JP2010205992A5 - - Google Patents
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- Publication number
- JP2010205992A5 JP2010205992A5 JP2009050764A JP2009050764A JP2010205992A5 JP 2010205992 A5 JP2010205992 A5 JP 2010205992A5 JP 2009050764 A JP2009050764 A JP 2009050764A JP 2009050764 A JP2009050764 A JP 2009050764A JP 2010205992 A5 JP2010205992 A5 JP 2010205992A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- melting point
- metal piece
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Claims (4)
前記プリント基板に形成された穴と、 A hole formed in the printed circuit board;
前記穴に挿入される金属片と、を備え、 A metal piece inserted into the hole,
前記金属片は、第１の融点の半田を用いて前記穴に固定され、 The metal piece is fixed to the hole using a solder having a first melting point,
前記発熱部品は、前記第１の融点より低い第２の融点の半田を用いて前記プリント基板に搭載されている、 The heat generating component is mounted on the printed circuit board using a solder having a second melting point lower than the first melting point.
ことを特徴とするプリント基板。 A printed circuit board characterized by that.
前記プリント基板に形成された穴と、 A hole formed in the printed circuit board;
前記穴に挿入される金属片と、を備え、 A metal piece inserted into the hole,
前記金属片は、前記発熱部品の搭載に用いる半田より融点の高い半田を用いて前記穴に固定されている、 The metal piece is fixed to the hole using a solder having a higher melting point than the solder used for mounting the heat-generating component.
ことを特徴とするプリント基板。 A printed circuit board characterized by that.
ことを特徴とする請求項１又は請求項２に記載のプリント基板。 The printed circuit board according to claim 1, wherein the printed circuit board is provided.
前記プリント基板に形成された穴に金属片を挿入し、前記穴に第１の融点の半田を用いて前記金属片を固定した後、前記第１の融点より低い第２の融点の半田を用いてリフロー処理を行って前記発熱部品を搭載した、 After inserting a metal piece into the hole formed in the printed circuit board and fixing the metal piece into the hole using a solder having a first melting point, a solder having a second melting point lower than the first melting point is used. The reflow process was performed and the heat generating component was mounted.
ことを特徴とするプリント基板の製造方法。 A printed circuit board manufacturing method characterized by the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009050764A JP5546778B2 (en) | 2009-03-04 | 2009-03-04 | Printed circuit board and printed circuit board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009050764A JP5546778B2 (en) | 2009-03-04 | 2009-03-04 | Printed circuit board and printed circuit board manufacturing method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010205992A JP2010205992A (en) | 2010-09-16 |
| JP2010205992A5 true JP2010205992A5 (en) | 2012-05-31 |
| JP5546778B2 JP5546778B2 (en) | 2014-07-09 |
Family
ID=42967189
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009050764A Active JP5546778B2 (en) | 2009-03-04 | 2009-03-04 | Printed circuit board and printed circuit board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5546778B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014171004A1 (en) | 2013-04-19 | 2014-10-23 | 株式会社メイコー | Printed wiring board, manufacturing method for same, and thermally conductive body |
| JP6169694B2 (en) * | 2013-06-25 | 2017-07-26 | 株式会社メイコー | Heat dissipation board and manufacturing method thereof |
| JP6354163B2 (en) * | 2014-01-10 | 2018-07-11 | 株式会社デンソー | Circuit board and electronic device |
| JP2018182147A (en) * | 2017-04-18 | 2018-11-15 | 株式会社オートネットワーク技術研究所 | Substrate with metal member, circuit configuration body, and electric connection box |
| JP7081476B2 (en) * | 2018-12-26 | 2022-06-07 | 株式会社豊田自動織機 | Circuit board configuration |
| WO2021024445A1 (en) * | 2019-08-08 | 2021-02-11 | 株式会社メイコー | Heat dissipation substrate and production method therefor |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0786717A (en) * | 1993-09-17 | 1995-03-31 | Fujitsu Ltd | Printing wiring board structure |
| JP4453159B2 (en) * | 2000-04-27 | 2010-04-21 | 株式会社村田製作所 | Electronic component module |
| JP2003197835A (en) * | 2001-12-26 | 2003-07-11 | Tdk Corp | Power amplification module and element aggregate therefor |
| DE102004036960A1 (en) * | 2004-07-30 | 2006-03-23 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Printed circuit board and method for producing such a printed circuit board |
| JP2006128265A (en) * | 2004-10-27 | 2006-05-18 | Kyocera Corp | Wiring board for light emitting element and light emitting device |
| JP5061669B2 (en) * | 2007-03-15 | 2012-10-31 | パナソニック株式会社 | Heat dissipation wiring board |
-
2009
- 2009-03-04 JP JP2009050764A patent/JP5546778B2/en active Active
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