CN102326215B - Metal plate low resistance chip resistor, and production method for the same - Google Patents
Metal plate low resistance chip resistor, and production method for the same Download PDFInfo
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- CN102326215B CN102326215B CN200980157340.2A CN200980157340A CN102326215B CN 102326215 B CN102326215 B CN 102326215B CN 200980157340 A CN200980157340 A CN 200980157340A CN 102326215 B CN102326215 B CN 102326215B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/245—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by mechanical means, e.g. sand blasting, cutting, ultrasonic treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C3/00—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/001—Mass resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
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Abstract
Provided is a metal plate low resistance chip resistor which has a resistance value of about 15 to 50 mO, high reliability, and a lower back. Also provided is a production method that can produce the metal plate low resistance chip resistor with a high degree of accuracy and at a high yield using a relatively simple process. A metal plate low resistance chip resistor (10) includes a metal resistance plate (11), electrode films (12) formed on both ends of the metal resistance plate, and a protective film (13) formed between the electrode films. Both sides (11a) of the rectangular metal resistance plate are cut off at predetermined positions to form the shape of the metal resistance plate. On both edge sections (11d) of the metal resistance plate, the electrode films (12) are formed near one edge side and the other edge side, respectively. An area where there is no electrode film on the metal resistance plate is provided as a resistance section. In the resistance section, there is a portion both sides of which remains without being cut off, and the portion serves as a resistance value adjustment section (11f). There is a portion both sides of which are cut off, and the portion serves as a resistance value fixed section (11e). The surface of the metal resistance plate is covered with the protective film. The protective film extends over both sides of the resistance value fixed section. Therefore, the width of the protective layer is the same as that of both edge sections.
Description
Technical field
The present invention relates to metal plate low resistance chip resistor and compared with highland and realize accurately the method for its resistance value.
Background technology
Always, use the low-resistance chip resistor that is formed with electrode film at the two ends of the tabular metal electric resistance body being formed by alloy.In such metal plate low resistance chip resistor, require to realize accurately 15 ~ 50m Ω of high resistance value as a comparison.
As the manufacture method of metal plate low resistance chip resistor, for example, as recorded in patent documentation 1, there is following method, be about to engage by dot welding method as the copper coin of electrode with by etching method or the resistance metallic plate that utilizes the blanking method of metal die to be shaped the method for utilizing transfer modling to encapsulate., owing to carrying out spot welding, encapsulating by transfer modling to resistance metallic plate with as the copper coin of electrode, so be difficult to seek the reduction of low thickness and manufacturing cost.In addition, also there is following problem,, when this metal plate low resistance chip resistor is energized, at resistance metallic plate, produce heat spot (hot spot), cause reliability to reduce.
As from above-mentioned different manufacture method, for example in patent documentation 2, recorded following method, the substrate of electrode part and resistance section uses same resistance metallic plate, in resistance section, carves and establishes the slit that width is very narrow and improve resistance value.And, having at resistance section coating protective film, electrode part is by the method that coated copper coin utilization (cladding) method etc. is engaged to form.; in the case of resistance section is carved and is established the slit that width is very narrow and improve resistance value; have when chip resistor is passed through to electric current; at resistance metallic plate, produce heat spot; the shortcoming that reliability reduces; and then, because electrode part is that copper coin is engaged by coated method, so be still difficult to manufacture at an easy rate.
And then, as other manufacture method of metal plate low resistance chip resistor, as recorded in patent documentation 3, there is following method, resistance value is improved in the hole of opening various shape at resistance metallic plate, and then carry out adjusting resistance value by changing its size, at electrode part, in order to guarantee scolding tin wetability, form copper and tin plated film, can hide hole and to keep the mode of independence to encapsulate.(reference) is in this manufacture method, although resistance value raising, owing to encapsulating, so the height of parts uprises.Now, there is the requirement of many low thickness to parts, but can not tackle such client's requirement, and have the numerous and diverse problem of adjustment process of resistance value.
Patent documentation 1: No. 3846987 communique of Japan Patent;
Patent documentation 2: TOHKEMY 2006-19669 communique;
Patent documentation 3: Japanese kokai publication hei 11-3804 communique.
Summary of the invention
The problem that invention will solve
The present invention proposes in view of above such present situation just, and its object is to provide metal plate low resistance chip resistor specific resistance value, that have high reliability, low thickness of a kind of 15 ~ 50m Ω left and right scope.
In addition another object of the present invention is to provide a kind of and can, by relatively more easy continuous operation, manufactures to high accuracy and high finished product rate the manufacture method of the metal plate low resistance chip resistor of the specific resistance value with 15 ~ 50m Ω left and right scope.
For solving the scheme of problem
The present invention solves above-mentioned problem by following (1) to the means of (7) of recording.
(1) metal plate low resistance chip resistor, possesses: metal electric baffle-wall, electrode film, is respectively formed at the two ends of this metal electric baffle-wall, and diaphragm, for covering metal resistance board, be formed between two electrode films, the assigned position that described metal electric baffle-wall is formed as rectangular dual-side is cut out the shape of breach, at the both ends of described metal electric baffle-wall, at end avris, with Rack, be formed with respectively described electrode film, the region that there is no electrode film in described metal electric baffle-wall arranges as resistance section, the part that both sides in this resistance section are not cut out breach is used as resistance adjustment part, the part that both sides in this resistance section are cut out breach is used as resistance value fixed part, described diaphragm covers the surface of described metal electric baffle-wall, and fill up two sides of described resistance value fixed part and be formed as the width identical with both ends.
(2), according to the metal plate low resistance chip resistor described (1) Suo Shu, wherein, it is large that described resistance value fixed part is formed as Length Ratio width.
(3) manufacture method for metal plate low resistance chip resistor, is characterized in that, possesses: the metal electric baffle-wall of given size with predetermined distance linearity form the operation of multiple through slots; Between through slot, form the operation in the multiple holes that form a line with predetermined distance; Region the Rack except both sides of described through slot is covered with diaphragm, and the diaphragm that stops up described multiple holes forms operation; The region from through slot to described hole of described metal electric baffle-wall, in the both sides in hole, the region that there is no electrode film is set, and the electrode film that the side existing at through slot forms electrode film with Rack forms operation; After described diaphragm forms operation and described electrode film formation operation, along described through slot, cut off the band shape cut-out operation that metal electric baffle-wall forms banded metal electric baffle-wall; And banded metal electric baffle-wall is cut off at short side direction in the part that is provided with described hole, the sheet that forms sheet metal resistance board is cut off operation, in this sheet, cut off in operation, to obtain the mode of the sheet metal resistance board that possesses desirable resistance value, determine the cut-out width of banded metal electric baffle-wall.
(4) manufacture method for metal plate low resistance chip resistor, is characterized in that, possesses: the operation that forms the multiple holes that form a line with predetermined distance at banded metal electric baffle-wall; Central long side direction at banded metal electric baffle-wall forms diaphragm, and the diaphragm that stops up described multiple holes forms operation; The region from dual-side to described hole of described metal electric baffle-wall, in the both sides in hole, the region that there is no electrode film is set, and the electrode film that forms electrode film with Rack in side side forms operation; And banded metal electric baffle-wall is cut off at short side direction in the part that is provided with described hole, the sheet that forms sheet metal resistance board is cut off operation, in this sheet, cut off in operation, to obtain the mode of the sheet metal resistance board that possesses desirable resistance value, determine the cut-out width of banded metal electric baffle-wall.
(5) according to the manufacture method of the metal plate low resistance chip resistor described (3) or described (4) Suo Shu; it is characterized in that; at described diaphragm, form in operation; lamellar or banded organic resin material is arranged on to the two sides of metal electric baffle-wall; exert pressure while make its welding, form thus diaphragm.
(6) according to the manufacture method of the metal plate low resistance chip resistor described (3) or described (4) Suo Shu, it is characterized in that, described sheet is cut off operation and is possessed: banded metal electric baffle-wall is cut off at short side direction in the part that is provided with described hole, form the operation of sheet metal resistance board, the operation that the resistance value of this sheet metal resistance board is measured, and use described measured value to carry out computing, to obtain the mode of the sheet metal resistance board that possesses desirable resistance value, calculate the operational process of the cut-out width of the banded metal electric baffle-wall in ensuing cut-out operation, with the cut-out width calculating in described operational process, banded metal electric baffle-wall is cut off at short side direction, resistance value to the sheet metal resistance board forming is thus measured, use the resistance value of measuring to carry out computing, to obtain the mode of the sheet metal resistance board that possesses desirable resistance value, calculate the cut-out width of the banded metal electric baffle-wall in ensuing cut-out operation.
(7) according to the manufacture method of the metal plate low resistance chip resistor described (3) or described (4) Suo Shu, it is characterized in that, described sheet is cut off operation and is comprised: banded metal electric baffle-wall is cut off at short side direction in the part that is provided with described hole, form the operation of sheet metal resistance board, the mensuration operation that the resistance value of this sheet metal resistance board is measured, and use described measured value to carry out computing, to obtain the mode of the sheet metal resistance board that possesses desirable resistance value, calculate the operational process of the cut-out width of the short side direction of the banded metal electric baffle-wall in ensuing cut-out operation, with the cut-out width calculating by described operational process, banded metal electric baffle-wall is cut off twice at short side direction, the resistance value of two sheet metal resistance boards that form is thus measured respectively and calculating mean value, use described mean value to carry out computing, to obtain the mode of the sheet metal resistance board that possesses desirable resistance value, calculate the cut-out width of the banded metal electric baffle-wall in ensuing cut-out operation.
Have again, in the manufacture method of the metal plate low resistance chip resistor of described (3), the metal electric baffle-wall of given size with predetermined distance linearity form the operation of multiple through slots, and the operation that forms the multiple holes that form a line with predetermined distance between each through slot can be carried out simultaneously.For example, by etching method or utilize the blanking method of metal die, can form multiple through slots and multiple hole at metal electric baffle-wall simultaneously, also can form successively as different operations in addition.
The effect of invention
In metal plate low resistance chip resistor of the present invention, by the resistance value fixed part of narrow width is set at the assigned position of metal electric baffle-wall, seek the rough rising of resistance value, both ends at metal electric baffle-wall arrange the region that there is no electrode film, when the manufacture of metal plate low resistance chip resistor, by the width of adjusting a little these both ends, carry out the inching of resistance value, resistance value can be set as to the scope of regulation, for example specific resistance value of the scope of 15 ~ 50m Ω left and right with high accuracy.In addition the resistance value fixed part of metal electric baffle-wall compared with both ends narrowed width a little, but it is large that resistance value fixed part is formed as Length Ratio width, resistance value fixed part and both ends are same thickness, hole, groove or slit are not set as existing metal plate low resistance chip resistor, therefore can prevent the generation of heat spot, there is high reliability, can physically guarantee in addition sufficient intensity.
In the manufacture method of metal plate low resistance chip resistor of the present invention; any of the metal electric baffle-wall of use given size or banded metal electric baffle-wall; from these metal electric baffle-wall manufactures using predetermined distance, form multiple holes and be provided with diaphragm and the banded metal electric baffle-wall of electrode film as middle processed goods; in the position that the middle processed goods of this band shape is existed in hole, at short side direction, cut off; form the resistor of sheet; by this cut-out width of suitable adjustment, can manufacture the metal plate low resistance chip resistor that possesses desirable resistance value.
That is to say, in the hole of metal electric baffle-wall setting when banded middle processed goods is cut off and becomes sheet metal resistance board, barbed portion described in becoming in the metal electric baffle-wall of (1), forms the narrow resistance value fixed part of width thus, seeks the rough rising of resistance value.And, the part that there is no hole of banded middle processed goods is when being cut off, become the both ends of the metal electric baffle-wall of described (1), the width at these both ends is the cut-out width of banded middle processed goods, therefore particularly by the region that there is no electrode film at both ends, by the resistance value of metal plate low resistance chip resistor to prescribed limit inching.Like this, as the resistance value of metal plate low resistance chip resistor, can be set as the resistance value of target, for example specific resistance value of 15 ~ 50m Ω left and right scope with high accuracy.
In the manufacture method of metal plate low resistance chip resistor of the present invention, as middle processed goods manufacture, with predetermined distance, form multiple holes, and be provided with the banded metal electric baffle-wall of diaphragm and electrode film, in the position that the middle processed goods of this band shape is existed in hole, and the cut-out width (initial set value) with the regulation suitable with chip resistor cuts off at short side direction, form sheet metal resistance board (sheet processed goods), resistance value to this sheet processed goods is measured, use this measured value to carry out computing, to obtain the mode of the sheet processed goods that possesses desirable resistance value, calculate the cut-out width of the short side direction of the middle processed goods of band shape in ensuing cut-out operation.
Then, with the cut-out width calculating and the position existing in hole, banded middle processed goods being carried out to 1 time or 2 times at short side direction cuts off, form sheet processed goods, resistance value to sheet processed goods is measured, use 1 resistance value of this mensuration or the mean value of 2 resistance values, calculate the cut-out width for ensuing cut-out operation.Afterwards, by similarly repeatedly cutting off the mensuration operation of operation, resistance value and cutting off the calculation process of width, thereby manufacturing sheet processed goods, is the sheet processed goods manufacture metal plate low resistance chip resistor in permissible range from resistance value.
Therefore, the hole arranging at metal electric baffle-wall, while becoming sheet metal resistance board being cut off, becomes the barbed portion of dual-side, forms thus the narrow resistance value fixed part of width, seeks the rough rising of resistance value.And, the part that there is no hole of banded middle processed goods is when being cut off, both ends described in becoming in the metal electric baffle-wall of (1), the width at these both ends is the cut-out width of banded middle processed goods, therefore particularly by the region that there is no electrode film at both ends, by the resistance value of metal plate low resistance chip resistor to prescribed limit inching.
That is to say, the cut-out width of the short side direction to banded middle processed goods is always corrected corresponding to the resistance value of 1 or 2 the sheet processed goods forming in the operation before 1 in the present invention, therefore the resistance value of sheet processed goods is converged in permissible range with high precision, and the rate of finished products of the metal plate low resistance chip resistor of manufacturing from sheet processed goods is extremely high.In the present invention, by simpler and easy and continuous operation, can manufacture high-precision low-resistance metal plate low resistance chip resistor.
Accompanying drawing explanation
Fig. 1 (a) is the vertical view of metal plate low resistance chip resistor of the present invention, (b) be the cutaway view cutting off along B-B line, (c) being the cutaway view cutting off along C-C line, is (d) plane graph that forms the metal electric baffle-wall of metal plate low resistance chip resistor.
Fig. 2 is the vertical view of the banded middle processed goods in the manufacture process of metal plate low resistance chip resistor of the present invention.
Fig. 3 (a) is the plane graph of the metal electric baffle-wall 20A of given size, is (b) plane graph of banded metal electric baffle-wall 20B.
Fig. 4 (a) ~ (f) is plane graph or the cutaway view in the manufacture process of metal plate low resistance chip resistor of the present invention.
Fig. 5 is the cutaway view of following the operation of the manufacturing process of Fig. 4.
Fig. 6 is the figure of the theoretical formula for the cut-out width that calculates banded middle processed goods is described.
Description of reference numerals
10 metal plate low resistance chip resistors;
11 metal electric baffle-walls;
11a side;
11b holds limit;
11c notch part;
11d both ends;
11e resistance value fixed part;
11f resistance adjustment part;
12 electrode films;
13 diaphragms;
13a diaphragm lower floor;
13b diaphragm upper strata;
The middle processed goods of 20 band shapes;
The metallic resistance sheetmetal resistance board of 20A given size;
The metal electric baffle-wall of 20B band shape;
The hole of 21 rectangles;
22 through slots;
A
nby the n time, cut off the sheet processed goods forming;
R
na
nresistance value;
W
nthe cut-out width of the n time.
Embodiment
Below, with reference to accompanying drawing, for embodiments of the present invention, describe, but the present invention is not by its restriction.
Fig. 1 (a) is the vertical view of metal plate low resistance chip resistor 10 of the present invention, Fig. 1 (b) is the cutaway view cutting off along B-B line, Fig. 1 (c) is the cutaway view cutting off along C-C line, and Fig. 1 (d) is the plane graph that forms the metal electric baffle-wall 11 of metal plate low resistance chip resistor 10.In metal plate low resistance chip resistor 10, at the surperficial back side at the two ends of the metal electric baffle-wall 11 being formed by alloy, be formed with electrode film 12, between the electrode film 12 at two ends, be formed with diaphragm 13.
Here, above-mentioned metal electric baffle-wall 11 as shown in Figure 1 (d) shows, be formed as in the rectangle being formed by side 11a and end limit 11b, the substantial middle of dual-side 11a be cut out breach shape, by this notch part 11c, in substantial middle, form the region 11e narrower than both ends 11d width, i.e. resistance value fixed part 11e.It is larger than width W that this resistance value fixed part 11e is set as length L.There is again the alloy that metal electric baffle-wall 11 for example can be by comprising iron, chromium and aluminium or comprise nickel and the alloy of chromium forms.
Described electrode film 12 forms at the surperficial back side and end face with Rack from the end 11b of metal electric baffle-wall 11, in the close notch part 11c side of both ends 11d, is provided with and there is no the region of electrode film 12 11f.The region 11f that there is no electrode film 12 of these both ends 11d as described later, brings into play function as resistance adjustment part 11f.Have again, as electrode film 12 can stacked Cu film, Ni film and Sn film form.
Described diaphragm 13 consists of the 13a of diaphragm lower floor and diaphragm upper strata 13b; the 13a of this diaphragm lower floor is for example by being crimped on the resin thin plate with photosensitive group after the surperficial back side of metal electric baffle-wall 11 carries out melting; by utilizing photomask to cover the photoetching method that specified part is exposed, developed, from the region that forms electrode film 12, be removed to form.The 13a of diaphragm lower floor fills up the notch part 11c of metal electric baffle-wall 11, as shown in Fig. 1 (a), the profile of metal plate low resistance chip resistor 10 is made to essentially rectangular.In addition diaphragm upper strata 13b for example applies epoxy paste from the top of the 13a of diaphragm lower floor by silk screen print method, and it is cured to form.
Fig. 2 is the vertical view of the banded middle processed goods 20 in the manufacture process of metal plate low resistance chip resistor 10 of the present invention.At banded metal electric baffle-wall 11, with predetermined distance, be formed with the hole 21 of multiple rectangles, at the long side direction of the both sides of banded metal electric baffle-wall 11, form electrode film 12, at the long side direction of surperficial back side central portion, be formed with diaphragm 13.
In manufacture method of the present invention, by the middle processed goods 20 of this band shape, as represented with chain-dotted line 22, the position existing in hole 21 is the cut-out width W with regulation at short side direction
ncut off, form the processed goods A of sheet
n, for the processed goods A of goods to sheet
nfurther apply the operation of a little, form as the metal plate low resistance chip resistor 10 that completes product.
Like this, the position existing in hole 21 due to banded middle processed goods 20 is cut off, so in this cut-out operation, width, the length of the resistance value fixed part 11e of the metal plate low resistance chip resistor 10 of Fig. 1 do not change, corresponding to cutting off width W
nonly increase and decrease the width of resistance adjustment part 11f, thus the resistance value of metal plate low resistance chip resistor 10 increase and decrease and by inching.That is to say, cut off width W
ndirectly become the width of resistance adjustment part 11f, if widen this cut-out width W
n, can make resistance value decline a little, on the contrary, if constriction is cut off width W
n, can make resistance value increase a little.
On the other hand, metal plate low resistance chip resistor 10 is in this manufacturing process, if be adjusted at size, the interval in the hole 21 that metal electric baffle-wall 11 arranges, width, the length of resistance value fixed part 11e can be set, the rising of the rough resistance value of metal plate low resistance chip resistor 10 can be sought thus.
As mentioned above, metal plate low resistance chip resistor 10 can be sought the rising of rough resistance value by resistance value fixed part 11e, can seek the inching of resistance value by the width of resistance adjustment part 11f.
Then, for the manufacture method of metal plate low resistance chip resistor 10 of the present invention, describe.
In the manufacture method of metal plate low resistance chip resistor of the present invention, at the metal electric baffle-wall 20A of given size such shown in Fig. 3 (a), by etching method or utilize the blanking method of metal die, with the multiple through slots 22 of formation of predetermined distance linearity, between these through slots 22, interval forms rectangular multiple hole 21 in the mode forming a line in accordance with regulations simultaneously.Have again, in Fig. 3 (a), as metal electric baffle-wall 20A, show the metal electric baffle-wall of rectangular flat shape, but this flat shape, size can select aptly, also can use banded metal electric baffle-wall 20B such shown in Fig. 3 (b).In banded metal electric baffle-wall 20B, also interval forms rectangular multiple hole 21 in the mode forming a line in accordance with regulations.
Fig. 4 (a) ~ (c) is plane graph and the cutaway view that has amplified Fig. 3 (a), when the metal electric baffle-wall 20A that has formed like this hole 21 and through slot 22 being formed as at a metal plate low resistance chip resistor 10 such shown in Fig. 1 (d), hole 21 becomes notch part 11c, region between hole 21 and hole 21 becomes resistance value fixed part 11e, between hole 21 and through slot 22, becomes both ends 11d.The whole region crimping on table back of the body two sides at the metal electric baffle-wall 20A that has formed like this hole 21 and through slot 22 has the resin thin plate of photosensitive group and carries out melting, and it fills up hole 21 thus, is adhered to the surface of metal electric baffle-wall 20A.If by this resin thin plate; by utilizing photomask to cover the methods such as the specified part photoetching that exposes, develop; from the Rack of the both sides of through slot 22, the region that forms electrode film 12, remove, as shown in Fig. 4 (d) ~ (f), form the 13a of diaphragm lower floor.The hole 21 of this 13a of diaphragm lower floor buried-metal resistance board 20A, covers the region of resistance adjustment part 11f that the Rack of the both sides in hole 21 arranges.
And then, from the top of the 13a of diaphragm lower floor, by silk screen print method, apply epoxy paste, make it dry and curing, as shown in Fig. 5 (a), form diaphragm upper strata 13b.
Then,, in the both sides of through slot 22, in the region that does not also form the 13a of diaphragm lower floor and diaphragm upper strata 13b, by stacked Cu film, Ni film and Sn film, form electrode film 12.Electrode film 12 forms at the surperficial back side and end face with Rack from the through slot 22 of metal electric baffle-wall 20A; the side existing in the hole 21 of the both ends 11d of metal electric baffle-wall 20A does not arrange electrode film 12; here with the 13a of diaphragm lower floor and diaphragm upper strata 13b, cover as described above, this does not have the region of electrode film 12 to become resistance adjustment part 11f.
After metal electric baffle-wall 20A has formed electrode film 12, when cutting off along through slot 22, form banded middle processed goods 20 as shown in Figure 2.
Have again; in the case of using banded metal electric baffle-wall 20B such shown in Fig. 3 (b); also with predetermined distance, in the mode forming a line, form rectangular multiple hole 21; central long side direction at banded metal electric baffle-wall 20B forms the 13a of diaphragm lower floor consisting of resin thin plate; stop up multiple holes 21 and the region with the both sides of Rack coverage hole 21, in the region of the both sides in hole 21, guarantee resistance adjustment part 11f.And; diaphragm upper strata 13b is set on the 13a of diaphragm lower floor and after forming diaphragm 13; if form electrode layer 12 at the stacked Cu film of the side side that does not form diaphragm 13, Ni film and Sn film, can form the middle processed goods 20 of band shape similar to the above.
Then, for the cut-out width W of calculating banded middle processed goods 20
nmethod describe.
By the banded middle processed goods 20 of Fig. 2 short side direction with regulation cut-out width W
ncut off, form the processed goods A of sheet
nsituation under, its resistance value can be calculated by theoretical formula (1) below.
Here, resistance section consists of resistance value fixed part a and resistance adjustment part b and b' as shown in Figure 6, full resistance (R) as resistance value (Ra), the resistance value (Rb) of resistance adjustment part b and the resistance value (Rb') of resistance adjustment part b' of resistance value fixed part a and represent.
ρ is equivalent to specific insulation, and t is equivalent to the thickness of metal electric baffle-wall, w
2be equivalent to the cut-out width W of Fig. 2
n.
Then,, for cutting off banded middle processed goods 20, form the processed goods A of sheet
noperation describe.
Manufacturing installation (not shown) input initial value to metal plate low resistance chip resistor.This initial value for example can be enumerated and cut off the allowable maximum of allowing minimum value, cut-out width of width, the frequency that resistance value is measured, the frequency that cuts off width change, target resistance values and the breaks to one piece of banded middle processed goods.
After input initial value, according to allowing minimum value W
min, allowable maximum W
maxmean value (W
min+ W
max)/2, ask for primary cut-out width W
1.Then, with this cut-out width W
1processed goods 20 in the middle of cutting off, forms sheet processed goods A
1, measure its resistance value R
1, according to resistance value R
1with the deviation of the resistance value R of target, by theoretical formula (1), calculate secondary cut-out width W
2.
In the input operation of initial value, at the frequency that resistance value is measured, be made as 1, the frequency that cuts off width change be made as 1, at second later sheet processed goods A
nformation operation in, to cut off width W
ncut off banded middle processed goods 20, to thus obtained sheet processed goods A
nresistance value R
nmeasure, according to its resistance value R
nwith the deviation of resistance value R that becomes target, calculate and form n+1 sheet processed goods A
n+1time cut-out width W
n+1, above operation is carried out repeatedly by forming each sheet processed goods, till implement as the breaks of initial value input.
In the input operation of this external initial value, at the frequency that resistance value is measured, be made as 2, the frequency that cuts off width change be made as 2, in the formation operation of second later sheet processed goods, with identical cut-out width W
nprocessed goods 20 in the middle of banded is cut off, form sheet processed goods A
n,, A
n+1.To these sheet processed goods A
n, A
n+1resistance value R
n, R
n+1measure singly, to these resistance values R
n, R
n+1mean value carry out computing, according to this mean value with as the deviation of the resistance value R of target, by theoretical formula (1), calculate and cut off width W
n+2.Then, follow sheet processed goods A
n, A
n+1two sheet processed goods A that form afterwards
n+2, A
n+3with identical cut-out width W
n+2from banded middle processed goods 20, be cut off.Above operation is carried out repeatedly by two sheet processed goods of every formation, till implement as the breaks of initial value input.
The sheet processed goods A obtaining in the above described manner
nthrough the some operations for goods, become as the metal plate low resistance chip resistor 10 that completes product.
Claims (6)
1. a metal plate low resistance chip resistor, profile is rectangle, possesses: metal electric baffle-wall; Electrode film, is respectively formed at the two ends of this metal electric baffle-wall; And diaphragm, for covering metal resistance board, be formed between two electrode films,
The assigned position that described metal electric baffle-wall is formed as rectangular dual-side is cut out the shape of breach,
At the both ends of described metal electric baffle-wall, at end avris, with Rack, be formed with respectively described electrode film,
The region that there is no electrode film in described metal electric baffle-wall arranges as resistance section, the part that both sides in this resistance section are not cut out breach is used as resistance adjustment part, the part that both sides in this resistance section are cut out breach is used as resistance value fixed part, this resistance value fixed part and described both ends are same thickness
It is large that described resistance value fixed part is formed as Length Ratio width,
Described diaphragm covers the surface of described metal electric baffle-wall; and fill up two sides of described resistance value fixed part and be formed as the width identical with both ends; and described diaphragm is formed by the diaphragm upper strata being cut out described in filling up in diaphragm lower floor and this diaphragm lower floor of part of breach.
2. a manufacture method for metal plate low resistance chip resistor, is characterized in that, possesses: the metal electric baffle-wall of given size with predetermined distance linearity form the operation of multiple through slots; Between through slot, form the operation in the multiple holes that form a line with predetermined distance; Region the Rack except both sides of described through slot is covered with diaphragm, and the diaphragm that stops up described multiple holes forms operation; The region from through slot to described hole of described metal electric baffle-wall, in the both sides in hole, the region that there is no electrode film is set, and the Rack of the side existing at through slot forms the electrode film formation operation of electrode film; After described diaphragm forms operation and described electrode film formation operation, along described through slot, cut off the band shape cut-out operation that metal electric baffle-wall forms banded metal electric baffle-wall; And banded metal electric baffle-wall is cut off at short side direction in the part that is provided with described hole, the sheet that forms sheet metal resistance board is cut off operation,
In this sheet, cut off in operation, to obtain the mode of the sheet metal resistance board that possesses desirable resistance value, determine the cut-out width of banded metal electric baffle-wall.
3. a manufacture method for metal plate low resistance chip resistor, is characterized in that, possesses: the operation that forms the multiple holes that form a line with predetermined distance at banded metal electric baffle-wall; Central long side direction at banded metal electric baffle-wall forms diaphragm, and the diaphragm that stops up described multiple holes forms operation; The region from dual-side to described hole of described metal electric baffle-wall, in the both sides in hole, the region that there is no electrode film is set, and the electrode film that forms electrode film with Rack in side side forms operation; And banded metal electric baffle-wall is cut off at short side direction in the part that is provided with described hole, the sheet that forms sheet metal resistance board is cut off operation, in this sheet, cut off in operation, to obtain the mode of the sheet metal resistance board that possesses desirable resistance value, determine the cut-out width of banded metal electric baffle-wall.
4. according to the manufacture method of claim 2 or metal plate low resistance chip resistor claimed in claim 3; it is characterized in that; at described diaphragm, form in operation; lamellar or banded organic resin material is arranged on to the two sides of metal electric baffle-wall; exert pressure while make its welding, form thus diaphragm.
5. according to the manufacture method of claim 2 or metal plate low resistance chip resistor claimed in claim 3, it is characterized in that, described sheet is cut off operation and is also comprised: the mensuration operation that the resistance value of this sheet metal resistance board is measured; And use the measured value of described mensuration to carry out computing, to obtain the mode of the sheet metal resistance board that possesses desirable resistance value, calculate the operational process of the cut-out width of the banded metal electric baffle-wall in ensuing cut-out operation,
With the cut-out width calculating in described operational process, banded metal electric baffle-wall is cut off at short side direction, resistance value to the sheet metal resistance board forming is thus measured, use the resistance value of measuring to carry out computing, to obtain the mode of the sheet metal resistance board that possesses desirable resistance value, calculate the cut-out width of the banded metal electric baffle-wall in ensuing cut-out operation.
6. according to the manufacture method of claim 2 or metal plate low resistance chip resistor claimed in claim 3, it is characterized in that, described sheet is cut off operation and is also comprised: the mensuration operation that the resistance value of this sheet metal resistance board is measured; And use the measured value of described mensuration to carry out computing, to obtain the mode of the sheet metal resistance board that possesses desirable resistance value, calculate the operational process of the cut-out width of the short side direction of the banded metal electric baffle-wall in ensuing cut-out operation,
With the cut-out width calculating by described operational process, banded metal electric baffle-wall is cut off twice at short side direction, the resistance value of two sheet metal resistance boards that form is thus measured respectively and calculating mean value, use described mean value to carry out computing, to obtain the mode of the sheet metal resistance board that possesses desirable resistance value, calculate the cut-out width of the banded metal electric baffle-wall in ensuing cut-out operation.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2009/053149 WO2010095256A1 (en) | 2009-02-23 | 2009-02-23 | Metal plate low resistance chip resistor, and production method for the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102326215A CN102326215A (en) | 2012-01-18 |
| CN102326215B true CN102326215B (en) | 2014-05-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200980157340.2A Active CN102326215B (en) | 2009-02-23 | 2009-02-23 | Metal plate low resistance chip resistor, and production method for the same |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101267876B1 (en) |
| CN (1) | CN102326215B (en) |
| WO (1) | WO2010095256A1 (en) |
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| JP5039867B1 (en) * | 2011-11-22 | 2012-10-03 | 株式会社シンテック | Resistor and manufacturing method of resistor |
| TWI512766B (en) * | 2013-08-08 | 2015-12-11 | I Hsing Tsai | Ultra low ohm resistor and manufacturing method thereof |
| CN106662603B (en) * | 2014-09-25 | 2019-12-13 | 三洋电机株式会社 | Current detection device and power supply device provided with shunt resistor |
| US10763017B2 (en) * | 2017-05-23 | 2020-09-01 | Panasonic Intellectual Property Management Co., Ltd. | Metal plate resistor and method for manufacturing same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3284375B2 (en) * | 1993-03-10 | 2002-05-20 | コーア株式会社 | Current detecting resistor and method of manufacturing the same |
| JP2000114009A (en) * | 1998-10-08 | 2000-04-21 | Alpha Electronics Kk | Resistor, its mounting method, and its manufacture |
| JP3508600B2 (en) * | 1999-02-12 | 2004-03-22 | 松下電器産業株式会社 | Manufacturing method of resistor |
| JP3848286B2 (en) | 2003-04-16 | 2006-11-22 | ローム株式会社 | Chip resistor |
| TWI430293B (en) * | 2006-08-10 | 2014-03-11 | Kamaya Electric Co Ltd | Production method of corner plate type chip resistor and corner plate type chip resistor |
| US20100236054A1 (en) * | 2007-08-30 | 2010-09-23 | Kamaya Electric Co., Ltd. | Method and apparatus for manufacturing metal plate chip resistors |
| JP4727638B2 (en) | 2007-09-27 | 2011-07-20 | ローム株式会社 | Method of manufacturing a chip resistor having a low resistance value |
| JP5122917B2 (en) * | 2007-11-01 | 2013-01-16 | 釜屋電機株式会社 | Metal plate low resistance chip resistor and manufacturing method thereof |
-
2009
- 2009-02-23 KR KR1020117017188A patent/KR101267876B1/en active IP Right Grant
- 2009-02-23 WO PCT/JP2009/053149 patent/WO2010095256A1/en active Application Filing
- 2009-02-23 CN CN200980157340.2A patent/CN102326215B/en active Active
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| Title |
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| JP特开2000-232009A 2000.08.22 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102326215A (en) | 2012-01-18 |
| WO2010095256A1 (en) | 2010-08-26 |
| KR101267876B1 (en) | 2013-05-28 |
| KR20110107819A (en) | 2011-10-04 |
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