JP6354163B2 - Circuit board and electronic device - Google Patents

Circuit board and electronic device Download PDF

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Publication number
JP6354163B2
JP6354163B2 JP2014003089A JP2014003089A JP6354163B2 JP 6354163 B2 JP6354163 B2 JP 6354163B2 JP 2014003089 A JP2014003089 A JP 2014003089A JP 2014003089 A JP2014003089 A JP 2014003089A JP 6354163 B2 JP6354163 B2 JP 6354163B2
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Prior art keywords
heat
heat transfer
solder
circuit board
hole
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JP2015133373A (en
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英郎 矢橋
英郎 矢橋
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株式会社デンソー
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3677Wire-like or pin-like cooling fins or heat sinks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/021Components thermally connected to metal substrates or heat-sinks by insert mounting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10242Metallic cylinders
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections

Description

  The present invention relates to a circuit board and an electronic device in which a heat transfer member that promotes heat dissipation from a heat-generating component is inserted into a through hole.

  There is a known method of dissipating heat from the back side of the circuit board in order to suitably cool the heat generating parts such as QFN (Quad For Non-Lead Package) and QFP (Quad Flat Package) soldered on the circuit board. ing. Specifically, for example, a metal plate (heat dissipating terminal) provided on the lower surface of the heat generating component is soldered to a land on the mounting surface of the circuit board, and heat is dissipated to the back side of the circuit board through the land and the plated through hole. The structure is known. In particular, in the heat dissipation structure as described above, in order to further improve the heat dissipation to the back side, coin-shaped copper (copper inlay) is adopted instead of the plated through hole, and the heat dissipation terminal of the heat generating component is provided on this copper inlay. Soldering methods are known.

  As a technique relating to such a circuit board with improved heat dissipation to the back side, a wiring board disclosed in Patent Document 1 below is known. In this wiring board, a heat transfer member is press-fitted into a portion where a heat generating component is mounted, and a large-diameter portion is formed on the press-fitting side periphery of a fitting hole into which the heat transfer member is fitted. And the flange part engaged with a large diameter part in the said press-fit state is formed in the heat-transfer member. Accordingly, the insertion depth of the heat transfer member can be easily made constant without strictly controlling the pressure input of the heat transfer member to the insertion hole, and the press-fitting accuracy of the heat transfer member and the press-fitting work thereof. Improves sex.

JP 2009-170493 A

  By the way, due to the heat generated from the heat generating component, the heat transfer solder between the heat radiating terminal and the copper inlay becomes high temperature, and a large cooling stress due to the difference in thermal expansion coefficient between the heat generating component and the circuit board acts on this solder. There is a case. In such a case, in the heat-generating component in which the distance between the heat radiation terminal and the mounting surface of the circuit board is relatively small, the thickness of the heat transfer solder is small. Cracks may occur and heat dissipation may be reduced. In this case, the temperature of the solder further increases in accordance with the decrease in heat dissipation, which may promote solder cracks and further deteriorate the heat dissipation.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a circuit board and an electronic device that can prevent a decrease in heat dissipation regarding a heat dissipation structure for a heat-generating component to be mounted. There is to do.

In order to achieve the above object, according to the first aspect of the present invention, the heat transfer member (24, 27, 29) for promoting the heat radiation of the heat generating component (30) is changed from one surface (21a) to the other surface (21b). ) Are multilayer circuit boards (20, 20 a, 20 b, 20 c) inserted into the through holes (23) formed over the surface, and the heat transfer member is exposed on the one surface with respect to the through holes. The side end surfaces (24a, 29a) are inserted so as to be located on the inner layer side with respect to the peripheral edge (23a) on the one surface side of the through hole, and the one surface side end surface is connected to the peripheral edge on the one surface side at the time of insertion. A joining member (44) having heat conductivity whose end surface (44a) is located on the same plane is disposed, and the other surface side end surface (29b) opposite to the one surface side end surface is arranged on the other surface side of the through hole. Has heat conductivity located on the same plane with respect to the periphery (23b) Bonding member (44) is disposed on an outer peripheral surface of the heat transfer member (29c) is joined member (44) is arranged to have a heat conductivity, the joining member, and the heat transfer member and the heat generating component characterized Rukoto such a material having the same composition as the solder (42) for heat transfer interposed between.
In addition, the code | symbol in the parenthesis of a claim and the said means shows a corresponding relationship with the specific means as described in embodiment mentioned later.

  In the first aspect of the invention, in the heat transfer member that promotes heat dissipation of the heat-generating component, the one-surface-side end surface exposed to one surface of the through-hole is from the peripheral surface on the one surface side of the through-hole (hereinafter also referred to as the single-surface-side peripheral surface). Is also inserted so as to be located on the inner layer side.

  As a result, there is a step that is recessed toward the inner layer so that the one side edge is the bottom surface by the one side edge and the one side edge, so that the distance between the heat radiating terminal and the circuit board mounting surface is relatively small. However, the thickness of the solder for heat transfer can be increased by the level difference. Therefore, since the thermal stress is preferably alleviated by the heat transfer solder having a sufficient thickness as described above, the solder joint reliability is improved, and the heat dissipation performance of the heat dissipation structure for the heat-generating component to be mounted is improved. Can be prevented.

It is sectional drawing which shows schematic structure of the electronic device which concerns on 1st Embodiment. It is an expanded sectional view which expands and shows the electronic component vicinity of FIG. It is an expanded sectional view for explaining the insertion position of a heat transfer member. It is sectional drawing which shows the principal part of the circuit board which concerns on 2nd Embodiment. It is sectional drawing which shows the principal part of the circuit board which concerns on 3rd Embodiment. It is sectional drawing which shows the principal part of the circuit board which concerns on 4th Embodiment.

[First Embodiment]
A first embodiment that embodies a circuit board and an electronic device according to the present invention will be described below with reference to the drawings.
The electronic device 10 shown in FIG. 1 is employed in an environment where the temperature change is large, and is configured as an electronic control unit (Electronic Control Unit) that controls in-vehicle equipment such as an engine mounted on the vehicle, for example. . The electronic device 10 is configured by housing a circuit board 20, another board, and the like in a housing 11.

  The circuit board 20 is a multilayer board in which resin layers made of epoxy resin or the like and conductive layers are alternately stacked, and the electronic component 30 and the external connector 12 are mounted on the mounting surface 21a. As shown in FIG. 2, a plated through hole 22 is formed in the circuit board 20 from the mounting surface 21 a to the back surface 21 b at a position directly below the electronic component 30, and is configured by the plated through hole 22. A heat transfer member 24 such as a copper inlay that promotes heat dissipation of the electronic component 30 is inserted (fitted) and embedded in the through hole 23. The detailed shape and the like of the heat transfer member 24 will be described later. The mounting surface 21a may correspond to an example of “one surface”, and the back surface 21b may correspond to an example of “other surface”.

  The electronic component 30 is a heat generating component that generates heat during a predetermined operation, and includes a package body 31 in which a semiconductor element or the like is sealed with a sealing member, a plurality of lead terminals 32 led out from the package body 31, and a heat dissipation terminal. 33. The electronic component 30 is solder-bonded to each lead terminal 32 via a land 25 and a solder 41 arranged at a predetermined position on the mounting surface 21a.

  The heat radiating terminal 33 is a substantially flat terminal constituting a heat radiating path for a semiconductor element that generates heat, and is formed of, for example, a metal plate. The heat radiating terminal 33 is sealed so that a semiconductor element or the like serving as a heat source is attached to one surface (upper surface) via an adhesive or the like, and the other surface (lower surface) is exposed from below the package body 31. It is sealed by a stop member.

  The heat radiating terminal 33 and the heat transfer member 24 are soldered and joined together by interposing a heat transfer solder 42 functioning as a heat transferable joining member between the two members. As a result, a heat dissipation structure that radiates the heat of the electronic component 30 to the back side of the circuit board 20 via the solder 42 and the heat transfer member 24 is configured.

Next, the detailed shape and insertion position of the heat transfer member 24 will be described in detail with reference to FIG. FIG. 3 is an enlarged cross-sectional view for explaining the insertion position of the heat transfer member 24.
The heat transfer member 24 is formed in a columnar shape. As shown in FIG. 3, the end surface exposed to the mounting surface 21 a (hereinafter also referred to as one surface side end surface 24 a) with respect to the through hole 23 is the through hole 23. It is inserted so that it may be located in the inner layer side rather than the periphery (henceforth the one surface side periphery 23a) of one surface side. The heat transfer member 24 has an end surface exposed to the back surface 21b (hereinafter also referred to as the other surface side end surface 24b) at the time of insertion described above, and a peripheral edge on the other surface side of the through hole 23 (hereinafter also referred to as the other surface side peripheral edge 23b). Are formed so as to be located on substantially the same plane.

  As a result, the one-surface-side end surface 24a is set as a bottom surface at the position directly below the heat dissipation terminal 33 of the electronic component 30 by the one-surface-side peripheral edge 23a and the one-surface-side end surface 24a and the inner peripheral surface of the one-surface-side through hole 23. A step 26 that is recessed toward the inner layer side is formed. Since the step 26 is filled with the solder 42 for soldering the heat radiating terminal 33 and the heat transfer member 24, the thickness t of the solder 42 is increased by the step 26. For this reason, even if a large thermal stress is caused by the difference in thermal expansion coefficient between the electronic component 30 and the circuit board 20 due to the solder 42 formed in this way, the thermal stress is preferably alleviated. Become.

  As described above, in the circuit board 20 according to the present embodiment, the heat transfer member 24 that promotes heat dissipation of the electronic component 30 is exposed to the mounting surface 21 a with respect to the through hole 23 configured by the plated through hole 22. The one surface side end surface 24 a is inserted so as to be located on the inner layer side with respect to the one surface side peripheral edge 23 a of the through hole 23.

  Accordingly, a step 26 that is recessed toward the inner layer side is formed by the one-surface side peripheral surface 23a and the one-surface-side end surface 24a so that the one-surface-side end surface 24a serves as a bottom surface. Even in the case of the electronic component 30 to be reduced, the thickness t of the heat transfer solder 42 can be increased by the level difference 26. Therefore, since the thermal stress is preferably alleviated by the solder 42 having a sufficient thickness as described above, the solder joint reliability is improved, and the heat dissipation performance of the electronic component 30 to be mounted is reduced. Can be prevented.

  The circuit board 20 and the electronic component 30 configured as described above are provided, and the heat radiation terminal 33 of the electronic component 30 mounted on the mounting surface 21a and the end surface 24a on the one surface side of the heat transfer member 24 are solder for heat dissipation. By configuring the electronic device 10 to be solder-bonded by 42, it is possible to realize the electronic device 10 that has an effect of preventing a decrease in heat dissipation with respect to the heat dissipation structure for the electronic component 30 to be mounted.

  In particular, since the through hole 23 is constituted by the plated through hole 22 formed from the mounting surface 21a to the back surface 21b, the heat transmitted through the heat transfer member 24 is also diffused into the plated through hole 22, so that the heat transfer member 24 It is possible to improve the heat dissipation through the.

  Further, the heat transfer member 24 is formed so that the other surface side end surface 24b exposed to the back surface 21b is located on substantially the same plane with respect to the other surface side peripheral edge 23b of the through hole 23 at the time of the insertion. Accordingly, the step 26 having a predetermined depth is performed by performing an insertion operation of inserting the heat transfer member 24 into the through hole 23 so that the other surface side end surface 24b and the other surface side peripheral edge 23b are positioned on the same plane. Will be formed. For this reason, since the variation in the depth of the step 26, that is, the variation in the thickness of the solder 42, is suppressed, it is possible to reliably prevent a decrease in heat dissipation through the solder 42 and the heat transfer member 24.

[Second Embodiment]
Next, a circuit board and an electronic device according to a second embodiment of the present invention will be described with reference to FIG. FIG. 4 is a cross-sectional view showing the main part of the circuit board 20a according to the second embodiment.
The second embodiment is mainly different from the first embodiment in that a heat transfer member 27 is employed instead of the heat transfer member 24 described above. For this reason, substantially the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 4, the heat transfer member 27 of the circuit board 20 a according to the present embodiment is configured such that the protrusion 28 protrudes in a columnar shape from the center of the one end surface 24 a with respect to the heat transfer member 24 described above. Has been. The protrusion 28 is formed such that the protruding end surface 28a is located on substantially the same plane with respect to the one-surface-side peripheral edge 23a at the time of insertion.

  Even in this case, the thickness t of the heat transfer solder 42 is increased by the amount corresponding to the step 26, and it is possible to prevent the heat dissipation of the electronic component 30 to be mounted from being deteriorated.

  In particular, the one end surface 24a on the one surface side of the heat transfer member 27 is formed with a projection 28 whose protruding end surface 28a is located on substantially the same plane with respect to the one surface side peripheral edge 23a at the time of insertion. For this reason, if the insertion work which inserts the heat-transfer member 27 in the through-hole 23 so that the protrusion end surface 28a and the one surface side peripheral edge 23a may be located on the same plane, the level | step difference 26 of predetermined depth will be formed. Therefore, the insertion operation can be facilitated while suppressing variations in the thickness of the solder 42. In particular, since the depth of the step 26, that is, the thickness t of the solder 42 does not become smaller than the height ta from the one-side end surface 24a of the protrusion 28, the necessary thickness t of the solder 42 can be easily secured. It is possible to reliably prevent a decrease in heat dissipation via the solder 42 and the heat transfer member 27.

  The protrusion 28 is not limited to being provided at the center of the one-surface-side end surface 24a, and a plurality of protrusions 28 may be provided on the one-surface-side end surface 24a. Further, the protrusion 28 is not limited to being provided at the center of the one-surface-side end surface 24a, and may be provided at another part of the one-surface-side end surface 24a.

[Third Embodiment]
Next, a circuit board and an electronic device according to a third embodiment of the present invention will be described with reference to FIG. FIG. 5 is a cross-sectional view showing a main part of the circuit board 20b according to the third embodiment. FIG. 5 shows a state of the circuit board 20b before the electronic component 30 is mounted.
The third embodiment is mainly different from the first embodiment in that the solder 43 is arranged in advance on the one end surface 24a of the heat transfer member 24 described above. For this reason, substantially the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  In the circuit board 20b according to the present embodiment, a solder 43 made of a material having the same composition as the solder 42 is disposed in advance on the one end surface 24a of the heat transfer member 24 at a necessary thickness using solder plating or solder coating. ing. And as shown in FIG. 5, the insertion operation which inserts the heat-transfer member 24 in the through-hole 23 is implemented so that the end surface 43a of the solder 43 and the one surface side peripheral edge 23a may be located on the substantially the same plane. Thereafter, the solder 43 and the solder 42 are melted when the heat radiating terminal 33 of the electronic component 30 mounted on the mounting surface 21a and the heat transfer member 24 are joined by solder, so that the heat radiating terminal 33 is formed by the integrated solder 43 and solder 42. The heat transfer member 24 is soldered.

  As a result, similar to the first embodiment, the stepped portion 26 constituted by the one-surface-side peripheral edge 23a and the one-surface-side end surface 24a is filled with the integrated solder. The thickness can be increased. Therefore, it is possible to prevent a decrease in heat dissipation of the heat dissipation structure for the electronic component 30 to be mounted.

  In particular, since the solder 43 is previously formed on the one end surface 24a of the heat transfer member 24, the thickness of the solder 43 can be easily adjusted. That is, the thickness of the solder for soldering the heat radiation terminal 33 and the heat transfer member 24 to each other can be changed.

  Note that the solder 43 made of the material having the same composition as the solder 42 is not disposed in advance on the one surface side end surface 24a of the heat transfer member 24, but a bonding member that can be bonded to the solder 42 and has heat conductivity is previously provided. You may arrange. Thereby, for example, by using a solder alloy or the like having a higher resistance to cold heat connection than the solder used for component mounting in place of the solder 43, it is possible to reliably prevent a decrease in heat dissipation.

[Fourth Embodiment]
Next, a circuit board and an electronic device according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 6 is a cross-sectional view showing a main part of the circuit board 20c according to the fourth embodiment. FIG. 6 shows a state of the circuit board 20c before the electronic component 30 is mounted.
The fourth embodiment is mainly different from the third embodiment in that the solder 44 is arranged in advance on the entire surface of the heat transfer member 29 employed instead of the heat transfer member 24. For this reason, substantially the same components as those in the third embodiment are denoted by the same reference numerals and description thereof is omitted.

  In the circuit board 20 c according to the present embodiment, a heat transfer member 29 made of the same material as the heat transfer member 24 and having a smaller diameter than the through hole 23 is employed instead of the heat transfer member 24. A solder 44 made of a material having the same composition as that of the solder 42 is disposed in advance on one surface side end surface 29a, the other surface side end surface 29b, and the outer peripheral surface 29c of the heat transfer member 29 using solder plating or solder coating in advance. Has been. In particular, the thickness of the solder 44 covering the outer peripheral surface 29 c of the heat transfer member 29 is set according to the inner diameter dimension of the through hole 23.

  And as shown in FIG. 6, the insertion operation which inserts the heat-transfer member 29 in the through-hole 23 is implemented so that the one surface side end surface 44a of the solder 44 and the one surface side peripheral edge 23a may be located on the substantially the same plane. Thereafter, the solder 44 and the solder 42 are melted when the heat radiating terminal 33 and the heat transfer member 29 of the electronic component 30 mounted on the mounting surface 21a are joined by solder, so that the heat radiating terminal 33 and the heat transfer member are integrated by the integrated solder. 29 is soldered.

  As a result, as in the third embodiment, since the solder integrated with the step formed by the one-surface-side peripheral edge 23a and the one-surface-side end surface 29a is filled, the thickness of the solder is reduced by this step. Can be thicker. Therefore, it is possible to prevent a decrease in heat dissipation of the heat dissipation structure for the electronic component 30 to be mounted.

  In particular, the solder 44 covering the outer peripheral surface 29c of the heat transfer member 29 is melted and joined to the plated through hole 22, so that the gap between the outer peripheral surface 29c and the plated through hole 22 is filled, and the heat transfer member 29 and the solder 44 are attached. Since the transmitted heat is easily diffused into the plated through hole 22, the heat dissipation by the circuit board 20c can be enhanced. Moreover, the vibration resistance regarding the heat transfer member 29 can be improved.

  The solder 44 is not limited to being disposed in advance on the entire surface of the heat transfer member 29, but may be disposed in advance on the one-side end surface 29a and the outer peripheral surface 29c, or may be disposed in advance only on the outer peripheral surface 29c. .

  In addition, the entire surface or a part of the heat transfer member 29 is not limited to preliminarily arranging the solder 44 made of the material having the same composition as the solder 42, but a bonding member that can be bonded to the solder 42 and has heat transfer properties is preliminarily provided. You may arrange. Thereby, for example, by using a solder alloy or the like having a higher resistance to cold heat connection than the solder used for component mounting in place of the solder 44, it is possible to reliably prevent a decrease in heat dissipation.

In addition, this invention is not limited to said each embodiment, For example, you may actualize as follows.
(1) The heat transfer members 24, 27, and 29 are not limited to being inserted into the through holes 23 formed by the plated through holes 22, but are formed from the mounting surface 21 a to the back surface 21 b immediately below the electronic component 30. You may insert directly in a through-hole.

(2) The heat transfer members 24, 27, and 29 are not limited to being configured as copper inlays, and may be configured by members having good thermal conductivity such as aluminum members.

DESCRIPTION OF SYMBOLS 10 ... Electronic device 20, 20a, 20b, 20c ... Circuit board 21a ... Mounting surface (one surface)
21b ... Back side (other side)
22 ... Plating through hole 23 ... Through hole 23a ... One surface side periphery 23b ... Other surface side periphery 24,27,29 ... Heat transfer member 24a, 29a ... One surface side end surface 24b, 29b ... Other surface side end surface 28 ... Protrusion 28a ... Projection End face 30 ... Electronic parts (heat generating parts)
42, 43, 44 ... solder

Claims (3)

  1. A heat transfer member (29) for promoting heat dissipation of the heat generating component (30) is a multilayer circuit board (20c) inserted into a through hole (23) formed from one surface (21a) to the other surface (21b),
    The heat transfer member is inserted with respect to the through hole so that the one end surface (29a) exposed on the one surface is located on the inner layer side with respect to the peripheral edge (23a) on the one surface side of the through hole,
    The one surface side end surface is provided with a heat transferable joining member (44) in which the end surface (44a) is located on the same plane with respect to the peripheral edge on the one surface side at the time of insertion,
    On the other surface side end surface (29b) opposite to the one surface side end surface, a joining member (44) having heat conductivity located on the same plane with respect to the peripheral surface (23b) on the other surface side of the through hole is arranged. And
    On the outer peripheral surface (29c) of the heat transfer member, a joining member (44) having heat transfer properties is disposed,
    The circuit board, wherein the joining member is made of a material having the same composition as a heat transfer solder (42) interposed between the heat transfer member and the heat generating component.
  2.   The circuit board according to claim 1, wherein the through hole is configured by a through hole formed from the one surface to the other surface.
  3. The circuit board according to claim 1 or 2,
    A heat generating component (30),
    The electronic device (10), wherein the heat generating component mounted on the one surface and the end surface on one surface side are soldered together by a heat transfer solder (42).
JP2014003089A 2014-01-10 2014-01-10 Circuit board and electronic device Active JP6354163B2 (en)

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JP2014003089A JP6354163B2 (en) 2014-01-10 2014-01-10 Circuit board and electronic device
DE102015200031.1A DE102015200031A1 (en) 2014-01-10 2015-01-05 Board and electronic device

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JP2017201679A (en) * 2016-02-22 2017-11-09 株式会社Daiwa Method for manufacturing wiring board or wiring board material
US20200126884A1 (en) * 2017-05-22 2020-04-23 Sony Interactive Entertainment Inc. Electronic equipment

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US6411516B1 (en) * 2001-06-15 2002-06-25 Hughes Electronics Corporation Copper slug pedestal for a printed circuit board
JP4159861B2 (en) * 2002-11-26 2008-10-01 新日本無線株式会社 Method for manufacturing heat dissipation structure of printed circuit board
JP3935090B2 (en) * 2003-01-28 2007-06-20 京セラ株式会社 Wiring board
JP2006156610A (en) * 2004-11-29 2006-06-15 Nidec Copal Electronics Corp Circuit board
JP4988609B2 (en) 2008-01-11 2012-08-01 株式会社日立国際電気 Wiring board
JP5388598B2 (en) * 2008-11-14 2014-01-15 カルソニックカンセイ株式会社 Element heat dissipation structure
JP2010177366A (en) * 2009-01-28 2010-08-12 Panasonic Corp Flexible substrate, mounting substrate using the same, and production process of flexible substrate
JP5546778B2 (en) * 2009-03-04 2014-07-09 株式会社日立国際電気 Printed circuit board and printed circuit board manufacturing method
JP2012195464A (en) * 2011-03-16 2012-10-11 Mitsubishi Electric Corp Ceramic multilayer substrate and manufacturing method of the same
WO2014136175A1 (en) * 2013-03-04 2014-09-12 株式会社メイコー Heat-dissipating substrate and method for producing same

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