CN102326215A - Metal plate low resistance chip resistor, and production method for the same - Google Patents
Metal plate low resistance chip resistor, and production method for the same Download PDFInfo
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- CN102326215A CN102326215A CN2009801573402A CN200980157340A CN102326215A CN 102326215 A CN102326215 A CN 102326215A CN 2009801573402 A CN2009801573402 A CN 2009801573402A CN 200980157340 A CN200980157340 A CN 200980157340A CN 102326215 A CN102326215 A CN 102326215A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/245—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by mechanical means, e.g. sand blasting, cutting, ultrasonic treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C3/00—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/001—Mass resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
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Abstract
Provided is a metal plate low resistance chip resistor which has a resistance value of about 15 to 50 mO, high reliability, and a lower back. Also provided is a production method that can produce the metal plate low resistance chip resistor with a high degree of accuracy and at a high yield using a relatively simple process. A metal plate low resistance chip resistor (10) includes a metal resistance plate (11), electrode films (12) formed on both ends of the metal resistance plate, and a protective film (13) formed between the electrode films. Both sides (11a) of the rectangular metal resistance plate are cut off at predetermined positions to form the shape of the metal resistance plate. On both edge sections (11d) of the metal resistance plate, the electrode films (12) are formed near one edge side and the other edge side, respectively. An area where there is no electrode film on the metal resistance plate is provided as a resistance section. In the resistance section, there is a portion both sides of which remains without being cut off, and the portion serves as a resistance value adjustment section (11f). There is a portion both sides of which are cut off, and the portion serves as a resistance value fixed section (11e). The surface of the metal resistance plate is covered with the protective film. The protective film extends over both sides of the resistance value fixed section. Therefore, the width of the protective layer is the same as that of both edge sections.
Description
Technical field
The present invention relates to metallic plate low resistance chip resistor and than the highland and realize the method for its resistance value accurately.
Background technology
Always, use the low-resistance chip resistor that is formed with electrode film at the two ends of the tabular metal electric resistance body that constitutes by alloy.In such metallic plate low resistance chip resistor, require to realize as 15 ~ 50m Ω accurately than higher resistance value.
Manufacturing approach as metallic plate low resistance chip resistor; For example as patent documentation 1 record; Following method is arranged; Be about to engage the method for utilizing transfer modling to encapsulate through dot welding method as the copper coin of electrode with through etching method or the resistance metallic plate that utilizes the blanking method of metal die to be shaped., owing to carry out spot welding, encapsulate, be difficult to seek the reduction of low thicknessization and manufacturing cost through transfer modling to resistance metallic plate with as the copper coin of electrode.In addition, also there is following problem, promptly when this metallic plate low resistance chip resistor is energized, produces heat spot (hot spot), cause reliability to reduce at resistance metallic plate.
As with above-mentioned different manufacturing approach, for example in patent documentation 2, put down in writing following method, promptly the substrate of electrode part and resistance section uses same resistance metallic plate, carves in resistance section and establishes the very narrow slit of width and improve resistance value.And, having at the resistance section coating protective film, electrode part is through (cladding) method etc. that coats engages the method that forms with the copper coin utilization.; Establish the very narrow slit of width and improve under the situation of resistance value in that resistance section is carved, to have chip resistor during through electric current, is being produced heat spot at resistance metallic plate; The shortcoming that reliability reduces; And then, because electrode part is that copper coin is engaged through the coating method, so still be difficult to make at an easy rate.
And then; As other manufacturing approach of metallic plate low resistance chip resistor, as patent documentation 3 records, following method is arranged, promptly improve resistance value in the hole that resistance metallic plate is opened multiple shape; And then regulate resistance value through changing its size; In order to guarantee the scolding tin wetability, form copper and tin plated film, in electrode part can hide the hole and to keep the mode of independence to encapsulate.(reference) is in this manufacturing approach, though the resistance value raising, owing to encapsulate, so the height of parts uprises.Now, there is the requirement of many low thicknessization to parts, but can not tackles such client's requirement, and the numerous and diverse problem of adjustment process of resistance value is arranged.
Patent documentation 1: No. 3846987 communique of Japan Patent;
Patent documentation 2: TOHKEMY 2006-19669 communique;
Patent documentation 3: japanese kokai publication hei 11-3804 communique.
Summary of the invention
The problem that invention will solve
The present invention proposes in view of the present situation of above that kind just, and its purpose is to provide metallic plate low resistance chip resistor specific resistance value, that have high reliability, low thicknessization of a kind of 15 ~ 50m Ω left and right sides scope.
Another object of the present invention is to provide a kind of and can makes to high accuracy and high finished product rate the manufacturing approach of the metallic plate low resistance chip resistor of the specific resistance value with 15 ~ 50m Ω left and right sides scope through relatively easy continuous operation in addition.
Be used to solve the scheme of problem
The present invention solves above-mentioned problem through the means of (1) to (7) of following record.
(1) a kind of metallic plate low resistance chip resistor possesses: the metal electric baffle-wall; Electrode film is respectively formed at the two ends of this metal electric baffle-wall; And diaphragm; Be formed between two electrode films in order to cover the metal electric baffle-wall; The assigned position that said metal electric baffle-wall forms rectangular dual-side is cut out the shape of breach; At the both ends of said metal electric baffle-wall, be formed with said electrode film at the end avris respectively with Rack, the zone that does not have electrode film in the said metal electric baffle-wall is provided with as resistance section; The part that both sides in this resistance section are not cut out breach is used as resistance adjustment part; The part that both sides in this resistance section are cut out breach is used as the resistance value fixed part, and said diaphragm covers the surface of said metal electric baffle-wall, and fills up two sides of said resistance value fixed part and form the width identical with both ends.
(2) according to said (1) described metallic plate low resistance chip resistor, wherein, it is bigger than width that said resistance value fixed part forms length.
(3) a kind of manufacturing approach of metallic plate low resistance chip resistor is characterized in that possessing: the operation that forms a plurality of through slots at the metal electric baffle-wall of given size with predetermined distance linearity ground; Between through slot, form the operation in a plurality of holes that form a line with predetermined distance; The zone except the Rack of both sides of said through slot is covered with diaphragm, and the diaphragm that stops up said a plurality of holes forms operation; The zone from through slot to said hole of said metal electric baffle-wall, in the both sides in hole the zone that does not have electrode film is set, and forms operation with the electrode film that Rack forms electrode film in the side that through slot exists; After said diaphragm forms operation and said electrode film formation operation, cut off the band shape cut-out operation that the metal electric baffle-wall forms banded metal electric baffle-wall along said through slot; And the metal electric baffle-wall of band shape cut off at short side direction in being provided with the part in said hole; The sheet that forms the sheet metal resistance board is cut off operation; Cut off in the operation in this sheet; With the mode of the sheet metal resistance board that obtains to possess desirable resistance value, the cut-out width of the metal electric baffle-wall that decision is banded.
(4) a kind of manufacturing approach of metallic plate low resistance chip resistor is characterized in that possessing: the operation that forms a plurality of holes that form a line with predetermined distance at the metal electric baffle-wall of band shape; Central long side direction at the metal electric baffle-wall of band shape forms diaphragm, and the diaphragm that stops up said a plurality of holes forms operation; The zone from dual-side to said hole of said metal electric baffle-wall, in the both sides in hole the zone that does not have electrode film is set, and forms operation with the electrode film that Rack forms electrode film in side; And the metal electric baffle-wall of band shape cut off at short side direction in being provided with the part in said hole; The sheet that forms the sheet metal resistance board is cut off operation; Cut off in the operation in this sheet; With the mode of the sheet metal resistance board that obtains to possess desirable resistance value, the cut-out width of the metal electric baffle-wall that decision is banded.
(5) according to the manufacturing approach of said (3) or said (4) described metallic plate low resistance chip resistor; It is characterized in that; Form in the operation at said diaphragm; Lamellar or banded organic resinous materials is arranged on the two sides of metal electric baffle-wall, makes its welding, form diaphragm thus while exert pressure.
(6) according to the manufacturing approach of said (3) or said (4) described metallic plate low resistance chip resistor; It is characterized in that; Said sheet is cut off operation and is possessed: the metal electric baffle-wall of band shape is cut off at short side direction in being provided with the part in said hole, form the operation of sheet metal resistance board; The operation that the resistance value of this sheet metal resistance board is measured; And use said measured value to carry out computing; The mode that possesses the sheet metal resistance board of desirable resistance value with acquisition; Calculate the operational process of cut-out width of the metal electric baffle-wall of the band shape in the ensuing cut-out operation; Cut off at short side direction with the cut-out width that in said operational process, calculates metal electric baffle-wall, the resistance value of a sheet metal resistance board forming is thus measured, use the resistance value of measuring to carry out computing band shape; With the mode of the sheet metal resistance board that obtains to possess desirable resistance value, calculate the cut-out width of the metal electric baffle-wall of the band shape in the ensuing cut-out operation.
(7) according to the manufacturing approach of said (3) or said (4) described metallic plate low resistance chip resistor; It is characterized in that; Said sheet is cut off operation and is comprised: the metal electric baffle-wall of band shape is cut off at short side direction in being provided with the part in said hole, form the operation of sheet metal resistance board; The mensuration operation that the resistance value of this sheet metal resistance board is measured; And use said measured value to carry out computing; The mode that possesses the sheet metal resistance board of desirable resistance value with acquisition; Calculate the operational process of cut-out width of short side direction of the metal electric baffle-wall of the band shape in the ensuing cut-out operation; With the cut-out width that calculates through said operational process the metal electric baffle-wall of band shape is cut off twice at short side direction, the resistance value of two sheet metal resistance boards forming is thus measured respectively and calculating mean value, use said mean value to carry out computing; With the mode of the sheet metal resistance board that obtains to possess desirable resistance value, calculate the cut-out width of the metal electric baffle-wall of the band shape in the ensuing cut-out operation.
Have again; In the manufacturing approach of the metallic plate low resistance chip resistor of said (3); Form the operation of a plurality of through slots at the metal electric baffle-wall of given size with predetermined distance linearity ground, and the operation that between each through slot, forms a plurality of holes that form a line with predetermined distance can be carried out simultaneously.For example, through etching method or utilize the blanking method of metal die, can form a plurality of through slots and a plurality of hole simultaneously, also can come to form successively in addition as different operations at the metal electric baffle-wall.
The effect of invention
In metallic plate low resistance chip resistor of the present invention; The resistance value fixed part of narrow width is set through the assigned position at the metal electric baffle-wall; Seek the rough rising of resistance value; Both ends at the metal electric baffle-wall are provided with the zone that does not have electrode film; When the manufacturing of metallic plate low resistance chip resistor, carry out the inching of resistance value through the width of adjusting these both ends a little, can resistance value be set at the scope of regulation, the specific resistance value of the scope about 15 ~ 50m Ω for example with high accuracy.In addition the resistance value fixed part of metal electric baffle-wall compare with both ends narrowed width a little; But it is bigger than width that the resistance value fixed part forms length; Resistance value fixed part and both ends are same thickness, as existing metallic plate low resistance chip resistor, hole, groove or slit are not set, and therefore can prevent the generation of heat spot; Have high reliability, can physically guarantee full intensity in addition.
In the manufacturing approach of metallic plate low resistance chip resistor of the present invention; Any of the metal electric baffle-wall of use given size or banded metal electric baffle-wall; From these metal electric baffle-wall manufacturings form a plurality of holes with predetermined distance and be provided with diaphragm and the metal electric baffle-wall of the band shape of electrode film as middle processed goods; The middle processed goods of this band shape is cut off at short side direction in the position that the hole exists; Form the resistor of sheet, should cut off width, can make the metallic plate low resistance chip resistor that possesses desirable resistance value through suitable adjustment.
That is to say; In the hole of metal electric baffle-wall setting when the middle processed goods of band shape is cut off and becomes the sheet metal resistance board; Become the barbed portion in the metal electric baffle-wall of said (1), form the resistance value fixed part of narrow width thus, seek the rough rising of resistance value.And; The part that does not have the hole of banded middle processed goods is when being cut off; Become the both ends of the metal electric baffle-wall of said (1); The width at these both ends promptly is the cut-out width of banded middle processed goods, so the zone that does not have electrode film through both ends particularly, with the resistance value of metallic plate low resistance chip resistor to the prescribed limit inching.Like this, as the resistance value of metallic plate low resistance chip resistor, can be set at the resistance value of target, the specific resistance value of 15 ~ 50m Ω left and right sides scope for example with high accuracy.
In the manufacturing approach of metallic plate low resistance chip resistor of the present invention; Form a plurality of holes with predetermined distance and be provided with diaphragm and the metal electric baffle-wall of the band shape of electrode film as middle processed goods manufacturing; The middle processed goods of this band shape is cut off at short side direction in the position that the hole exists and with the cut-out width (initial set value) of the regulation suitable with chip resistor; Form sheet metal resistance board (sheet processed goods); Resistance value to this sheet processed goods is measured; Use this measured value to carry out computing,, calculate the cut-out width of the short side direction of processed goods in the middle of banded in the ensuing cut-out operation with the mode of the sheet processed goods that obtains to possess desirable resistance value.
Then; With the cut-out width that calculates and the position that exists in the hole the middle processed goods of band shape being carried out 1 time or 2 times at short side direction cuts off; Form the sheet processed goods; Resistance value to the sheet processed goods is measured, and uses 1 resistance value of this mensuration or the mean value of 2 resistance values, calculates the cut-out width that is used for ensuing cut-out operation.Afterwards, through the mensuration operation of likewise cutting off operation, resistance value repeatedly and the calculation process that cuts off width, thereby making the sheet processed goods, is the sheet processed goods manufacturing metallic plate low resistance chip resistor in the permissible range from resistance value.
Therefore, the hole in that the metal electric baffle-wall is provided with when becoming the sheet metal resistance board being cut off, becomes the barbed portion of dual-side, forms the resistance value fixed part of narrow width thus, seeks the rough rising of resistance value.And; The part that does not have the hole of banded middle processed goods is when being cut off; Become the both ends in the metal electric baffle-wall of said (1); The width at these both ends promptly is the cut-out width of banded middle processed goods, so the zone that does not have electrode film through both ends particularly, with the resistance value of metallic plate low resistance chip resistor to the prescribed limit inching.
That is to say; Cut-out width to the short side direction of the middle processed goods of band shape always is corrected corresponding to the resistance value of 1 or 2 the sheet processed goods that forms in the operation before 1 in the present invention; Therefore the resistance value of sheet processed goods is converged in the permissible range with high precision, and the rate of finished products of the metallic plate low resistance chip resistor of making from the sheet processed goods is extremely high.In the present invention, through simpler and easy and continuous operation, can make high-precision low-resistance metallic plate low resistance chip resistor.
Description of drawings
Fig. 1 (a) is the vertical view of metallic plate low resistance chip resistor of the present invention; (b) be the cutaway view that cuts off along the B-B line; (c) being the cutaway view that cuts off along the C-C line, (d) is the plane graph that constitutes the metal electric baffle-wall of metallic plate low resistance chip resistor.
Fig. 2 is the vertical view of the middle processed goods of the band shape in the manufacture process of metallic plate low resistance chip resistor of the present invention.
Fig. 3 (a) is the plane graph of the metal electric baffle-wall 20A of given size, (b) is the plane graph of the metal electric baffle-wall 20B of band shape.
Fig. 4 (a) ~ (f) is plane graph or the cutaway view in the manufacture process of metallic plate low resistance chip resistor of the present invention.
Fig. 5 is the then cutaway view of the operation of the manufacturing process of Fig. 4.
Fig. 6 is the figure that is used to explain the theoretical formula of the cut-out width that calculates the middle processed goods of band shape.
Description of reference numerals
10 metallic plate low resistance chip resistors;
11 metal electric baffle-walls;
The 11a side;
11b holds the limit;
The 11c notch part;
The 11d both ends;
11e resistance value fixed part;
The 11f resistance adjustment part;
12 electrode films;
13 diaphragms;
13a diaphragm lower floor;
13b diaphragm upper strata;
The middle processed goods of 20 band shapes;
The metallic resistance sheetmetal resistance board of 20A given size;
The metal electric baffle-wall that 20B is banded;
The hole of 21 rectangles;
22 through slots;
A
nCut off the sheet processed goods that forms through the n time;
R
nA
nResistance value;
W
nThe n time cut-out width.
Embodiment
Below, describe to execution mode of the present invention with reference to accompanying drawing, but the present invention is not by its qualification.
Fig. 1 (a) is the vertical view of metallic plate low resistance chip resistor 10 of the present invention; Fig. 1 (b) is the cutaway view that cuts off along the B-B line; Fig. 1 (c) is the cutaway view that cuts off along the C-C line, and Fig. 1 (d) is the plane graph that constitutes the metal electric baffle-wall 11 of metallic plate low resistance chip resistor 10.In metallic plate low resistance chip resistor 10, be formed with electrode film 12 at the surperficial back side at the two ends of the metal electric baffle-wall 11 that constitutes by alloy, between the electrode film 12 at two ends, be formed with diaphragm 13.
Here; Above-mentioned metal electric baffle-wall 11 is shown in Fig. 1 (d); Form in the rectangle that constitutes by side 11a and end limit 11b; The substantial middle of dual-side 11a cut out breach shape, through this notch part 11c, form regional 11e, be resistance value fixed part 11e than both ends 11d narrow width in substantial middle.It is bigger than width W that this resistance value fixed part 11e is set as length L.Have again, the alloy that metal electric baffle-wall 11 for example can be through comprising iron, chromium and aluminium, or the alloy that comprises nickel and chromium form.
Said electrode film 12 forms at the surperficial back side and end face with Rack from the end 11b of metal electric baffle-wall 11, and 11d's is provided with the regional 11f that does not have electrode film 12 near notch part 11c side at both ends.The regional 11f that does not have electrode film 12 of these both ends 11d as after state, bring into play function as resistance adjustment part 11f.Have again, as electrode film 12 can range upon range of Cu film, Ni film and Sn film form.
Said diaphragm 13 is made up of 13a of diaphragm lower floor and diaphragm upper strata 13b; Carry out after the fusion at the surperficial back side that the 13a of this diaphragm lower floor for example is crimped on metal electric baffle-wall 11 through the resin sheeting that will have photosensitive group; Through utilizing photomask to cover the photoetching method that specified part is made public, developed, be removed from the zone of formation electrode film 12 and form.The 13a of diaphragm lower floor fills up the notch part 11c of metal electric baffle-wall 11, shown in Fig. 1 (a), the profile of metallic plate low resistance chip resistor 10 is made essentially rectangular.Diaphragm upper strata 13b for example applies epoxy paste from the top of the 13a of diaphragm lower floor through silk screen print method in addition, it is cured form.
Fig. 2 is the vertical view of the middle processed goods 20 of the band shape in the manufacture process of metallic plate low resistance chip resistor 10 of the present invention.Be formed with the hole 21 of a plurality of rectangles at the metal electric baffle-wall 11 of band shape with predetermined distance, the long side direction in the both sides of the metal electric baffle-wall 11 of band shape forms electrode film 12, and the long side direction of central portion is formed with diaphragm 13 at the surperficial back side.
In manufacturing approach of the present invention, as with chain-dotted line 22 expressions, 21 positions that exist are in the cut-out width W of short side direction with regulation in the hole with the middle processed goods 20 of this band shape
nCut off, form the processed goods A of sheet
n, for the processed goods A of goodsization to sheet
nFurther apply the operation of a little, form metallic plate low resistance chip resistor 10 as the article of completion.
Like this, because the position of banded middle processed goods 20 21 existence in the hole is cut off, so cut off in operation at this, width, the length of the resistance value fixed part 11e of the metallic plate low resistance chip resistor 10 of Fig. 1 do not change, corresponding to cutting off width W
nOnly increase and decrease the width of resistance adjustment part 11f, thus the resistance value of metallic plate low resistance chip resistor 10 increase and decrease and by inching.That is to say, cut off width W
nDirectly become the width of resistance adjustment part 11f, if widen this cut-out width W
n, resistance value is descended a little, on the contrary, if constriction is cut off width W
n, resistance value is risen a little.
On the other hand; Metallic plate low resistance chip resistor 10 is in this manufacturing process; If be adjusted at the size in the hole 21 that metal electric baffle-wall 11 is provided with, at interval; Width, the length of resistance value fixed part 11e can be set, the rising of the rough resistance value of metallic plate low resistance chip resistor 10 can be sought thus.
As stated, metallic plate low resistance chip resistor 10 can be sought the rising of rough resistance value through resistance value fixed part 11e, can seek the inching of resistance value through the width of resistance adjustment part 11f.
Then, the manufacturing approach to metallic plate low resistance chip resistor 10 of the present invention describes.
In the manufacturing approach of metallic plate low resistance chip resistor of the present invention; Metal electric baffle-wall 20A in given size such shown in Fig. 3 (a); Through etching method or utilize the blanking method of metal die; With a plurality of through slots 22 of the formation of predetermined distance linearity, between these through slots 22, form rectangular a plurality of hole 21 with the mode that forms a line simultaneously by predetermined distance.Have again, in Fig. 3 (a), show the metal electric baffle-wall of rectangular flat shape, but this flat shape, size can select aptly, also can use the metal electric baffle-wall 20B of band shape such shown in Fig. 3 (b) as metal electric baffle-wall 20A.In the metal electric baffle-wall 20B of band shape, also form rectangular a plurality of hole 21 with the mode that forms a line by predetermined distance.
Fig. 4 (a) ~ (c) is plane graph and the cutaway view that has amplified Fig. 3 (a); When the metal electric baffle-wall 20A that will form hole 21 and through slot 22 like this forms at such shown in Fig. 1 (d) metallic plate low resistance chip resistor 10; Hole 21 becomes notch part 11c; Zone between hole 21 and the hole 21 becomes resistance value fixed part 11e, becomes both ends 11d between hole 21 and the through slot 22.The whole regional crimping of carrying on the back the two sides at the table of the metal electric baffle-wall 20A that has formed hole 21 and through slot 22 like this has the resin sheeting of photosensitive group and carries out fusion, and it fills up hole 21 thus, is adhered to the surface of metal electric baffle-wall 20A.If with this resin sheeting; Through utilizing photomask to cover the methods such as photoetching that specified part is made public, developed; Remove in the zone that from the Rack of the both sides of through slot 22, promptly forms electrode film 12, shown in Fig. 4 (d) ~ (f), forms the diaphragm 13a of lower floor.The hole 21 that the 13a of this diaphragm lower floor buries metal electric baffle-wall 20A covers the zone of the resistance adjustment part 11f that the Rack of the both sides in hole 21 is provided with.
And then, pass through silk screen print method from the top of the 13a of diaphragm lower floor and apply epoxy paste, make its dry and curing, that kind forms diaphragm upper strata 13b shown in Fig. 5 (a).
Then, in the both sides of through slot 22,,, form electrode film 12 through range upon range of Cu film, Ni film and Sn film in the zone that does not also form 13a of diaphragm lower floor and diaphragm upper strata 13b.Electrode film 12 forms at the surperficial back side and end face with Rack from the through slot 22 of metal electric baffle-wall 20A; A side that exists in the hole 21 of the both ends 11d of metal electric baffle-wall 20A is not provided with electrode film 12; Here as above-mentioned, cover with 13a of diaphragm lower floor and diaphragm upper strata 13b, this does not have the zone of electrode film 12 to become resistance adjustment part 11f.
After metal electric baffle-wall 20A has formed electrode film 12,, form the middle processed goods 20 of the band shape of that kind shown in Figure 2 when when through slot 22 cuts off.
Have again; Under the situation of the metal electric baffle-wall 20B that uses band shape such shown in Fig. 3 (b); Also form rectangular a plurality of hole 21 with the mode that forms a line with predetermined distance; Central long side direction at the metal electric baffle-wall 20B of band shape forms the 13a of diaphragm lower floor that is made up of resin sheeting, stops up a plurality of holes 21 and with the zone of the both sides of Rack coverage hole 21, resistance adjustment part 11f is guaranteed in the zone of 21 both sides in the hole.And; Diaphragm upper strata 13b is set and after forming diaphragm 13 on the 13a of diaphragm lower floor; If form electrode layer 12, can form middle processed goods 20 with above-mentioned same band shape at the range upon range of Cu film of the side that does not form diaphragm 13, Ni film and Sn film.
Then, to the cut-out width W of calculating banded middle processed goods 20
nMethod describe.
With the middle processed goods 20 of the band shape of Fig. 2 in the cut-out width W of short side direction with regulation
nCut off, form the processed goods A of sheet
nSituation under, its resistance value can be calculated through following theoretical formula (1).
Here; Resistance section is as shown in Figure 6 to be made up of resistance value fixed part a and resistance adjustment part b and b', full resistance (R) as the resistance value (Rb') of the resistance value (Rb) of the resistance value (Ra) of resistance value fixed part a, resistance adjustment part b and resistance adjustment part b' with represent.
ρ is equivalent to specific insulation, and t is equivalent to the thickness of metal electric baffle-wall, w
2The cut-out width W that is equivalent to Fig. 2
n
Then, to cutting off banded middle processed goods 20, form the processed goods A of sheet
nOperation describe.
Manufacturing installation (not shown) input initial value to metallic plate low resistance chip resistor.This initial value for example can enumerate cut off width allow the frequency that minimum value, the allowable maximum of cutting off width, resistance value measure, the frequency that cuts off the width change, target resistance values and to one piece banded in the middle of the breaks of processed goods.
After the input initial value, according to allowing minimum value W
Min, allowable maximum W
MaxMean value (W
Min+ W
MaxPrimary cut-out width W is asked in)/2
1Then, cut off width W with this
1 Processed goods 20 in the middle of cutting off forms sheet processed goods A
1, measure its resistance value R
1, according to resistance value R
1With the deviation of the resistance value R of target, calculate secondary cut-out width W through theoretical formula (1)
2
In the input operation of initial value, be made as 1 at the frequency that resistance value is measured, will cut off frequency that width changes and be made as under 1 the situation, at second later sheet processed goods A
nThe formation operation in, to cut off width W
nCut off banded middle processed goods 20, to thus obtained sheet processed goods A
nResistance value R
nMeasure, according to its resistance value R
nWith the deviation of the resistance value R that becomes target, calculate and form n+1 sheet processed goods A
N+1The time the cut-out width W
N+1, above operation is carried out by forming each sheet processed goods repeatedly, till the breaks as the initial value input, implements.
In the input operation of this external initial value, be made as 2, will cut off frequency that width changes and be made as under 2 the situation, in the formation operation of second later sheet processed goods, with identical cut-out width W at the frequency that resistance value is measured
nProcessed goods 20 in the middle of banded is cut off, form sheet processed goods A
N,, A
N+1To these sheet processed goods A
n, A
N+1Resistance value R
n, R
N+1Measure singly, to these resistance values R
n, R
N+1Mean value carry out computing, according to this mean value with as the deviation of the resistance value R of target, calculate through theoretical formula (1) and to cut off width W
N+2Then, follow sheet processed goods A
n, A
N+1Two sheet processed goods A that form afterwards
N+2, A
N+3With identical cut-out width W
N+2Be cut off from banded middle processed goods 20.Above operation is carried out by two sheet processed goods of every formation repeatedly, till the breaks as the initial value input, implements.
The sheet processed goods A that obtains in the above described manner
nThrough being used for some operations of goodsization, become metallic plate low resistance chip resistor 10 as the article of completion.
Claims (7)
1. a metallic plate low resistance chip resistor possesses: the metal electric baffle-wall; Electrode film is respectively formed at the two ends of this metal electric baffle-wall; And diaphragm, be formed between two electrode films in order to cover the metal electric baffle-wall,
The assigned position that said metal electric baffle-wall forms rectangular dual-side is cut out the shape of breach,
At the both ends of said metal electric baffle-wall, be formed with said electrode film at the end avris respectively with Rack,
The zone that does not have electrode film in the said metal electric baffle-wall is provided with as resistance section, and the part that the both sides in this resistance section are not cut out breach is used as resistance adjustment part, and the part that the both sides in this resistance section are cut out breach is used as the resistance value fixed part,
Said diaphragm covers the surface of said metal electric baffle-wall, and fills up two sides of said resistance value fixed part and form the width identical with both ends.
2. metallic plate low resistance chip resistor according to claim 1, wherein, it is bigger than width that said resistance value fixed part forms length.
3. the manufacturing approach of a metallic plate low resistance chip resistor is characterized in that possessing: the operation that forms a plurality of through slots at the metal electric baffle-wall of given size with predetermined distance linearity ground; Between through slot, form the operation in a plurality of holes that form a line with predetermined distance; The zone except the Rack of both sides of said through slot is covered with diaphragm, and the diaphragm that stops up said a plurality of holes forms operation; The zone from through slot to said hole of said metal electric baffle-wall, the zone that does not have electrode film is set in the both sides in hole, and the electrode film that the Rack of a side that exists at through slot forms electrode film forms operation; After said diaphragm forms operation and said electrode film formation operation, cut off the band shape cut-out operation that the metal electric baffle-wall forms banded metal electric baffle-wall along said through slot; And the metal electric baffle-wall of band shape cut off at short side direction in being provided with the part in said hole, the sheet that forms the sheet metal resistance board is cut off operation,
Cut off in operation in this sheet, with the mode of the sheet metal resistance board that obtains to possess desirable resistance value, the cut-out width of the metal electric baffle-wall that decision is banded.
4. the manufacturing approach of a metallic plate low resistance chip resistor is characterized in that possessing: the operation that forms a plurality of holes that form a line with predetermined distance at the metal electric baffle-wall of band shape; Central long side direction at the metal electric baffle-wall of band shape forms diaphragm, and the diaphragm that stops up said a plurality of holes forms operation; The zone from dual-side to said hole of said metal electric baffle-wall, in the both sides in hole the zone that does not have electrode film is set, and forms operation with the electrode film that Rack forms electrode film in side; And the metal electric baffle-wall of band shape cut off at short side direction in being provided with the part in said hole; The sheet that forms the sheet metal resistance board is cut off operation; Cut off in the operation in this sheet; With the mode of the sheet metal resistance board that obtains to possess desirable resistance value, the cut-out width of the metal electric baffle-wall that decision is banded.
5. according to the manufacturing approach of claim 3 or the described metallic plate low resistance of claim 4 chip resistor; It is characterized in that; Form in the operation at said diaphragm; Lamellar or banded organic resinous materials is arranged on the two sides of metal electric baffle-wall, makes its welding, form diaphragm thus while exert pressure.
6. according to the manufacturing approach of claim 3 or the described metallic plate low resistance of claim 4 chip resistor; It is characterized in that; Said sheet is cut off operation and is possessed: the metal electric baffle-wall of band shape is cut off at short side direction in being provided with the part in said hole, form the operation of sheet metal resistance board; The mensuration operation that the resistance value of this sheet metal resistance board is measured; And use said measured value to carry out computing, with the mode of the sheet metal resistance board that obtains to possess desirable resistance value, calculate the operational process of cut-out width of the metal electric baffle-wall of the band shape in the ensuing cut-out operation,
Cut off at short side direction with the cut-out width that in said operational process, calculates metal electric baffle-wall band shape; Resistance value to a sheet metal resistance board forming is thus measured; Use the resistance value of measuring to carry out computing; With the mode of the sheet metal resistance board that obtains to possess desirable resistance value, calculate the cut-out width of the metal electric baffle-wall of the band shape in the ensuing cut-out operation.
7. according to the manufacturing approach of claim 3 or the described metallic plate low resistance of claim 4 chip resistor; It is characterized in that; Said sheet is cut off operation and is comprised: the metal electric baffle-wall of band shape is cut off at short side direction in being provided with the part in said hole, form the operation of sheet metal resistance board; The mensuration operation that the resistance value of this sheet metal resistance board is measured; And use said measured value to carry out computing, with the mode of the sheet metal resistance board that obtains to possess desirable resistance value, calculate the operational process of cut-out width of short side direction of the metal electric baffle-wall of the band shape in the ensuing cut-out operation,
Cut off twice at short side direction with the cut-out width that calculates through said operational process metal electric baffle-wall band shape; Resistance value to two sheet metal resistance boards forming is thus measured respectively and calculating mean value; Use said mean value to carry out computing; With the mode of the sheet metal resistance board that obtains to possess desirable resistance value, calculate the cut-out width of the metal electric baffle-wall of the band shape in the ensuing cut-out operation.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2009/053149 WO2010095256A1 (en) | 2009-02-23 | 2009-02-23 | Metal plate low resistance chip resistor, and production method for the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102326215A true CN102326215A (en) | 2012-01-18 |
| CN102326215B CN102326215B (en) | 2014-05-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200980157340.2A Active CN102326215B (en) | 2009-02-23 | 2009-02-23 | Metal plate low resistance chip resistor, and production method for the same |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101267876B1 (en) |
| CN (1) | CN102326215B (en) |
| WO (1) | WO2010095256A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104347201A (en) * | 2013-08-08 | 2015-02-11 | 蔡宜兴 | ultra-low resistance resistor and manufacturing method thereof |
| CN106662603A (en) * | 2014-09-25 | 2017-05-10 | 三洋电机株式会社 | Electrical current detection device equipped with shunt resistor, and power supply device |
| CN110520942A (en) * | 2017-05-23 | 2019-11-29 | 松下知识产权经营株式会社 | Metal plate resistance device and its manufacturing method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013076817A1 (en) * | 2011-11-22 | 2013-05-30 | 株式会社シンテック | Resistor and resistor manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4264463B2 (en) * | 2007-08-30 | 2009-05-20 | 釜屋電機株式会社 | Manufacturing method and manufacturing apparatus for metal plate chip resistor |
| JP5122917B2 (en) * | 2007-11-01 | 2013-01-16 | 釜屋電機株式会社 | Metal plate low resistance chip resistor and manufacturing method thereof |
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2009
- 2009-02-23 WO PCT/JP2009/053149 patent/WO2010095256A1/en active Application Filing
- 2009-02-23 KR KR1020117017188A patent/KR101267876B1/en active IP Right Grant
- 2009-02-23 CN CN200980157340.2A patent/CN102326215B/en active Active
Patent Citations (6)
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| JPH06267707A (en) * | 1993-03-10 | 1994-09-22 | Koa Corp | Current detecting resistor and manufacture thereof |
| JP2000114009A (en) * | 1998-10-08 | 2000-04-21 | Alpha Electronics Kk | Resistor, its mounting method, and its manufacture |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104347201A (en) * | 2013-08-08 | 2015-02-11 | 蔡宜兴 | ultra-low resistance resistor and manufacturing method thereof |
| CN104347201B (en) * | 2013-08-08 | 2017-05-10 | 蔡宜兴 | ultra-low resistance resistor and manufacturing method thereof |
| CN106662603A (en) * | 2014-09-25 | 2017-05-10 | 三洋电机株式会社 | Electrical current detection device equipped with shunt resistor, and power supply device |
| CN106662603B (en) * | 2014-09-25 | 2019-12-13 | 三洋电机株式会社 | Current detection device and power supply device provided with shunt resistor |
| CN110520942A (en) * | 2017-05-23 | 2019-11-29 | 松下知识产权经营株式会社 | Metal plate resistance device and its manufacturing method |
| CN110520942B (en) * | 2017-05-23 | 2021-08-10 | 松下知识产权经营株式会社 | Metal plate resistor and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20110107819A (en) | 2011-10-04 |
| CN102326215B (en) | 2014-05-07 |
| KR101267876B1 (en) | 2013-05-28 |
| WO2010095256A1 (en) | 2010-08-26 |
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