KR20110107819A - Metal plate low resistance chip resistor, and production method for the same - Google Patents

Abstract

A manufacturing method which enables a high precision and high yield to be produced by a relatively simple process of a metal plate low resistance chip resistor having a high resistance, having a high resistance value of about 15 to 50 mΩ, and a metal plate low resistance chip resistor. To provide.
The metal plate low resistance chip resistor 10 of the present invention includes a metal resistor plate 11, an electrode film 12 formed at both ends of the metal resistor plate, and a protective film 13 formed between both electrode films. The resistance plate is formed in a shape in which predetermined positions of both sides 11a of the rectangle are cut out, and electrode films 12 are formed at both ends 11d of the metal resistance plate at the short sides, respectively, and the electrodes in the metal resistance plate. A region without a film is provided as a resistance portion, and a portion where both sides of the resistance portion are not cut off becomes the resistance value adjusting portion 11f, and a portion where both sides of the resistance portion are cut off becomes the resistance value fixing portion 11e, and the protective film Silver covers the surface of the metal resistance plate, and fills both sides of the resistance value fixing part to have the same width as both ends.

Description

Metal Plate Low Resistance Chip Resistor and Method for Manufacturing the Same {METAL PLATE LOW RESISTANCE CHIP RESISTOR, AND PRODUCTION METHOD FOR THE SAME}

The present invention relates to a metal plate low resistance chip resistor and a method of realizing the resistance value thereof relatively high and with high accuracy.

Low resistance chip resistors in which electrode films are formed on both ends of a plate-shaped metal resistor made of an alloy have been conventionally used. Among such metal plate low resistance chip resistors, there is a desire to realize a high accuracy of 15 to 50 mΩ, which is a relatively high resistance value.

As a manufacturing method of a metal plate low resistance chip resistor, for example, as described in patent document 1, the copper plate as an electrode and the resistance metal plate formed by the etching method or the punching process by a metal mold | die are joined by the spot welding method, and a transfer mold is carried out. There is a way to package it. However, spot welding of the resistance metal plate and the copper plate as an electrode, or packaging by a transfer mold makes it difficult to achieve low magnification and a reduction in manufacturing cost. Moreover, when this metal plate low resistance chip resistor is energized, there also exists a subject that reliability falls by hot spot generate | occur | producing in a resistance metal plate.

As a manufacturing method different from the above, for example, Patent Document 2 discloses a method in which the base of the electrode portion and the resistance portion uses the same resistance metal plate, in which a very narrow slit is inscribed on the resistance portion and the resistance value is increased. It is described. There is a method in which a protective film is applied to the resistance portion, and the electrode portion is formed by joining the copper plate by a clad method or the like. However, even in the case where a very narrow slit is engraved in the resistor portion to increase the resistance value, when a current flows through the chip resistor, a hot spot occurs in the resistive metal plate, which leads to a decrease in reliability. Since the copper parts are joined to each other by the clad method, it is difficult to manufacture the electrode part at low cost.

Moreover, as another manufacturing method of a metal plate low resistance chip resistor, as described in patent document 3, a resistance metal plate is made to make resistance resistance by raising a resistance value by changing various dimensions, and changing an electrode dimension, an electrode part In order to ensure solder wettability, copper and tin plated films are formed and packaging is carried out so that holes are covered and self-supporting is maintained. (Refer) In this manufacturing method, the resistance value is increased, but the packaging height is increased. Becomes high. At present, there are many demands for lowering of parts, but there is a problem that it cannot cope with such a customer's demand and that the process of adjusting the resistance value becomes complicated.

Japanese Patent No. 3846987 Japanese Patent Laid-Open No. 2006-19669 Japanese Patent Application Laid-Open No. 11-3804

(Initiation of invention)

(Tasks to be solved by the invention)

The present invention has been proposed in view of the above phenomena, and its object is to provide a metal plate low resistance chip resistor having a specific resistance value in the range of about 15 to 50 mΩ and having high reliability.

In addition, another object of the present invention is to provide a manufacturing method for producing a metal sheet low resistance chip resistor having a specific resistance value in the range of about 15 to 50 mΩ by a relatively simple and continuous process with high precision and high yield. will be.

In this invention, the said subject is solved by the means of (1)-(7) described below.

(1) a metal resistance plate, an electrode film formed on each end of the metal resistance plate, and a protective film formed between both electrode films to cover the metal resistance plate, wherein the metal resistance plate is a predetermined position on both sides of the rectangle. Is formed in a cut-out shape, and at each end of the metal resistor plate, the electrode films are formed at predetermined widths at the end sides, and regions in which the electrode film is absent in the metal resistor plate are provided as resistors. The portion where both sides are not cut out becomes a resistance value adjustment part, and the part where both sides were cut out among the said resistance parts becomes a resistance value fixing part, The said protective film covers the surface of the said metal resistance plate, and the said resistance value A metal plate low resistance chip resistor formed by filling both sides of the fixing part and having the same width as both ends.

(2) The metal plate low resistance chip resistor according to (1), wherein the resistance value fixing portion is formed with a length larger than the width.

(3) forming a plurality of through grooves in a straight line at predetermined intervals in a metal resistor plate of a predetermined size; forming a plurality of holes arranged in a line at predetermined intervals between the through grooves; A protective film forming step of covering the plurality of holes by covering a region except a predetermined width on both sides with a protective film, and a region without an electrode film on both sides of the hole in the region from the through groove to the hole of the metal resistance plate. In addition, after the electrode film forming step of forming the electrode film with a predetermined width on the side with the through groove, the protective film forming step and the electrode film forming step, a metal resistor plate is cut along the through groove to form a strip-shaped metal resistor. A strip-shaped cutting process for forming a plate, and a strip-shaped metal resistor plate is cut in the short side direction at the portion where the hole is provided to form a chip-shaped metal resistor. And a chip-shaped cutting step of forming a chip, and in the chip-shaped cutting step, the cutting width of the band-shaped metal resistor plate is determined so that a chip-shaped metal resistor plate having a desired resistance value is obtained. Method of manufacturing a chip resistor.

(4) forming a plurality of holes arranged in a row at predetermined intervals in the strip-shaped metal resistance plate; and forming a protective film in the central long side direction of the strip-shaped metal resistance plate to form a protective film forming step of blocking the plurality of holes. And an electrode film forming step of forming an electrode film in a predetermined width on both sides of the hole in a region from both side edges of the metal resistance plate to the hole, and having no electrode film on both sides of the hole; The metal resistance plate of the present invention is provided with a chip-shaped cutting step of cutting a short-circuit direction at a portion where the hole is provided to form a chip-shaped metal resistor plate. In the chip-shaped cutting step, the chip-shaped metal resistor plate having a desired resistance value The cutting width of the strip | belt-shaped metal resistance plate is determined so that the manufacturing method of the metal plate low resistance chip resistor can be obtained.

(5) In the protective film forming step, the protective film is formed by attaching a sheet-like or strip-shaped organic resin material on both sides of the metal resistance plate and welding them under pressure. The manufacturing method of the metal plate low resistance chip resistor of description).

(6) The said chip-shaped cutting process is a process of cut | disconnecting a strip | belt-shaped metal resistance plate in the short side direction in the part in which the said hole was provided, and forming a chip-shaped metal resistance plate, and measuring the resistance value of the said chip-shaped metal resistance plate. And a calculation step of calculating the cutting width of the band-shaped metal resistance plate in the next cutting step so as to obtain a chip-shaped metal resistance plate having a desired resistance value by calculating the measurement step and using the measured value. Then, the band-shaped metal resistance plate was cut in the short side direction by the cutting width calculated in the previous calculation step, the resistance value of one chip-shaped metal resistance plate formed thereby was measured, and the measured resistance value was used. The cutting width of the strip | belt-shaped metal resistance plate in a next cutting process is computed so that it may calculate and obtain the chip-shaped metal resistance plate which has a desired resistance value. The above-mentioned (3) or the metal sheet manufacturing method of the low-resistance chip resistor according to the above (4).

(7) The said chip-shaped cutting process is a process of cut | disconnecting a strip | belt-shaped metal resistance plate in the short side direction in the part in which the said hole was provided, and forming a chip-shaped metal resistance plate, and measuring the resistance value of the said chip-shaped metal resistance plate. Calculation which calculates using the said measurement process and the said measured value, and calculates the cutting width of the short side direction of the strip | belt-shaped metal resistance plate in a next cutting process so that the chip-shaped metal resistance plate with a desired resistance value is obtained. Including the process, the band-shaped metal resistance plate is cut twice in the short-side direction by the cutting width calculated by the above calculation process, and the resistance values of the two chip-shaped metal resistance plates formed thereby are measured and averaged, respectively. Is calculated using the average value and the band-shaped metal in the next cutting step is obtained so as to obtain a chip-shaped metal resistor plate having a desired resistance value. Plate method of producing a low-resistance chip resistor according to the above (3) or (4) above, characterized in that for calculating the cutting width of the hangpan.

Further, in the method for manufacturing a metal plate low resistance chip resistor according to the above (3), a step of forming a plurality of through grooves in a linear shape at a predetermined interval in a metal resistor plate of a predetermined size, and in a line at a predetermined interval between the respective through grooves The process of forming the several hole arrange | positioned can also be performed simultaneously. For example, it is possible to simultaneously form a plurality of through grooves and a plurality of holes in the metal resistance plate by an etching method or a punching processing method using a metal mold, and can also be formed sequentially in different steps.

In the metal plate low resistance chip resistor of the present invention, a narrow resistance value fixing portion is provided at a predetermined position of the metal resistance plate, whereby a large increase in the resistance value is achieved, and regions where no electrode film is provided at both ends of the metal resistance plate, In the manufacture of the metal plate low resistance chip resistor, the width of the both ends is slightly adjusted so that fine adjustment of the resistance value is performed, and the resistance value is set to a specific resistance value in a predetermined range, for example, in a range of about 15 to 50 m? It is possible to set. In addition, the resistance value fixing portion of the metal resistance plate is slightly narrower than both ends, but the resistance value fixing portion is formed to have a length larger than the width, and the resistance value fixing portion is the same thickness as both ends. As described above, since holes, grooves, or slits are not provided, the occurrence of hot spots can be prevented, and high reliability can be secured and physically sufficient strength can be secured.

In the manufacturing method of the metal plate low resistance chip resistor of this invention, either one of the metal resistance plate of a predetermined | prescribed size, or a strip | belt-shaped metal resistance plate is used, and these holes are formed in predetermined space | interval from these metal resistance plates, and a protective film And a strip-shaped metal resistance plate provided with an electrode film is manufactured as an intermediate workpiece, and the strip-shaped intermediate workpiece is cut in a short side direction at a position having a hole to form a chip-shaped resistor. A metal plate low resistance chip resistor having a desired resistance value can be manufactured.

That is, the hole provided in the metal resistance plate becomes a notch part in the metal resistance plate of said (1) when a strip | belt-shaped intermediate | middle workpiece is cut | disconnected and became a chip-shaped metal resistance plate, and thereby narrow resistance value A fixed portion is formed, and a large increase in the resistance value is achieved. And the part without the hole of a strip | belt-shaped intermediate workpiece becomes the both ends in the metal resistance plate of said (1) when cut | disconnected, and since the width | variety of these both ends is a cutting width of a strip | belt-shaped intermediate workpiece | work, In particular, the resistance value of the metal plate low resistance chip resistor is fine-tuned to a predetermined range by the region where the electrode films at both ends are absent. In this way, the resistance value of the metal plate low resistance chip resistor is a specific resistance value which is relatively high, for example, in the range of about 15 to 50 mΩ, and the target resistance value can be set with high precision.

In the manufacturing method of the metal plate low resistance chip resistor of this invention, the strip | belt-shaped metal resistance plate in which several holes are formed at predetermined intervals, and the protective film and the electrode film were provided is manufactured as an intermediate workpiece, and this strip | belt-shaped intermediate workpiece | work is made into a hole In the short side direction at a predetermined cutting width (initial setting value) corresponding to one chip resistor and forming a chip-shaped metal resistance plate (chip-shaped workpiece), and measuring the resistance value of the chip-shaped workpiece. And it calculates using this measured value and calculates the cutting width of the short side direction of the strip | belt-shaped intermediate workpiece | work in the following cutting process so that the chip-shaped workpiece | work which has a desired resistance value is obtained.

Next, the band-shaped intermediate workpiece is cut once or twice in the short side direction at the calculated cutting width and the position where the hole is formed to form a chip-shaped workpiece, and the resistance value of the chip-shaped workpiece is measured. Using the resistance value or the average value of the two resistance values, the cutting width for the next cutting process is calculated. After this, a chip-shaped processed product is manufactured by repeating a cutting process, the measurement process of a resistance value, and the calculation process of a cutting width similarly, and a metal plate low resistance chip resistor is manufactured from the chip-form processed goods within a tolerance.

Therefore, when the hole provided in the metal resistance plate is cut and turned into a chip-shaped metal resistance plate, it becomes a cutout part of both sides, whereby a narrow resistance value fixing part is formed, and a large increase in resistance value is achieved. And the part without the hole of a strip | belt-shaped intermediate workpiece becomes the both ends in the metal resistance plate of said (1) when cut | disconnected, and since the width | variety of these both ends is a cutting width of a strip | belt-shaped intermediate workpiece | work, In particular, the resistance value of the metal plate low resistance chip resistor is fine-tuned to a predetermined range by the region where the electrode films at both ends are absent.

That is, in the present invention, since the cutting width in the short side direction with respect to the strip-shaped intermediate workpiece is always corrected according to the resistance value of one or two chip-shaped workpieces formed in one step, the resistance value of the chip-shaped workpiece is very large. It falls within the permissible range with high precision, and the yield of the metal plate low resistance chip resistor manufactured from a chip-shaped processed object also becomes very high. In the present invention, a highly accurate low resistance metal plate low resistance chip resistor can be manufactured by a relatively simple and continuous process.

1 (a) is a plan view of a metal plate low resistance chip resistor of the present invention, (b) is a cross section taken along line BB, (c) is a cross section taken along line CC, and (d) is a metal plate low resistance chip Top view of a metal resistor plate constituting a resistor.
2 is a plan view of a strip-shaped intermediate workpiece in the manufacturing process of the metal sheet low resistance chip resistor of the present invention.
Fig. 3 (a) is a plan view of a metal resistor plate 20A of a predetermined size, and (b) is a plan view of a band-shaped metal resistor plate 20B.
4 (a) to 4 (f) are a plan view or a sectional view in the manufacturing process of the metal sheet low resistance chip resistor of the present invention.
5 is a sectional view of a process following the manufacturing process of FIG. 4.
6 is a view for explaining a theoretical formula for calculating the cutting width of a strip-shaped intermediate workpiece.

(The best mode for carrying out the invention)

EMBODIMENT OF THE INVENTION Hereinafter, although embodiment of this invention is described with reference to drawings, this invention is not limited to this.

1 (a) is a plan view of the metal sheet low resistance chip resistor 10 of the present invention, Figure 1 (b) is a cross-sectional view taken along the line BB, Figure 1 (c) is a cross-sectional view taken along the line CC, 1D is a plan view of the metal resistance plate 11 constituting the metal plate low resistance chip resistor 10. In the metal plate low resistance chip resistor 10, the electrode film 12 is formed on the front and back of both ends of the metal resistance plate 11 made of an alloy, and the protective film 13 is formed between the electrode film 12 at both ends.

Here, as shown in Fig. 1 (d), the metal resistance plate 11 has a shape in which a substantially center of both side edges 11a is cut out in a rectangular shape consisting of side edges 11a and end edges 11b. The cutout portion 11c forms a region 11e that is narrower than both ends 11d, that is, a resistance value fixing portion 11e. This resistance value fixing part 11e has a length L larger than the width W. As shown in FIG. The metal resistance plate 11 can be formed of, for example, an alloy containing iron, chromium and aluminum, or an alloy containing nickel and chromium.

The electrode film 12 is formed on the front and back and end surfaces with a predetermined width from the end edge 11b of the metal resistance plate 11, and is disposed on the side close to the cutout 11c at both ends 11d. An area 11f without () is provided. The region 11f without the electrode film 12 at both ends 11d functions as the resistance value adjusting unit 11f as described later. In addition, as the electrode film 12, it is possible to form a Cu film, a Ni film and a Sn film by laminating them.

The protective film 13 is composed of a protective film lower layer 13a and a protective film upper layer 13b. The protective film lower layer 13a has, for example, a resin sheet having a photosensitive device on the front and back surfaces of the metal resistance plate 11. After pressing and melting, the film is formed by removing the film into a region where the electrode film 12 is formed by means of photofabrication, which is exposed and developed by covering a predetermined portion with a photomask. The protective film lower layer 13a fills in the notch 11c of the metal resistance plate 11, and as shown in Fig. 1 (a), the outer shape of the metal plate low resistance chip resistor 10 is almost rectangular. Moreover, the protective film upper layer 13b is formed by apply | coating an epoxy resin paste by the screen printing method, for example from above the protective film lower layer 13a, and hardening this.

2 is a plan view of a strip-shaped intermediate workpiece 20 in the manufacturing process of the metal sheet low resistance chip resistor 10 of the present invention. A plurality of rectangular holes 21 are formed in the band-shaped metal resistor plate 11 at predetermined intervals, and the electrode film 12 is formed in the long side direction of both sides of the band-shaped metal resistor plate 11. The protective film 13 is formed in the long side direction of the front and back central part.

In the process of the present invention, as shown in the intermediate products (20) of the strip-shaped with the dashed line 22, it is cut into a hole 21 with a predetermined cutting width (W _n) in the short side direction at the position where , intended to form the work piece (a _n) of the chip-like, and some processes for the more commercialized performed on the chip-shaped workpiece (a _n), the plate low-resistance chip resistor 10 as the final product is formed.

Thus, since the strip | belt-shaped intermediate workpiece | work 20 is cut | disconnected in the position with the hole 21, in this cutting process, the resistance value fixing part 11e in the metal plate low resistance chip resistor 10 of FIG. The width and the length of are not changed, and only the width of the resistance value adjusting section 11f increases or decreases according to the cutting width W _n , whereby the resistance value of the metal plate low resistance chip resistor 10 is increased and decreased and finely adjusted. That is, the cutting width W _n becomes the width of the resistance value adjusting unit 11f as it is. If the cutting width W _n is widened, the resistance value can be slightly reduced, and conversely, the cutting width W _n is used. By narrowing the resistance, the resistance value can be slightly increased.

On the other hand, when the metal plate low resistance chip resistor 10 adjusts the size and spacing of the holes 21 provided in the metal resistance plate 11 in the manufacturing process, the width and the length of the resistance value fixing part 11e. Can be set, whereby a large resistance value of the metal plate low resistance chip resistor 10 can be increased.

As described above, in the metal plate low resistance chip resistor 10, a large resistance value is increased by the resistance value fixing part 11e, and the resistance value is finely adjusted by the width of the resistance value adjusting part 11f.

Next, the manufacturing method of the metal plate low resistance chip resistor 10 of this invention is demonstrated.

In the method for manufacturing a metal sheet low resistance chip resistor of the present invention, a plurality of through grooves (20A) of a predetermined size as shown in Fig. 3A are formed by an etching method or a punching process using a mold. 22 is formed in a linear shape at predetermined intervals, and at the same time, a plurality of rectangular holes 21 are formed to be arranged in a line at predetermined intervals between these through grooves 22. In addition, although FIG.3 (a) shows the rectangular planar thing as 20A of metal resistance plates, this planar shape and a dimension can be selected suitably, and the strip | belt shape as shown in FIG.3 (b) is shown. You may use the metal resistance plate 20B. Also in the strip | belt-shaped metal resistance plate 20B, the some rectangular hole 21 is formed so that it may arrange in a row at predetermined intervals.

4 (a) to 4 (c) are a plan view and a cross-sectional view enlarged in FIG. 3 (a). As shown in FIG. 1 (d), a metal resistor plate 20A having a hole 21 and a through groove 22 formed therein is shown in FIG. When formed in one metal plate low resistance chip resistor 10 as shown in Fig. 1, the hole 21 is a cutout portion 11c, and the region between the hole 21 and the hole 21 is a resistance value fixing portion. It becomes 11e, and the both ends 11d are between the hole 21 and the through groove 22. As shown in FIG. Thus, the resin sheet which has a photosensitive member is crimped | melted and melt | dissolved throughout the front and back both sides of the metal resistance plate 20A in which the hole 21 and the through-groove 22 were formed, and this fills the hole 21 and a metal resistance plate It is adhered to the surface of 20A. A predetermined width of both sides of the through groove 22, that is, the region where the electrode film 12 is formed, by means of photofabrication or the like, which covers the predetermined portion with a photomask and exposes and develops the resin sheet. When removed from the film, as shown in Figs. 4D to 4F, the protective film underlayer 13a is formed. The protective film lower layer 13a fills the hole 21 of the metal resistance plate 20A and covers the region of the resistance value adjusting part 11f provided at predetermined widths on both sides of the hole 21.

Moreover, when an epoxy resin paste is apply | coated by the screen printing method from above the protective film lower layer 13a, and it is dried and hardened | cured, as shown in FIG.5 (a), the protective film upper layer 13b is formed.

Next, the electrode film 12 is formed by laminating a Cu film, a Ni film, and a Sn film in regions where the protective film lower layer 13a and the protective film upper layer 13b are not yet formed on both sides of the through groove 22. The electrode film 12 is formed in the front and back and end surfaces with a predetermined width from the through grooves 22 of the metal resistance plate 20A, and the holes 21 at both ends 11d of the metal resistance plate 20A are formed. The electrode film 12 is not provided on the side where it is, and as described above, the protective film lower layer 13a and the protective film upper layer 13b are covered, and the region where the electrode film 12 is absent is provided with the resistance value adjusting unit 11f. do.

After the electrode film 12 is formed on the metal resistance plate 20A, and cut along the through grooves 22, a band-shaped intermediate workpiece 20 as shown in FIG. 2 is formed.

In addition, also when using the strip | belt-shaped metal resistance plate 20B as shown to FIG. 3 (b), it forms so that the some rectangular hole 21 may be arranged in a line at predetermined space | interval, and strip | belt-shaped metal resistance is carried out. A protective film lower layer 13a made of a resin sheet is formed in the central long side direction of the plate 20B, the plurality of holes 21 are blocked, and the regions on both sides of the hole 21 are covered to a predetermined width, and the holes ( The resistance value adjusting section 11f is secured in the regions on both sides of the 21. Then, after the protective film upper layer 13b is formed on the protective film lower layer 13a to form the protective film 13, a Cu film, a Ni film and a Sn film are laminated on the side of the side where the protective film 13 is not formed. When the film 12 is formed, the same band-shaped intermediate workpiece 20 as described above can be formed.

Next, a method of calculating the cutting width W _n of the strip-shaped intermediate workpiece 20 will be described.

When the band-shaped intermediate workpiece 20 of FIG. 2 is cut in a short side direction at a predetermined cutting width W _n , and the chip-shaped workpiece A _n is formed, the resistance value is expressed in the following theoretical _formula (1). Can be calculated by

R = Ra + Rb + Rb '

= ρ × {L ₁ / (w ₁ t)} + ρ × {L ₂ / (w ₂ t)} + ρ × {L ₂ '/ (w ₂ t)}

= ρ / t × {L ₁ / w ₁ + L ₂ / w ₂ + L ₂ '/ w ₂ } ············

Here, as shown in FIG. 6, the resistance part consists of the resistance value fixing part a and the resistance value adjusting part b and b ', and the total resistance value R is the resistance value fixing part a of. It is displayed as the sum of the resistance value Ra, the resistance value Rb of the resistance value adjustment part b, and the resistance value Rb 'of the resistance value adjustment part b'.

ρ is the volume resistivity, t is the thickness of the metal resistance plate, and w ₂ corresponds to the cutting width W _n in FIG. 2.

And then by cutting the intermediate products (20) of the strip-like, description will be made on the process of forming a chip-shaped workpieces (A _n).

An initial value is input to the manufacturing apparatus (not shown) of a metal plate low resistance chip resistor. This initial value is, for example, the allowable minimum value of the cutting width, the maximum allowable value of the cutting width, the frequency of resistance measurement, the frequency of changing the cutting width, the target resistance value, and the number of cutting times for one strip-shaped intermediate workpiece. Can be mentioned.

After entering the initial value, the allowable minimum value (W _min), the maximum allowed value (W _max) average value _{(W min + W max) /} 2 from obtains the cutting width (W ₁₎ of the first time of. Next, the intermediate workpiece 20 is cut at this cut width W ₁ to form a chip-shaped workpiece A ₁ , the resistance value R ₁ is measured, and the resistance value R ₁ and the target are set. From the deviation of the resistance value R to be calculated, the _second cutting width W ₂ is calculated by the theoretical formula (1).

In the initial value input process, when the frequency of the resistance measurement is 1 and the frequency of the change of the cutting width is 1, the forming process of the second and subsequent chip-shaped workpieces (A _n ) is performed by the band-shaped intermediate workpiece (20). To the cutting width (W _n ), the resistance value (R _n ) of the chip-shaped workpiece (A _n ) obtained thereby is measured, and the resistance value (R _n ) and the target resistance value (R) The cutting width W _{n + 1 at the} time of forming the n + 1th chip-shaped workpiece (A _{n +1} ) is calculated from the deviation from the above, and each time the above step forms one chip-shaped workpiece. It is repeated and the cutting frequency input as an initial value is performed.

In the initial value input step, when the frequency of the resistance measurement is 2 and the frequency of the change of the cutting width is 2, in the step of forming the chip-shaped workpiece after the second time, the bands have the same cutting width (W _n ). The shape intermediate workpiece 20 is cut to form chip shape workpieces A _n and A _{n +1} . The resistance values R _n and R _{n +1 of} these chip-shaped workpieces A _n and A _{n +1} are measured one by one, and the average value of these resistance values R _n and R _{n + 1} is calculated. From the deviation between the average value and the target resistance value R, the cutting width W _{n + 2} is calculated by the formula (1). The two chip-shaped workpieces (A _{n +2} , A _{n +3} ) continuously formed on the chip-shaped workpieces (A _n , A _{n + 1} ) are strip-shaped intermediate workpieces with the same cutting width (W _{n +2} ). It cuts from (20). The above process is repeated every time two chip-shaped workpieces are formed, and the cutting count input as an initial value is performed.

The chip-shaped processed product A _n obtained as described above is subjected to a few steps for commercialization to become the metal plate low resistance chip resistor 10 as a finished product.

10 Metal Plate Low Resistance Chip Resistor 11 Metal Resistance Plate
11a side 11b end side
11c cutout 11d both ends
11e Resistance value adjustment part 11f Resistance value adjustment part
12 electrode film 13 protective film
13a passivation layer lower layer 13b passivation layer upper layer
20 strip-shaped intermediate workpiece
20A metal resistive plate of specified size metal resistive plate
20B strip-shaped metal resistor plate 21 rectangular hole
22 through hole
An chip-shaped workpiece formed by cutting an n times
Resistance value of R _n A _n W _n n cut width

Claims (7)

A metal resistance plate, electrode films formed on both ends of the metal resistance plate, and a protective film formed between both electrode films to cover the metal resistance plate,
The metal resistance plate is formed in a shape in which predetermined positions of both sides of the rectangle are cut out,
On both ends of the metal resistance plate, the electrode films are formed at predetermined widths on the end sides, respectively.
An area in which the electrode film is absent in the metal resistance plate is provided as a resistance portion, and a portion where both sides of the resistor portion are not cut out is a resistance value adjusting portion, and both sides of the resistance portion are cut out to a resistance value fixing portion. Become,
The protective film covers the surface of the metal resistance plate, and fills both sides of the resistance value fixing part, and is formed to have the same width as both ends of the metal plate low resistance chip resistor. The metal plate low resistance chip resistor according to claim 1, wherein the resistance value fixing portion has a length greater than a width. Forming a plurality of through grooves in a straight line at predetermined intervals in a metal resistor plate of a predetermined size; forming a plurality of holes arranged in a line at predetermined intervals between the through grooves; and predetermined on both sides of the through grooves. A protective film forming step of covering the plurality of holes by covering the area except the width with a protective film, and providing a region without electrode film on both sides of the hole in the area from the through groove to the hole of the metal resistance plate, After the electrode film forming step of forming the electrode film with a predetermined width on the side with the side, the protective film forming step and the electrode film forming step, a band for forming a band-shaped metal resistance plate by cutting the metal resistance plate along the through groove. The chip-shaped metal resistor plate is formed by cutting the strip-shaped metal resistor plate and the strip-shaped metal resistor plate in the short side direction at the portion where the hole is provided. Equipped with a chip shape cutting step
In the said chip-shaped cutting process, the cutting width of a strip | belt-shaped metal resistance plate is determined so that the chip-shaped metal resistance plate with a desired resistance value can be obtained, The manufacturing method of the metal plate low resistance chip resistor characterized by the above-mentioned. Forming a plurality of holes arranged in a row at predetermined intervals in the strip-shaped metal resistance plate, forming a protective film in the central long side direction of the strip-shaped metal resistance plate, and forming a protective film for blocking the plurality of holes; An electrode film forming step of forming an electrode film on both sides of the hole without an electrode film on both sides of the hole from the side edges of the metal resistance plate to the hole; Is provided in the short side direction at the part where the said hole is provided, and has a chip-shaped cutting process which forms a chip-shaped metal resistance plate, and in the said chip-shaped cutting process, a chip-shaped metal resistance plate with a desired resistance value is obtained, A cutting width of a metal resistance plate having a shape is determined. The metal plate according to claim 3 or 4, wherein in the protective film forming step, a sheet or strip-shaped organic resin material is provided on both sides of the metal resistance plate, and a protective film is formed by welding under pressure. Method of manufacturing a low resistance chip resistor. The said chip-shaped cutting process is a process which cut | disconnects a strip | belt-shaped metal resistance plate to the short side direction at the part in which the said hole was provided, and forms a chip-shaped metal resistance plate, The said chip-shaped metal resistance of Claim 3 or 4 The cutting width of the strip | belt-shaped metal resistance plate in a next cutting process is computed so that the measurement process which measures the resistance value of a plate, and the said measured value are computed, and the chip-shaped metal resistance plate which has a desired resistance value is obtained. Including operation process to do,
The band-shaped metal resistance plate is cut in the short side direction by the cutting width calculated in the previous calculation step, the resistance value of the one chip-shaped metal resistance plate formed thereby is measured and calculated using the measured resistance value. And cutting width | variety of the strip | belt-shaped metal resistance plate in a next cutting process so that the chip-shaped metal resistance plate which has a desired resistance value can be obtained. The said chip-shaped cutting process is a process of cut | disconnecting a strip | belt-shaped metal resistance plate to the short side direction at the part in which the said hole was provided, and forming a chip-shaped metal resistance plate, The said chip-shaped metal of Claim 3 or 4 In the measuring step of measuring the resistance value of the resistance plate and the chip-shaped metal resistance plate having the desired resistance value calculated by using the measured value, the band-shaped metal resistance plate in the short side direction in the next cutting step is obtained. A calculation process for calculating the cutting width;
The band-shaped metal resistance plate was cut twice in the short side direction by the cutting width calculated by the above calculation step, and the average value was calculated by measuring the resistance values of the two chip-shaped metal resistance plates formed thereby. A method for manufacturing a metal sheet low resistance chip resistor, characterized in that the calculation is performed using an average value and the cutting width of the band-shaped metal resistance plate in the next cutting step is calculated so that a chip-shaped metal resistance plate having a desired resistance value is obtained. .

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