JP2006157064A - Chip resistor and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip resistor, which can solve or suppress problems such as errors in resistance caused by sticking of solder to the resistor. <P>SOLUTION: The chip resistor A1 is provided with a chip-shaped resistor 1, having a front and rear faces 10a and 10b separated by an interval in the thickness direction and a pair of sides 10c extending along a certain direction separated by the interval in the width direction, and a pair of electrodes 3, which are arranged parallel with each other on the rear side 10b of the resistor 1 in the certain direction separated by interval. A first insulation layer 2A, which covers all areas between the pair of electrodes 3 on the rear side 10b of the resistor 1 and provides a formation region of the pair of electrodes by being formed prior to the formation of the pair of electrodes, and a second insulation layer 2B, which entirely covers each of the pair of sides 10c of the resistor 1, are provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a chip resistor and a manufacturing method thereof.

  An example of a conventional chip resistor is shown in FIG. 12 (see Patent Document 1). The illustrated chip resistor B has a configuration in which a pair of electrodes 91 are provided on a lower surface 90 b of a metal chip-like resistor 90 with a gap 93 therebetween. A solder layer 92 is formed on the lower surface of each electrode 91 as a means for improving solderability during mounting.

  This chip resistor B is manufactured by a method as shown in FIG. First, as shown in FIG. 5A, two metal plates 90 ′ and 91 ′ are prepared as the respective materials of the resistor 90 and the electrode 91, and as shown in FIG. A metal plate 91 ′ is overlapped and joined to the lower surface of 90 ′. Next, as shown in FIG. 3C, a part of the metal plate 91 ′ is cut by machining to form a gap 93. Thereafter, as shown in FIG. 4D, a solder layer 92 ′ is formed on the lower surface of the metal plate 91 ′, and then the metal plates 90 ′ and 91 ′ are cut as shown in FIG. . As a result, the chip resistor B is manufactured.

JP 2002-57009 A (FIG. 1)

  The chip resistor B described above has a structure in which the region between the pair of electrodes 91 and the side surfaces 90c of the resistor 90 are not insulated and protected among the lower surface 90b of the resistor 90. For this reason, when the chip resistor B is surface-mounted using solder, a part of the solder protruding from the lower side of each electrode 91 may adhere to the lower surface 90b or each side surface 90c of the resistor 90. there were. When such a situation occurs, a large error occurs in the resistance value, and the specification of the electric circuit configured using the chip resistor B is distorted. Such a problem becomes more serious as the resistance of the chip resistor B is reduced and the necessity of reducing the error in the resistance value is increased.

  Moreover, in the said prior art, there existed a malfunction that the manufacture operation | work of the chip resistor B was complicated and the productivity was bad. More specifically, conventionally, the gap portion 93 is formed by machining. Moreover, the process must finish the dimension s5 between the pair of electrodes 91 with high accuracy. For this reason, it is necessary to perform the above-mentioned processing very carefully, and the productivity of the chip resistor B has deteriorated. Further, in the above prior art, since the chip resistor B is manufactured through the cutting process, an error in the inter-electrode resistance value due to the cutting process accuracy has also occurred.

  The present invention has been conceived under the circumstances described above, and it is possible to eliminate or suppress such a problem that an error occurs in the resistance value due to solder adhesion to the resistor. The problem is to provide a chip resistor. Moreover, this invention makes it the other subject to provide the manufacturing method of the chip resistor which can manufacture such a chip resistor efficiently and appropriately.

  In order to solve the above problems, the present invention takes the following technical means.

  The chip resistor provided by the first aspect of the present invention has a front and back surfaces spaced apart in the thickness direction and a pair of side surfaces extending in a certain direction spaced apart in the width direction. A chip resistor, and a pair of electrodes provided on the back surface of the resistor so as to be arranged at intervals in the fixed direction, of the back surface of the resistor, A first insulating layer that covers the entire region between the pair of electrodes and is formed before the pair of electrodes is formed to define a region for forming the pair of electrodes, and the pair of side surfaces of the resistor. And a second insulating layer that covers all of them.

  According to such a configuration, the following effects can be obtained.

  First, since the region between the electrodes on the back surface of the resistor and the pair of side surfaces are all covered with the first and second insulating layers, the solder is not applied to those portions of the resistor, unlike the prior art. There is no risk of accidental adhesion. Therefore, it is possible to prevent a large error in the resistance value due to improper solder adhesion to the resistor, and to appropriately eliminate the fact that the specification of the electric circuit configured using the chip resistor is greatly deviated. can do.

  Second, in the present invention, the distance between the plurality of electrodes can be defined by the first insulating layer. More specifically, for example, when the width of the portion sandwiched between the pair of electrodes in the first insulating layer is set to a predetermined dimension, the distance between the pair of electrodes can be defined to the same dimension. . On the other hand, if the first insulating layer is formed using a technique such as thick film printing described later, the width can be finished to a desired width with high dimensional accuracy. Therefore, the distance between the pair of electrodes can be set to a desired dimension with high dimensional accuracy. As a condition for bringing the rated resistance value of the chip resistor close to a desired target resistance value, it is required to finish the inter-electrode dimension to a predetermined accurate dimension. It is suitable for satisfying.

  Thirdly, since the plurality of electrodes have a structure partitioned by the first insulating layer, it is not necessary to use cutting means as means for forming the plurality of electrodes. For this reason, unlike the prior art, it is possible to easily prevent the resistor from being cut inappropriately and to make the resistor have a desired accurate size. As a result, according to the present invention, the error of the interelectrode resistance value can be eliminated or made very small, and the quality of the chip resistor can be made very high.

  In a preferred embodiment of the present invention, a third insulating layer covering the surface of the resistor is further provided. According to such a configuration, the surface of the resistor is insulated and protected by the third insulating layer. For example, the surface of the resistor is in direct contact with other electrical components and an inappropriate current flows between them. This can be prevented.

  In a preferred embodiment of the present invention, at least two of the first to third insulating layers are made of the same material. Such a configuration is suitable for reducing the production cost by sharing the material of the insulating layer. Of course, more preferably, all of the first to third insulating layers are made of the same material, and the formation method thereof is also made the same. As a method of forming the insulating layer, for example, thick film printing can be employed. According to this thick film printing, for example, even when the first insulating layer has a complicated shape, the first insulating layer can be easily formed with high dimensional accuracy.

  In a preferred embodiment of the present invention, the thickness of each electrode is larger than the thickness of the first insulating layer. According to such a configuration, when the chip resistor is mounted at a desired location using solder, the electrodes are easily soldered.

  The manufacturing method of the chip resistor provided by the second aspect of the present invention is a manufacturing method of the chip resistor according to the first aspect described above, and the resistor itself is formed on the back surface of the bar-shaped resistor material. A plurality of electrodes arranged at intervals in the longitudinal direction of the body material and the plurality of inter-electrode regions on the back surface of the resistor material are all covered and formed before the electrodes are formed. Forming a bar-shaped resistor assembly in which a first insulating layer defining a region and a second insulating layer covering all of a pair of side surfaces of the resistor material are formed; and the resistor assembly And dividing the body into a plurality of chip resistors by cutting the body at a plurality of locations in the longitudinal direction.

  According to the chip resistor manufacturing method of the present invention, in addition to being able to take a plurality of chip resistors from the resistor material, the second insulating layer is formed by using a plurality of chip resistors. Since the work corresponding to the number is performed collectively, the chip resistor provided by the first aspect of the present invention can be efficiently and appropriately manufactured.

  In a preferred embodiment of the present invention, the step of producing the bar-shaped resistor assembly includes an insulating layer patterned on one side of a plate as a resistor material and a conductive layer serving as each of the electrodes. Thereafter, the method includes a step of dividing the plate into the bar-shaped resistor material and a step of forming an insulating layer on a pair of side surfaces of the bar-shaped resistor material. According to such a configuration, it becomes possible to take a large number of chip resistors from one plate, and it is more preferable to increase the productivity of the chip resistors.

  In a preferred embodiment of the present invention, the step of producing the bar-shaped resistor assembly includes the step of forming an insulating layer on one side of the plate as a resistor material and then forming the plate into the bar-shaped resistor. Dividing the material, forming an insulating layer on a pair of side surfaces of the bar-shaped resistor material, and forming a plurality of electrodes on the surface on which the patterned insulating layer is formed. Contains. Even with such a configuration, a large number of chip resistors can be manufactured with high productivity from one plate.

  The chip resistor manufacturing method provided by the third aspect of the present invention is a chip resistor manufacturing method according to the first aspect of the present invention, which is a back surface of a bar-shaped resistor material itself. A plurality of electrodes arranged at intervals in the longitudinal direction of the resistor material, and the plurality of inter-electrode regions on the back surface of the resistor material, and are formed before the formation of the electrodes. A step of producing a bar-shaped resistor assembly provided with a first insulating layer that defines an electrode formation region, and cutting the resistor assembly at a plurality of locations in the longitudinal direction, thereby providing a resistor And dividing the plurality of chip resistors into exposed plurality of chip resistors, and forming the second insulating layer on the side surfaces of the respective resistors of the plurality of chip resistors. Yes. Even with such a configuration, the chip resistor provided by the first aspect of the present invention can be appropriately manufactured.

  In a preferred embodiment of the present invention, a step of forming a third insulating layer on the surface of the resistor material so as to cover the surface of the resistor material before dividing the resistor assembly into a plurality of chip resistors. In addition.

  Other features and advantages of the present invention will become more apparent from the following description of embodiments of the invention.

  Hereinafter, a preferred embodiment of the present invention will be specifically described with reference to the drawings.

  1 to 4 show an example of a chip resistor according to the present invention. As clearly shown in FIGS. 1 and 2, the chip resistor A <b> 1 of this embodiment includes a resistor 1, first to third insulating layers 2 </ b> A to 2 </ b> C, and a pair of electrodes 3. .

  The resistor 1 has a rectangular chip shape in which the thickness of each part is constant, and is made of metal. Specific examples of the material include a Ni—Cu alloy, a Cu—Mn alloy, a Ni—Cr alloy, and the like. However, the material is not limited to these, and the size and target resistance value of the chip resistor A1. It is sufficient to appropriately select one having a resistivity corresponding to the above. Although not realistic, the resistor 1 can be made of non-metal.

  The first to third insulating layers 2A to 2C are all resin films such as epoxy resin. 2 A of 1st insulating layers are provided so that the whole area | region between a pair of electrodes 3 may be covered among the back surfaces 10b of the resistor 1. FIG. The second insulating layer 2B is provided so as to cover each of the pair of side surfaces 10c of the resistor 1 as well shown in FIG. The third insulating layer 2 </ b> C is provided so as to cover the entire surface 10 a of the resistor 1. Only the both end faces 10d of the resistor 1 are uncovered exposed surfaces.

  The pair of electrodes 3 is provided on the back surface 10b of the resistor 1, and is separated in the direction in which the pair of side surfaces 10c extends so as to sandwich the first insulating layer 2A. As will be described later, the pair of electrodes 3 are formed, for example, by applying copper plating to the resistor 1. Each electrode 3 is in contact with the end face 20 so that no gap is formed between the end face 20 in the width direction of the first insulating layer 2A. Thus, the distance between the pair of electrodes 3 is defined by the first insulating layer 2A and has the same dimension as the width s1 of the first insulating layer 2A. A solder layer 39 is laminated on the lower surface of each electrode 3 to improve solderability.

  1 and 2 schematically show the end portions of the electrode 3 and the solder layer 39. However, since these electrodes 3 and the solder layer 39 are formed by plating, in practice, as shown in FIG. As indicated by reference numeral n1, a part of them overlaps on the first insulating layer 2A. However, the overlapping portion itself is not in direct contact with the back surface 10b of the resistor 1, and therefore does not cause an error in the resistance value between the electrodes of the resistor 1. The thickness t1 of each electrode 3 is larger than the thickness t2 of the first insulating layer 2A, and each electrode 3 and the solder layer 39 project downward from the lower surface of the first insulating layer 2A. ing.

  As an example of the thickness of each part, the first to third insulating layers 2A to 2C are each about 20 μm, each electrode 3 is about 30 μm, and each solder layer 39 is about 5 μm. The resistor 1 has a thickness of about 0.1 mm to 1 mm, and vertical and horizontal dimensions of about 2 mm to 7 mm, respectively. However, it goes without saying that the size of the resistor 1 is variously changed according to the size of the target resistance value. The chip resistor A1 is configured as a low resistance of about 0.5 mΩ to 100 mΩ. The inter-electrode resistance of the chip resistor A1 is determined by the resistivity of the resistor 1, the distance between the electrodes 3, and the thickness of the resistor 1.

  Next, an example of a manufacturing method of the above-described chip resistor A1 will be described with reference to FIGS.

  First, as shown in FIG. 5A, a metal plate 1 </ b> A that is a material of the resistor 1 is prepared. The plate 1A has a vertical and horizontal size that allows a plurality of resistors 1 to be obtained, and is uniform in thickness throughout. As shown in FIG. 5B, a third insulating layer 2C ′ is formed on the whole or substantially the entire upper surface 10a of the plate 1A. The third insulating layer 2C ′ is formed by, for example, printing a thick film of an epoxy resin in a solid coating. A step of marking the surface of the third insulating layer 2C ′ may be performed.

  Next, as shown in FIG. 6C, after the plate 1A is turned upside down, a plurality of first insulating layers 2A ′ are formed in a stripe pattern on the upward surface 10b of the plate 1A. To do. The first insulating layer 2A ′ is formed by thick film printing using the same resin and apparatus used for forming the third insulating layer 2C ′. This is preferable for reducing the manufacturing cost of the chip resistor A1 as compared with the case of using a plurality of types of materials and devices. According to the thick film printing method, the width of each first insulating layer 2A ′ can be accurately finished to a predetermined dimension.

  As shown in FIG. 6D, a conductive layer 3A ′ and a solder layer 39A ′ are formed in a region between the plurality of first insulating layers 2A ′ on the surface 10b of the plate 1A. The conductive layer 3A ′ is a portion that becomes a prototype of the electrode 3 and is formed by, for example, copper plating. According to the plating process, the conductive layer 3A ′ is uniformly formed in the region between the adjacent first insulating layers 2A ′ so as not to generate a gap between the conductive layer 3A ′ and the first insulating layer 2A ′. It is possible to form. The solder layer 39A ′ is also formed by plating, for example.

  Thereafter, as shown in FIG. 6 (e), the plate 1A is cut in a direction orthogonal to the direction in which each conductive layer 3A 'or each first insulating layer 2A' extends to form a plurality of bar-shaped resistor materials. Divide into 1A '. Next, as shown in FIG. 7F, a second insulating layer 2B ′ is formed on each of the pair of side surfaces 10c of the bar-shaped resistor material 1A ′. As a result, a bar-shaped resistor aggregate A1 ′ corresponding to a configuration in which the chip resistors A1 are connected in series is obtained. The second insulating layer 2B ′ covers the side surfaces of the conductive layer 3A ′ and the solder layer 39A ′, but this does not adversely affect the function and quality of the chip resistor.

  After the resistor assembly A1 ′ is manufactured, it is cut and divided into a plurality of chips as shown in FIG. This operation is performed, for example, by cutting a portion indicated by a virtual line C1 in the figure so as to divide each conductive layer 3A ′ in the longitudinal direction of the resistor assembly A1 ′. Thereby, each conductive layer 3A ′ becomes the electrode 3 of the chip resistor A1, and a plurality of chip resistors A1 are suitably manufactured from one resistor aggregate A1 ′.

  Next, the operation of the chip resistor A1 will be described.

  First, the chip resistor A1 is surface-mounted on a desired mounting target area by using, for example, a solder reflow technique. In this solder reflow technique, cream solder is applied to the terminals provided in the mounting target area, and then the chip resistor A1 is placed so that each electrode 3 is brought into contact therewith, in the reflow furnace. Heat using. Since each electrode 3 protrudes downward from the lower surface of the first insulating layer 2A, it is possible to ensure the solder adhesion to the lower surface of each electrode 3.

  At the time of the surface mounting, the molten solder may protrude from the terminal. However, since the region between the electrodes 3 on the back surface 10b of the resistor 1 and the side surfaces 10c of the resistor 1 are covered with the first and second insulating layers 2A and 2B, those of the resistor 1 There is no direct adhesion of solder to the surface. Therefore, a resistance value error does not occur due to improper solder adhesion to the resistor 1. In addition, since the surface 10a of the resistor 1 is covered with the third insulating layer 2C, it is possible to prevent undue electrical continuity between the surface 10a and other members or devices. Since the pair of end faces 10d of the resistor 1 are exposed, it is possible to form solder fillets by attaching solder to the end faces 10d, thereby increasing the solder joint strength.

  The resistor 1 of the chip resistor A1 is formed by cutting the plate 1A. The size of the resistor 1 can be finished with high dimensional accuracy. The thickness of the resistor 1 can be accurately finished from the stage of the plate 1A. In addition, the dimension s1 between the pair of electrodes 3 matches the width of the first insulating layer 2A, but the first insulating layer 2A can be formed with considerably high dimensional accuracy by thick film printing. The dimension s1 can be finished to a desired dimension with high accuracy. Thus, if the size of the resistor 1 and the dimension s1 between the pair of electrodes 3 are finished with high accuracy, the error of the inter-electrode resistance value of the chip resistor A1 can be extremely reduced. . Therefore, in this chip resistor A1, it is possible to eliminate the need for trimming for adjusting the resistance value after its manufacture. If trimming can be eliminated, the cost of the chip resistor A1 can be reduced accordingly.

  Further, unlike the prior art, when manufacturing the chip resistor A1 of the present embodiment, it is not necessary to form a pair of electrodes by cutting a part of a metal plate. good. Therefore, the cost of the chip resistor A1 can be further reduced.

  8 to 11 show another embodiment of the present invention. In these drawings, elements that are the same as or similar to those in the above embodiment are given the same reference numerals.

  The chip resistor A2 shown in FIG. 8 is different from the above-described chip resistor A1 in that the second insulating layer 2B does not cover the side surfaces of the electrodes 3 and the solder layer 39, and other configurations are the same. The same as the chip resistor A1.

  This chip resistor A2 is manufactured by a process as shown in FIG. 9, for example. That is, as shown in FIG. 2A, first, the first insulating layer 2A ′ is formed in a stripe shape on one surface of the plate 1A, and the third insulating layer 2C ′ is formed on the opposite surface. The plate 1A is cut as a bar-shaped resistor material 1A ′. Thereafter, as shown in FIG. 2B, a second insulating layer 2B ′ is formed on the pair of side surfaces of the resistor material 1A ′. Further, as shown in FIG. 4C, a conductive layer 3A ′ and a solder layer 39A ′ are formed in a region between the first insulating layers 2A ′. As a result, a bar-shaped resistor aggregate A2 ′ is obtained. Thereafter, as shown in FIG. 4D, the resistor assembly A2 ′ is cut into a plurality of chips. By this cutting operation, the chip resistor A2 shown in FIG. 8 is obtained. In this chip resistor A2, the same operation as described for the chip resistor A1 can be obtained.

  FIG. 10 shows another example of the manufacturing method. In this manufacturing method, first, a bar-shaped resistor material 1A ′ is prepared as shown in FIG. Next, as shown in FIG. 5B, by forming the first to third insulating layers 2A ′ to 2C ′, the plurality of conductive layers 3A ′ and the solder layer 39A ′ on the resistor material 1A ′, Resistor assembly A2 'is produced. Thereafter, as shown in FIG. 5C, the resistor assembly A2 ′ is cut and divided into a plurality of chip resistors A2. As described above, in the present invention, when a resistor assembly is manufactured, a bar-shaped resistor material may be used from the beginning instead of using a plate-shaped resistor material.

  In the present invention, the bar-shaped resistor assembly may not have a configuration in which the chip resistor intended by the present invention is obtained immediately by cutting into a chip shape, for example. For example, a bar-shaped resistor assembly includes a plurality of electrodes arranged at intervals in the longitudinal direction on the back surface of a bar-shaped resistor material, and a first insulating layer covering the plurality of inter-electrode regions. It may be produced as provided. In this case, the resistor assembly is divided into a plurality of chip resistors whose side surfaces are exposed by cutting the resistor assembly at a plurality of positions in the longitudinal direction, and then each resistor of the plurality of chip resistors is divided. Alternatively, the second insulating layer may be formed by individually coating the side surfaces. Also by such a method, the chip resistor intended by the present invention can be manufactured.

  Of course, the chip resistor according to the present invention can be manufactured by a manufacturing method different from the manufacturing method of the chip resistor according to the present invention. For example, after producing a chip resistor in which the second insulating layer is not formed on the pair of side surfaces of the resistor, the second insulating layer is formed on the pair of side surfaces, whereby the chip according to the present invention is formed. You can complete the resistor. In consideration of productivity and cost, the electrode is preferably formed by plating, but is not limited thereto. The first to third insulating layers are preferably formed by thick film printing. However, the present invention is not limited to this. For example, an adhesive tape is bonded to the resistor, or the resistor is immersed in a liquid resin tank. It can also be formed by a technique such as coating.

  A chip resistor A3 shown in FIGS. 11 (a) and 11 (b) is provided with a pair of electrodes 3 at positions separated from both end edges of the back surface 10b of the resistor 1 by an appropriate distance s2, and the rest of the back surface 10b. In this region, the first insulating layer 2A is provided in three dispersed positions (in FIG. 11, the solder layer 39 formed on each electrode 3 is omitted). ing). When manufacturing this chip resistor A3, for example, as shown in FIG. 5C, after forming a plurality of first insulating layers 2A ′ arranged in a stripe on one side of the plate 1A, A conductive layer 3A ′ serving as a prototype of the electrode 3 is formed in the region between (in the same figure, the portion with cross-hatching is an insulating layer). Next, the plate 1A is cut at a position indicated by an imaginary line in FIG. The operation of forming the second insulating layer 2B on each side surface 10c of the resistor 1 may be performed at the stage of forming the plate 1A into a chip.

  In the chip resistor A3 having such a configuration, each electrode 3 is separated from the edge of the resistor 1 by an appropriate distance s2, so that the width of each electrode 3 is reduced. For this reason, it is possible to reduce the difference between the resistance value R1 between the inner end edges 30a of the pair of electrodes 3 and the resistance value R2 between the outer end edges 30b. Therefore, for example, when solder used for surface mounting is unevenly applied, soldering is performed at a position biased toward the inner edge 30a, and position biased toward the outer edge 30b. This is suitable for reducing the difference in resistance value from the case where soldering is performed.

  The present invention is not limited to the contents of the above-described embodiment. The specific configuration of each part of the chip resistor according to the present invention can be varied in design in various ways. The chip resistor according to the present invention is suitable for manufacturing as a low-resistance one, but the specific value of the resistance value is not limited.

It is a perspective view which shows an example of the chip resistor which concerns on this invention. It is II-II sectional drawing of FIG. It is a principal part expanded sectional view of FIG. It is IV-IV sectional drawing of FIG. (A)-(c) is a perspective view which shows a part of manufacturing process of the chip resistor shown in FIG. (D), (e) is a perspective view which shows a part of manufacturing process of the chip resistor shown in FIG. (F), (g) is a perspective view which shows a part of manufacturing process of the chip resistor shown in FIG. It is a perspective view which shows the other example of the chip resistor which concerns on this invention. (A)-(d) is a perspective view which shows an example of the manufacturing method of the chip resistor shown in FIG. (A)-(c) is a perspective view which shows the other example of the manufacturing method of the chip resistor shown in FIG. (A) is sectional drawing which shows the other example of the chip resistor which concerns on this invention, (b) is a bottom view of (a), (c) is the chip resistor shown to (a) It is a principal part top view which shows the process example at the time of manufacturing. It is a perspective view which shows an example of the conventional chip resistor. (A)-(e) is explanatory drawing which shows an example of the manufacturing method of the conventional chip resistor.

Explanation of symbols

A1 to A5 Chip resistor 1 Resistor 1A Plate 2A, 2A 'First insulating layer 2B, 2B' Second insulating layer 2C, 2C 'Third insulating layer 3 Electrode 10a Surface (of resistor)
10b Back side (resistor)
10c Side (resistor)

Claims (9)

A resistor having a front and back surfaces spaced apart in the thickness direction and a pair of side surfaces extending in a certain direction spaced apart in the width direction, and the resistor itself formed into a chip shape, and the back surface of the resistor in the constant direction A chip resistor provided with a pair of electrodes provided so as to be arranged at intervals,
A first insulating layer that covers the entire region between the pair of electrodes on the back surface of the resistor and defines the formation region of the pair of electrodes by being formed before the pair of electrodes is formed; And a second insulating layer covering all of the pair of side surfaces of the resistor.   The chip resistor according to claim 1, further comprising a third insulating layer that covers the entire surface of the resistor.   The chip resistor according to claim 2, wherein at least two of the first to third insulating layers are made of the same material.   4. The chip resistor according to claim 1, wherein a thickness of each of the electrodes is larger than a thickness of the first insulating layer. A resistor having a front and back surfaces spaced apart in the thickness direction and a pair of side surfaces extending in a certain direction spaced apart in the width direction, and the resistor itself formed into a chip shape, and the back surface of the resistor in the constant direction A pair of electrodes arranged so as to be spaced apart from each other, and covers the entire region between the pair of electrodes on the back surface of the resistor, and is formed before the formation of the pair of electrodes. A chip resistor manufacturing method comprising: a first insulating layer that defines a region where the pair of electrodes are formed; and a second insulating layer that covers all of the pair of side surfaces of the resistor. ,
A plurality of electrodes that themselves are arranged on the back surface of the bar-shaped resistor material at intervals in the longitudinal direction of the resistor material, and cover all the inter-electrode regions on the back surface of the resistor material, A bar-like shape in which a first insulating layer that defines the formation region of the electrode and a second insulating layer that covers all of the pair of side surfaces of the resistor material is formed before the electrode is formed. Producing a resistor assembly;
Dividing the resistor assembly into a plurality of chip resistors by cutting at a plurality of locations in the longitudinal direction;
A method of manufacturing a chip resistor, comprising: The step of producing the bar-shaped resistor assembly is as follows:
A step of dividing the plate into the bar-shaped resistor material after sequentially providing an insulating layer patterned on one side of the plate as the resistor material and a conductive layer to be the electrodes;
Forming an insulating layer on a pair of side surfaces of the bar-shaped resistor material;
The manufacturing method of the chip resistor of Claim 6 containing this. The step of producing the bar-shaped resistor assembly is as follows:
After patterning the insulating layer on one side of the plate as the resistor material, dividing the plate into the bar-shaped resistor material;
Forming an insulating layer on a pair of side surfaces of the bar-shaped resistor material, and forming a plurality of electrodes on the surface on which the patterned insulating layer is formed;
The manufacturing method of the chip resistor of Claim 8 containing this. A resistor having a front and back surfaces spaced apart in the thickness direction and a pair of side surfaces extending in a certain direction spaced apart in the width direction, and the resistor itself formed into a chip shape, and the back surface of the resistor in the constant direction A pair of electrodes arranged so as to be spaced apart from each other, and covers the entire region between the pair of electrodes on the back surface of the resistor, and is formed before the formation of the pair of electrodes. A chip resistor manufacturing method comprising: a first insulating layer that defines a region where the pair of electrodes are formed; and a second insulating layer that covers all of the pair of side surfaces of the resistor. ,
A plurality of electrodes that themselves are arranged on the back surface of the bar-shaped resistor material at intervals in the longitudinal direction of the resistor material, and cover all the inter-electrode regions on the back surface of the resistor material, Producing a bar-shaped resistor assembly provided with a first insulating layer that defines the formation region of the electrode by being formed before the formation of the electrode;
The step of dividing the resistor assembly into a plurality of chip resistors in which side surfaces of the resistor are exposed by cutting at a plurality of positions in the longitudinal direction;
Forming the second insulating layer on the side surface of each resistor of the plurality of chip resistors;
A method of manufacturing a chip resistor, comprising:   9. The method according to claim 5, further comprising a step of forming a third insulating layer covering a surface of the resistor material before dividing the resistor assembly into a plurality of chip resistors. The manufacturing method of the chip resistor of description.

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