間加工品２０を切断して、チップ状の加工品Ａnを形成する工程について説明する。
　金属板低抵抗チップ抵抗器の製造装置（図示せず）に初期値を入力する。この初期値は、例えば、切断幅の許容最小値、切断幅の許容最大値、抵抗値測定の頻度、切断幅変更の頻度、目標抵抗値、及び一枚の帯状中間加工品に対する切断回数を挙げることができる。 Then, by cutting the belt-like intermediate workpiece 20, steps of forming a chip-shaped workpiece A n.
An initial value is input to a metal plate low resistance chip resistor manufacturing apparatus (not shown). Examples of the initial value include an allowable minimum value of the cutting width, an allowable maximum value of the cutting width, a frequency of resistance value measurement, a frequency of changing the cutting width, a target resistance value, and the number of times of cutting for one strip-shaped intermediate workpiece. be able to.
　初期値を入力した後、許容最小値Ｗmin、許容最大値Ｗmaxの平均値（Ｗmin＋Ｗmax）／２から、一回目の切断幅Ｗ1を求める。次に、この切断幅Ｗ1で中間加工品２０を切断してチップ状加工品Ａ1を形成し、その抵抗値Ｒ1を測定し、抵抗値Ｒ1と、目標とする抵抗値Ｒとの偏差から、理論式（１）により二回目の切断幅Ｗ2を算出する。
　初期値の入力工程において、抵抗値測定の頻度を１、切断幅変更の頻度を１とした場合、二個目以降のチップ状加工品Ａnの形成工程は、帯状中間加工品２０を切断幅Ｗnで切断し、これにより得られたチップ状加工品Ａnの抵抗値Ｒnを測定し、その抵抗値Ｒnと、目標とする抵抗値Ｒとの偏差から、ｎ＋１個目のチップ状加工品Ａn+1を形成する際の切断幅Ｗn+1を算出し、以上の工程が、一個のチップ状加工品を形成するごとに繰り返され、初期値として入力された切断回数まで実施される。 After inputting the initial value, the first cutting width W 1 is obtained from the average value (W min + W max ) / 2 of the allowable minimum value W min and the allowable maximum value W max . Next, the intermediate workpiece 20 is cut with the cutting width W 1 to form a chip-like workpiece A 1 , the resistance value R 1 is measured, and the resistance value R 1 and the target resistance value R are calculated. From the deviation, the second cutting width W 2 is calculated by the theoretical formula (1).
In the initial value input process, when the resistance value measurement frequency is 1 and the cutting width change frequency is 1, the second and subsequent chip-shaped processed products An are formed by cutting the strip-shaped intermediate processed product 20 into the cutting width. cut with W n, thereby measuring the resistance value R n of the chip-workpiece a n obtained, and the resistance value R n, the difference between the resistance value R of the target, n + 1 th chip-like The cutting width W n + 1 when forming the processed product A n + 1 is calculated, and the above steps are repeated every time one chip-shaped processed product is formed, and the number of cuttings input as the initial value is performed. Is done.
　また初期値の入力工程において、抵抗値測定の頻度を２、切断幅変更の頻度を２とした場合には、二個目以降のチップ状加工品の形成工程では、同じ切断幅Ｗnで帯状中間加工品２０を切断し、チップ状加工品Ａn，Ａn+1を形成する。これらチップ状加工品Ａn，Ａn+1の抵抗値Ｒn，Ｒn+1を一個ずつ測定し、これら抵抗値Ｒn，Ｒn+1の平均値を演算し、この平均値と、目標とする抵抗値Ｒとの偏差から、理論式（１）により切断幅Ｗn+2を算出する。そして、チップ状加工品Ａn，Ａn+1に引き続き形成する二個のチップ状加工品Ａn+2，Ａn+3は、同じ切断幅Ｗn+2で帯状中間加工品２０から切断する。以上の工程が、二個のチップ状加工品を形成するごとに繰り返され、初期値として入力された切断回数まで実施される。
　以上のようにして得られたチップ状加工品Ａnが、製品化のための若干の工程を経て、完成品としての金属板低抵抗チップ抵抗器１０となる。 In input step of the initial value, if the frequency of the resistance value measurement 2, in which the frequency of cutting width changes and 2, in two subsequent chip-like workpiece forming step, the strip in the same cutting width W n The intermediate workpiece 20 is cut to form chip-like workpieces An and An + 1 . The resistance values R n and R n + 1 of the chip-like processed products A n and A n + 1 are measured one by one , the average value of these resistance values R n and R n + 1 is calculated, From the deviation from the target resistance value R, the cutting width W n + 2 is calculated by the theoretical formula (1). Then, the two chip-like processed products A n + 2 and A n + 3 that are subsequently formed after the chip-like processed products An and An + 1 are cut from the strip-shaped intermediate processed product 20 with the same cutting width W n + 2. To do. The above process is repeated every time two chip-shaped workpieces are formed, and is performed up to the number of cuttings input as an initial value.
Chip-like workpieces A n obtained as described above is, through some steps for commercialization, the metal plate low resistance chip resistor 10 as a finished product.

Claims (7)

  1. 　金属抵抗板と、当該金属抵抗板の両端にそれぞれ形成された電極膜と、金属抵抗板を覆うため両電極膜間に形成された保護膜とを備え、
    　前記金属抵抗板は長方形の両側辺の所定位置が切欠かれた形状に形成され、
    　前記金属抵抗板の両端部には、端辺側に所定幅で前記電極膜がそれぞれ形成され、
    　前記金属抵抗板における電極膜の無い領域が抵抗部として設けられ、当該抵抗部のうち両側が切欠かれていない箇所が抵抗値調整部とされ、当該抵抗部のうち両側が切欠かれた箇所が抵抗値固定部とされ、
    　前記保護膜は、前記金属抵抗板の表面を覆うと共に、前記抵抗値固定部の両側方を満たして両端部と同じ幅に形成されたものである金属板低抵抗チップ抵抗器。     A metal resistor plate, an electrode film formed on each end of the metal resistor plate, and a protective film formed between both electrode films to cover the metal resistor plate,
    The metal resistance plate is formed in a shape in which predetermined positions on both sides of a rectangle are cut out,
    At both ends of the metal resistor plate, the electrode films are respectively formed with a predetermined width on the edge side,
    A region without an electrode film in the metal resistor plate is provided as a resistance portion, a portion where both sides are not cut out of the resistance portion is a resistance value adjusting portion, and a portion where both sides are cut out is a resistor. The value is fixed.
    The protective film covers the surface of the metal resistor plate, fills both sides of the resistance value fixing portion, and is formed to have the same width as both end portions.
  2. 　前記抵抗値固定部は長さが幅よりも大きく形成されたものである請求項１に記載の金属板低抵抗チップ抵抗器。 The metal plate low resistance chip resistor according to claim 1, wherein the resistance value fixing portion is formed to have a length larger than a width.
  3. 　所定サイズの金属抵抗板に複数の貫通溝を直線状に所定間隔で形成する工程と、貫通溝間に所定間隔で一列に並ぶ複数の穴を形成する工程と、前記貫通溝の両側の所定幅を除いた領域を保護膜で被覆して前記複数の穴を塞ぐ保護膜形成工程と、前記金属抵抗板の貫通溝から前記穴までの領域において、穴の両側に電極膜の無い領域を設けると共に貫通溝の在る側の所定幅に電極膜を形成する電極膜形成工程と、前記保護膜形成工程及び前記電極膜形成工程の後に、前記貫通溝に沿って金属抵抗板を切断して帯状の金属抵抗板を形成する帯状切断工程と、帯状の金属抵抗板を前記穴が設けられた部分で短辺方向に切断してチップ状金属抵抗板を形成するチップ状切断工程とを備え、
    　当該チップ状切断工程では、所望の抵抗値を備えたチップ状金属抵抗板が得られるように、帯状の金属抵抗板の切断幅が決定されることを特徴とする金属板低抵抗チップ抵抗器の製造方法。     A step of linearly forming a plurality of through grooves on a metal resistor plate of a predetermined size at predetermined intervals, a step of forming a plurality of holes arranged in a line at predetermined intervals between the through grooves, and a predetermined width on both sides of the through grooves In the protective film forming step of covering the plurality of holes by covering the area except for the protective film, and in the area from the through groove to the hole of the metal resistor plate, areas without electrode films are provided on both sides of the hole. After the electrode film forming step of forming an electrode film in a predetermined width on the side where the through groove is present, and the protective film forming step and the electrode film forming step, the metal resistor plate is cut along the through groove to form a belt-like shape A strip-shaped cutting step of forming a metal resistive plate, and a chip-shaped cutting step of cutting the strip-shaped metal resistive plate in the short side direction at the portion where the hole is provided to form a chip-shaped metal resistive plate,
    In the chip-shaped cutting step, the cutting width of the strip-shaped metal resistor plate is determined so that a chip-shaped metal resistor plate having a desired resistance value is obtained. Production method.
  4. 　帯状の金属抵抗板に所定間隔で一列に並ぶ複数の穴を形成する工程と、帯状の金属抵抗板の中央長辺方向に保護膜を形成して前記複数の穴を塞ぐ保護膜形成工程と、前記金属抵抗板の両側辺から前記穴までの領域において、穴の両側に電極膜の無い領域を設けると共に、側辺側に所定幅に電極膜を形成する電極膜形成工程と、帯状の金属抵抗板を前記穴が設けられた部分で短辺方向に切断してチップ状金属抵抗板を形成するチップ状切断工程とを備え、当該チップ状切断工程では、所望の抵抗値を備えたチップ状金属抵抗板が得られるように、帯状の金属抵抗板の切断幅が決定されることを特徴とする金属板低抵抗チップ抵抗器の製造方法。 A step of forming a plurality of holes arranged in a line at a predetermined interval in the strip-shaped metal resistor plate; a protective film forming step of forming a protective film in the central long side direction of the strip-shaped metal resistor plate and closing the plurality of holes; In the region from both sides of the metal resistor plate to the hole, an electrode film forming step of forming an electrode film on both sides of the hole and forming an electrode film with a predetermined width on the side side, and a strip-shaped metal resistor A chip-shaped cutting step of forming a chip-shaped metal resistor plate by cutting the plate in the short side direction at the portion provided with the hole, and in the chip-shaped cutting step, a chip-shaped metal having a desired resistance value A method of manufacturing a metal plate low resistance chip resistor, characterized in that a cutting width of a strip-shaped metal resistor plate is determined so as to obtain a resistor plate.
  5. 　前記保護膜形成工程において、シート状又は帯状の有機系樹脂材料を金属抵抗板の両面に設け、圧力をかけながら溶着させることにより保護膜を形成することを特徴とする請求項３又は請求項４に記載の金属板低抵抗チップ抵抗器の製造方法。 5. The protective film is formed by providing a sheet-like or belt-like organic resin material on both surfaces of the metal resistance plate and welding them while applying pressure in the protective film forming step. The manufacturing method of the metal plate low resistance chip resistor of description.
  6. 　前記チップ状切断工程は、帯状の金属抵抗板を前記穴が設けられた部分で短辺方向に切断してチップ状金属抵抗板を形成する工程と、当該チップ状金属抵抗板の抵抗値を測定する測定工程と、前記測定値を用いて演算し、所望の抵抗値を備えたチップ状金属抵抗板が得られるように、次の切断工程における帯状の金属抵抗板の切断幅を算出する演算工程とを含み、
    　前の演算工程において算出した切断幅で帯状の金属抵抗板を短辺方向に切断し、これにより形成された一個のチップ状金属抵抗板の抵抗値を測定し、測定した抵抗値を用いて演算し、所望の抵抗値を備えたチップ状金属抵抗板が得られるように、次の切断工程における帯状の金属抵抗板の切断幅を算出することを特徴とする請求項３又は請求項４に記載の金属板低抵抗チップ抵抗器の製造方法。     The chip-shaped cutting step includes a step of cutting a strip-shaped metal resistor plate in a short side direction at a portion where the hole is provided to form a chip-shaped metal resistor plate, and measuring a resistance value of the chip-shaped metal resistor plate And a calculation step for calculating the cutting width of the strip-shaped metal resistance plate in the next cutting step so that a chip-shaped metal resistance plate having a desired resistance value is obtained by calculation using the measurement value. Including
    Cut the strip-shaped metal resistor plate in the short side direction with the cutting width calculated in the previous calculation step, measure the resistance value of one chip-shaped metal resistor plate formed by this, and calculate using the measured resistance value 5. The cutting width of the strip-shaped metal resistor plate in the next cutting step is calculated so that a chip-shaped metal resistor plate having a desired resistance value is obtained. Metal plate low resistance chip resistor manufacturing method.
  7. 　前記チップ状切断工程は、帯状の金属抵抗板を前記穴が設けられた部分で短辺方向に切断してチップ状金属抵抗板を形成する工程と、当該チップ状金属抵抗板の抵抗値を測定する測定工程と、前記測定値を用いて演算し、所望の抵抗値を備えたチップ状金属抵抗板が得られるように、次の切断工程における帯状の金属抵抗板の短辺方向の切断幅を算出する演算工程とを含み、
    　前の演算工程により算出した切断幅で帯状の金属抵抗板を短辺方向に二回切断し、これにより形成された二個のチップ状金属抵抗板の抵抗値をそれぞれ測定して平均値を算出し、前記平均値を用いて演算し、所望の抵抗値を備えたチップ状金属抵抗板が得られるように、次の切断工程における帯状の金属抵抗板の切断幅を算出することを特徴とする請求項３又は請求項４に記載の金属板低抵抗チップ抵抗器の製造方法。     The chip-shaped cutting step includes a step of cutting a strip-shaped metal resistor plate in a short side direction at a portion where the hole is provided to form a chip-shaped metal resistor plate, and measuring a resistance value of the chip-shaped metal resistor plate And the cutting width in the short side direction of the strip-shaped metal resistor plate in the next cutting step so that a chip-shaped metal resistor plate having a desired resistance value is obtained by calculation using the measured value. A calculation step to calculate,
    Cut the strip-shaped metal resistor plate twice in the short side direction with the cutting width calculated in the previous calculation step, and measure the resistance value of the two chip-shaped metal resistor plates formed thereby to calculate the average value The cutting width of the strip-shaped metal resistor plate in the next cutting step is calculated so that a chip-shaped metal resistor plate having a desired resistance value is obtained by calculation using the average value. The manufacturing method of the metal plate low resistance chip resistor of Claim 3 or Claim 4.
PCT/JP2009/053149 2009-02-23 2009-02-23 Metal plate low resistance chip resistor, and production method for the same WO2010095256A1 (en)

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